The ISL97635 is a digitally controlled LED driver that
controls 8 channels of LED current for LCD backlight
applications. The ISL97635 is capable of driving typically 72
(8x9) pieces of 3.5V/30mA or 80 (8x10) pieces of
3.2V/20mA LEDs. The ISL97635’s 8 channels of voltage
controlled current sources with typical currents matching of
±1%, which compensate for the non-uniformity effect of
forward voltages variance in the LED stacks. T o minimize the
voltage headroom and power loss in the typical multi-strings
operation, the ISL97635 features a dynamic headroom
control that monitors the highest LED forward voltage string
and uses its feedback signal for output regulation.
The LED dimming control can be achieved through a
SMBus, an external PWM, or a variable DC (analog light
sensor) input. SMBus controlled dimming allows 256 levels
each of PWM and DC current adjustments. The SMBus
PWM dimming frequency can be adjusted from 100Hz to
5kHz by an external capacitor. External PWM input allows up
to 20kHz audio noise free PWM dimming. The SMBus PWM
setting and an external PWMI signal can also be combined
to provide a dynamic PWM dimming that complies with
Intel’s DPST (Display Power Saving Technology)
requirement.
One or more channels can be selected sequentially in any
order, allowing scrolling in RGB LED backlighting
applications.
The ISL97635 features extensi v e protection functions that
include string open and short circuit detections, OVP, OTP,
thermal shutdown and an optional input overcurrent
protection with master fault disconnect switch. The fault
conditions will be recorded in the Fault/Status register. There
are selectable short-circuit thresholds and the switching
frequency can be programmed between 600kHz and
1.2MHz.
Available in the 24 Ld 4mmx4mm QFN, the ISL97635
operates from -40°C to +85°C with input voltage ranging
from 6V to 24V.
- String Short Circuit Detection with Select able Thresho lds
- Over-Temperature Protection
- Overvoltage Protection
- Input Overcurrent Protection with Disconnect Switch
• 600kHz/1.2MHz Selectable f
SW
• Selectable Channels Allows Scrolling Backlight
• 24 Ld (4mmx4mm) QFN Package
• Pb-Free (RoHS compliant)
Applications
• Notebook Displays WLED or RGB LED Backlighting
• LCD Monitor LED Backlighting
• Automotive Displays LED Backlighting
• Automotive or Traffic Lighting
Ordering Information
PART NUMBER
(Note)
ISL97635IRZ*976 35IRZ24 Ld 4x4 QFNL24.4x4D
*Add “-T” or “-TK” suffix for tape and reel. Please refer to TB347 for
details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
PART
MARKING
PACKAGE
(Pb-free)
PKG.
DWG. #
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2008. All Rights Reserved
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: T
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See T ech
1. θ
JA
Brief TB379.
2. For θ
3. PSI
, the “case temp” location is the center of the exposed metal pad on the package underside.
JC
is the PSI junction-to-top thermal characterization parameter. If the package top temperature can be measured with this rating then the
JT
die junction temperature can be estimated more accurately than the θ
4. Limits established by characterization and are not production tested.
Electrical SpecificationsAll specifications below are tested at T
unless otherwise noted. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise
specified. Temperature limits established by characterization and are not production tested.
ILX_leakageLx Leakage CurrentVLX = 36V, EN = 010µA
REFERENCE
I
MATCH
I
ACC
Channel-to-Channel Current Matching I
= 30mA, BRT = 255-3.5±1+3.5%
OUT
Current Accuracy±3%
FAULT DETECTION
V
SC
Short Circuit Threshold AccuracyReg0x08 = 0x0F or 0x0B
7.888.8V
Reg0x00 = 0xFF
Reg0x08 = 0x0E or 0x0A
2.83.13.8V
Reg0x00 = 0xFF
V
temp_acc
V
OVPlo
OVP
OVP
hys
fault
Over-Temperature Threshold Accuracy5°C
Overvoltage Limit on OVP Pin1.171.21.23V
OVP Hysteresis20mV
OVP Short Detection Fault Level300mV
SMBus INTERFACE
VILGuaranteed Range for Data, Clock Input Low Voltage0.8V
VIHGuaranteed Range for Data, Clock Input High Voltage2.1VDDV
VOLSMBus Data Line Logic Low Voltage with 1.1kΩ series
resistor from data bus to SMBDAT pin
SMBus Data Line Logic Low Voltage without series resistor
from data bus to SMBDAT pin
I
LEAK
V
DD
Input Leakage On SMBData/SMBClk-11µA
Nominal Bus Voltage3V to 5V ±10%2.75.5V
I
= 350µA0.4V
PULLUP
= 4mA0.17V
I
PULLUP
SMBus TIMING SPECIFICATIONS (Note 4)
f
SMB
t
BUF
t
HD:STA
SMBus Clock Frequency10100kHz
Bus Free Time Between Stop and Start Condition4.7µs
Hold Time After (Repeated) START Condition. After this
Electrical SpecificationsAll specifications below are tested at T
unless otherwise noted. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise
= -40°C to +85°C; VIN = 12V, EN = 5V, R
A
= 36.6kΩ,
SET
specified. Temperature limits established by characterization and are not production tested. (Continued)
PARAMETERDESCRIPTIONCONDITIONMINTYPMAXUNIT
t
HD:DAT
t
SU:DAT
t
LOW
t
HIGH
t
F
t
R
Data Hold Time300ns
Data Setup Time250ns
Clock Low Period4.7µs
Clock High Period4.050µs
Clock/data Fall Time300ns
Clock/data Rise Time1000ns
GENERAL TIMING SPECIFICATIONS (Note 4)
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
t
11
Minimum Setup Time Between VIN Rising above VUVLO
with EN = 1 and SMBus Communications
Minimum Setup Time Between EN Going High with VIN
above VUVLO and SMBus Communications
Minimum Time Between VIN Rising above VUVLO with
EN = 1 to SMBus BL CTRL On
Minimum Time Between EN Going High with VIN above
VUVLO to SMBus BL CTRL On
Minimum Time for LED Output to Respond to SMBus Data at
any Levels
Response Time Between Backlight CTRL Off with Boost
Not Switching to Backlight CTRL On with Boost Switching
Response Time Between Backlight CTRL On with Boost
Switching to Backlight CTRL Off with Boost Not Switching
LED Channel Short Circuit Fault Detection to Status
Register Data Ready
V
Short Circuit Detection During Operation to
OUT-GND
Status Register Data Ready
Time Between VIN Rising Above VUVLO with EN = 1 and
V
Short being Reported in Status Register
OUT-GND
Time Between EN Going High with VIN Above VUVLO and
a V
OUT-GND
Short being Reported in Status Register
EN = 1, TA = +25°C, VDC
80µs
capacitor < 10µF
VIN > VUVLO, TA= +25°C,
80µs
VDC capacitor < 10µF
EN = 1, TA = +25°C4.5ms
VIN > VUVLO, TA = +25°C4.5ms
VIN > VUVLO, EN = 1,
T
= +25°C
A
VIN > VUVLO, EN = 1,
T
= +25°C
A
VIN > VUVLO, EN = 1,
T
= +25°C
A
VIN > VUVLO, EN = 1,
T
= +25°C, LEDs Active
A
VIN > VUVLO, EN = 1,
T
= +25°C, Fault FET used
A
EN = 1, VDC capacitor < 10µF,
5µs
5µs
5µs
6ms
5µs
30ms
TA = +25°C, Fault FET used.
> VUVLO, VDC capacitor <
V
IN
10µF, T
used.
