The ISL6753 is a high-performance, low-pin-count
alternative, zero-voltage switching (ZVS) full-bridge PWM
controller. Like the ISL6551, it achieves ZVS operation by
driving the upper bridge FETs at a fixed 50% duty cycle while
the lower bridge FETS are trailing-edge modulated with
adjustable resonant switching delays. Compared to the more
familiar phase-shifted control method, this algorithm offers
equivalent efficiency and improved overcurrent and lightload performance with less complexity in a lower pin count
package.
This advanced BiCMOS design features low operating
current, adjustable oscillator frequency up to 2MHz,
adjustable soft-start, internal over temperature protection,
precision deadtime and resonant delay control, and short
propagation delays. Additionally, Multi-Pulse Suppression
ensures alternating output pulses at low duty cycles where
pulse skipping may occur.
Ordering Information
PART
NUMBER
ISL6753AAZA
(See Note)
Add -T suffix to part number for tape and reel packaging
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
PART
MARKING
ISL6753AAZ-40 to 105 16 Ld QSOP
TEMP.
RANGE (°C) PACKAGE
(Pb-free)
PKG.
DWG. #
M16.15A
Pinout
ISL6753 (QSOP)
TOP VIEW
Features
• Adjustable Resonant Delay for ZVS Operation
• Voltage- or Current-Mode Operation
• 3% Current Limit Threshold
• 175µA Startup Current
• Supply UVLO
• Adjustable Deadtime Control
• Adjustable Soft-Start
• Adjustable Oscillator Frequency Up to 2MHz
• Tight Tolerance Error Amplifier Reference Over Line,
Load, and Temperature
• 5MHz GBWP Error Amplifier
• Adjustable Cycle-by-Cycle Peak Current Limit
• Fast Current Sense to Output Delay
• 70ns Leading Edge Blanking
• Multi-Pulse Suppression
• Buffered Oscillator Sawtooth Output
• Internal Over Temperature Protection
• Pb-Free Plus Anneal Available and ELV, WEEE,
RoHS Compliant
Applications
• ZVS Full-Bridge Converters
• Telecom and Datacom Power
• Wireless Base Station Power
• File Server Power
• Industrial Power Systems
1
VERRVREF
2
CTBUF
3
RTD
RESDEL
4
5
CT
6
FB
7
RAMP
89
CSGND
1
16
15
14
13
12
11
10
SS
VDD
OUTLL
OUTLR
OUTUL
OUTUR
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved
Functional Block Diagram
www.BDTIC.com/Intersil
VDD
UVLO
OVER-
TEMPERATURE
2
PROTECTION
VREF
PWM
STEERING
LOGIC
50%
PWM
VDD
OUTUL
OUTUR
OUTLL
OUTLR
GND
VREF
RESDEL
CT
RTD
CTBUF
SS
OSCILLATOR
VREF
+
-
OVER CURRENT
COMPARATOR
+
-
PWM
COMPARATOR
SOFTSTART
CONTROL
1.00V
0.33
80mV
70 nS
LEADING
EDGE
BLANKING
VREF
1 mA
CS
RAMP
ISL6753
VERR
+
0.6V
-
FB
April 4, 2006
FN9182.2
Typical Application - High Voltage Input ZVS Full-Bridge Converter
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
2. All voltages are with respect to GND.
JA
(°C/W)
Electrical SpecificationsRecommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application
Leading Edge Blanking (LEB) Duration(Note 4)5070100ns
CS to OUT Delay + LEBT
CS Sink Current Device ImpedanceV
Input Bias CurrentV
RAMP
RAMP Sink Current Device ImpedanceV
RAMP to PWM Comparator OffsetT
LOAD
= 0 - -10mA4.8505.0005.150V
