Single Output LNB Supply and Control
Voltage Regulator with I2C Interface for
Advanced Satellite Set-Top Box Designs
The ISL6423B is a highly integrated voltage regulator and
interface IC, specifically designed for supplying power and
control signals from advanced satellite set-top box (STB)
modules to the low noise blocks (LNBs) of singe antenna
ports. The device consists of a current-mode boost PWM
and a low-noise linear regulator along with the circuitry
required for 22kHz tone generation, modulation and I
device interface. The device makes the total LNB supply
design simple, efficient and compact with low external
component count.
The current-mode boost converters provides the linear
regulator with input voltage that is set to the final output
voltages, plus typically 0.8V to insure minimum power
dissipation across each linear regulator. This maintains
constant voltage drop across the linear pass element while
permitting adequate voltage range for tone injection.
The final regulated output voltage is available at output
terminals to support the operation of an antenna port for
single tuners. The outputs for each PWM can be controlled
in two ways, full control from I
bits or set the I
switch to higher range i.e., 18V/19V, with the SELVTOP pin.
All the functions on this IC are controlled via the I
writing 8 bits words onto the System Registers (SR). The
same register can be read back, and five I
the diagnostic status. Separate enable command sent on the
2
I
C bus provides for standby mode control for the PWM and
linear combination, disabling the output and forcing a shutdown
mode. The output channel is capable of providing 750mA of
continuous current. The overcurrent limit can be digitally
programmed to four levels.
The External modulation input EXTM can accept a
modulated Diseqc command and transfer it symmetrically to
the output. Alternatively the EXTM pin can be used to
modulate the continuos internal tone.
The FLT
any condition turns OFF the LNB controller (Over
Temperature, Overcurrent, Disabled). The nature of the
Disable can be read of the I
2
C to the lower range i.e., 13V/14V, and
pin serves as an interrupt for the processor when
2
C using the VTOP and VBOT
2
C bits will report
2
C registers.
2
C
2
C bus by
April 10, 2007
FN6412.1
Features
• Single Chip Power solution
- Operation for 1-Tuner/1-Dish Applications
- Integrated DC/DC Converter and I
• Switch-Mode Power Converter for Lowest Dissipation
- Boost PWMs with >92% Efficiency
- Selectable 13.3V or 18.3V Outputs
- Digital Cable Length Compensation (1V)
2
-I
C and Pin Controllable Output
• Output Back Bias Capability of 28V
2
C Compatible Interface for Remote Device Control
•I
• Registered Slave Address 0001 00XX
• 2.5V, 3.3V, 5V Logic Compatible
• External Pin to Toggle Between V and H Polarization
• Built-In Tone Oscillator Factory Trimmed to 22kHz
- Facilitates DiSEqC (EUTELSAT) Encoding
- External Modulation Input
• Internal Over-Temperature Protection and Diagnostics
• Internal OV, UV, Overload and Overtemp Flags
(Visible on I
signal
•FLT
• LNB Short-Circuit Protection and Diagnostics
• QFN, EPTSSOP Packages
• Pb-Free Available (RoHS Compliant)
2
C)
2
C Interface
Applications
• LNB Power Supply and Control for Satellite Set-Top Box
Ordering Information
PART
NUMBER*
ISL6423BERZ
(Note)
ISL6423BEVEZ
(Note)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Add “-T” suffix for tape and reel.
PART
MARKING
6423BERZ-20 to +85 24 Ld 4x4 QFN
ISL6423BEVEZ -20 to +85 28 Ld EPTSSOP
TEMP.
(°C)PACKAGE
(Pb-free)
(Pb-free)
PKG.
