Multiple Linear Power Controller with
ACPI Control Interface
The ISL6505 complements other power building blocks
(voltage regulators) in ACPI-compliant designs for
microprocessor and computer applications. The IC
integrates three linear controllers/regulators, switching,
monitoring and control functions into a 20-pin wide-body
SOIC or 20-pin QFN (also known as MLF) 5x5 package.
The ISL6505’s operating mode (active or sleep outputs) is
selectable through two digital control pins, S3
One linear controller generates the 3.3V
voltage plane from the ATX supply’s 5V
the south bridge and the PCI slots through an external NPN
pass transistor during sleep states (S3, S4/S5). In active
state (during S0 and S1/S2), the 3.3V
DUAL
regulator uses an external N-channel pass MOSFET to
connect the outputs directly to the 3.3V input supplied by an
ATX power supply, f or minimal losses. Th e 3 .3 V
output is active for as long as the ATX 5V
to the chip.
A controller powers up the 5V
plane by switching in the
DUAL
ATX 5V output through an NMOS transistor in active states,
or by switching in the ATX 5V
through a PMOS (or PNP)
SB
transistor in S3 sleep state. In S4/S5 sleep states, the
ISL6505 5V
output is either shut down or stays on,
DUAL
based on the state of the EN5 pin.
An internal linear regulator supplies the 1.2V for the voltage
identification circuitry (VID) only during active states (S0 and
S1/S2), and uses the 3V3 pin as input source for its internal
pass element.
A linear controller generates V
3.3V
/3.3VSB voltage plane, using an external NFET.
DUAL
OUT1
from the
The voltage is user-programmable to values between 1.2V
and 1.5V, using an external resistor divider. The mode is
user-selectable with the LAN pin; a logic high (or open)
selects the 10/100 LAN mode, wh er e V
(S0-S5); a logic low selects the Gigabit Ethernet mode,
where V
is only on during active modes (S0-S2).
OUT1
and S5.
/3.3VSB
DUAL
output, powering
SB
/3.3VSB linear
/3.3VSB
DUAL
voltage is applied
SB
is always on
OUT1
FN9109.3
Features
• Provides four ACPI-Controlled Voltages
-5V
-3.3V
-1.2V
-V
USB/Keyboard/Mouse
DUAL
/3.3VSB PCI/Auxiliary/LAN
DUAL
Processor VID Circuitry
VID
(1.2V - 1.5V programmable) LAN/Ethernet
OUT1
• Excellent Output Voltage Regulation
- All Outputs: ±2.0% over temperature (as applicable)
• Small Size; Very Low External Component Count
• Undervoltage Monitoring of All Outputs with Centralized
FAULT Reporting and Temperature Shutdown
• QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
•
ACPI-Compliant Power Regulation for Motherboards
Ordering Information
PART NUMBER
ISL6505CB*0 to 7020 Ld Wide SOICM20.3
ISL6505CR*0 to 7020 Ld 5x5 QFNL20.5x5
ISL6505CRZ*
1. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and
100% matte tin plate termination finish, which are RoHS
compliant and compatible with both SnPb and Pb-free soldering
operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the
Pb-free requirements of IPC/JEDEC J STD-020.
TEMP.
RANGE (°C)PACKAGE
0 to 7020 Ld 5x5 QFN
(Pb-free)
PKG.
DWG. #
L20.5x5
Pinouts - See page 6.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. θ
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
3. θ
JA
Tech Brief TB379.
4. For θ
, the “case temp” location is the center of the exposed metal pad on the package underside.