VREF
= 125°C, 1000 hours (Note 4)-3-mV
A
= 25°C--130ns
A
= 1.1V--20Ω
CS
= 0.3V-1.0-1.0µA
CS
RAMP
= 25°C658095mV
A
= 0-11.015.5mA
OUT
= 1.1V--20Ω
= -40°C to 105°C (Note 3), Typical values are at
A
4
FN9182.2
April 4, 2006
ISL6753
www.BDTIC.com/Intersil
Electrical SpecificationsRecommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application
schematic. 9V < VDD < 20V, RTD = 10.0kΩ, CT = 470pF, T
T
= 25°C (Continued)
A
PARAMETERTEST CONDITIONSMINTYPMAXUNITS
Bias CurrentV
Clamp Voltage(Note 4)6.5-8.0V
PULSE WIDTH MODULATOR
Minimum Duty CycleVERR < 0.6V--0%
Maximum Duty Cycle (per half-cycle)VERR = 4.20V, V
Zero Duty Cycle VERR Voltage0.85-1.20V
VERR to PWM Comparator Input OffsetT
VERR to PWM Comparator Input Gain0.310.330.35V/V
Common Mode (CM) Input Range(Note 4)0-V
ERROR AMPLIFIER
Input Common Mode (CM) Range(Note 4)0-VREFV
GBWP(Note 4)5--MHz
VERR VOLI
VERR VOHI
VERR Pull-Up Current SourceVERR = 2.5V0.81.01.3mA
EA ReferenceT
EA Reference + EA Input Offset Voltage0.5900.6000.612V
OSCILLATOR
Frequency Accuracy, Overall(Note 4)165183201kHz
Frequency Variation with VDDT
Temperature StabilityVDD = 10V, |F
Charge Current T
Discharge Current Gain192023µA/µA
CT Valley VoltageStatic Threshold0.750.800.88V
CT Peak VoltageStatic Threshold2.752.802.88V
CT Pk-Pk VoltageStatic Value1.922.002.05V
RTD Voltage1.972.002.03V
RESDEL Voltage Range0-2V
CTBUF Gain (V
CTBUF Offset from GNDV
CTBUF VOH∆V(I
CTBUFp-p/VCTp-p
)V
= 0.3V-5.0--2.0µA
RAMP
= 0V,
20V
-40°C
|/F
= 0mA, I
RAMP
- - F
25°C
LOAD
10V
- F
)/F
10V
|/F
0°C
= -2mA),
0°C
= 0V (Note 5)-94-%
V
CS
RTD = 2.00kΩ, CT = 220pF-97-%
RTD = 2.00kΩ, CT = 470pF-99-%
= 25°C0.70.80.9V
A
= 2mA--0.4V
LOAD
= 0mA4.20--V
LOAD
= 25°C0.5940.6000.606V
A
= 25°C, (F
A
- F
|F
0°C
(Note 4)
V
105°C
= 25°C-193-200-207µA
A
= 0.8V, 2.6V1.952.02.05V/V
CT
= 0.8V0.340.400.44V
CT
LOAD
= 2.6V
CT
= -40°C to 105°C (Note 3), Typical values are at
A
SS
-10-+10%
-0.31.7%
-4.5- %
-1.5- %
--0.10V
V
5
FN9182.2
April 4, 2006
ISL6753
www.BDTIC.com/Intersil
Electrical SpecificationsRecommended operating conditions unless otherwise noted. Refer to Block Diagram and Typical Application
schematic. 9V < VDD < 20V, RTD = 10.0kΩ, CT = 470pF, T
T
= 25°C (Continued)
A
PARAMETERTEST CONDITIONSMINTYPMAXUNITS
CTBUF VOL∆V(I
V
SOFT-START
Charging CurrentSS = 3V-60-70-80µA
SS Clamp Voltage4.4104.5004.590V
SS Discharge CurrentSS = 2V10--mA
Reset Threshold VoltageT
OUTPUTS
High Level Output Voltage (VOH)I
Low Level Output Voltage (VOL)I
Rise TimeC
Fall TimeC
UVLO Output Voltage ClampVDD = 7V, I
THERMAL PROTECTION
Thermal Shutdown(Note 4)130140150°C
Thermal Shutdown Clear(Note 4)115125135°C
Hysteresis, Internal Protection(Note 4)-15-°C
NOTES:
3. Specifications at -40°C and 105°C are guaranteed by 25°C test with margin limits.
4. Guaranteed by design, not 100% tested in production.
5. This is the maximum duty cycle achievable using the specified values of RTD and CT. Larger or smaller maximum duty cycles may be obtained
using other values for these components. See Equations 1 - 5.