DWG . #
L24.4x4D
M28.173B
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2006, 2007. All Rights Reserved
Pinouts
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VCC
NC
FLT
SGND
SGND
TCAP
ADDR0
ADDR1
BYPASS
PGND
GATE
VSW
NC
CS
ISL6423B
(28 LD EPTSSOP)
TOP VIEW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
ISL6423B
(24 LD QFN)
TOP VIEW
CPSWIN
28
CPSWOUT
27
CPVOUT
26
EXTM
25
SDA
24
SCL
23
TDOUT
22
TDIN
21
20
VO
NC
19
NC
18
AGND
17
16
SELVTOP
TXT
15
SGND
TCAP
ADDR0
ADDR1
BYPASS
PGND
SGND
FLT
VCC
CS
CPSWIN
TXT
24 23 22 2120 19
1
2
3
4
5
6
789101112
GATE
VSW
CPSWOUT
SELVTOP
CPVOUT
18
17
16
15
14
13
AGND
EXTM
SDA
SCL
TDOUT
TDIN
VO
2
FN6412.1
April 10, 2007
Block Diagram
www.BDTIC.com/Intersil
11
CLK1
SLOPE
OLF/BCF
DCL
OC1
+
-
-
+
VREF1
SELVTOP
BAND GAP
REF VOLTAGE
REF
VOLTAGE
ADJ1
COUNTER
GATE
7
3
PGND
6
CS
9
TDOUT
15
TONE
DECODER
TDIN
14
VSW
8
OVERCURRENT
PROTECTION
LOGIC SCHEME 1
ILIM1
CS
AMP
PWM
LOGIC
Q
S
∑
COMPENSATION
TXT
TTH
17
SDA
SDA
ISELL&H
EN
ENT
VTOP
BGV
TONE
INJ
CKT
SCL
SCL
VBOT
CLK1
OLF/BCF
I2C
INTERFACE
OSC.
DIV &
WAVE SHAPING
INT
TONE
ADDR0
316
ADDR0
ADDR1
4
ADDR1
OUVF
OUVF
OTF
TTH
DCL
23
FLT
THERMAL
SHUTDOWN
VO
13
AGND
12
VCC
22
SGND
1
SGND
24
April 10, 2007
FN6412.1
NOTE:
ON CHIP
LINEAR
UVLO
POR
SOFT-START
BYPASS
5
INT 5V
SOFT-START
EN1/EN2
TXT
10
1. Pinouts shown are for the QFN package.
TCAP
2
MSEL1
EXTM
18
EXT TONE CKT
ENT1
CPSWOUT
CPSWIN
2021
CHARGE PUMP
CPVOUT
19
+
-
Typical Application Schematic QFN
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VIN
RTN
0
4
C24
1µF
0
1
2
3
4
5
6
SGND
TCAP
ADDR0
ADDR1
BYPASS
PGND
2
L5
15µH
1
C23
56µF
0
1234
5
6
TPC6002
Q2
R10
18
0
R8
0.1
0
R9
470
C21
100pF
0
C27
C26
0.22µF
1µF
0
C29
1n
22
21
23
24
FLT
VCC
SGND
U2
ISL6423ER
VSW
GATE
8CS9
7
C25 47n
19
20
CPSWIN
CPVOUT
EXTM
CPSWOUT
SDA
TDOUT
TDIN
TXT10AGND
SELVTOP
11
12
SCL
VO
D7
0
18
17
16
15
14
13
C16
10n
CMS06
C28
0.1µF
R11100
R12
D6
CMS06
R13 4.7k
R22
47k
100
R23
10k
R24
4.7k
220µH
L4
12
C15
0.22µF
R7
NDS356AP
Q4
2N2222A
15
M6
FLT BAR
EXTM
SDA
SCL
VLNB
D8
1.5KE24
RTN
TXT
TDOUT
SELVTOP
D5
CMS06
April 10, 2007
FN6412.1
C22
56µF
0
C18
10µF
0
4.7µH
L6
12
C19
10µF
0
C20
10µF
0
NOTE : SDA and SCL require pull up to the required logic level.
(SDA, SCL, ENT, DSQIN 1 and 2, SEL18V 1 and 2) . -0.5V to 7V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. θ
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JA
Tech Brief TB379.
3. For θ
4. +150°C max junction temperature is intended for short periods of time to prevent shortening the lifetime. Operation close to +150°C junction may
, the "case temp" location is the center of the exposed metal pad on the package underside.
JC
trigger the shutdown of the device even before +150°C, since this number is specified as typical.
Maximum Junction Temperature (Note 4) . . . . . . . . . . . . . . .+150°C
Maximum Storage Temperature Range. . . . . . . . . .-40°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-20°C to +85°C
Electrical SpecificationsV
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Operating Supply Voltage Range81214 V
Standby Supply CurrentEN = L-1.53.0mA
Supply CurrentI
UNDERVOLTAGE LOCKOUT
Start Threshold7.5-7.95V
Stop Threshold7.0-7.55V
Start to Stop Hysteresis350400500mV
SOFT-START
COMP Rise Time (Note 5)(Note 5)-8196-Cycles
Output Voltage (Note 5)V
Line RegulationDV
Load RegulationDV
Dynamic Output Current LimitingI
Dynamic Overload Protection Off TimeTOFFDCL = 0, Output Shorted (Note 8)-900-ms
Dynamic Overload Protection On TimeTON-51-ms
Static Output Current LimitingI
Cable Fault CABF ThresholdI
= 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
CC
VBOT = L, ENT = L, DCL = L, I
access to the system.