= +25°C, Fault FET
A
30ms
CURRENT SOURCES
V
headroom
V
RSET
ILEDmaxMaximum LED Current per ChannelR
Dominant Channel Current Source Headroom at IIN PinI
Voltage at RSET PinR
= 20mA, TA = +25°C100mV
LED
= 36.6kΩ680700720mV
SET
= 20.9kΩ35mA
SET
PWM GENERATOR
FPWMGenerated PWM FrequencyC
DPWMDuty Cycle Of Generated PWM (DC-to-PWM)V
= 27nF
FPWM
C
= 220nF
PWMO
= 0.3V
PWMO
CFPWM = 27nF
= 1.1V
V
PWMO
CFPWM = 27nF
200Hz
90%
10%
tMAX_PWM_OFF Maximum P WMI Off Time B efore Sh u tdownEN/PWMI toggles28ms
6
FN6434.2
December 22, 2008
ISL97635
Electrical SpecificationsAll specifications below are tested at T
unless otherwise noted. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise
= -40°C to +85°C; VIN = 12V, EN = 5V, R
A
= 36.6kΩ,
SET
specified. Temperature limits established by characterization and are not production tested. (Continued)
PARAMETERDESCRIPTIONCONDITIONMINTYPMAXUNIT
FAULT PIN
I
FAULT
V
FAULT
Fault Pull-down CurrentVIN = 12V101830µA
Fault Clamp Voltage with Respect to V
IN
VIN = 12, VIN-V
FAULT
7.5V
IlxStart-upLx Start-up CurrentVDC = 5.2V12.77mA
Typical Performance Curves
92
7S6P - 18V
90
88
86
84
82
80
78
76
EFFICIENCY (%)
74
72
70
68
66
020406080 100 120 140 160 180
9S6P - 6V
9S8P - 6V
7S8P - 6V
7S8P - 6V
9S6P - 12V
7S6P - 6V
9S8P - 12V
7S8P - 12V
7S6P - 12V
(mA)
I
O
9S8P - 18V
7S8P - 18V
9S6P - 18V
L = 8.2µH
IHLP-2525BD-01
DCR = 106mΩ
I
= 3A
SAT
FIGURE 2. EFFICIENCY, L = 8.2µH WITH DCR = 106mΩ,
C
= 4x4.7µF/50V
O
92
90
7S6P - 18V
88
86
84
82
80
78
76
74
EFFICIENCY (%)
72
70
68
9S8P - 6V
66
020406080 100 120 140 160 180
7S6P - 6V
7S8P - 6V
7S8P - 6V
9S6P - 6V
9S8P - 12V
9S6P - 18V
9S6P - 12V
IO (mA)
9S8P - 18V
7S6P - 12V
7S8P - 12V
7S8P - 18V
L = 10µH
IHLP-2525BD-01
DCR = 129mΩ
I
= 2.5A
SAT
FIGURE 3. EFFICIENCY, L = 10µH WITH DCR = 129mΩ,
CO= 4x4.7µF/50V
92
7S8P - 12V
90
7S6P - 12V
88
86
84
82
80
78
76
74
EFFICIENCY (%)
72
70
68
66
9S8P - 12V
9S8P - 6V
020406080 100 120 140 160 180
7S6P - 18V
9S8P - 18V
7S8P - 6V
7S8P - 6V
9S6P - 6V
9S6P - 18V
9S6P - 12V
7S6P - 6V
(mA)
I
O
7S8P - 18V
L = 10µH
DCR = ~500mΩ
<1mm HEIGHT
FIGURE 4. 3 EFFICIENCY, L = 10µH WITH DCR = 500mΩ,
1mm, C
= 4µFx4.7µF/50V
O
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
CURRENT VARIATION (%)
-0.8
-1.0
-1.2
46810 12 14 16 18 20 22 24 26
20mA
(V)
V
IN
FIGURE 5. CURRENT REGULATION
7
FN6434.2
December 22, 2008
Typical Performance Curves (Continued)
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
CURRENT MATCHING (%)
-1.5
-2.0
CH 0 CH 1 CH 2 CH 3 CH 4 CH 5 CH 6 CH 7
6V/1mA
FIGURE 6. CHANNEL-TO-CHANNEL CURRENT MATCHING
180
8 CHANNELS
9 LEDS PER CHANNEL
160
140
120
100
80
60
40
TOTAL OUTPUT CURRENT (mA)
20
0
0 102030405060708090100
FIGURE 8. PWM DIMMING LINEARITYFIGURE 9. LX, VIIN, IL AND I
12V/1mA
12V/20mA
6V/20mA
CHANNELS
VIN = 6V
VIN = 12V
VIN = 18V
PWM DUTY CYCLE (%)
ISL97635
1.0
0.9
0.8
0.7
0.6
CURRENT MATCHING (%)
0.5
0 102030405060708090100
1kHz
100kHz
20kHz
200kHz
10kHz
PWM DUTY CYCLE (%)
VIN = 12V
FIGURE 7. CURRENT MATCHING vs DUTY CYCLE vs
DIMMING FREQUENCY
AT PWM DIMMING
O
FIGURE 10. I
AT 50% PWM DIMMING
L
8
FIGURE 11. I
ZOOM IN AT PWM DIMMING ZOOM IN
L
December 22, 2008
FN6434.2
Typical Performance Curves (Continued)
ISL97635
FIGURE 12. LX AT 50% PWM DIMMING
FIGURE 14. RIPPLE VOLTAGE
FIGURE 13. LX ZOOM IN AT 50% DIMMING
FIGURE 15. I
AT 50% PWM DIMMING
LED
FIGURE 16. RIPPLE VOLTAGE ZOOM IN
9
FN6434.2
December 22, 2008
Pinout
SMBCLK
SMBDAT
PWMO
PWMI/EN
FPWM
GND
1
2
3
4
5
6
Pin Descriptions (I = Input, O = Output, S = Supply)
ISL97635
ISL97635
(24 LD QFN)
TOP VIEW
VDC
VIN
COMP
FAULT
LX
LX
24 23 22 21 20 19
789101112
IIN7
IIN6
IIN5
IIN4
RSET
IIN3
PGND
18
PGND
17
OVP
16
IIN0
15
IIN1
14
IIN2
13
PINNAMETYPEDESCRIPTION
1SMBCLKISMBus serial clock input
2SMBDATI/OSMBus serial data input and output
3FPWMIConnect a capacitor between FPWM and GND to set the DPWM frequency. FPWM = 5.4µ/C
If SMBus PWM or DPST mode is used, connect C
connect C
connect C
between V
PWMO
to set the dimming frequency and apply a 0.21V to 1.21V at V
FPWM
and GND pins for DPST operation. If DC-to-PWM mode is used,
PWMO
to GND to set the dimming frequency. Also,
FPWM
.
PWMO
FPWM
4PWMOI/OPWMI buffered output. If one connects a capa citor betwee n PWMO and GND, it forms a lo w pass filter
with an internal 40kΩ resistor , which filters the PWMI signal for DPST operation when Reg 0x01 = 0x01.
If one applies a 0.2V to 1.2V DC input voltage, the output w ill be PWM with duty cycle proportional to the
DC input.
5GNDSAnalog GND and LED power return
6PWMI/ENIDual Functions: Enable pin and PWM brightness control pin or DPST control input. DO NOT let
PWMI/EN floating. The device needs 4ms for initial power-up Enable, then this pin can be applied with
a PWM signal with off-time no longer than 28ms.
7IIN7IInput 7 to current source, FB, and monitoring
8IIN6IInput 6 to current source, FB, and monitoring
9IIN5IInput 5 to current source, FB, and monitoring
10IIN4IInput 4 to current source, FB, and monitoring
11RSETIResistor connection for setting LED current, (see Equation 1 for calculating the I
LEDmax
)
12IIN3IInput 3 to current source, FB, and monitoring
13IIN2IInput 2 to current source, FB, and monitoring
14IIN1IInput 1 to current source, FB, and monitoring
15IIN0IInput 0 to current source, FB, and monitoring
16OVPIOvervoltage protection input
17, 18PGNDSPower ground (LX Power return)
19, 20LXIInput to boost switch
21FAULTOFault disconnect switch
10
FN6434.2
December 22, 2008
ISL97635
Pin Descriptions (I = Input, O = Output, S = Supply) (Continued)
PINNAMETYPEDESCRIPTION
22COMPOBoost compensation pin
23VINSInput voltage for the device and LED power
24VDCSDe-couple capacitor for internally generated supply rail. If 2.7V < VBL+ < 5.5V , apply VDC directly with
a supply voltage of 2.7V to 5.5V
Theory of Operation
PWM Boost Converter
The current mode PWM boost converter produces the
minimal voltage needed to enable the LED stack with the
highest forward voltage drop to run at the programmed
current. The ISL97635 employs current mode control boost
architecture that has a fast current sense loop and a slow
voltage feedback loop. Such architecture achieves a fast
transient response that is essential for the notebook
backlight application where the power can be a series of
drained batteries or instantly change to an AC/DC adapter
without rendering a noticable visual nuisance. The number
of LEDs that can be driven by ISL97635 depends on the
type of LED chosen in the application. The ISL97635 is
capable of boosting up to 34.5V and typically driving 9 LEDs
in series for each of the 8 channels, enabling a total of 72
pieces of the 3.5V/30mA type of LEDs.