6. Adjust VDD below the UVLO stop threshold prior to setting at 7V.
A
OUT
OUT
= 2mA, I
LOAD
= 0.8V
CT
= 25°C0.230.270.33V
= -10mA, VDD - VOH-0.51.0V
= 10mA, VOL - GND-0.51.0V
= 220pF, VDD = 15V(Note 4)-110200ns
OUT
= 220pF, VDD = 15V(Note 4)-90150ns
OUT
LOAD
= 0mA),
LOAD
= 1mA (Note 6)--1.25V
= -40°C to 105°C (Note 3), Typical values are at
A
--0.10V
6
FN9182.2
April 4, 2006
Typical Performance Curves
www.BDTIC.com/Intersil
ISL6753
1.02
25
24
1.01
1
23
22
21
Normalized Vref
0.99
0.98
40 25 105 203550658095110
Temperature (C)
FIGURE 1. REFERENCE VOLTAGE vs TEMPERATUREFIGURE 2. CT DISCHARGE CURRENT GAIN vs RTD CURRENT
4
1 10
3
1 10
100
Deadtime - TD (nS)
10
0 102030405060708090100
RTD (kohms)
CT =
1000pF
680pF
470pF
330pF
220pF
100pF
20
19
CT Discharge Current Gain
18
02004006008001000
RTD Current (uA)
3
1 10
100
Frequency (kHz)
10
0.1110
CT (nF)
RTD=
10k
50k
100k
FIGURE 3. DEADTIME (DT) vs CAPACITANCEFIGURE 4. CAPACITANCE vs FREQUENCY
Pin Descriptions
VDD - VDD is the power connection for the IC. To optimize
noise immunity, bypass VDD to GND with a ceramic
capacitor as close to the VDD and GND pins as possible.
Supply voltage under-voltage lock-out (UVLO) start and stop
thresholds track each other resulting in relatively constant
hysteresis.
GND - Signal and power ground connections for this device.
Due to high peak currents and high frequency operation, a
low impedance layout is necessary. Ground planes and
short traces are highly recommended.
VREF - The 5.00V reference voltage output having 3%
tolerance over line, load and operating temperature. Bypass
to GND with a 0.1µF to 2.2µF low ESR capacitor.
CT - The oscillator timing capacitor is connected between
this pin and GND. It is charged through an internal 200µA
current source and discharged with a user adjustable current
source controlled by RTD.
RTD - This is the oscillator timing capacitor discharge
current control pin. The current flowing in a resistor
connected between this pin and GND determines the
magnitude of the current that discharges CT. The CT
discharge current is nominally 20x the resistor current. The
PWM deadtime is determined by the timing capacitor
discharge duration. The voltage at RTD is nominally 2.00V.
CS - This is the input to the overcurrent comparator. The
overcurrent comparator threshold is set at 1.00V nominal.
The CS pin is shorted to GND at the termination of either
PWM output.
Depending on the current sensing source impedance, a
series input resistor may be required due to the delay
between the internal clock and the external power switch.
This delay may result in CS being discharged prior to the
power switching device being turned off.
RAMP - This is the input for the sawtooth waveform for the
PWM comparator. The RAMP pin is shorted to GND at the
termination of the PWM signal. A sawtooth voltage
7
FN9182.2
April 4, 2006
ISL6753
www.BDTIC.com/Intersil
waveform is required at this input. For current-mode control
this pin is connected to CS and the current loop feedback
signal is applied to both inputs. For voltage-mode control,
the oscillator sawtooth waveform may be buffered and used
to generate an appropriate signal, RAMP may be connected
to the input voltage through a RC network for voltage feed
forward control, or RAMP may be connected to VREF
through a RC network to produce the desired sawtooth
waveform.
OUTUL and OUTUR - These outputs control the upper
bridge FETs and operate at a fixed 50% duty cycle in
alternate sequence. OUTUL controls the upper left FET and
OUTUR controls the upper right FET. The left and right
designation may be switched as long as they are switched in
conjunction with the lower FET outputs, OUTLL and OUTLR.
RESDEL - Sets the resonant delay period between the
toggle of the upper FETs and the turn on of either of the
lower FETs. The voltage applied to RESDEL determines
when the upper FETs switch relative to a lower FET turning
on. Varying the control voltage from 0 to 2.00V increases the
resonant delay duration from 0 to 100% of the deadtime. The
control voltage divided by 2 represents the percent of the
deadtime equal to the resonant delay. In practice the
maximum resonant delay must be set lower than 2.00V to
ensure that the lower FETs, at maximum duty cycle, are OFF
prior to the switching of the upper FETs.
Functional Description
Features
The ISL6753 PWM is an excellent choice for low cost ZVS
full-bridge applications employing conventional output
rectification. If synchronous rectification is required, please
consider the ISL6752 or ISL6551 products.
With the ISL6753’s many protection and control features, a
highly flexible design with minimal external components is
possible. Among its many features are support for both
current- and voltage-mode control, a very accurate
overcurrent limit threshold, thermal protection, a buffered
sawtooth oscillator output suitable for slope compensation,
voltage controlled resonant delay, and adjustable frequency
with precise deadtime control.
Oscillator
The ISL6753 has an oscillator with a programmable
frequency range to 2MHz, and can be programmed with an
external resistor and capacitor.