EN = VTOP = VBOT = ENT = H, No Load-4.08.0mA
(Refer to Table 1)13.0413.313.56V
(Refer to Table 1)14.0214.314.58V
(Refer to Table 1)17.9418.318.66V
(Refer to Table 1)19.0019.319.68V
VIN = 8V to 14V; VO = 13.3V -4.040.0mV
O1,
O2
O1,
O2
= 8V to 14V; VO = 18.3V-4.060.0mV
V
IN
IO = 0mA to 350mA-5080mV
= 0mA to 750mA-100200mV
I
O
DCL = 0, ISEL H = 0, ISEL L = 0 (Note 8)275305345mA
DCL = 0, ISEL H = 0, ISEL L = 1 (Note 8)515570630mA
DCL = 0, ISEL H = 1, ISEL L = 0 (Note 8)635705775mA
DCL = 0, ISEL H = 1, ISEL L = 1 (Note 8)800890980mA
DCL = 1 (Note 8)-1000-mA
EN = 1, VO = 19V, No Tone.21020mA
V
V
V
DV
DV
MAX
MAX
CAB
IN
O1
O1
O1
O1
= 12mA, unless otherwise noted. See software description section for I2C
OUT
5
FN6412.1
April 10, 2007
Electrical SpecificationsV
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PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
TONE OSCILLATOR
Tone Frequencyf
Tone AmplitudeV
Tone Duty Cycledc
Tone Rise or Fall TimeT
TONE DECODER
Input AmplitudeVtdin200-1000mV
Frequency Capture RangeFtdin17.5-26.5kHz
Input ImpedanceZdet-8.6-kΩ
Detector Output VoltageVtdout_LTone Present, I
Detector Output LeakageItdout_HTone absent, V
Tone Decoder Rx ThresholdV
Tone Decoder Tx ThresholdV
LINEAR REGULATOR
Drop-out VoltageI
Output Backward Leakage CurrentI
Output Backward Leakage CurrentI
Output Backward Current ThresholdI
Output Backward Current LimitI
Output Backward VoltageV
Output Under Voltage
(Asserted high during soft-start)
Output Over Voltage
(Asserted high during soft-start)
TXT, EXTM, SELVTOP AND ADDR 0/1 INPUT PINs (Note 8)
Maximum Duty Cycle9093-%
Minimum Pulse Width-20- ns
= 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
CC
VBOT = L, ENT = L, DCL = L, I
access to the system. (Continued)
tone
tone
tone
, T
r
RXth
TXth
BKLK
BKLK
BKTH
BKLM
OBK
BIAS
CS
OL
GBP
ENT = H20.022.024.0kHz
ENT = H, IO = 5mA500680800mV
ENT = H, 405060%
ENT = H, 51014μs
f
TXT = L and TTH = 0 (Note 9)100150200mV
TXT = H and TTH = 0 (Note 9)400450500mV
= 750mA-0.81.05V
OUT
EN = 0; V
EN = 0; V
EN = 1; V
EN = 1; V
EN = 0--27V
OUVF bit is asserted high, Measured from
the typ. output set value
OUVF bit is asserted high, Measured from
the typ. output set value
Static current mode, DCL = H325450500mV
= 12mA, unless otherwise noted. See software description section for I2C
OUT
= 3mA--0.4V
LOAD
= 6V--10μA
O
= 27V-2.03.0mA
OBK
= 28V-3.017mA
OBK
= 19V (Note 7)-140-mA
OFAULT
= 19V (Note 7)-350-mA
OFAULT
-6--2%
+2-+6%
-700-nA
-93- dB
-14-MHz
6
FN6412.1
April 10, 2007
Electrical SpecificationsV
www.BDTIC.com/Intersil
= 12V, TA = -20°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C. EN = H, VTOP
CC
VBOT = L, ENT = L, DCL = L, I
access to the system. (Continued)
= 12mA, unless otherwise noted. See software description section for I2C
OUT
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
OSCILLATOR
Oscillator Frequencyf
o
Fixed at (20)(f
)396440484kHz
tone
Thermal Shutdown
Temperature Shutdown Threshold-150-°C
Temperature Shutdown Hysteresis-20-°C
OTFI
(released)VO = 6V--10μA
FLT
(asserted)I
FLT
= 3.2mA--0.4V
SINK
NOTES:
5. Internal digital soft-start
6. EXTM, TXT and SELVTOP and addr 0/1 pins have 200k internal pulldown resistors.
7. On exceeding this backward current limit threshold for a period of 2ms, the device enters the Backward dynamic current limit mode (350mA typ)
and the BCF I
2
C bit is set. The dynamic current limit duty ratio during a back current fault is ON = 2ms/OFF = 50ms. The output will remain
clamped to the fault output voltage till released. On removal of the fault condition the device returns to normal operation
8. In the Dynamic current limit mode the output is ON for 51ms and OFF for 900ms. But remains continuously ON in the Static mode. When tone
is ON the minimum current limit is 50mA lower the values indicated in the table.
Tone Waveform
ENT
2
I
MSEL
2
I
EXTM
PIN
VOUT
PIN
C
C
22kHz22kHz22kHz22kHz22kHz22kHz
INTERNAL TONE
Tr = 10µs TYP
EXTERNAL TONE
Tr = 10µs TYP
NOTES:
9. The signal pin TXT changes the decoder threshold during tone transmit and receive. TTH allows threshold control through I
10. The tone rise and fall times are not shown due to resolution of graphics. It is 10µs typ for 22kHz.
11. The EXTM pins have input thresholds of Vil(max) = 0.8V and Vih(min) = 1.7V
FIGURE 1. TONE WAVEFORM
INTERNAL TONE
RETURNS TO NOMINAL V
AFTER THE LAST EXTM RISING EDGE
T > 55µs;
~1 PERIOD
OUT
2
C.
7
FN6412.1
April 10, 2007
Typical Performance Curves
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0.80
0.70
0.60
0.50
(A)
0.40
OUT
I
0.30
0.20
0.10
0.00
020406080
TEMPERATURE (°C)
I
OUT
_max
0.80
0.70
0.60
0.50
(A)
0.40
OUT
I
0.30
0.20
0.10
0.00
020406080
TEMPERATURE (°C)
FIGURE 2. OUTPUT CURRENT DERATING (EPTSSOP)FIGURE 3. OUTPUT CURRENT DERATING (4x4 QFN)
Functional Pin Description
SYMBOLFUNCTION
2
SDABidirectional data from/to I
2
SCLClock from I
C bus.
VSWInput of the linear post-regulator.
PGNDDedicated ground for the output gate driver of respective PWM.
CSCurrent sense input; connect the sense resistor Rsc at this pin for desired peak overcurrent value for the boost FET. The
set peak limit is effective in the static mode current limit only i.e., DCL = HIGH.
SGNDSmall signal ground for the IC.
TCAPCapacitor for setting rise and fall time of the output voltage. Typical value is 0.1µF.
BYPASSBypass capacitor for internal 5V.
TXTTXT is the Tone Transmit signal input used to change the Tone Decoder Threshold from TXT = 0, 200mV max during
Receive to TXT = 1, 400mV min during Transmit.
VCCMain power supply to the chip.
GATEThis output drives the boost FET gate. The output is held low when V
VOOutput voltage for the LNB is available at VO pin.
ADDR0 & ADDR1Logic combination at the ADDR0 & 1 can se lect four different chip select addresses.
EXTMThis pin can be used in two ways:
1) As an input for externally modulated Diseqc tone signal which is transferred to the symmetrically onto V
2) Alternatively apply a Diseqc modulation envelope which modulates an internal tone and then transfers it symmetrically
onto V
OUT
FLTThis is an Open Drain output from the controller. When the FLT goes low it indicates that an Over Temperature, Over load
fault, UVLO, or an I
cause of the error. A high on the FLT
CPVOUT, CPSWIN
CPSWOUT
A 47n charge pump decoupling capacitor is to be connected to CPVOUT. Connect a 1.5n capacitor between CPSWIN and
CPSWOUT
SELVTOPWhen this pin is low the V
When this pin is high the 18V, 19V range selected by the I
be set low for the SELVTOP pins to be active. Setting VSPEN high disables this pins and voltage selection will be done
using the I
2
C bits VBOT and VTOP only.
TDIN, TDOUTTDIN is the tone decoder input and TDOUT is the tone detector output. TDOUT is an open drain output
C bus.
is below the UVLO threshold.