+
REF
REF
-
RSET
RSET
PWM DIMMING
DC DIMMING
FIGURE 17. SIMPLIFIED CURRENT SOURCE CIRCUIT
+
+
-
-
+
+
-
-
Enable and PWMI
The EN/PWMI pin serves dual purposes; it is used as an
Enable signal and can be used as a PWM input signal for
dimming. If a PWM signal is applied to this pin, the first pulse of
minimum 40µs will be used as an Enable signal. If there is no
signal for longer than 28ms, the device will enter shutdown. The
EN/PWMI pin cannot be floating thus a 10kΩ pull-down resistor
may need to be added.
Current Matching and Current Accuracy
Each channel of the LED current is regulated by the current
source circuit, as shown in Figure 17.
The LED peak current is set by translating the R
to the output with a scaling factor of 733/R
SET
terminals of the current source MOSFETs are designed as
100mV to minimize the power loss. The sources of errors of
the channel-to-channel current matching come from the
op amp’s offset, internal layout, reference, and current
source resistors. These parameters are optimized for current
matching and absolute current accuracy. On the other hand,
the absolute accuracy is additionally determined by the
external R
, and therefore, additional tolerance will be
SET
contributed by the current setting resistor. A 1% tolerance
resistor is therefore recommended.
current
SET
. The source
Dynamic Headroom Control
The ISL97635 features a proprietary Dynamic Headroom
Control circuit that detects the highest forward voltage string
or effectively the lowest voltage from any of the IIN pins.
When this lowest I
threshold, V
SC
voltage is lower than the short circuit
IN
, such voltage will be used as the feedback
signal for the boost regulator. The boost makes the output to
the correct level such that the lowest IIN pin is at the target
headroom voltage. Since all LED stacks are connected to
the same output voltage, the other IIN pins will have a higher
voltage, but the regulated current source circuit on each
channel will ensure that each channel has the same
programmed current. The output voltage will regulate
cycle-by-cycle and is always referenced to the highest
forward voltage string in the architecture.
Dimming Controls
The ISL97635 allows two ways of controlling the LED
current, and therefore, the brightness. They are:
1. DC current adjustment
2. PWM chopping of the LED current defined in Step 1.
There are various ways to achieve DC or PWM current
control, which will be described in the following.
11
FN6434.2
December 22, 2008
ISL97635
MAXIMUM DC CURRENT SETTING
The initial brightness should be set by choosing an
appropriate value for R
. This should be chosen to fix the
SET
maximum possible LED current, as shown in Equation 1:
733
I
LEDmax
=
---------------
R
SET
(EQ. 1)
DC CURRENT ADJUSTMENT
Once R
is fixed, the LED DC current can be adjusted
SET
through Register 0x07 (BRTDC), as shown in Equation 2:
I
LED
2.87 BRTDC R
⁄×=
SET
(EQ. 2)
BRTDC can be programmed from 0 to 255 in decimal and
defaults to 255 (0xFF). If left at the default value, LED
current will be fixed at I
. BRTDC can be adjusted
LEDmax
dynamically on the fly during operation. BRTDC = 0
disconnects all channels and I
is guaranteed to be <10µA
LED
at this state.
For example, if the maximum required LED current (I
LEDmax
is 20mA, rearranging Equation 1 yields Equation 3:
R
733 0.02⁄36.6kΩ==
SET
(EQ. 3)
If BRTDC is set to 200 then:
I
2.87 200 36600 15.4mA=ڥ=
LED
(EQ. 4)
PWM CONTROL
The ISL97635 provides four different PWM dimming
methods, as described in the following. Each of these
methods results in PWM chopping of the current in the LEDs
for all 8 channels to provide an average LED current. During
the On periods, the LED current will be defined by the value
of R
and BRTDC, as described in Equations 1 and 2. The
SET
source of the PWM signal can be described as follows:
1. Internally generated 256 step duty cycle programmed
through the SMBus.
2. External signal from PWMI.
3. DPST mode. Internally generated signal with a duty cycle
defined by the product of the external PWMI and SMBus
programmed PWM at the internal setting frequency.
4. DC-to-PWM control.
The default PWM dimming is in DPST mode. In all four
methods, the average LED current of each channel is
controlled by I
and the PWM duty cycle in percent, as
LED
shown in Equation 5:
I
LED ave()ILED
PWM×=
(EQ. 5)
Method 1 (Internal Mode, SMBus controlled PWM)
The average LED current of each channel is controlled by the
internally generated PWM signal, as shown in Equation 6:
I
LED ave()ILED
BRT 255⁄()×=
(EQ. 6)
where BRT is the PWM brightness level programmed in the
Register 0x00. BRT ranges from 0 to 255 in decimal and
defaults to 255 (0xFF). BRT = 0 disconnects all channels
and I
is guaranteed to be <10µA in this state.
LED
To use only the SMBus controlled PWM brightness control,
users need to set Register0x01 to 0x05 with EN/PWMI in
logic high.
The SMBus controlled PWM frequency is adjusted by a
capacitor at the FPWM pin, which will be described in “PWM
Dimming Frequency Adjustment” on page 13.
Method 2 (External Mode)
The average LED current of each channel can also be
controlled by an external PWMI signal, as shown in Equation 7:
)
I
LED ave()ILED
PWMI×=
(EQ. 7)
The PWM dimming frequency can be for example 20kHz but
there are a minimum on and off time requirements such that
the dimming will be in the range of 10% to 99.5%. If the
dimming frequency is below 5kHz, the dimming range can
be 1% to 99.5%. The PWM dimming off time cannot be
longer than 28ms or else the driver will enter shutdown.
To use PWMI only brightness control, users need to set
Register 0x01 to 0x03.
Method 3 (DPST Mode)
The average LED current of each channel can also be
controlled by the product of the SMBus controlled PWM and
the external PWMI signals as:
I
LED ave()ILED
xPWM
=
DPST
(EQ. 8)
Where:
PWM
DPST
BRT 255⁄PWMI×=
(EQ. 9)
Therefore:
I
LED ave()ILED
BRT 255⁄×PWMI×=
(EQ. 10)
Where BRT is the value held in Register 0x00 (default
setting 0xFF) controlled by SMBus and PWMI is the duty
cycle of the incoming PWMI signal. In this way, the users can
change the PWM current in ratiometric manner to achieve
DPST compliance backlight dimming.
To use the DPST mode, users need to set Register 0x01 to
0x01 with external PWM signal.
12
The DPST mode PWM frequency is adjusted by a capacitor at
the FPWM pin. A C
capacitor , is also needed in the
PWMO
FN6434.2
December 22, 2008
ISL97635
PWMO pin for DPST mode operation which will be described
in “PWM Dimming Frequency Adjustment” on page 13.
For example, if the SMBus controlled PWM duty is 80%
dimming at 200Hz (see C
Equation 12) and the
FPWM
external PWMI duty cycle is 60% dimming at 1kHz, the
resultant PWM duty cycle is 48% dimming at 200Hz.
Method 4 (Analog Mode, DC-to-PWM Mode)
By overdriving the PWMO pin with a DC voltage between
0.21V and 1.21V, the average LED current of each channel
is controlled by the internally generated PWM signal, as
shown in Equation 11:
I
LED ave()ILED
BRT 2551V PWMO()0.21–()–()×⁄×=
(EQ. 11)
Where BRT is the value held in Register 0x00 (default
setting 0xFF). The PWMO pin is internally driven to 0.21V
via a 40kΩ resistor when the EN/PWMI pin is in logic high,
any overdrive circuit will need to be able to drive up to 40µA
in order to overcome this.
The DC-to-PWM controlled PWM frequency is adjusted by a
capacitor at the FPWM pin, which will be described in “PWM
Dimming Frequency Adjustment” on page 13.
For example, if PWMO is applied with a DC voltage ≥ 1.21V,
the output will be zero. On the other hand, if the PWMO is
applied with a DC voltage ≤ 0.21V, the PWM duty cycle will
be at its maximum. If the PWMO pin is applied with a DC
voltage of 0.31V, the PWM duty cycle will be at 90% at
200Hz if C
FPWM
= 27nF.
