Intersil ITF87056DQT Datasheet

ITF87056DQT
Data Sheet March 2000
5A, 20V, 0.045 Ohm, Dual P-Channel,
2.5V Specified Power MOSFET Packaging
TSSOP-8
5
1
2
4
3
Symbol
DRAIN1(1)
OURCE1(2)
SOURCE1(3)
GATE1(4)
(8) DRAIN2 (7) SOURCE2 (6) SOURCE2 (5) GATE2
File Number 4813.2
Features
-r
-r
-r
= 0.045Ω, VGS= −4.5V
DS(ON)
= 0.048Ω, VGS= −4.0V
DS(ON)
= 0.077Ω, VGS= −2.5V
DS(ON)
• 2.5V Gate Drive Capability
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Switching Time vs R
GS
Curves
Ordering Information
PART NUMBER PACKAGE BRAND
ITF87056DQT TSSOP-8 87056
NOTE: When ordering, use the entire part number.ITF87056DQT2 is available only in tape and reel.
Absolute Maximum Ratings T
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
Continuous (TA = 25oC, VGS = -4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 25oC, VGS = -4.0V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 100oC, VGS = -4.0V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 100oC, VGS = -2.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief TB370. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
NOTES:
1. TJ = 25oC to 125oC.
2. 62.5oC/W measured using FR-4 board with 0.50 in2(322.6 mm2) copper pad at 1 second.
3. 230oC/W measured using FR-4 board with 0.0022 in2 (1.44 mm2) copper pad at 1000 seconds.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
= 25oC, Unless Otherwise Specified
A
DSS
DGR
GS
DM
STG
pkg
ITF87056DQT UNITS
-20 V
-20 V
±12 V
D D D D
D
L
5.0
5.0
3.0
2.5
Figure 4
2.0 16
-55 to 150
300 260
A A A A
W
mW/oC
o
C
o
C
o
C
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
SABER© is a Copyright of Analogy Inc. PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 321-724-7143
| Copyright © Intersil Corporation 2000
ITF87056DQT
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV Zero Gate Voltage Drain Current I Gate to Source Leakage Current I
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V Drain to Source On Resistance r
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Ambient
SWITCHING SPECIFICATIONS (VGS = -2.5V) Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t SWITCHING SPECIFICATIONS (VGS = -4.5V) Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q Gate Charge at -2V Q Threshold Gate Charge Q Gate to Source Gate Charge Q Gate to Drain “Miller” Charge Q
CAPACITANCE SPECIFICATIONS
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C
DSSID DSS GSS
GS(TH)VGS
DS(ON)ID
VDS = -20V, VGS = 0V - - -10 µA VGS = ±12V - - ±10 µA
ID = 3.0A, VGS = -4.0V Figure 8 - 0.039 0.048 ID = 2.5A, VGS = -2.5V Figure 8 - 0.057 0.077
R
θJA
Pad Area = 0.50 in2(322.6 mm2) (Note 2) - - 62.5oC/W Pad Area = 0.017 in2 (11.2 mm2) Figure 20 - - 199 Pad Area = 0.0022 in2 (1.44 mm2) Figure 20 - - 230
d(ON)
VDD = -10V, ID = 2.5A VGS= -2.5V,
r
RGS = 15
d(OFF)
d(ON)
Figures 14, 18, 19
f
VDD = -10V, ID = 5.0A VGS= -4.5V,
r
RGS = 16
d(OFF)
g(TOT)VGS
g(-2)
g(TH)
ISS
Figures 15, 18, 19
f
VGS = 0V to -2V - 4.1 - nC VGS = 0V to -0.5V - 0.5 - nC
gs
gd
VDS = -10V, VGS = 0V, f = 1MHz
OSS RSS
Figure 12
= 250µA, VGS = 0V Figure 11 -20 - - V
= VDS, ID = 250µA Figure 10 -0.5 - -1.5 V
= 5.0A, VGS = -4.5V Figures 8, 9 - 0.037 0.045