The switching period is the sum of the timing capacitor
charge and discharge durations. The charge duration is
determined by CT and a fixed 200µA internal current source.
The discharge duration is determined by RTD and CT.
TC11.5 10⋅
3
CT⋅≈S
(EQ. 1)
OUTLL and OUTLR - These outputs control the lower
bridge FETs, are pulse width modulated, and operate in
alternate sequence. OUTLL controls the lower left FET and
OUTLR controls the lower right FET. The left and right
designation may be switched as long as they are switched in
conjunction with the upper FET outputs, OUTUL and
OUTUR.
VERR - The control voltage input to the inverting input of the
PWM comparator. The output of an external error amplifier
(EA) is applied to this input for closed loop regulation. VERR
has a nominal 1mA pull-up current source.
FB - FB is the inverting input to the error amplifier (EA).
SS - Connect the soft-start timing capacitor between this pin
and GND to control the duration of soft-start. The value of
the capacitor determines the rate of increase of the duty
cycle during start-up.
SS may also be used to inhibit the outputs by grounding
through a small transistor in an open collector/drain
configuration.
CTBUF - CTBUF is the buffered output of the sawtooth
oscillator waveform present on CT and is capable of
sourcing 2mA. It is offset from ground by 0.40V and has a
nominal valley-to-peak gain of 2. It may be used for slope
compensation.
T
0.06 RTD CT⋅⋅()50 109–⋅+≈S
D
== S
T
SWTCTD
where T
+
and TD are the charge and discharge times,
C
respectively, T
1
------------
F
SW
is the oscillator period, and FSW is the
SW
(EQ. 2)
(EQ. 3)
oscillator frequency. One output switching cycle requires two
oscillator cycles. The actual times will be slightly longer than
calculated due to internal propagation delays of
approximately 10ns/transition. This delay adds directly to the
switching duration, but also causes overshoot of the timing
capacitor peak and valley voltage thresholds, effectively
increasing the peak-to-peak voltage on the timing capacitor.
Additionally, if very small discharge currents are used, there
will be increased error due to the input impedance at the CT
pin.
The maximum duty cycle, D, and percent deadtime, DT, can
be calculated from:
T
D
DT1 D–=
C
------------=
T
SW
(EQ. 4)
(EQ. 5)
8
FN9182.2
April 4, 2006
ISL6753
www.BDTIC.com/Intersil
Soft-Start Operation
The ISL6753 features a soft-start using an external capacitor in
conjunction with an internal current source. Soft-start reduces
component stresses and surge currents during start-up.
Upon start-up, the soft-start circuitry limits the error voltage
input (VERR) to a value equal to the soft-start voltage. The
output pulse width increases as the soft-start capacitor
voltage increases. This has the effect of increasing the duty
cycle from zero to the regulation pulse width during the softstart period. When the soft-start voltage exceeds the error
voltage, soft-start is completed. Soft-start occurs during
start-up and after recovery from a fault condition. The softstart charging period may be calculated as follows:
t64.3 C⋅=ms
(EQ. 6)
where t is the charging period in ms and C is the value of the
soft-start capacitor in µF.
The soft-start voltage is clamped to 4.50V with a tolerance of
2%. It is suitable for use as a “soft-started” reference
provided the current draw is kept well below the 70µA
charging current.
The outputs may be inhibited by using the SS pin as a
disable input. Pulling SS below 0.25V forces all outputs low.
An open collector/drain configuration may be used to couple
the disable signal into the SS pin.
Gate Drive
The ISL6753 outputs are capable of sourcing and sinking
10mA (at rated VOH, VOL) and are intended to be used in
conjunction with integrated FET drivers or discrete bipolar
totem pole drivers. The typical on resistance of the outputs is
50Ω.
Overcurrent Operation
The cycle-by-cycle peak current limit results in pulse-by-pulse
duty cycle reduction when the current feedback signal
exceeds 1.0V. When the peak current exceeds the threshold,
the active output pulse is immediately terminated. This results
in a decrease in output voltage as the load current increases
beyond the current limit threshold. The ISL6753 operates
continuously in an overcurrent condition without shutdown.
If voltage-mode control is used in a bridge topology, it should
be noted that peak current limit results in inherently unstable
operation. The DC blocking capacitors used in voltage-mode
bridge topologies become unbalanced, as does the flux in
the transformer core. A latching overcurrent shutdown
method using external components is recommended.
