Add -T suffix to part number for tape and reel packaging.
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures
that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
6722AAB
Z
6723AAB
Z
6722AAV
Z
-40 to 105
-40 to 105
-40 to 105
包裝 包裝圖號
#
16 Ld
SOIC
(Pb-
free)
16LD
SOIC
(Pb
free)
16 Ld
TSSOP
(Pb-
free)
M16.15
M16.15
M16.173
• 1A MOSFET 驅動器
• 100µA 啟動電流
• 快速瞬變反應運用峰值電流控制模式
• 可調振蕩頻率高達 1MHz
• 低功耗的休止模式(ISL6722A)
• 低功耗的切斷模式
• 過壓及過流故障切斷延遲再啟動
• 可調斜率補償
• 可調軟啟動
• 可調過流切斷延遲
• 可調欠壓和過壓指示
• 上升邊緣消隱
• 基准電壓 1%容差
• 不含鉛加退火, 以及 ELV, WEEE (RoHS Compliant)
應用
• 電信和信息電源
• 無線基站電源
• 檔案服務器電源
• 工業動力系統
• 隔离式降壓及反饋轉換器
• 升壓調節器
插腳引線
ISL6722A,ISL6723A (SOIC,TSSOP)
頂視圖
GATE
ISENSE
SYNC/SLEEP
SLOPE
UV
OV
RTCT
1
2
3
4
5
6
7
89ISETFB
VC
16
PG ND
15
VCC
14
VRE F
13
LGND
12
SS
11
COM
10
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774|Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners
Thermal Resistance Junction to Ambient (Typical) θJA (oC/W)
16 Lead SOIC (Note 1)-------------------------------------80
16 Lead TSSOP (Note 1)----------------------------------105
Maximum Junction Temperature -------------------55
Maximum Storage Temperature Range-----------65
Maximum Lead Temperature (Soldering 10s)--------------300
o
C to 150oC
o
C to 150oC
o
C
(SOIC, TSSOP – Lead Tips Only)
額定值
Supply Voltage, VCC, VC -----------GND - 0.3V to +20.0V
GATE ------------GND-0.3V to Gate Output Limit Voltage
PGND to LGND -------------------------------------------+
VREF ---------------------------------------GND – 0.3V to 5.3V
Signal Pins --------------------------------GND – 0.3V to V
Peak GATE Current ------------------------------------------- 1A
ESD Classification
Human Body Model (Per JESD22-A114C.01)--------------------1250V
Charged Device Model (Per JESD22-C101-A)-------------------1000V
0.3V
運行條件
Supply Voltage Range (Typical)------------------9V-18VDC
Temperature Range
ISL6722AAxZ-------------------------------40
ISL6723AAxZ----------------------------- -40
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational section of this specification is not implied.
Notes:
1) θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for
details.
2) All voltages are with respect to GND.
電气規范
Recommended Operating Conditions, Unless Otherwise Noted. Refer to Block Diagram and Typical Application Schematic.
9V < V
o
C to 105oC
o
C to 105oC
Electrical Specifications
= VC < 20V, RT = 11kΩ, CT = 330pF, TA = -40oC to 105oC (Note 3), Typical values are at TA= 25oC (Continued)
CC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
UNDERVOLTAGE LOCKOUT
START Threshold (ISL6722A) SLEEP = 0V 7.95 8.25 8.55 V
START Threshold (ISL6723A) 12.4 13 13.4 V
STOP Threshold 7.4 7.7 8.2 V
Hysteresis (ISL6722A) 0.50 0.55 1.00 V
Hysteresis (ISL6723A) 4.00 5.00 6.00 V
Start-Up Current, ICC V
OC/OV Fault Operating Current, ICC - 200 300
< START Threshold - 100 175
CC
µA
µA
Operating Current, ICC - 4.5 10.0 mA
Operating Supply Current, IC Includes 1nF GATE loading - 8.0 12.0 mA
REFERENCE VOLTAGE
Overall Accuracy
Line, load, TA = 0 - 105°C 4.95 5.00 5.05 V
Line, load, T
= -40 - 105°C 4.90 5.00 5.05 V
A
Long Term Stability TA = 125°C, 1000 hours (Note 5) - 5.00 - mV
Fault Voltage 4.50 4.65 4.75 V
VREF Good Voltage 4.65 4.8 4.95 V
Hysteresis 75 165 250 mV
Operational Current -10 - - mA
Current Limit -20 - - mA
CURRENT SENSE
Input Impedance
5
- 5 -
kΩ
ISL6722A, ISL6723A
電气規范
Recommended Operating Conditions, Unless Otherwise Noted. Refer to Block Diagram and Typical Application Schematic.