PWM Dimming Frequency Adjustment
(Applicable to SMBus controlled PWM, DPST, and
DC-to-PWM Modes)
Except for the external PWM dimming mode where the
frequency follows the external signals, the dimming
frequencies of the other modes are set by an external
capacitor C
C
FPWM
where FPWM is the desirable PWM dimming frequency.
For example, if FPWM = 200Hz, C
The PWM dimming frequency can be for example 20kHz but
there are a minimum on and off time requirements such that
the dimming will be in the range of 10% to 99.5%. If the
dimming frequency is below 5kHz, the dimming range can
be 1% to 99.5%.
In the DPST and DC-to-PWM modes, a C
also needed. An internal 40kΩ and an external C
PWMO pin form a low pass network to filter the PWMI to an
averaged DC. As a result, the time constant of the 40kΩ and
at the FPWM pin, as shown in Equation 12:
FPWM
5.4μ FFPWM⁄=
= 5.4µF/200 = 27nF
FPWM
PWMO
(EQ. 12)
capacitor is
at the
PWMO
C
should be significantly larger than the external PWMI
PWMO
period, t, such that Equation 13 will show:
40kΩ x C
For example, if F
PWMO
>t
is 200Hz and an external PWMI is
PWM
1kHz and above, a 220nF C
can be chosen that allows
PWMO
(EQ. 13)
the external PWMI signal to be filtered as an averaged DC.
Also, the F
frequency in the DPST mode should be
PWM
limited between 100Hz to 2kHz and at least five times
smaller than the external PWMI frequency when DPST
mode is used.
Switching Frequency
An internal clock of 1.2MHz is used for the boost regulator
control of the LX pin in default. There are 2 levels of
switching frequencies: 600kHz or 1.2MHz. Each can be
programmed in the Configuration Register 0x08 bit 2. The
default switching frequency is at 1.2MHz.
5V Low Dropout Regulator
A 5.2V LDO regulator is present at the VDC pin to develop the
necessary low voltage supply, which is used by the chips
internal control circuitry. Because VDC is an LDO pin, it
requires a bypass capacitor of 1µF or more for the regulation.
For applications with an input voltage ≤ 5.5V, VIN and VDC
pins can be connected together . Low input voltage also all ows
only lower output voltage applications only with the maximum
boost ratio defined in “Components Selections” on page24.
The VDC pin can be used as a coarse reference with a few
mA sourcing capability.
In-rush Control and Soft-start
The ISL97635 has separately built-in independent inrush
control and soft-start functions. The inrush control function is
built around the short circuit protection FET, and is only
available in applications, which include this device. At
start-up, the fault protection FET is turned on slowly due to a
30µA pull-down current output from the FAULT pin. This
discharges the fault FET's gate-source capacitance, turning
on the FET in a controlled fashion. As this happens, the
output capacitor is charged slowly through the weakly turned
on FET before it becomes fully enhanced. This results in a
low in-rush current. This current can be further reduced by
adding a capacitor (in the 1nF to 5nF range) across the
gate-source terminals of the FET.
Once the chip detects that the fault protection FET is turned
on hard, it is assumed that in-rush has completed. At this
point, the boost regulator will begin to switch and the current
in the inductor will ramp-up. The current in the boost power
switch is monitored and the switching is terminated in any
cycle where the current exceeds the current limit. The
ISL97635 includes a soft-start feature where this current limit
starts at a low value (375mA). This is stepped up to the final
3A current limit in 7 further steps of 375mA. These steps will
happen over a 1ms total time, such that after 1ms, the final
limit will be reached. This allows the output capacitor to be
13
FN6434.2
December 22, 2008
ISL97635
charged to the required value at a low current limit and
prevents high input current for systems that have only a low
to medium output current requirement.
For systems with no master fault protection FET, the inrush
current will flow towards C
determined by the ramp rate of VIN and the values of C
when VIN is applied and it is
OUT
OUT
and L.
Fault Protection and Monitoring
The ISL97635 features extensive protection functions to
cover all the perceivable failure conditions. The failure mode
of a LED can be either open circuit or as a short. The
behavior of an open circuited LED can additionally take the
form of either infinite resistance or, for some LEDs, a zener
diode, which is integrated into the device in parallel with the
now opened LED.
For basic LEDs (which do not have built-in zener diodes), an
open circuit failure of an LED will only result in the loss of
one channel of LEDs without affecting other channels.
Similarly, a short circuit condition on a channel that results in
that channel being turned off does not affect other channels
unless a similar fault is occurring. All LED faults are reported
via the SMBus interface to Register 0x02 (Fault/Status
register). The controller is able to determine which channels
have failed via Register 0x09 (Output Masking register). The
controller can also choose to use Register 0x09 to disable
faulty channels at start-up, resulting in only further faulty
channels being reported by Register 0x02.
Due to the lag in boost response to any load change at its
output, certain transient events (such as LED current steps
or significant step changes in LED duty cycle) can transiently
look like LED fault modes. The ISL97635 uses feedback
from the LEDs to determine when it is in a stable operating
region and prevents apparent faults during these transient
events from allowing any of the LED stacks to fault out. See
Table 1 for more details.
A fault condition that results in an input current that exceeds
the devices electrical limits will result in a shutdown of all
output channels. The control device logic will remain
functional such that the Fault/Status Register can be
interrogated by the system. The root cause of the failure will
be loaded to the volatile Fault/Status Register so that the
host processor can interrogate the data for failure
monitoring.
Short Circuit Protection (SCP)
The short circuit detection circuit monitors the voltage on
each channel and disables faulty channels which are
detected above the programmed short circuit threshold.
There are two selectable levels of short circuit threshold
(3.1V and 8.0V) that can be programmed through the
Configuration Register 0x08 bit 0. When an LED becomes
shorted, the action taken is described in T able 1. The default
short circuit threshold is 8V. The detection of this failure
mode can be disabled via Register 0x08 bit 1 if required.
Open Circuit Protection (OCP)
When one of the LEDs becomes open circuit, it can behave
as either an infinite resistance or a gradually increasing finite
resistance. The ISL97635 monitors the current in each
channel such that any string which reaches at least 75% of
the intended output current is considered “good”. Should the
current subsequently fall below 50% of the target, the
channel will be considered an “open circuit”. Furthermore,
should the boost output of the ISL97635 reach the OVP limit
or should the lower over-temperature threshold be reached,
all channels which are not “good” will immediately be
considered as “open circuit”. Detection of an “open circuit”
channel will result in a time-out before disabling of the
affected channel. This time-out is sped up when the device
is above the lower over-temperature threshold in an attempt
to prevent the upper over-temperature trip point from being
reached.
Some users employ some special types of LEDs that have
zener diode structure in parallel with the LED for ESD
enhancement, thus enabling open circuit operation. When this
type of LED goes open circuit, the effect is as if the LED
forward voltage has increased, but no lighting. Any af fecte d
string will not be disabled, unless the failure results in the
boost OVP limit being reached, allowing all other LEDs in the
string to remain functional. Care should be taken in th is case
that the boost OVP limit and SCP limit are set properly, so as
to make sure that multiple failures on one string do not cause
all other good channels to be faulted out. This is due to the
increased forward voltage of the faulty channel making all
other channel look as if they have LED shorts. See Table1 for
details for responses to fault conditions.
Overvoltage Protection (OVP)
The integrated OVP circuit monitors the output voltage and
keeps the voltage at a safe level. The OVP threshold is set as
Equation 14:
OVP1.21VR
+()R
UPPERRLOWER
⁄×=
LOWER
(EQ. 14)
These resistors should be large to minimize the power loss.
For example, a 1MΩ R
to 32.2V. Large OVP resistors also allow C
UPPER
and 39kΩ R
LOWER
OUT
sets OVP
discharges
slowly during the PWM Off-time.
Undervoltage Lockout
If the input voltage falls below the UVLO level of 2.45V, the
device will stop switching and be reset. Operation will restart
when the voltage comes back into the operating range.
Input Overcurrent Protection
During normal switching operation, the current through the
internal boost power FET is monitored. If the current
exceeds the current limit, the internal switch will be turned
14
FN6434.2
December 22, 2008
ISL97635
off. This monitoring happens on a cycle by cycle basis in a
self protecting way.