Voltage Feed Forward Operation
Voltage feed forward is a technique used to regulate the
output voltage for changes in input voltage without the
intervention of the control loop. Voltage feed forward is often
implemented in voltage-mode control loops, but is redundant
and unnecessary in peak current-mode control loops.
Voltage feed forward operates by modulating the sawtooth
ramp in direct proportion to the input voltage. Figure 5
demonstrates the concept.
VIN
ERROR VOLTAGE
RAMP
CT
OUTLL, LR
FIGURE 5. VOLTAGE FEED FORWARD BEHAVIOR
Input voltage feed forward may be implemented using the
RAMP input. An RC network connected between the input
voltage and ground, as shown in Figure 7, generates a
voltage ramp whose charging rate varies with the amplitude
of the source voltage. At the termination of the active output
pulse RAMP is discharged to ground so that a repetitive
sawtooth waveform is created. The RAMP waveform is
compared to the VERR voltage to determine duty cycle. The
selection of the RC components depends upon the desired
input voltage operating range and the frequency of the
oscillator. In typical applications the RC components are
selected so that the ramp amplitude reaches 1.0V at
minimum input voltage within the duration of one half-cycle.
R3
C7
VIN
1
2
3
4
ISL6753
5
6
RAMP
7
89
16
15
14
13
12
11
10
GND
The propagation delay from CS exceeding the current limit
threshold to the termination of the output pulse is increased
by the leading edge blanking (LEB) interval. The effective
delay is the sum of the two delays and is nominally 105ns.
FIGURE 6. VOLTAGE FEED FORWARD CONTROL
9
FN9182.2
April 4, 2006
ISL6753
www.BDTIC.com/Intersil
The charging time of the ramp capacitor is
V
RAMP PEAK()
tR3C71
ln⋅⋅–=S
----------------------------------------–
V
IN MIN()
(EQ. 7)
For optimum performance, the maximum value of the
capacitor should be limited to 10nF. The maximum DC
current through the resistor should be limited to 2mA
maximum. For example, if the oscillator frequency is
400kHz, the minimum input voltage is 300V, and a 4.7nF
ramp capacitor is selected, the value of the resistor can be
determined by rearranging Equation 7.
where t is equal to the oscillator period minus the deadtime.
If the deadtime is short relative to the oscillator period, it can
be ignored for this calculation.
If feed forward operation is not desired, the RC network may
be connected to VREF rather than the input voltage.
Alternatively, a resistor divider from CTBUF may be used as
the sawtooth signal. Regardless, a sawtooth waveform must
be generated on RAMP as it is required for proper PWM
operation.
Slope Compensation
Peak current-mode control requires slope compensation to
improve noise immunity, particularly at lighter loads, and to
prevent current loop instability, particularly for duty cycles
greater than 50%. Slope compensation may be
accomplished by summing an external ramp with the current
feedback signal or by subtracting the external ramp from the
voltage feedback error signal. Adding the external ramp to
the current feedback signal is the more popular method.
From the small signal current-mode model [1] it can be
shown that the naturally-sampled modulator gain, Fm,
without slope compensation, is
Fm
where Sn is the slope of the sawtooth signal and Tsw is the
duration of the half-cycle. When an external ramp is added,
the modulator gain becomes
Fm
1
=
--------------------
SnTsw
==
1
---------------------------------------
Sn Se+()Tsw
1
----------------------------
SnTsw
m
c
(EQ. 9)
(EQ. 10)
The criteria for determining the correct amount of external
ramp can be determined by appropriately setting the
damping factor of the double-pole located at half the
oscillator frequency. The double-pole will be critically
damped if the Q-factor is set to 1, and over-damped for
Q > 1, and under-damped for Q < 1. An under-damped
condition can result in current loop instability.
where D is the percent of on time during a half cycle. Setting
Q = 1 and solving for Se yields:
SeS
=
Since S
1
--- 0.5+
n
π
and Se are the on time slopes of the current ramp
n
1
-------------
1D–
1–
(EQ. 13)
and the external ramp, respectively, they can be multiplied
by Ton to obtain the voltage change that occurs during Ton.
VeV
=
1
--- 0.5+
n
π
1
-------------
1D–
1–
(EQ. 14)
where Vn is the change in the current feedback signal during
the on time and Ve is the voltage that must be added by the
external ramp.
Vn can be solved for in terms of input voltage, current
transducer components, and output inductance yielding:
TSWV⋅ORCS⋅
------------------------------------------
=V
V
e
where R
⋅
N
CTLO
is the current sense burden resistor, N
CS
current transformer turns ratio, L
V
is the output voltage, and Ns and Np are the secondary
O
N
S
1
--------
⋅
--- D0.5–+
N
π
P
is the output inductance,
O
(EQ. 15)
is the
CT
and primary turns, respectively.
