Intersil ITF87008DQT Datasheet

ITF87008DQT
Data Sheet March 2000
7.0A, 20V, 0.023 Ohm, Dual N-Channel,
2.5V Specified Power MOSFET Packaging
TSSOP-8
5
1
2
4
3
Symbol
DRAIN1(1) SOURCE1(2) SOURCE1(3)
GATE1(4)
(8) DRAIN2 (7) SOURCE2 (6) SOURCE2 (5) GATE2
File Number 4814.2
Features
-r
-r
-r
= 0.023Ω, VGS= 4.5V
DS(ON)
= 0.024Ω, VGS= 4.0V
DS(ON)
= 0.029Ω, VGS= 2.5V
DS(ON)
• 2.5 Volt Gate Drive Capability
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Switching Time vs R
GS
Curves
Ordering Information
PART NUMBER PACKAGE BRAND
ITF87008DQT TSSOP-8 87008
NOTE: When ordering, use the entirepart number. ITF87008DQT2 is available only in tape and reel.
Absolute Maximum Ratings T
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain Current
Continuous (TA = 25oC, VGS = 4.5V) (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 25oC, VGS = 4.0V) (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 100oC, VGS = 4.0V) (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA = 100oC, VGS = 2.5V) (Note 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief TB370. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
NOTES:
1. TJ = 25oC to 125oC.
2. 62.5oC/W measured using FR-4 board with 0.50 in2(322.6 mm2) copper pad at 1 second.
3. 230oC/W measured using FR-4 board with 0.0022 in2 (1.44 mm2) copper pad at 1000 seconds.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
= 25oC, Unless Otherwise Specified
A
DSS
DGR
GS
DM
STG
pkg
ITF87008DQT UNITS
20 V 20 V
±12 V
D D D D
D
L
7.0
7.0
2.0
2.0
Figure 4
2.0 16
-55 to 150
300 260
A A A A
W
mW/oC
o
C
o
C
o
C
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
SABER© is a Copyright of Analogy Inc. PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 321-724-7143
| Copyright © Intersil Corporation 2000
ITF87008DQT
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV Zero Gate Voltage Drain Current I Gate to Source Leakage Current I
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V Drain to Source On Resistance r
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Ambient
SWITCHING SPECIFICATIONS VGS = 2.5V Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t SWITCHING SPECIFICATIONS VGS = 4.5V Turn-On Delay Time t Rise Time t Turn-Off Delay Time t Fall Time t
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q Gate Charge at 2V Q Threshold Gate Charge Q Gate to Source Gate Charge Q Gate to Drain “Miller” Charge Q
CAPACITANCE SPECIFICATIONS
Input Capacitance C Output Capacitance C Reverse Transfer Capacitance C
DSSID DSS GSS
GS(TH)VGS
DS(ON)ID
VDS = 20V, VGS = 0V - - 10 µA VGS = ±12V - - ±10 µA
ID = 2.0A, VGS = 4.0V Figure 8 - 0.018 0.024 ID = 2.0A, VGS = 2.5V Figure 8 - 0.022 0.029
R
θJA
Pad Area = 0.50 in2(322.6 mm2) (Note 2) - - 62.5oC/W Pad Area = 0.017 in2 (11.2 mm2) Figure 20 - - 199 Pad Area = 0.0022 in2 (1.44 mm2) Figure 20 - - 230
d(ON)
VDD = 10V, ID = 2.0A VGS= 2.5V,
r
RGS = 12
d(OFF)
d(ON)
Figures 14, 18, 19
f
VDD = 10V, ID = 7.0A VGS= 4.5V,
r
RGS = 13
d(OFF)
g(TOT)VGS
g(2)
g(TH)
ISS
Figures 15, 18, 19
f
VGS = 0V to 2.0V - 5.7 - nC VGS = 0V to 0.5V - 0.5 - nC
gs
gd
VDS = 10V, VGS = 0V, f = 1MHz
OSS RSS
Figure 12