9V < V
= VC < 20V, RT = 11kΩ, CT = 330pF, TA = -40oC to 105oC (Note 3), Typical values are at TA= 25oC (Continued)
CC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Offset Voltage 0.08 0.10 0.11 V
Input Voltage Range 0 - 1.5 V
Blanking Time (Note 5) 30 60 100 ns
Gain, ACS
V
ISET
= ∆ISET/∆ISENSE
A
CS
0.77 0.79 0.81 V/V
V
= 0V, VFB = 2.3V,
SLOPE
= 0.35V, 1.5V
ERROR AMPLIFIER
Open Loop Voltage Gain (Note 5) 60 90 - dB
Gain-Bandwidth Product (Note 5) - 15 - MHz
Reference Voltage Initial Accuracy VFB = COMP, TA = 25°C (Note 5) 2.465 2.515 2.565 V
Reference Voltage V
= COMP 2.44 2.515 2.590 V
FB
COMP to PWM Gain, ACOMP COMP = 4V, TA = 25°C 0.31 0.33 0.35 V/V
COMP to PWM Offset COMP = 4V 0.51 0.75 0.88 V
FB Input Bias Current V
= 0V -2 0.1 2
FB
COMP Sink Current COMP = 1.5V, VFB = 2.7V 2 6 - mA
COMP Source Current COMP = 1.5V, VFB = 2.3V -0.25 -0.5 - mA
COMP VOH VFB = 2.3V 4.25 4.4 5.0 V
COMP VOL VFB = 2.7V 0.4 0.8 1.2 V
PSRR Frequency = 120Hz (Note 5) 60 80 -
SS Clamp, VCOMP SS = 2.5V, VFB = 0V, I
= 2V 2.4 2.5 2.6 V
SET
Electrical Specifications
µA
dB
OSCILLATOR
Frequency Accuracy 289 318 347 kHz
Frequency Variation with VCC TA = 105°C (F
T
= -40°C (F
A
- F9V)/F9V - 2 3
20V
- F9V)/F9V 2 3
20V
%
Temperature Stability (Note 5) - 8 - %
Maximum Duty Cycle (Note 6) 68 75 81 %
Comparator High Threshold - 3.00 - V
Comparator High Threshold w/Ext. SYNC
(ISL6723A)
(Note 5) - 4.00 - V
Comparator Low Threshold - 1.50 - V
Discharge Current
TA = 0 - 105°C 0.75 1 1.2
T
= -40 - 105°C 0.70 1 1.2
A
mA
SOFTSTART
Charging Current SS = 2V -40 -55 -70
µA
Charged Threshold Voltage 4.26 4.5 4.74 V
Initial Overcurrent Discharge Current
Sustained OC Threshold
< SS < Charged Threshold
30 40 55
µA
6
電气規范
ISL6722A, ISL6723A
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Noted. Refer to Block Diagram and Typical Application Schematic.
9V < V
= VC < 20V, RT = 11kΩ, CT = 330pF, TA = -40oC to 105oC (Note 3), Typical values are at TA= 25oC (Continued)
CC
Overcurrent Shutdown Threshold Voltage
Charged Threshold minus,
= 25°C
T
A
0.110 0.125 0.140 V
Fault Discharge Current SS = 2V 0.25 1.0 - mA
Reset Threshold Voltage TA = 25°C 0.22 0.27 0.31 V
[1] Ridley, R., “A New Continuous-Time Model for Current
Mode Control”, IEEE Transactions on Power
Electronics, Vol. 6, No. 2, April 1991.
21
[2] Dixon, Lloyd H., “Closing the Feedback Loop”, Unitrode
Power Supply Design Seminar, SEM-700, 1990.
ISL6722A, ISL6723A
f
6
m
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
-AD
e
B
0.25(0.010)C AMBS
Symbols are defined in the “MO Series Symbol List” in Section 2.2 o
1.
Publication Number 95.
Dimensioning and tolerancing per ANSI Y14.5M-1982.
2.
3.
Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.00
inch) per sid e.
4.
Dim ens ion “E” do es not incl u de inte rle ad fl ash or prot rusio ns. Interle ad
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5.
The chamfer on the body is optional. If it is not present , a visual index
f eat ure mus t be located w ithin the cr ossh atch ed ar ea.
6.
“L” is the length of terminal for soldering to a substrate.
7.
“N” is the number of terminal positions.
8.
Terminal numbers are shown for reference only.
9.
The lead width “B” , as m ea sur ed 0.36m m (0.0 14 i nch) or gr eater ab ove
t he se ati ng pl a ne, sha ll no t exc eed a m axi mum val ue o f 0. 61m
(0. 024 inch).
Cont ro lli ng dim ens ion: MI LLI ME TER . C onv ert ed i nch di mensio ns a re
.
10
not necessari ly exa ct.
E
-B-
SEATING PLANE
A
-C-
M
0.25(0.010)BMM
H
α
A1
0.10(0.004)
L
h x 45°
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
C
INCHESMILLIMETERSNOTES
MIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.004 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.3859 0.3937 9.80 10.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.244 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N 16 16 7
α
0O 8
O
0
O
8
O
-
Rev.1 6/05
22
ISL6722A, ISL6723A
Thin Shrink Small Outline Plastic
Packages (TSSOP)
N
INDEX
AREA
123
0.05(0.002)
-A-
D
e
b
0.10(0.004)C AMBS
SE ATIN G P LA NE
E1
-B-
A
-C-
M
0.25(0.010)BMM
E
α
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
c
Notes:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum
space between protrusion and adjacent lead is 0.07mm (0.0027
inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees).
M16.173A
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOLINCHES
A - 0.043 - 1.10 -
A1 0.002 0.006 0.05 0.15 -
A2 0.033 0.037 0.85 0.95 -
b 0.0075 0.012 0.19 0.30 9
c 0.0035 0.008 0.09 0.20 -
D 0.193 0.201 4.90 5.10 3
E1 0.169 0.177 4.30 4.50 4
e 0.026 BSC 0.65 BSC -
E 0.246 0.256 6.25 6.50 -
L 0.020 0.028 0.50 0.70 6
N 16 16 7
α
MIN MAX MIN MAX
0O 8
MILLIMETERSNOTES
O
0
O
8
O
-
Rev.1 2/02
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the
reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by
Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any
patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
23
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