The inductor current, when reflected through the isolation
transformer and the current sense transformer to obtain the
current feedback signal at the sense resistor yields:
NSRCS⋅
------------------------
=V
V
CS
N
⋅
PNCT
where V
and I
is the voltage across the current sense resistor
CS
is the output current at current limit.
O
DT⋅
I
O
---------------------
+
2L
SW
O
N
S
--------
V
⋅V
IN
–
O
N
P
(EQ. 16)
Since the peak current limit threshold is 1.00V, the total
current feedback signal plus the external ramp voltage must
sum to this value.
VeVCS+1=
(EQ. 17)
where Se is slope of the external ramp and
mc1
Se
+=
-------
Sn
(EQ. 11)
Substituting Equations 15 and 16 into Equation 17 and
solving for R
For simplicity, idealized components have been used for this
discussion, but the effect of magnetizing inductance must be
considered when determining the amount of external ramp
to add. Magnetizing inductance provides a degree of slope
compensation to the current feedback signal and reduces
the amount of external ramp required. The magnetizing
inductance adds primary current in excess of what is
reflected from the inductor current in the secondary.
⋅
V
INDTSW
IP∆
-------------------------------=A
where V
IN
L
m
is the input voltage that corresponds to the duty
(EQ. 19)
cycle D and Lm is the primary magnetizing inductance. The
effect of the magnetizing current at the current sense
resistor, R
∆V
CS
, is
CS
∆IPRCS⋅
--------------------------=V
N
CT
(EQ. 20)
If ∆VCS is greater than or equal to Ve, then no additional
slope compensation is needed and R
Assuming the designer has selected values for the RC filter
placed on the CS pin, the value of R9 required to add the
appropriate external ramp can be found by superposition.
rescaled so that the current sense signal presented at the
CS pin is that predicted by Equation 16. The divider created
by R6 and R9 makes this necessary.
R′
CS
----------------------
R9
⋅=
R
CS
(EQ. 24)
R6 R9+
Example:
V
= 280V
IN
VO = 12V
LO = 2.0µH
Np/Ns = 20
If ∆V
value of R
is less than Ve, then Equation 18 is still valid for the
CS
, but the amount of slope compensation added
CS
by the external ramp must be reduced by ∆VCS.
Adding slope compensation is accomplished in the ISL6753
using the CTBUF signal. CTBUF is an amplified
representation of the sawtooth signal that appears on the CT
pin. It is offset from ground by 0.4V and is 2x the peak-topeak amplitude of CT (0.4 - 4.4V). A typical application sums
this signal with the current sense feedback and applies the
result to the CS pin as shown in Figure 7.
1
2
CTBUF
3
4
R9
R6
R
CS
C4
ISL6753
5
6
7
8
CS
Lm = 2mH
IO = 55A
Oscillator Frequency, Fsw = 400kHz
Duty Cycle, D = 85.7%
NCT = 50
R6 = 499Ω
Solve for the current sense resistor, RCS, using Equation 18.
RCS = 15.1Ω.
Determine the amount of voltage, Ve, that must be added to
the current feedback signal using Equation 15.
Ve = 153mV
Next, determine the effect of the magnetizing current from
Equation 20.
∆V
= 91mV
CS
Using Equation 23, solve for the summing resistor, R9, from
CTBUF to CS.
R9 = 30.1kΩ
Determine the new value of R
, R’CS, using Equation 24.
CS
R’CS = 15.4Ω
The above discussion determines the minimum external
FIGURE 7. ADDING SLOPE COMPENSATION
ramp that is required. Additional slope compensation may be
considered for design margin.
11
FN9182.2
April 4, 2006
If the application requires deadtime less than about 500ns,
)
www.BDTIC.com/Intersil
the CTBUF signal may not perform adequately for slope
compensation. CTBUF lags the CT sawtooth waveform by
300-400ns. This behavior results in a non-zero value of
CTBUF when the next half-cycle begins when the deadtime
is short.
Under these situations, slope compensation may be added
by externally buffering the CT signal as shown below.