Additionally, the ISL97635 monitors the voltage at the LX
and OVP pins. At start-up, a fixed current is injected out of
the LX pins and into the output capacitor. The device will not
start-up unless the voltage at LX exceeds 1.2V . Furthermore,
should the voltage at LX not rise above this threshold during
any subsequent period where the power FET is not switched
on, it will immediately disable the input protection FET. The
OVP pin is also monitored such that if it rises above and
subsequently falls below 20% of the target OVP level, the
input protection FET will also be switched off.
Over-Temperature Protection (OTP)
The ISL97635 includes two over-temperature thresholds. The
lower threshold is set to +130°C. When this threshold is
reached, any channel which is outputting current at a level
significantly below the regulation target will be treated as “open
circuit” and disabled after a time-out period. This time-out
period is also reduced to 800µs when it is above the lower
threshold. The intention of the lower threshold is to allow bad
channels to be isolated and disabled before they cause enough
power dissipation (as a result of other channels having large
voltages across them) to hit the upper temperature threshold.
The upper threshold is set to +150°C. Each time this is
reached, the boost will stop switching and the output current
sources will be switched off. Once the device has cooled to
approximately +100°C, the device will restart with the DC
LED current level reduced to 77% of the initial setting. If the
dissipation problem persists, subsequent hitting of the limit
will cause identical behavior, with the current reduced in
steps to 53% and finally 30%. Hitting of the upper threshold
will also set the thermal fault bit of the Fault/Status register
0x02. Unless disabled via the EN pin, the device stays in an
active state throughout, allows the external processor to
interrogate the fault condition.
For the extensive fault protection conditions, please refer to
Figure 18 and Table 1 for details.
Over-Temperature
Protection limit (OTP)
not triggered and VIIN0
< VSC
2CH0 Short CircuitUpper OTP triggered but
VIN0 < VSC
3CH0 Short CircuitUpper OTP not triggered
but VIIN0 > VSC
4CH0 Open Circuit
with infinite
Upper OTP not triggered
and VIIN0 < VSC
resistance
5CH0 LED Open
Circuit but has
Upper OTP not triggered
and VIIN0 < VSC
paralleled Zener
6CH0 LED Open
Circuit but has
Upper OTP triggered but
VIIN0 < VSC
paralleled Zener
7CH0 LED Open
Circuit but has
paralleled Zener
Upper OTP not triggered
but VIIN0 > VSC
Upper OTP not triggered
but VIINx > VSC
8Channel-to-Channel
ΔVF too high
9Channel-to-Channel
ΔVF too high
10Output LED stack
Lower OTP triggered but
VIINx < VSC
Upper OTP triggered but
VIINx < VSC
VOUT > VOVPDriven with normal current. Any channel that is below 50% of the target
voltage too high
11VOUT/LX shorted to
GND
LX current and timing
are monitored.
OVP pin monitored for
excursions below 20% of
OVP threshold
CH0 ON and burns powerCH1 through CH7 NormalHighest VF of
CH0 goes off until chip cooled and
Same as CH0Highest VF of
then comes back on with current
reduced to 76%. Further OTP
triggers result in reduction to 53%,
then 30%. Thermal event reported
in Fault/Status Register.
CH0 doubled after 6ms time-out.
CH1 through CH7 NormalHighest VF of
Time-out reduced to 420µs if above
lower OTP limit
V
will ramp to OVP. CH0 will
OUT
CH1 through CH7 NormalHighest VF of
time-out after 6ms (800µs if above
lower OTP limit) and switch off.
V
will drop to normal level.
OUT
CH0 remains ON and has highest
VF, thus V
increases
OUT
CH0 goes off until chip cooled and
CH1 through CH7 ON, Q1
through Q7 burn power
Same as CH0VF of CH0
then comes back on with current
reduced to 76%. Further OTP
triggers result in reduction to 53%,
then 30%. Thermal event reported
in Fault/Status Register.
CH0 OFFCH1 through CH7 NormalHighest VF of
CH0 remains ON and has highest
VF, thus V
increases.
OUT
increases then CH-X
V
OUT
switches OFF. This is an
unwanted shut off and can be
prevented by setting OVP and/or
VSC at an appropriate level.
Any channel at below 50% of the target current will fault out after
400µs.
Remaining channels driven with normal current.
All channels switched off until chip cooled and then comes back on
with current reduced to 76%. Further OTP triggers result in reduction
to 53%, then 30%. Thermal event reported in Fault/Status Register.
current will time-out after 6ms.
Fault switch disabled and system shutdown until fault goes away,
V
is checked at start-up with a low current from LX to check for
OUT
presence of short before the fault switch is enabled.
VOUT
REGULATED BY
CH1 through CH7
CH1 through CH7
CH1 through CH7
CH1 through CH7
VF of CH0
CH1 through CH7
VF of CH0
Highest VF of
CH0 through CH7
Highest VF of
CH0 through CH7
Highest VF of
CH0 through CH7
16
FN6434.2
December 22, 2008
ISL97635
SMBCLK
V
IH
V
IL
SMBDAT
V
IH
V
IL
t
BUF
NOTES:
SMBus Description
S = Start condition
P = Stop condition
A = Acknowledge
A
= Not acknowledge
R/W
= Read enable at high; write enable at low
t
HD:STA
t
LOW
t
HIGH
t
F
t
t
SU:DAT
SU:STA
SSP
t
SU:STO
P
t
R
t
HD:DAT
FIGURE 19. SMBUS INTERFACE
171181811
SSLAVE ADDRESSW
ACOMMAND CODEADATA BYTEAP
Master to Slave
Slave to Master
FIGURE 20. WRITE BYTE PROTOCOL
1711811811811
SSLAVE ADDRESSW
ACOMMAND CODEASSLAVE ADDRESSRADATA BYTEAP
Master to Slave
Slave to Master
FIGURE 21. READ BYTE PROTOCOL
17
FN6434.2
December 22, 2008
ISL97635
Write Byte
The Write Byte protocol is only three bytes long. The first byte
starts with the slave address followed by the “command code,”
which translates to the “register index” being written. The third
byte contains the data byte that must be written into the register
selected by the “command code”. A shaded label is used on
cycles during which the slaved backlight controller “owns” or
“drives” the Data line. All other cycles are driven by the “host
master.”
Read Byte
As shown in the Figure 21, the four byte long Read Byte
protocol starts out with the slave address followed by the
“command code” which translates to the “register index.”
Subsequently, the bus direction turns around with the
re-broadcast of the slave address with bit 0 indicating a read
(“R”) cycle. The fourth byte contains the data being returned
by the backlight controller. That byte value in the dat a byte
reflects the value of the register being queried at the
“command code” index. Note the bus directions, which are
highlighted by the shaded label that is used on cycles during
which the slaved backlight controller “owns” or “drives” the
Data line. All other cycles are driven by the “host maste r.”
Slave Device Address
The slave address contains 7 MSB plus one LSB as R/W bit,
but these 8 bits are usually called Slave Aaddress bytes. As
shown in Figure 22, the high nibble of the Slave Address byte is
0x5 or 0101b to denote the “backlight controller class.” Bit 3 in
the lower nibble of the Slave Address byte is 1. Bit 0 is always
the R/W bit, as specified by the SMBus protocol. Note: In this
document, the device address will always be expressed as a
full 8-bit address instead of the shorter 7-bit address typically
used in other backlight controller specifications to avoid
confusion. Therefore, if the device is in the write mode where bit
0 is 0, the slave address byte is 0x58 or 0101 1000b. If the
device is in the read mode where bit 0 is 1, the slave address
byte is 0x59 or 01011001b.
The backlight controller may sense the state of the pins at POR
or during normal operation—the pins will not change state while
the device is in operation.
MSB
0101100R/W
DEVICE
IDENTIFIER
DEVICE
ADDRESS
FIGURE 22. SLAVE ADDRESS BYTE DEFINITION
LSB
T
I
B
E
T
I
R
W
/
D
A
E
R
SMBus Register Definitions
The backlight controller registers are Byte wide and
accessible via the SMBus Read/Write Byte protocols. Their
bit assignments are provided in the following sections with
reserved bits containing a default value of “0”.