CC
2
C reset condition has occurred. The processor should then look at the I2C register to get the actual
indicates that the device is functioning normally.
is in the 13V, 14V range selected by the I2C bit VBOT.
OUT
2
C bit VTOP. The Voltage select pin enable VSPEN I2C bit must
I
OUT
OUT
_max
8
FN6412.1
April 10, 2007
Functional Description
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The ISL6423B single output voltage regulator makes an
ideal choice for advanced satellite set-top box and personal
video recorder applications. The device utilizes built-in
DC/DC step up converters that, operates from a single
supply source ranging from 8V to 14V, and generates the
voltage needed to enable the linear post-regulator to work
with a minimum of dissipated power. An undervoltage
lockout circuit disables the device when VCC drops below a
fixed threshold (7.5V typ).
DiSEqC Encoding
The internal oscillator is factory-trimmed to provide a tone of
22kHz in accordance with DiSEqC (EUTELSAT) standards.
No further adjustment is required. The tone oscillator can be
controlled either by the I
dedicated pin (EXTM) that allows immediate DiSEqC data
encoding separately for each LNB. All the functions of this IC
are controlled via the I
registers. The same registers can be read back, and four bits
will report the diagnostic status. The internal oscillator
operates the converters at twenty times the 22k tone
frequency . The device offers full I
supports 2.5V, 3.3V or 5V logic, up to an operational speed of
400kHz.
If the Tone Enable (ENT) bit is set LOW and the MSEL bits
set LOW through I
internal tone signal, modulating the DC output with a
680mV
of this signal usually provides the LNB with information
about the band to be received.
Burst coding of the tone can be accomplished due to the fast
response of the EXTM input and rapid tone response. This
allows implementation of the DiSEqC (EUTELSAT)
protocols.
When the ENT bit is set HIGH, a continuous 22kHz tone is
generated regardless of the EXTM pin logic status for the
regulator channel LNB-A. The ENT bit must be set LOW
when the EXTM pin is used for DiSEqC encoding.
The EXTM accepts an externally modulated tone command
when the MSEL I
typical symmetrical tone waveform. The presence
PP
DiSEqC Decoder
TDIN is the input to the tone decoder. It accepts and the tone
signal derived from the V
capacitor. The detector threshold can be set to 200mV max
in the Receive mode and to 400mV min in the Transmit
mode by means of the logic presented to the TXT pin. If tone
is detected the open drain pin TDOUT is asserted low. This
enables the tone diagnostics to be performed, apart from the
normal tone detection function.
2
C interface (ENT bit) or by a
2
C bus by writing to the system
2
C compatibility, and
2
C, then the EXTM terminal activates the
2
C bit is set HIGH and ENT is set LOW.
thru the 10nF decoupling
OUT
Linear Regulator
The output linear regulator will sink and source current. This
feature allows full modulation capability into capacitive loads
as high as 0.75μF. In order to minimize the power
dissipation, the output voltage of the internal step-up
converter is adjusted to allow the linear regulator to work at
minimum dropout.
When the device is put in the shutdown mode (EN =LOW),
the PWM power block is disabled. When the regulator blocks
are active (EN = HIGH and VSPEN = LOW), the output can
be controlled via I
(typical) by means of the VTOP and VBOT bits (Voltage
Select) for remote controlling of non-DiSEqC LNBs.
When the regulator blocks are active (EN = HIGH and
VSPEN = HIGH), the VBOT and SELVTOP pin will control
the output between 13V and 14V and the VTOP and
SELVTOP pin will control the output betwe en 18V and 19V.
2
C logic to be 13V/14V or 18V/19V
Output Timing
The output voltage rise and fall times can be set by an the
external capacitor on the TCAP pin. The output rise and fall
times is given by the equation:
327.6T
------------------ -
C
=(EQ. 1)
ΔV
Where C is the TCAP value in nF, T is the required transition
time in ms and ΔV is the differential transition voltage from
low output voltage range to the high output range in Volts.
The maximum recommended value for TCAP is 0.15µF. Too
large a value of TCAP prevents the output from rising to the
nominal value, within the soft-start time when the error
amplifier is released. T oo small a value of the TCAP can cause
high peak currents in the boost circuit. For example, a 10V/ms
slew on a 80µF VSW capacitor with an inductor of 15µH can
cause a peak inductor current of approximately 2.3A.