ISL6753
DEADTIME
OUTLL
OUTLR
CT
PWM
PWM
PWM
PWM
1
2
3
4
5
CT
R9
R6
R
CS
C4
6
7
CS
89
CT
ISL6753
VREF
16
15
14
13
12
11
10
FIGURE 8. ADDING SLOPE COMPENSATION USING CT
Using CT to provide slope compensation instead of CTBUF
requires the same calculations, except that Equations 21
and 22 require modification. Equation 21 becomes:
The buffer transistor used to create the external ramp from
CT should have a sufficiently high gain so as to minimize the
required base current. Whatever base current is required
reduces the charging current into CT and will reduce the
oscillator frequency.
ZVS Full-Bridge Operation
The ISL6753 is a full-bridge zero-voltage switching (ZVS)
PWM controller that behaves much like a traditional hardswitched topology controller. Rather than drive the diagonal
bridge switches simultaneously, the upper switches (OUTUL,
OUTUR) are driven at a fixed 50% duty cycle and the lower
switches (OUTLL, OUTLR) are pulse width modulated on
the trailing edge.
OUTUR
OUTUL
RESDEL
WINDOW
RESONANT
DELAY
FIGURE 9. BRIDGE DRIVE SIGNAL TIMING
To understand how the ZVS method operates one must
include the parasitic elements of the circuit and examine a
full switching cycle.
VIN+
UL
LL
VIN-
UR
L
L
LR
D1
VOUT+
RTN
D2
FIGURE 10. IDEALIZED FULL-BRIDGE
In Figure 10, the power semiconductor switches have been
replaced by ideal switch elements with parallel diodes and
capacitance, the output rectifiers are ideal, and the
transformer leakage inductance has been included as a
discrete element. The parasitic capacitance has been
lumped together as switch capacitance, but represents all
parasitic capacitance in the circuit including winding
capacitance. Each switch is designated by its position, upper
left (UL), upper right (UR), lower left (LL), and lower right
(LR). The beginning of the cycle, shown in Figure 11, is
arbitrarily set as having switches UL and LR on and UR and
LL off. The direction of the primary and secondary currents
are indicated by I
and IS, respectively.
P
12
FN9182.2
April 4, 2006
)
ISL6753
www.BDTIC.com/Intersil
VIN+
VIN-
UL
I
P
LL
UR
L
L
LR
D1
D2
I
S
VOUT+
RTN
FIGURE 11. UL - LR POWER TRANSFER CYCLE
The UL - LR power transfer period terminates when switch
LR turns off as determined by the PWM. The current flowing
in the primary cannot be interrupted instantaneously, so it
must find an alternate path. The current flows into the
parasitic switch capacitance of LR and UR which charges
the node to VIN and then forward biases the body diode of
upper switch UR.
VIN+
VIN-
UL
I
P
LL
UR
L
L
LR
D1
D2
I
S
VOUT+
RTN
FIGURE 12. UL - UR FREE-WHEELING PERIOD
The primary leakage inductance, L
, maintains the current
L
which now circulates around the path of switch UL, the
transformer primary, and switch UR. When switch LR opens,
the output inductor current free-wheels through both output
diodes, D1 and D2. During the switch transition, the output
inductor current assists the leakage inductance in charging
the upper and lower bridge FET capacitance.
The current flow from the previous power transfer cycle
tends to be maintained during the free-wheeling period
because the transformer primary winding is essentially
shorted. Diode D1 may conduct very little or none of the
free-wheeling current, depending on circuit parasitics. This
behavior is quite different than occurs in a conventional
hard-switched full-bridge topology where the free-wheeling
current splits nearly evenly between the output diodes, and
flows not at all in the primary.
resonant delay. The voltage applied to RESDEL determines
how far in advance the toggle occurs prior to a lower switch
turning on. The ZVS transition occurs after the upper
switches toggle and before the diagonal lower switch turns
on. The required resonant delay is 1/4 of the period of the LC
resonant frequency of the circuit formed by the leakage
inductance and the parasitic capacitance. The resonant
transition may be estimated from Equation 27.
π
1
-----------------------------------
---
τ
=
2
---------------
L
LCP
2
R
1
----------–
2
4L
L
where τ is the resonant transition time, L
inductance, C
equivalent resistance in series with L
is the parasitic capacitance, and R is the
P
and CP.
L
is the leakage
L
(EQ. 27)
The resonant delay is always less than or equal to the
deadtime and may be calculated using the following
equation.
V
resdel
τ
resdel
where τ
--------------------
resdel
DT⋅=S
2
is the desired resonant delay, V
resdel
(EQ. 28
is a
voltage between 0 and 2V applied to the RESDEL pin, and
DT is the deadtime (see Equations 1 - 5).
