The ISL6801 is a single monolithic, inverting bootstrap
driver. Its floating Level Shifter Section is optimized for the
control of N-Channel Power MOSFETs in high side
configurations with Bus Voltages up to 120VDC from a 5V
Controller Output. It features two output stages pinned out
separately to allow independent control of rise and fall times.
To ensure static DC operation an integrated recharge path
charges the bootstrap cap while the driver is switched off. A
pull-up resistor forces the input low when no control signal is
applied. The supply voltage is monitored to guarantee
faultless operation at start-up.
Ordering Information
TEMP.
o
PART NUMBER
ISL6801AB-40 to 1258 Ld SOICM8.15
ISL6801AB-T-40 to 1258 Ld SOIC Tape
1V
2INDriver Control Signal Input
3GNDGround
4RESDriver Enable Signal Input (‘RESET’)
5VSMOSFET Source Connection
6HOLMOSFET Gate Low Connection
7HOHMOSFET Gate High Connection
8VBDriver Output Stage Supply
NOTE:
The HOL and HOH are the low respective high gate drive output pins. The turn on and turn off time of the external MOSFET could be controlled by
using different resistance values for high and low signal.
Supply Voltage Range (Max). . . . . . . . . . . . . . . . . . . . 4.5V to 6.5V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
Electrical SpecificationsAll values are over full temperature range.
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Operating Temperature RangeT
Source Reference VoltageVS-1.8V Continuous, VB/V
Supply Voltage (Note 2)V
Driver Output SupplyV
Switching FrequencyfGuaranteed by Design100--kHz
Voltage Transconductance (Note 3)dVs/dt--500V/µs
Peak Gate Drive CurrentI
Continuous Gate Drive Current (Note 3)I
Gate Drive Level LOWV
Gate Drive Level LOWV
Gate Drive Level HIGHV
Gate Drive Level HIGHV
Total IN to Output Delay (Figure 1)td
Total RES to Output Delay (Figure 2)td
Output Rise/Fall Timest
VB Drop Voltage (Figure 4, Note 4)VB
A
CC
VB - VS
V
VB - GND
HOpeak
HOcont
HOL, VS
HOL, VS
VB, HOH
VB, HOH
IN-HOH, L
RES - HOH, L
HOH, L
Fall/Rise
DROP
must stay
OH
low, IN = 0V, RES = 5V, V
6.5V, VB = 5V and 12V,
(Load R = 50Ω, C = 6.8nF)
= -40 to 125oC
T
A
Ident. to VGS of MOSFET Device
Functional
Sink/Source Current VB = 5V and 16V,
100ns
Sink/Source Current Continuous6.58-mA
IN at H, IHO = 1mA, VB-VS = 5V and 16V--0.3V
IN at H, IHO = 100mA--2.2V
IN at L, IHO = 1mA, VB-VS = 5V and 16V--0.5V
IN at L, IHO = 100mA--2.2V
at VCC = 5.0V, RES = 5V,
Output Trigger Level: 3.5V ON at
VB = 5V, 1.0V OFF at VB = 16V,
Input 2.5V (Load R = 50Ω, C = 6.8nF)
VB-VS = 5V and 16V,
(Load R = 50Ω, C = 6.8nF)
VB-VS = 5V
(Load R = 50Ω, C = 6.8nF)
VB-VS = 16V-200500ns
VB-VS = 9.0V, C
(Load R = 50Ω, C = 6.8nF)
100
= 1µF,
= 4.5V and
CC
-40-125
-1.5-120V
4.5-6.5V
4.08.516.0V
2.0--V
-200-mA
-1.03.0µs
-1.03.0µs
-100500ns
-100210
(Note 5)
θ
(oC/W)
JA
o
C to 150oC
o
C
mV
o
o
C
C
3
ISL6801
www.BDTIC.com/Intersil
Electrical SpecificationsAll values are over full temperature range. (Continued)
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
VB Input Current (Note 6)I
VB Input CurrentI
Driver Supply CurrentI
Input Threshold LOW (Note 7)IN
Input Threshold HIGH (Note 7)IN
Enable Threshold LOW (Note 7)RES
Enable Threshold HIGH (Note 7)RES
Input Impedance at INR
Input Impedance at RESR
Logic Input Current at RES (Note 8)I
Undervoltage Shutdown ThresholdV
Recharge Resistance (Note 9)R
Recharge Turn On Delay (Note 9)t
Recharge Turn Off Delayt
Recharge Path Voltage DropVdrop
NOTES:
2. Shutdown between 3.5V and 4.5V.
3. Parametric limits are guaranteed by design, but not tested in production.
4. The drop voltage is caused by VB to VS current flow during switching. See Figure 3.
5. Assuming 3µs switching overlap, time delay use at testing 100µs.
6. External MOSFET ON or OFF.
7. Input and Enable thresholds tested at V
8. The defined values are to be considered as a maximum allowed value. The input stage does not need to have sink or source capability.
9. The recharge path has to withstand transients in the 120V range for approximately 1µs while injector turn off, causing high power dissipation in
the resistor.
VB
VB
VCC
LOW
HIGH
LOW
HIGH
IN
RES
RES
UV
recharge
RechargeON
RechargeOFF
Recharge
= 4.5V and 6.5V, VB = 12V, VS = 0V, IN at 0V, Response RES at 5.0V.
CC
Static Current, VB-VS = 8.5V,
= 5V, IN = 0V,
V
CC
RES = 5V, (Load R = 50Ω, C = 6.8nF)
Static Current, VB-VS = 8.5V,
= 5V, IN = 0V,
V
CC
RES = 0V, (Load R = 50Ω, C = 6.8nF)
at VCC = 4.5V and 6.5V
(Load R = 50Ω, C = 6.8nF)
VCC = 4.5V and 6.5V1.4--V
VCC = 4.5V and 6.5V--3.0V
VCC = 4.5V and 6.5V1.4--V
VCC = 4.5V and 6.5V--3.0V
at VCC = 5.0V, RES = 5V, IN = 0V,
VB = 12V
at VCC = 5.0V, RES = 5V, IN = 0V,
VB = 12V
at Logic LOW Response HIGH-0.1-1.0mA
VCC to GND, Incl. Hyst.-3.5-V
VB = VS = HOH = HOL = 7V, RES = 5V,
IN = 5V, V
at a Constant Current of 1.0mA--0.8V
at a Constant Current of 10mA--3.5V
= 4.5V and 6V
CC
300750875µA
100550700µA
-1.22.5mA
60100170kΩ
60100170kΩ
70170350Ω
71015µs
--1.5µs
4
Timing Diagrams
www.BDTIC.com/Intersil
IN
RES
VS
ISL6801
90%
90%
HOH, L
t
RECHARGE
t
RechargeOFF
VB Drop Voltage Test
dIN-HOH, L
t
dIN-HOH, L
ONOFF
t
RechargeON
FIGURE 1. INPUT/OUTPUT TIMING DIAGRAM
IN
RES
HOH, L
td
RES-HOH, L
td
RES-HOH, L
FIGURE 2. RESET TIMING DIAGRAM
10%
t
HOH, Lrise
t
HOH, Lfall
10%
I
g
I
g
1
V
CC
2
IN
IN
3
GND
RES
4
ISL6801
VB
HOH
HOL
VS
8
50R
7
50R
6
5
6n8
1µ
IN
RES
7V
OFF
VB
DROP
BREAK BEFORE MAKEVB-VS
FIGURE 3. VB DROP VOLTAGE TEST CIRCUITFIGURE 4. VB DROP VOLTAGE DIAGRAM
5
0A
Small Outline Plastic Packages (SOIC)
www.BDTIC.com/Intersil
ISL6801
N
INDEX
AREA
123
-AD
e
B
0.25(0.010)C AMBS
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is ca utioned to verify that data she ets are current before pl acing orders. Information fur nished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or othe rwise under any patent or patent righ ts of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
6
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.