BRT7BRT6BRT5BRT4BRT3BRT2BRT1BRT00xFFRead and Write
Reserved Reserved Reserved Reserved Reserved PWM_MDPWM_SELBL_CTL0x00Read and Write
Reserved Reserved 2_CH_SD 1_CH_SD BL_STAT OV_CURR THRM_SHDN FAULT0x00Read Only
LED
PANEL
BRTDC7 BRTDC6 BRTDC5 BRTDC4 BRTDC3BRTDC2BRTDC1BRTDC00xFFRead and Write
Reserved Reserved Reserved Reserved ReservedFSWVSC1VSC00xXFRead and Write
CH7CH6CH5CH4CH3CH2CH1CH00xFFRead and W rite
MFG3MFG2MFG1MFG0REV2REV1REV00xC8Read Only
18
DEFAULT
VALUE
SMBUS
PROTOCOL
FN6434.2
December 22, 2008
ISL97635
TABLE 2B. DATA BIT DESCRIPTIONS
ADDRESSREGISTERDATA BIT DESCRIPTIONS
0x00PWM Brightness Control Register BRT[7..0] = 256 steps of DPWM duty cycle brightness control
0x01Device Contr ol RegisterPWM_MD = PWM mode select bit (1 = absolute brightness, 0 = % change), default = 0
PWM_SEL = Brightness control select bit (1 = control by PWMI, 0 = control by SMBus), default = 0
BL_CTL = BL On/Off (1 = On, 0 = Off), default = 0
PWM_MD PWM_SELMODE
X1PWMI Mode
10SMBus Mode
00SMBus and PWMI mode with DPST
0x02Fault/Status Register2_CH_SD = Two LED output channels are shutdown (1 = shutdown, 0 = OK)
1_CH_SD = One LED output channel is shutdown (1 = shutdown, 0 = OK)
BL_STAT = BL status (1 = BL On, 0 = BL Off)
OV_CURR = Input overcurrent (1 = Overcurrent condition, 0 = Current OK)
THRM_SHDN = Thermal Shutdown (1 = Thermal fault, 0 = Thermal OK)
FAULT = Fault occurred (Logic “OR” of all of the fault conditions)
0x03Identification RegisterMFG[3..0] = Manufacturer ID (16 vendors available. Intersil is vendor ID 9)
REV[2..0] = Silicon rev (Rev 0 through Rev 7 allowed for silicon spins)
0x07DC Brightness Control RegisterBRTDC[7..0] = 256 steps of DC brightness control
0x08Configuration RegisterVSC[1..0] = Short circuit thresholds selection
CH[5..0] = Output Channel Read and Write. In Write, 1 = Channel Enabled, 0 = Channel Disabled.
In Read, 1 = Channel OK, 0 = Channel Not OK/Channel disabled
PWM Brightness Control Register (0x00)
The Brightness control resolution has 256 steps of PWM duty
cycle adjustment. The bit assignment is shown in Figure 23. All
of the bits in this Brightness Control Register can be read or
write. Step 0 corresponds to the minimum step where the
current is less than 10µA. Steps 1 to 255 represent the linear
steps between 0.39% and 100% duty cycle with approximately
0.39% duty cycle adjustment per step.
• An SMBus Write Byte cycle to Register 0x00 sets the
PWM brightness level only if the backlight controller is in
SMBus mode (see Table 3 Operating Modes selected by
Device Control Register Bits 1 and 2).
• An SMBus Read Byte cycle to Register 0x00 returns the
programmed PWM brightness level, regardless of the
value of PWM_SEL.
f
SW
0f
SW
1f
SW
OPERATION
= 600kHz
= 1.2MHz
• An SMBus setting of 0xFF for Register 0x00 sets the
backlight controller to the maximum brightness.
• An SMBus setting of 0x00 for Register 0x00 sets the
backlight controller to the minimum brightness output in
which the LED current is guaranteed to be less than 10µA.
• Default value for Register 0x00 is 0xFF.
Device Control Register (0x01)
This register has 2 bits that control the operating mode of the
backlight controller and a single bit that controls the BL
ON/OFF state. The remaining bits are reserved. The bit
assignment is shown in Figure 24. All other bits in the Device
Control Register will read as low unless otherwise written.
Bits 7 and 6 are not implemented and will always read low.
19
FN6434.2
December 22, 2008
ISL97635
TABLE 3. OPERATING MODES SELECTED BY DEVICE
CONTROL REGISTER BITS 1 AND 2
PWM_MD PWM_SELMODE
X1PWMI Mode
10SMBus Mode
00SMBus and PWMI Mode with DPST
The PWM_SEL bit determines whether the SMBus or PWMI
input should drive the output br ig h tness in terms of PWM
dimming. When PWM_SEL bit is 1, the PWMI drives the
output brightness regardless of what the PWM_MD is.
When the PWM_SEL bit is 0, the PWM_MD bit selects the
manner in which the PWM dimming is to be interpreted;
when this bit is 1, the PWM dimming is based on the SMBus
brightness setting. When this bit is 0, the PWM dimming
reflects a percentage change in the current brightness
programmed in the SMBus Register 0x00, i.e. DPST
(Display Power Saving Technology) mode, as shown in
Equation 15:
DPST BrightnessCbt PWMI×=
(EQ. 15)
Where:
Cbt = Current brightness setting from SMBus Register 0x00
without influence from the PWMI
PWMI = is the percent duty cycle of the PWMI
For example, the Cbt = 50% duty cycle programmed in the
SMBus Register 0x00 and the PWM frequency is tuned to be
200Hz with an appropriate capacitor at the FPWM pin. On the
other hand, PWMI is fed with a 1kHz 30% high PWM signal.
When PWM_SEL = 0 and PWM_MD = 0, the device is in DPST
operation where DPST brightness = 15% PWM dimming at
200Hz.
• All reserved bits return a “0” when read.
• All reserved bits have no functional effect when written.
• All defined control bits return their current, latched value
when read.
• A value of 1 written to BL_CTL turns on the BL in 4ms or less
after the write cycle completes. The BL is deemed to be on
when Bit 3 BL_ST AT of Register 0x02 is 1 and Register
0x09 is not 0. See Figures 23 and 24.
• A value of 0 written to BL_CTL immediately turns off the BL.
The BL is deemed to be off when Bit 3 BL_ST AT of Register
0x02 is 0 and Register 0x09 is 0. See Figures 23 and 24.
• **Note that the behavior of Register 0x00 (Brightness
Control Register) is affected by certain combinations of the
control bits, as shown in Table 3 “Operating Modes
Selected by Device Control Register Bits 1 and 2.”
PWM_MD= PWM mode select bit (1 = absolute brightness,
PWM_SEL= Brightness control select bit (1 = control by
BL_CTL= BL On/Off (1 = On, 0 = Off) default = 0
= 256 steps of PWM brightness levels
FIGURE 23. DESCRIPTIONS OF BRIGHTNESS CONTROL REGISTER
0 = % change) default = 0
PWMI, 0 = control by SMBus) default = 0
FIGURE 24. DESCRIPTIONS OF DEVICE CONTROL REGISTER
20
FN6434.2
December 22, 2008
ISL97635
• When an SMBus mode is selected, Register 0x00 reflects
the last value written to it. But, when any non-SMBus
mode is selected, Register 0x00 reflects the current
brightness value based on the current mode of operation,
with the exception of SMBus mode with DPST, where
PWM_MD = 0 and PWM_SEL = 0.
• When SMBus mode with DPST is selected, Register 0x00
reflects the last value written to it from SMBus.
• When a write to Register 0x01 (Device Control Register)
causes the backlight controller to transition to an SMBus
mode, the brightness of the BL does not change. On the
other hand, when a write to Register 0x01causes the
backlight controller to transition to a non-SMBus mode,
the brightness of the BL changes as appropriate for the
new mode.
• The default value for Register 0x01 is 0x00.
Fault/Status Register (0x02)
This register has 6 status bits that allow monitoring of the
backlight controller’s operating state. Bit 0 is a logical “OR” of all
fault codes to simplify error detection. Not all of the bits in this
register are fault related (Bit 3 is a simple BL status indicator).
The remaining bits are reserved and return a “0” when read and
ignore the bit value when written. All of the bits in this register
are read-only, with the exception of bit 0, which can be cleared
by writing to it.
• A Read Byte cycle to Register 0x02 indicates the current
BL on/off status in BL_STAT (1 if the BL is on, 0 if the BL is
off).