Current Limiting
Dynamic current limiting block has four thresholds that can
be selected by the ISEL H and ISEL L bits of the SR. Refer
to Table 8 and Table 9 for threshold selection using these
bits. The DCL bit has to be set to low for this mode of
operation. In the dynamic overcurrent mode a fault
exceeding the selected overcurrent threshold for a period
greater than 51ms, will shutdown the output for 900ms,
during which the I
the OLF bit is returned to the low state, a soft-start cycle
(~20ms long) is initiated to ramp VSW and V
the fault is still present the overcurrent will be reached early
in the soft-start cycle and the 51ms shutdown timer will be
started again. If the fault is still present at the end of the
51ms, the OLF bit is again set high and the device once
again enters the 900ms OFF time. This dynamic operation
greatly reduces the power dissipation in a short circuit
condition, while still ensuring excellent power-on start-up in
most conditions.
2
C bit OLF is set high. At the end of 900ms
back up. If
OUT
9
FN6412.1
April 10, 2007
However, there could be some cases in which a highly
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capacitive load on the output may cause a difficult start-up
when the dynamic protection is selected. This can be solved
by initiating any power start-up in static mode (DCL = HIGH)
and then switching to the dynamic mode (DCL = LOW) after
a predetermined interval. When in static mode, the OLF bit
goes HIGH when the current clamp limit is reached and
returns LOW at the end of initial power-on soft-start. In the
Static mode th e output cu rrent through the l inears is limited to
a 990mA typ.
When a 19.3V line is connected onto a VOUT1 or 2 that has
been set to 13.3V the linear will then enter a back current
limited state. When a back current of greater than 140mA
typical is sensed at the lower FET of the linear for a period
greater that 2ms the output is disabled for a period of 50ms
and the BCF bit is set. If the 19.3V remains connected, the
output will cycle through the ON = 2ms/OFF = 50ms. The
output will return to the setpoint when the fault is removed.
BCF bit is set high during the 50ms OFF period.
Thermal Protection
This IC is protected against overheating. When the junction
temperature exceeds +150°C (typical), the step-up converter
and the linear regulator are shut off and the OTF bit of the
SR is set HIGH. When the junction is cooled down to +130°C
(typical), normal operation is resumed and the OTF bit is
reset LOW. If a part is repeatedly driven to the overtemp
shutdown temperature the chip is latched off after the fourth
occurrence and the I
2
C OTF bit is latched high and FLT_bar
low. This OTF counter and FLT_bar can be reset and the
chip restarted by either a power down/up and reload the I
2
C
or power can be left on and the reset accomplished by
toggling the I
2
C bit EN low then back high.
External Output Voltage Selection
When the I2C bit VSPEN is set high the output voltage can
be selected by the I
the pin SELVTOP for independent 13 thru 19V output
voltage selection., when the VSPEN bit is set low. A
summary of the voltage control is given in Table 1. For
further details refer to the individual registers SR1 and SR3
(Refer to Philips I2C Specification, Rev. 2.1)
Data transmission from main microprocessor to the ISL6423B
and vice versa takes place through the two wire I
interface, consisting of the two lines SDA and SCL. Both SDA
and SCL are bidirectional lines, connected to a positive supply
voltage via a pull up resistor. (Pull up resistors to positive supply
voltage must be externally connected). When the bus is free,
both lines are HIGH. The output stages of ISL6423B will have
an open drain/open collector in order to perform the wired-AND
function. Data on the I
2
C bus can be transferred up to 100Kbps
in the standard-mode or up to 400Kbps in the fast-mode. The
level of logic “0” and logic “1” is dependent of associated value
of V
as per electrical specification table. One clock pulse is
DD
generated for each data bit transferred.
Data Validity
The data on the SDA line must be stable during the HIGH
period of the clock. The HIGH or LOW state of the data line
can only change when the clock signal on the SCL line is
LOW. Refer to Figure 4.
SDA
SCL
DATA LINE
STABLE
DATA VALID
FIGURE 4. DATA VALIDITY
CHANGE
OF DATA
ALLOWED
START and STOP Conditions
As shown in Figure 5, START condition is a HIGH to LOW
transition of the SDA line while SCL is HIGH.
The STOP condition is a LOW to HIGH transition on the SDA
line while SCL is HIGH. A STOP condition must be sent
before each START condi tion.
SDA
SCL
SP
START
CONDITION
FIGURE 5. START AND STOP WAVEFORMS
2
C bus
STOP
CONDITION
10
FN6412.1
April 10, 2007
Byte Format
www.BDTIC.com/Intersil
Every byte put on the SDA line must be eight bits long. The
number of bytes that can be transmitted per transfer is
unrestricted. Each byte has to be followed by an
acknowledge bit. Data is transferred with the most significant
bit first (MSB).