JC
Electrical SpecificationsRecommended Operating Conditions, Unless Otherwise Noted Refer to Figures 1, 2 and 3
VCC SUPPLY CURRENT
Nominal Supply CurrentI
Shutdown Supply CurrentI
POWER-ON RESET, SOFT-START, AND VOLTAGE MONITORS
5VSB Rising POR Threshold4.04.34.5V
5VSB Falling POR Threshold3.153.43.55V
5VSB POR Hysteresis-0.9- V
3V3 Rising Threshold2.82.933.0V
3V3 Falling Threshold2.652.782.9V
3V3 Hysteresis-150-mV
5V Rising Threshold4.254.44.5V
5V Falling Threshold4.04.154.3V
5V Hysteresis-250-mV
VID_PG Rising Threshold-1.04-V
VID_PG Hysteresis-50- mV
VID_CT Charging CurrentI
Soft-Start CurrentI
Soft-Start Shutdown Voltage ThresholdV
Active State Assessment Past Input UV
Thresholds (Note 5)
Active-to-Sleep Control Input Delay-200-µs
Falling UV Threshold Timeout (All Monitors)-10-µs
CONTROL I/O (S3
High Level Input ThresholdS3, S5, EN5, LAN--2.2V
Low Level Input ThresholdS3
Internal Pull-up Current to 5VSBS3
Internal Pull-up Current to 5VSBEN5, LAN to GND-10-µA
Input Leakage Current to 5VSBEN5, LAN to 5VSB--10mA
FAULT Current IOH (to 5VSB)FAULT = 4.6V, 5VSB = 5V--7.5-mA
FAULT Current IOL (to GND)FAULT = 0.4V, 5VSB = 5V-0.75-mA
5VSB
VID_CT
VID_PG
SS
LAN
5VDL
5VDLSB
DLA
FAULT
GND
3V3DL
1V2VID
3V3
5V
EN5
NOTE: The QFN bottom pad is electrically connected to the IC
substrate, at GND potential. It can be left unconnected, or connected
to GND; do NOT connect to another potential.
Functional Pin Description (Pin numbers for SOIC and QFN)
3V3 (Pin 6 SOIC; Pin 3 QFN)
Connect this pin to the ATX 3.3V output. This pin provides
the output current for the 1V2VID pin, and is monitored for
power quality.
5V (Pin 7 SOIC; Pin 4 QFN)
Connect this pin to the ATX 5V output. This pin is only
monitored for power quality.
5VSB (Pin 20 SOIC; Pin 17 QFN)
Provide a very well de-coupled 5V bias supply for the IC to
this pin by connecting it to the ATX 5V
output. This pin
SB
provides all the chip’s bias as well as the base current for Q2
(see typical application diagram). The voltage at this pin is
monitored for power-on reset (POR) purposes.
GND (Pin 11 SOIC; Pin 8 QFN)
Signal ground for the IC. All voltage le vels are measured with
respect to this pin.
S3 and S5 (Pins 9, 10 SOIC; Pins 6, 7 QFN)
These pins switch the IC’s operating state from active (S0,
S1/S2) to S3 and S4/S5 sleep states. These are digital
inputs featuring internal 50µA (typical) current source pullups to 5VSB. Internal circuitry de-glitches these pins for
disturbances lasting as long as 2µs (typically). Additional
circuitry blocks illegal state transitions (such as S4/S5 to S3),
but does allow S3 to S4/S5. Connect S3
respectively to the computer system’s SLP_S3
signals.
and S5
and SLP_S5
EN5 (Pin 8 SOIC; Pin 5 QFN)
This digital input selects whether the 5VDL output stays up
or shuts down during the S5 Sleep Mode. It has a 10µA
typical pull-up current source. A logic high (5V) or open will
keep the 5VDL on during S5; a logic low (GND) will shut it off
during S5. NOTE: This pin should be tied low or high (or
open) on the board; it was not designed to be changed
during normal operation.
LAN (Pin 16 SOIC; Pin 13 QFN)
This digital input selects between two modes for the V
regulator. It has a 10µA pull-up current source. A logic high
(5V) or open selects the 10/100 LAN mode, where V
stays on all of the time (active and sleep modes). A logic low
(GND) selects the Gigabit Ethernet mode, where V
only on during active (S0, S1) modes. Note that this
selection is independent of the voltage selection of V
(which is determined by the external resistor divider). NOTE:
This pin should be tied low or high (or open) on the board; it
was not designed to be changed during normal operation.
FAULT (Pin 12 SOIC; Pin 9 QFN)
This digital output pin is used to report the fault condition by
being pulled to 5VSB (pulled to GND if no fault). It is a
CMOS digital output; an external pull-down resistor is NOT
required. In case of an undervoltage on any of the controlled
outputs, on any of the monitored ATX voltages (3V3 or 5V;
not 12V), or in case of an overtemperature event, t his pi n is
used to report the fault condition.
3V3DLSB
DR1
FB1
20 19 181716
1
2
3
4
5
678910
S3
S5
GND
5VSB
VID_CT
VID_PG
15
14
SS
13
LAN
5VDL
12
5VDLSB
11
DLA
FAULT
OUT1
OUT1
is
OUT1
OUT1
6
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