Intersil ITF87072DK8T Datasheet

TM
ITF87072DK8T
Data Sheet March 2000
6A, 20V, 0.037 Ohm, Dual P-Channel,
2.5V Specified Power MOSFET Packaging
SO8 (JEDEC MS-012AA)
BRANDING DASH
5
1
2
3
4
DRAIN1(8) DRAIN1(7)
SOURCE1(1)
GATE1(2)
DRAIN2(6) DRAIN2(5)
SOURCE2(3)
GATE2(4)
File Number 4812.3
Features
• Ultra Low On-Resistance
-r
-r
-r
= 0.037Ω, VGS= −4.5V
DS(ON)
= 0.039Ω, VGS= −4.0V
DS(ON)
= 0.059Ω, VGS= −2.5V
DS(ON)
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Switching Time vs R
GS
Curve
Ordering Information
PART NUMBER PACKAGE BRAND
ITF87072DK8T SO8 87072
NOTE: When ordering, use the entire part number. ITF87072DK8T is available only in tape and reel.
Absolute Maximum Ratings T
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
Continuous (TA = 25oC, VGS = -4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 25oC, VGS = -4.0V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 100oC, VGS = -4.0V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 100oC, VGS = -2.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Technical Brief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . .T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. TJ = 25oC to 125oC.
2. 50oC/W measured using FR-4 board with 0.14 in2 (90.3 mm2) copper pad at 1 second.
3. 228oC/W measured using FR-4 board with 0.006 in2 (3.9 mm2) copper pad at 1000 second.
= 25oC, Unless Otherwise Specified
A
DSS
DGR
GS
DM
STG
pkg
ITF87072DK8T UNITS
-20 V
-20 V
±12 V
D D D D
D
L
6.0
6.0
1.5
1.5
Figure 4
2.5 20
-55 to 150
300 260
A A A A
W
mW/oC
o
C
o
C
o
C
1
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
SABER© is a Copyright of Analogy Inc. , PSPICE® is a registered trademark of MicroSim Corporation.
ITF87072DK8T
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV Zero Gate Voltage Drain Current I Gate to Source Leakage Current I
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V Drain to Source On Resistance r
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Ambient
SWITCHING SPECIFICATIONS (VGS = -2.5V) Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t SWITCHING SPECIFICATIONS (VGS = -4.5V) Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q Gate Charge at -2V Q Threshold Gate Charge Q Gate to Source Gate Charge Q Gate to Drain “Miller” Charge Q
CAPACITANCE SPECIFICATIONS
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C
DSSID DSS GSS
GS(TH)VGS
DS(ON)ID
VDS = -20V, VGS = 0V - - -1 µA VGS = ±12V - - ±10 uA
ID = 1.5A, VGS = -4.0V Figure 8 - 0.030 0.039 ID = 1.5A, VGS = -2.5V Figure 8 - 0.044 0.059
R
θJA
Pad Area = 0.14 in2(90.3 mm2) (Note 2) - - 50 Pad Area = 0.027 in2 (17.4 mm2) Figure 20 - - 191 Pad Area = 0.006 in2 (3.9 mm2) Figure 20 - - 228
d(ON)
VDD = -10V, ID = 1.5A VGS= -2.5V,
r
RGS = 10
d(OFF)
d(ON)
Figures 14, 18, 19
f
VDD = -10V, ID = 6.0A VGS= -4.5V,
r
RGS = 10
d(OFF)
g(TOT)VGS
g(-2)
g(TH)
ISS
Figures 15, 18, 19
f
VGS = 0V to -2V - 6 - nC VGS = 0V to -0.5V - 0.7 - nC
gs gd
VDS = -10V, VGS = 0V, f = 1MHz
OSS RSS
Figure 12
= 250µA, VGS = 0V Figure 11 -20 - - V