o
C/W
o
C/W
- 470 - ns
- 1240 - ns
- 700 - ns
- 775 - ns
- 225 - ns
- 470 - ns
- 1200 - ns
- 800 - ns
= 0V to -4.5V VDD = -10V,
- 8.6 - nC ID = 5.0A, I
= 1.0mA
g(REF)
Figures 13, 16, 17
- 1.2 - nC
- 1.8 - nC
- 750 - pF
- 215 - pF
- 100 - pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V Reverse Recovery Time t Reverse Recovered Charge Q
2
SD rr RR
ISD = -5.0A - -0.86 - V ISD = -5.0A, dISD/dt = 10A/µs - 40 - ns ISD = -5.0A, dISD/dt = 10A/µs-5-nC
Typical Performance Curves
ITF87056DQT
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
125
TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWERDISSIPATION vs AMBIENT
TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
1
0.5
0.2
0.1
0.05
0.02
0.1
0.01
, NORMALIZED
θJA
0.01
Z
THERMAL IMPEDANCE
0.001
-5
10
-4
10
SINGLE PULSE
-3
10
-2
10
t, RECTANGULAR PULSE DURATION (s)
-6
VGS= -4.5V, R
= 62.5oC/W
θJA
-4
-2
, DRAIN CURRENT (A)
D
I
VGS= -2.5V, R
0
25 50 75 100 125 150
= 230oC/W
θJA
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
R
= 230oC/W
θJA
P
DM
t
1
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-1
10
0
10
1
10
θJA
1/t2
x R
10
θJA
2
t
2
+ T
A
3
10
-300
-100
VGS = -4.5V
-10
, PEAK CURRENT (A)
DM
I
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
-1
-5
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
VGS = -2.5V
-4
10
-3
10
-2
10
-1
10
0
10
t, PULSE WIDTH (s)
FIGURE 4. PEAK CURRENT CAPABILITY
3
R
= 230oC/W
θJA
FOR TEMPERATURES ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I = I
1
10
150 - T
25
10
125
2
TC = 25oC
A
3
10
Typical Performance Curves (Continued)
ITF87056DQT
-100
-10
-1 , DRAIN CURRENT (A) I
OPERATION IN THIS AREA MAY BE
D
LIMITED BY r
R
θJA
-0.1
-1 -10
DS(ON)
= 230oC/W
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
SINGLE PULSE TJ = MAX RATED T
= 25oC
A
100ms
1ms
10ms
-40
-15
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
V
= 15V
DD
-12
-9
-6
DRAIN CURRENT (A)
D,
I
-3
0
-0.5 -1.0 -1.5 -2.0 -2.5
TJ = 150oC
TJ = -55oC
TJ = 25oC
VGS, GATE TO SOURCE VOLTAGE (V)
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA FIGURE 6. TRANSFER CHARACTERISTICS
-15 VGS = -4.5V
-12
VGS = -3V
-9
-6
, DRAIN CURRENT (A)
D
I
-3
0
0 -0.5 -1.0 -1.5 -2.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
V
GS
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
= -2.5V
TA = 25oC
VGS = -2V
VGS = -1.5V
100
90
80
70
ID = -2.5A
60
, DRAIN TO SOURCE
50
ON RESISTANCE (m)
DS(ON)
r
40
30
-1 -2 -3 -4 -5
ID = -5A
, GATE TO SOURCE VOLTAGE (V)
V
GS
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
FIGURE 7. SATURATION CHARACTERISTICS FIGURE 8. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
1.6
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
0.8
ON RESISTANCE
0.6
NORMALIZED DRAIN TO SOURCE
0.4
-80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
VGS = -4.5V, ID = -5A
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
1.4
1.2
1.0
0.8
NORMALIZED GATE
THRESHOLD VOLTAGE
0.6
0.4
-80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
VGS = VDS, ID = -250µA
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGEvs
JUNCTION TEMPERATURE
4
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