= 250µA, VGS = 0V Figure 11 20 - - V
= VDS, ID = 250µA Figure 10 0.5 - 1.5 V
= 7.0A, VGS = 4.5V Figures 8,9 - 0.017 0.023
o
C/W
o
C/W
- 110 - ns
- 475 - ns
- 180 - ns
- 265 - ns
-60-ns
- 185 - ns
- 300 - ns
- 280 - ns
= 0V to 4.5V VDD = 10V,
- 9.7 - nC ID = 7.0A, I
= 1.0mA
g(REF)
Figures 13, 16, 17
- 1.1 - nC
- 2.9 - nC
- 980 - pF
- 300 - pF
- 160 - pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V Reverse Recovery Time t Reverse Recovered Charge Q
2
SD rr RR
ISD = 7.0A - 0.83 - V ISD = 7.0A, dISD/dt = 15A/µs - 44 - ns ISD = 7.0A, dISD/dt = 15A/µs - 2.2 - nC
Typical Performance Curves
ITF87008DQT
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
125
TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT
TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
1
0.5
0.2
0.1
0.05
0.02
0.1
0.01
, NORMALIZED
θJA
Z
0.01
THERMAL IMPEDANCE
0.001
-5
10
-4
10
10
-3
SINGLE PULSE
-2
10
t, RECTANGULAR PULSE DURATION (s)
8
6
VGS= 4.5V, R
= 62.5oC/W
θJA
4
, DRAIN CURRENT (A)
D
2
I
VGS= 2.5V, R
= 230oC/W
θJA
0
25
50 75 100 125 150
TA, AMBIENT TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
AMBIENT TEMPERATURE
R
θJA
P
DM
t
1
NOTES: DUTY FACTOR: D = t
PEAK TJ = PDM x Z
-1
10
0
10
1
10
θJA
1/t2
x R
10
θJA
2
+ T
= 230oC/W
t
2
A
3
10
400
100
, PEAK CURRENT (A)
DM
I
VGS = 4.5V
10
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
2
-5
10
VGS = 2.5V
-4
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
R
= 230oC/W
θJA
-3
10
-2
10
-1
10
0
10
10
t, PULSE WIDTH (s)
FIGURE 4. PEAK CURRENT CAPABILITY
3
TC = 25oC FOR TEMPERATURES ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
I = I
1
150 - T
25
125
2
10
A
3
10
Typical Performance Curves (Continued)
ITF87008DQT
200 100
10
OPERATION IN THIS AREA MAY BE
1
, DRAIN CURRENT (A)
LIMITED BY r
D
I
R
= 230oC/W
0.1
θJA
V
DS
DS(ON)
, DRAIN TO SOURCE VOLTAGE (V)
SINGLE PULSE TJ = MAX RATED
= 25oC
T
A
10 401
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
25
20
15
VGS = 4.5V V
= 3.0V
GS
V
= 2.5V
GS
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
TA = 25oC
VGS = 2.0V
100µs
1ms
10ms
25
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
V
= 15V
DD
20
15
10
DRAIN CURRENT (A)
D,
I
5
0
0.5 1.0 1.5 2.0 2.5 VGS, GATE TO SOURCE VOLTAGE (V)
TJ = 150oC
TJ = -55oC
TJ = 25oC
FIGURE 6. TRANSFER CHARACTERISTICS
40
35
30
ID = 1A
ID = 7A
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
10
, DRAIN CURRENT (A)
D
I
5
VGS = 1.5V
0
0 0.5 1.0 2.0
VDS, DRAIN TO SOURCE VOLTAGE (V)
1.5
25
, DRAIN TO SOURCE
ON RESISTANCE (m)
20
DS(ON)
r
15
12345
, GATE TO SOURCE VOLTAGE (V)
V
GS
FIGURE 7. SATURATION CHARACTERISTICS FIGURE 8. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
1.6
PULSE DURATION = 80µs DUTY CYCLE = 0.5% MAX
1.4
1.2
1.0
ON RESISTANCE
0.8
NORMALIZED DRAIN TO SOURCE
0.6
-80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
VGS = 4.5V, ID = 7A
1.4
1.2
1.0
0.8
NORMALIZED GATE
THRESHOLD VOLTAGE
0.6
0.4
-80 -40 0 40 80 120 160 TJ, JUNCTION TEMPERATURE (oC)
VGS = VDS, ID = 250µA
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
4
FIGURE 10. NORMALIZED GATETHRESHOLD VOLTAGEvs
JUNCTION TEMPERATURE
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