• A Read Byte cycles to Register 0x2 also returns FAULT as
the logical OR of THRM_SHDN, OV_CURR, 2_CH_SD,
and 1_CH_SD should these events occur.
• 1_CH_SD returns a 1 if one or more channels have
faulted out.
• 2_CH_SD returns a 1 if two or more channels have faulted
out.
• When FAULT is set to 1, it will remain at 1 even if the
signal which sets it goes away. FAULT will be cleared
when the BL_CTL bit of the Device Control Register is
toggled or when written low. At that time, if the fault
condition is still present or reoccurs, FAULT will be set to 1
again. BL_STAT will not cause FAULT to be set.
• The controller will not indicate a fault if the VBL+ goes
away, whether or not the LEDs were on at the time of the
power loss. This can occur if there is some hang condition
that causes the user to force the system off by holding the
power button down for 4s.
• The default value for Register 0x02 is 0x00.
Identification Register (0x03)
The ID register contains 3-bit fields to denote the LED driver
(always set to 1), manufacturer and the silicon revision of the
controller IC. The bit field widths allow up to 16 vendors with up
to 8 silicon revisions each. In order to keep the number of
silicon revisions low, the revision field will not be updated unless
the part will make it out to the user’s factory. Thus, if during the
engineering development process, 3 silicon spins were
needed, the next available revision ID would be used for all 3
spins until that same ID made it to the factory. Except Bit 7,
which has to be 1, all of the bits in this register are read-only.
• Vendor ID 9 represents Intersil Corporation.
• The default value for Register 0x03 is 0xC8.
The initial value of REV shall be 0. Subsequent values of
REV will increment by 1.
• A fault will not be reported in the event that the BL is
commanded on and then immediately off by the system.
Bit 52_CH_SD= Two LED output channels are shutdown (1 = shutdown, 0 = OK)
Bit 41_CH_SD= One LED output channel is shutdown (1 = shutdown, 0 = OK)
Bit 3BL_STAT= BL Status (1 = BL On, 0 = BL Off)
Bit 2OV_CURR= Input Overcurrent (1 = Overcurrent condition, 0 = Current OK)
Bit 1THRM_SHDN= Thermal Shutdown (1 = Thermal Fault, 0 = Thermal OK)
Bit 0FAULT= Fault occurred (Logic “OR” of all of the fault conditions)
REV[2..0]= Silicon rev (Rev 0 through Rev 7 allowed for
= Manufacturer ID. See “Identification Register
(0x03)” on page 21.
data 0 to 8 in decimal correspond to other vendors
data 9 in decimal represents Intersil ID
data 10 to 14 in decimal are reserved
data 15 in decimal Manufacturer ID is not
implemented
FIGURE 27. DESCRIPTIONS OF DC BRIGHTNESS CONTROL REGISTER
DC Brightness Control Register (0x07)
The DC Brightness Control Register 0x07 allows users to
have additional dimming flexibility by:
1. Effectively achieving 16 bits of dimming control when DC
dimming is combined with PWM dimming or,
2. Achieving visual or audio noise free 8-bit DC dimming
over potentially noisy PWM dimming.
The bit assignment is shown in Figure 27. All of the bits in
this Register can be read or write. Steps 0 to 255 represent
the linear steps of current adjustment in DC on the fly. It can
also be considered as the peak current factory calibration
feature to account for various LED production batch
variations, but external EEPROM settings storing and
restoring are required.
• An SMBus Write Byte cycle to Register 0x07 sets the
brightness level in DC only.
• An SMBus Read Byte cycle to Register 0x07 returns the
current DC brightness level.
• Default value for Register 0x07 is 0xFF.
users to set the boost conversion switching frequency
between 1.2MHz and 600kHz.
The bit assignment is shown in Figure 28. The default value
for Register 0x08 is 0xFF
Output Channel Mask/Fault Readout Register
(0x09)
This register can be read or write; the bit position
corresponds to the channel. For example, bit 0 corresponds
to Ch0 and bit 6 corresponds to Ch6 and so on. Writing data
to this register, it enables the channels of interest. When
reading data from this register, any disabled channel and
any faulted out channel will read as 0. This allows the user to
determine which channel is faulty and optionally not enabling
it in order to allow the rest of the system to continue to
function. Additionally, a faulted out channel can be disabled
and re-enabled in order to allow a retry for any faulty channel
without having to power-down the other channels.
The bit assignment is shown in Figure 29. The default for
Register 0x09 is 0xFF.
Configuration Register (0x08)
The Configuration Register allows users to set 2 levels of
channel Short-Circuit thresholds or disable it. It also allows
CH[7..0]CH7 = Channel 7, CH6 = Channel 6 and so on
FIGURE 29. OUTPUT CHANNEL REGISTER
Components Selections
According to the inductor Voltage-Second Balance principle,
the change of inductor current during the switching regulator
On-time is equal to the change of inductor current during the
switching regulator Off-time. Since the voltage across an
inductor is as shown in Equation 16:
VLL Δ ILΔt⁄×=
and ΔI
@ On = ΔIL @ Off, therefore:
L
0) L⁄DtS×VOVDVI––()=×L1(D) tS×–×⁄–
V(
I
where D is the switching duty cycle defined by the turn-on
time over the switching period. VD is Schottky diode forward
voltage that can be neglected for approximation.
Rearranging the terms without accounting for V
boost ratio and duty cycle respectively as Equations 18
and 19:
OVI
11D–()⁄=⁄
(VI) VO⁄–=
O
V
DV
Input Capacitor
Switching regulators require input capacitors to deliver peak
charging current and to reduce the impedance of the input
supply. This reduces interaction between the regulator and
input supply, thereby improving system stability. The high
switching frequency of the loop causes almost all ripple
current to flow in the input capacitor, which must be rated
accordingly.
A capacitor with low internal series resistance should be
chosen to minimize heating effects and improve system
efficiency, such as X5R or X7R ceramic capacitors, which
offer small size and a lower value of temperature and voltage
coefficient compared to other ceramic capacitors.
In Boost mode, input current flows continuously into the
inductor; AC ripple component is only proportional to the rate
of the inductor charging, thus, smaller value input capacitors
may be used. It is recommended that an input capacitor of at
least 10µF be used. Ensure the voltage rating of the input
capacitor is suitable to handle the full supply range.
(EQ. 16)
(EQ. 17)
gives the
D
(EQ. 18)
(EQ. 19)
Inductor
The selection of the inductor should be based on its
maximum current (I
) characteristics, power dissipation
SAT
(DCR), EMI susceptibility (shielded vs unshielded), and size.
Inductor type and value influence many key parameters,
including ripple current, current limit, efficiency, transient
performance and stability.
The inductor’s maximum current capability must be
adequate enough to handle the peak current at the worst
case condition. If an inductor core is chosen with too low a
current rating, saturation in the core will cause the effective
inductor value to fall, leading to an increase in peak to
average current level, poor efficiency and overheating in the
core. The series resistance, DCR, within the inductor causes
conduction loss and heat dissipation. A shielded inductor is
usually more suitable for EMI susceptible applications, such
as LED backlighting.
The peak current can be derived from the voltage across the
inductor during the Off-period, as expressed in Equation 20:
IL
peak
VO(IO) 85%(VI) 12VIVO(VI) L(VOfSW)××⁄–×[⁄+×⁄×=
(EQ. 20)
The choice of 85% is just an average term for the efficiency
approximation. The first term is the average current, which is
inversely proportional to the input voltage. The second term
is the inductor current change, which is inversely
proportional to L and f
. As a result, for a given switching
SW
frequency and minimum input voltage on which the system
operates, the inductor I
must be chosen carefully. At a
SAT
given inductor size, usually the larger the inductance, the
higher the series resistance because of the extra winding of
the coil. Thus, the higher the inductance, the lower the peak
current capability. The ISL97635 current limit should also
have to be taken into account.
Output Capacitors
The output capacitor acts to smooth the output voltage and
supplies load current directly during the conduction phase of
the power switch. Output ripple voltage consists of the
discharge of the output capacitor for I
and the voltage drop due to flowing through the ESR of the
during FET On
LPEAK
24
FN6434.2
December 22, 2008
ISL97635
output capacitor. The ripple voltage can be shown as
Equation 21:
ΔV
COI(OCO
DfS)I(OESR×()+⁄×⁄=
(EQ. 21)
The conservation of charge principle also brings up the fact
that during the boost switch Off-period, the output capacitor
is charged with the inductor ripple current minus a relatively
small output current in boost topology. As a result, the user
needs to select an output capacitor with low ESD and
enough input ripple current capability.