= VDS, ID = 250µA Figure 10 -0.5 - -1.5 V
= 6.0A, VGS = -4.5V Figures 8, 9 - 0.028 0.037
o
C/W
o
C/W
o
C/W
-13-ns
-85-ns
-55-ns
-62-ns
-9-ns
-72-ns
-81-ns
-82-ns
= 0V to -4.5V VDD = -10V,
-12-nC ID = 6.0A, I
= 1.0mA
g(REF)
Figures 13, 16, 17
- 2.5 - nC
- 3.5 - nC
- 1200 - pF
- 325 - pF
- 130 - pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V Reverse Recovery Time t Reverse Recovered Charge Q
2
SD rr RR
ISD = -6.0A - -0.85 - V ISD = -6.0A, dISD/dt = 100A/µs - 24 - ns ISD = -6.0A, dISD/dt = 100A/µs - 17 - nC
Typical Performance Curves
ITF87072DK8T
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
125
TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWERDISSIPATION vs AMBIENT
TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
1
0.5
0.2
0.1
0.05
0.02
0.1
0.01
-8
-6 VGS= -4.5V, R
θJA
= 50oC/W
-4
, DRAIN CURRENT (A)
-2
D
I
VGS= -2.5V, R
0
25 50 75 100 125 150
= 228oC/W
θJA
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
R
= 228oC/W
θJA
, NORMALIZED
0.01
θJA
Z
THERMAL IMPEDANCE
0.001
-5
10
-400
-100
-10
, PEAK CURRENT (A)
DM
I
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-1
-5
10
-4
10
VGS = -4.5V
-4
10
SINGLE PULSE
3
10
-2
10
-1
10
10
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
0
1
10
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
R
= 228oC/W
θJA
VGS = -2.5V
-3
10
-2
10
-1
10
t, PULSE WIDTH (s)
0
10
1
10
P
DM
t
1
t
2
1/t2
x R
θJA
+ T
θJA
A
2
10
TC = 25oC FOR TEMPERATURES
ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS:
150 - T
I = I
25
A
125
2
10
3
10
3
10
FIGURE 4. PEAK CURRENT CAPABILITY
3
Typical Performance Curves (Continued)
ITF87072DK8T
-200
-100
-10
, DRAIN CURRENT (A)
OPERATION IN THIS
D
I
AREA MAY BE LIMITED BY r
-1
-1 -10
DS(ON)
, DRAIN TO SOURCE VOLTAGE (V)
V
DS
SINGLE PULSE TJ = MAX RATED T
= 25oC
A
R
= 228oC/W
θJA
100µs
1ms
10ms
-50
-25
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
= 15V
V
DD
-20
-15
-10
DRAIN CURRENT (A)
D,
I
-5
TJ = 25oC
-0
-1.0 -1.5 -2.0 -2.5 -3.0
TJ = 150oC
TJ = -55oC
VGS, GATE TO SOURCE VOLTAGE (V)
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA FIGURE 6. TRANSFER CHARACTERISTICS
-25 TA = 25oC
-20
VGS = -4.5V
-15
-10
, DRAIN CURRENT (A)
D
I
-5
0
0 -0.5 -1.0 -1.5 -2.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
VGS = -3V
V
GS
VGS = -2V
VGS = -1.5V
= -2.5V
80
ID = -1.5A
60
ID = -6A
, DRAIN TO SOURCE
40
ON RESISTANCE (m)
DS(ON)
r
20
-1 -2 -3 -4 -5 , GATE TO SOURCE VOLTAGE (V)
V
GS
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
FIGURE 7. SATURATION CHARACTERISTICS FIGURE 8. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
1.6
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
1.4
1.2 VGS = -4.5V, ID = -6A
1.0
ON RESISTANCE
0.8
NORMALIZED DRAIN TO SOURCE
0.6
-80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
1.4
1.2
1.0
0.8
NORMALIZED GATE
THRESHOLD VOLTAGE
0.6
0.4
-80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
VGS = VDS, ID = -250µA
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
4
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