When the upper switches toggle, the primary current that
was flowing through UL must find an alternate path. It
charges/discharges the parasitic capacitance of switches UL
and LL until the body diode of LL is forward biased. If
RESDEL is set properly, switch LL will be turned on at this
time.The output inductor does not assist this transition. It is
VIN+
VIN-
UL
I
P
LL
UR
L
L
LR
D1
D2
I
S
VOUT+
RTN
FIGURE 13. UPPER SWITCH TOGGLE AND RESONANT
TRANSITION
purely a resonant transition driven by the leakage
inductance.
This condition persists through the remainder of the halfcycle.
During the period when CT discharges, also referred to as
the deadtime, the upper switches toggle. Switch UL turns off
and switch UR turns on. The actual timing of the upper
switch toggle is dependent on RESDEL which sets the
13
FN9182.2
April 4, 2006
ISL6753
www.BDTIC.com/Intersil
The second power transfer period commences when switch
LL closes. With switches UR and LL on, the primary and
secondary currents flow as indicated below.
VIN+
UL
LL
VIN-
UR
L
L
LR
D1
VOUT+
RTN
D2
FIGURE 14. UR - LL POWER TRANSFER
The UR - LL power transfer period terminates when switch
LL turns off as determined by the PWM. The current flowing
in the primary must find an alternate path. The current flows
into the parasitic switch capacitance which charges the node
to VIN and then forward biases the body diode of upper
switch UL. As before, the output inductor current assists in
this transition. The primary leakage inductance, L
,
L
maintains the current, which now circulates around the path
of switch UR, the transformer primary, and switch UL. When
switch LL opens, the output inductor current free-wheels
predominantly through diode D1. Diode D2 may actually
conduct very little or none of the free-wheeling current,
depending on circuit parasitics. This condition persists
through the remainder of the half-cycle.
VIN+
VIN-
UL
I
P
LL
UR
L
L
LR
D1
D2
I
S
VOUT+
RTN
FIGURE 15. UR - UL FREE-WHEELING PERIOD
When the upper switches toggle, the primary current that
was flowing through UR must find an alternate path. It
charges/discharges the parasitic capacitance of switches UR
and LR until the body diode of LR is forward biased. If
RESDEL is set properly, switch LR will be turned on at this
time.
VIN+
VIN-
UL
I
P
LL
UR
L
L
LR
D1
D2
I
S
VOUT+
RTN
FIGURE 16. UPPER SWITCH TOGGLE AND RESONANT
TRANSITION
The first power transfer period commences when switch LR
closes and the cycle repeats. The ZVS transition requires
that the leakage inductance has sufficient energy stored to
fully charge the parasitic capacitances. Since the energy
stored is proportional to the square of the current (1/2 L
LIP
2
the ZVS resonant transition is load dependent. If the leakage
inductance is not able to store sufficient energy for ZVS, a
discrete inductor may be added in series with the
transformer primary.
Fault Conditions
A fault condition occurs if VREF or VDD fall below their
undervoltage lockout (UVLO) thresholds or if the thermal
protection is triggered. When a fault is detected, the softstart capacitor is quickly discharged, and the outputs are
disabled low. When the fault condition clears and the softstart voltage is below the reset threshold, a soft-start cycle
begins.
An overcurrent condition is not considered a fault and does
not result in a shutdown.
Thermal Protection
Internal die over temperature protection is provided. An
integrated temperature sensor protects the device should
the junction temperature exceed 140°C. There is
approximately 15°C of hysteresis.
Ground Plane Requirements
Careful layout is essential for satisfactory operation of the
device. A good ground plane must be employed. VDD and
VREF should be bypassed directly to GND with good high
frequency capacitance.
References
[1] Ridley, R., “A New Continuous-Time Model for Current
Mode Control”, IEEE Transactions on Power
Electronics, Vol. 6, No. 2, April 1991.
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.10mm (0.004 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions are not necessarily exact.
M
A1
0.10(0.004)
S
GAUGE
PLANE
A2
M
0.25
0.010
h x 45°
-1982.
M
M16.15A
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
INCHESMILLIMETERS
SYMBOL
A0.0610.0681.551.73-
A10.0040.00980.1020.249-
L
C
A20.0550.0611.401.55-
B0.0080.0120.200.319
C0.00750.00980.1910.249-
D0.1890.1964.804.983
E0.1500.1573.813.994
e0.025 BSC0.635 BSC-
H0.2300.2445.846.20-
h0.0100.0160.250.415
L0.0160.0350.410.896
N16167
α
0°8°0°8°-
NOTESMINMAXMINMAX
Rev. 2 6/04
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
15
FN9182.2
April 4, 2006
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