Output Ripple
ΔVCo, can be reduced by increasing Co or fSW, or using
small ESR capacitors. In general, ceramic capacitors are the
best choice for output capacitors in small to medium sized
LCD backlight applications due to their cost, form factor, and
low ESR.
A larger output capacitor will also ease the driver response
during PWM dimming Off-period due to the longer sample
and hold effect of the output drooping. The driver does not
need to boost harder in the next On-period that minimizes
transient current. The output capacitor is also needed for
compensation, and, in general 2x4.7µF/50V ceramic
capacitors are suitable for notebook display backlight
applications.
Schottky Diode
A high speed rectifier diode is necessary to prevent
excessive voltage overshoot, especially in the boost
configuration. Low forward voltage and reverse leakage
current will minimize losses, making Schottky diodes the
preferred choice. Although the Schottky diode turns on only
during the boost switch Off-period, it carries the same peak
current as the inductor, and therefore, a suitable current
rated Schottky diode must be used.
Applications
High Current Applications
Each channel of the ISL97635 can support up to 35mA. For
applications that need higher current, multiple channels can
be grouped to achieve the desirable current. For example,
the cathode of the last LED can be connected to IIN0 to IIN2,
this configuration can be treated as a single string with
105mA current driving capability.
.
V
OUT
IIN0
IIN1
IIN2
FIGURE 30. GROUPING MULTIPLE CHANNELS FOR HIGH
CURRENT APPLICATIONS
SMBCLK
SMBDAT
EN1
EN2
SMBCLK
SMBDAT
EN/PWMI
FIGURE 31. MULTIPLE DRIVERS OPERATION
STEP 255 PWM CONTROL
STEP 0~255 DC CONTROL
STEP 254 PWM CONTROL
STEP 1 PWM CONTROL
STEPS 0~255 DC
STEP 0 PWM CONTROL
FIGURE 32. 16-BIT DIMMING ILLUSTRATION
SMBCLK
SMBDAT
EN/PWMI
Multiple Drivers Operation
For large LCD panels where more than 8 channels of LEDs
are needed, multiple ISL97635s with each driver having its
own supporting components can be controlled together with
the common SMBus. While the ISL97635 does not have
extra pins strappable slave address feature, separate EN
signal can be applied to each driver for asynchronous
operation. A trade-off of such scheme is that an exact faulty
channel cannot be identified if the PWMI/EN signal is
common to all drivers.
25
FN6434.2
December 22, 2008
ISL97635
16-Bit Dimming
The SMBus controlled PWM and DC dimmings can be
combined to effectively provide 16 bits of dimming capability,
which can be valuable for automotive and avionics display
applications. Figure 32 illustrates one programming example
where 256 steps of PWM dimming can be pro g rammed
between each DC dimming steps, or vice versa.
RGB LED Backlight or Scrolling Backlight
Operation
The SMBus control features of PWM dimming, DC dimming,
and random channels selection have offered many driving
possibilities. For example, red, green, and blue LEDs can be
arranged in Ch0 and Ch1, Ch2 and Ch3, Ch4 and Ch5
respectively such that each group can be controlled
independently in sequential order for RGB or RGGB LED
backlighting applications.
Compensation
The ISL97635 has two main elements in the system; the
Current Mode Boost Regulator and the op amp based
multi-channel current sources. The ISL97635 incorporates a
transconductance amplifier in its feedback path to allow the
user some levels of adjustment on the transient response,
as well as better regulation. The ISL97635 uses current
mode control architecture, which has a fast current sense
loop and a slow voltage feedback loop. The fast current
feedback loop does not require any compensation. The slow
voltage loop must be compensated for stable operation. The
compensation network is a series Rc, Cc1 network from
COMP pin to ground and an optional Cc2 capacitor
connected to the COMP pin. The Rc sets the high frequency
integrator gain for fast transient response and the Cc1 sets
the integrator zero to ensure loop stability. For most
applications, Rc is in the range of 200Ω to 3kΩ and Cc1 is in
the range of 27nF to 37nF. Depending on the PCB layout, a
Cc2, in range of 100nF, may be needed to create a pole to
cancel the output capacitor ESR’s zero effect for stability.
The ISL97635 evaluation board is configured with Rc1 of
500Ω, Cc1 of 33nF, and Cc2 of 0, which achieves stability. In
the actual applications, these values may need to be tuned
empirically but these recommended values are usually a
good starting point.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
26
FN6434.2
December 22, 2008
27
VIN
VLOGIC
SMBCLK
SMBDAT
GND
PWMI/EN
10µ/25V
R6
10k
27n/6.3V
220n/6.3V
C1
JP26
R5
10k
C13
C11
1µ/10V
C14
C2
0.1µ/25V
C12
0.1µ/10V
1
SMBCLK
2
SMBDAT
3
FPWM
4
PWMO
5
GND
PWMI/EN
6
U1
24
VDC
IIN7
7
C20
C10
33n
R7
500
22
23
VIN
COMP
ISL97635
IIN68IIN59IIN4
Q1
4
3
FDMA530PZ
20
21
LX
PGND
FAULT
PGND
RSET
11
10
12
1
2
5
6
19
LX
OVP
IIN0
IIN1
IIN2
IIN3
L1 : IHLP-2525BD-01 Vishay Inductor,
L1
8.2µH
C4
10µ/25V
18
17
16
15
14
13
OVP
D1
D1 : SS15 - Vishay Schottky Diode, 5
SS15
R3
1M
R4
39k
C6
4.7µ/50V
C7
4.7µ/50V
LED1
LED2
LED3
LED4
LED5
LED6
LED10
LED11
LED12
LED13
LED14
LED15
LED19
LED20
LED21
LED22
LED23
LED24
LED28
LED29
LED30
LED31
LED32
LED33
LED37
LED38
LED39
LED40
LED41
LED42
LED46
LED47
LED48
LED49
LED50
LED51
LED55
LED56
LED57
LED58
LED59
LED60
LED64
LED65
LED66
LED67
LED68
LED69
ISL97635
R2
36.6k
NOTES:
FOR 2 LAYERS BOARD, LAYOUT
PGND (NOISY GROUND) ON TOP
LAYER AND AGND (QUIET GROUND)
ON BOTTOM LAYER. TIE PGND AND
December 22, 2008
AGND ONLY AT ONE POINT BY DOING
THE FOLLOWING: BRIDGE U1 PGND (PINS 18 AND 19)
AND AGND (PIN 5) TO THE PACKAGE
THERMAL PAD. PUT MULTIPLE VIAS ON THE
THERMAL PAD THAT CONNECTS TO THE
FN6434.2
BOTTOM SIDE AGND.
LED7
LED8
LED9
LED16
LED17
LED18
LED25
LED26
LED27
LED34
LED35
LED36
LED43
LED44
LED45
LED52
LED53
LED61
LED62
LED63LED72LED54
LED70
LED71
FIGURE 33. TYPICAL APPLICATION CIRCUIT
Package Outline Drawing
L24.4x4D
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 10/06
4.00
A
B
ISL97635
4X
2.5
20X
19
0.50
24
PIN #1 CORNER
(C 0 . 25)
INDEX AREA
(4X)
( 3 . 8 TYP )
( 2 . 50 )
PIN 1
0.15
TOP VIEW
4.00
0 . 90 ± 0 . 1
( 20X 0 . 5 )
712
1
0.10 M C A B
24X 0 . 23
SEE DETAIL "X"
2 . 50 ± 0 . 15
+ 0 . 07
4
- 0 . 05
C
0.10
C
18
13
24X 0 . 4 ± 0 . 1
BOTTOM VIEW
BASE PLANE
SIDE VIEW
SEATING PLANE
0.08 C
TYPICAL RECOMMENDED LAND PATTERN
28
( 24X 0 . 25 )
( 24X 0 . 6 )
0 . 2 REF
C
0 . 00 MIN.
0 . 05 MAX.
5
DETAIL "X"
NOTES:
Dimensions are in millimeters.1.
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.