Acknowledge
The master (microprocessor) puts a resistive HIGH level on
the SDA line during the acknowledge clock pulse (Figure 6).
The peripheral that acknowledges has to pull down (LOW)
the SDA line during the acknowledge clock pulse, so that the
SDA line is stable LOW during this clock pulse. (Of course,
set-up and hold times must also be taken into account.)
The peripheral which has been addressed has to generate
an acknowledge after the reception of each byte, otherwise
the SDA line remains at the HIGH level during the ninth
clock pulse time. In this case, the master transmitter can
generate the STOP information in order to abort the transfer.
The ISL6423B will not generate the acknowledge if the
POWER OK signal from the UVLO is LOW.
SCL
8
9
ACKNOWLEDGE
FROM SLAVE
SDA
START
1
MSB
FIGURE 6. ACKNOWLEDGE ON THE I2C BUS
2
Transmission Without Acknowledge
Avoiding detection of the acknowledgement, the
microprocessor can use a simpler transmission; it waits one
clock without checking the slave acknowledging, and sends
the new data.
This approach, though, is less protected from error and
decreases the noise immunity.
ISL6423B Software Description
Interface Protocol
The interface protocol is comprised of the following, as
shown below in Table 2:
• A start condition (S)
• A chip address byte (MSB on left; the LSB bit determines
read (1) or write (0) transmission) (the assigned I
address for the ISL6423B is 0001 0XXX)
• A sequence of data (1 byte + Acknowledge)
• A stop condition (P)
TABLE 2. INTERFACE PROTOCOL
S00010A1A0R/WACKData (8 bits)ACKP
System Register Format
• R, W = Read and Write bit
• R = Read-only bit
All bits reset to 0 at Power-On
TABLE 3. STATUS REGISTER (SR1)
R, WR, WR, WRRRRR
SR1H SR1M SR1 LOTFCABF OUVFOLFBCF
TABLE 4. TONE REGISTER (SR2)
R, WR, WR, WR, WR, WR, W R, WR, W
SR2H SR2M SR2LENTMSELTTHXX
TABLE 5. COMMAND REGISTER (SR3)
R, WR, WR, WR, WR, WR, WR, WR, W
SR3H SR3M SR3 LDCLVSPENXISELH ISELL
TABLE 6. CONTROL REGISTER (SR4)
R, WR, WR, WR, WR, WR, W R, WR, W
SR4H SR4M SR4LENVTOP VBOT
Transmitted Data (I
When the R/W bit in the chip is set to 0, the main
microprocessor can write on the system registers (SR2 thru
SR4) of the ISL6423B via I
the microprocessor as shown below. The spare bits of
registers can be used for other functions.
2
C bus WRITE mode)
2
C bus. These will be written by
2
C slave
11
FN6412.1
April 10, 2007
TABLE 7. STATUS REGISTER SR1 CONFIGURATION
www.BDTIC.com/Intersil
SR1HSR1MSR1LOTFCABFOUVFOLFBCFFUNCTION
000XXXXXSR1 is selected
000XXX0XI
000XXX1XI
000XXXX0Iobck ≤ set limit, Normal Operation
000XXXX1Iobck > Dynamic Limiting Mode / Power blocks disabled
000XX0XXV
000XX1XXV
000X0XXXCable is connected, Io is >20mA
000X1XXXCable is open, Io <2mA
0000XXXXT
0001XXXXT
TABLE 8. TONE REGISTER SR2 CONFIGURATION
SR2HSR2MSR2LENTMSELTTHXXFUNCTION
001XXXXXSR2 is selected
00100XXXInt Tone = 22kHz, modulated by EXTM, T
00101XXXExt 22k modulated input, T
00110XXXInt Tone = 22kHz, modulated by ENT bit, Tr, Tf = 10µs typ
001XX0XXTXT = 0; Decoder Rx threshold is set at 200mV max
001XX1XXTXT = 0; Decoder Tx threshold is set at 400mV min
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
within specified range
is not within specified range
≤130°C, Normal operation
>150°C, Power blocks disabled
, Tf = 10µs typ
r
, Tf = 10µs typ
r
TABLE 9. COMMAND REGISTER SR3 CONFIGURATION
SR3HSR3MSR3LDCLVSPENXISELHISELLFUNCTION
010XXXXXSR3 is selected
0100XX00I
0100XX01I
0100XX10I
0100XX11I
0101XXXXDynamic current limit NOT selected
0100XXXDynamic current limit selected
010X0XXXSELVTOP H/W pin Enabled
010X1XXXSELVTOP H/W pin Disabled
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
limit threshold = 305mA typ.
OUT
limit threshold = 570mA typ.
OUT
limit threshold = 705mA typ.
OUT
limit threshold = 890mA typ.
OUT
12
FN6412.1
April 10, 2007
TABLE 10. CONTROL REGISTER SR4 CONFIGURATION
www.BDTIC.com/Intersil
SR4HSR4MSR4LENXXVTOPVBOTFUNCTION
0111XX00SR4 is selected
0111XX00VSPEN = SELVTOP = 0, V
0111XX01VSPEN = SELVTOP = 0, V
0111XX10VSPEN = SELVTOP = 0, V
0111XX11VSPEN = SELVTOP = 0, V
0111XX00VSPEN = 0,SELVTOP = 1, V
0111XX01VSPEN = 0,SELVTOP = 1, V
0111XX10VSPEN = 0,SELVTOP = 1, V
0111XX11VSPEN = 0,SELVTOP = 1, V
0111XX00VSPEN = 1,SELVTOP = X V
0111XX01VSPEN = 1,SELVTOP = X V
0111XX10VSPEN = 1,SELVTOP = X V
0111XX11VSPEN = 1,SELVTOP = X V
0110XXXXPWM and Linear for channel 1 disabled
NOTE: X indicates “Read Only” and is a “Don’t Care” for the Write mode.
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OUT
= 13V, V
= 14V, V
= 13V, V
= 14V, V
= 18V, V
= 18V, V
= 19V, V
= 19V, V
= 13V, V
= 14V, V
= 18V, V
= 19V, V
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
BOOST
= 13V + V
= 14V + V
= 13V + V
= 14V + V
= 18V + V
= 18V + V
= 19V + V
= 19V + V
= 13V + V
= 14V + V
= 18V + V
= 19V + V
DROP
DROP
DROP
DROP
DROP
DROP
DROP
DROP
DROP
DROP
DROP
DROP
Received Data (I
2
C bus READ MODE)
The ISL6423B can provide to the master a copy of the
system register information via the I
2
C bus in read mode.
The read mode is Master activated by sending the chip
address with R/W bit set to 1. At the following Master
generated clock bits, the ISL6423B issues a byte on the
SDA data bus line (MSB transmitted first).
At the ninth clock bit the MCU master can:
• Acknowledge the reception, starting in this way the
transmission of another byte from the ISL6423B.
• Not acknowledge, stopping the read mode
communication.
The read only bits of the register SR1 convey diagnostic
information about the ISL6423B, as indicated in the Table 7.
Power–On I2C Interface Reset
The I2C interface built into the ISL6423B is automatically reset
at power-on. The I
logic signal from the UVLO circuit. This signal will go HIGH
when chip power is OK. As long as this signal is LOW , the
interface will not respond to any I
system register SR1 thru SR4 are all initialized to all zero,
thus keeping the power blocks disabled. Once the V
above UVLO, the POWER OK signal to the I
high, and the I
can be configured by the main microprocessor. About 400mV
of hysteresis is provided in the UVLO threshold to avoid false
triggering of the Power-On reset circuit. (I
EN = 0; EN goes HIGH at the same time as (or later than) all
2
other I
C data for that PWM becomes valid).
2
C interface block will receive a Power OK
2
C commands and the
rises
CC
2
2
C interface becomes operative and the SR’s
C is asserted
2
C comes up with
ADDR0 and ADDR1 Pins
Connecting these pin to GND the chip I2C interface address
is 0001000, but, it is possible to choose between four
different addresses by setting these pins to the logic levels
indicated in Table 11.
TABLE 11. ADDRESS PIN CHARACTERISTICS
V
ADDR
-1 “0001000”00
V
ADDR
-2 “0001001”01
V
ADDR
V
-3 “0001010”10
ADDR
-4 “0001011”11
V
ADDR
ADDR1ADDR0
13
FN6412.1
April 10, 2007
I2C Bit DescriptionI2C Electrical Characteristics
www.BDTIC.com/Intersil
BIT
NAMEDESCRIPTION
ENENable Output for channels 1 and 2
VTOPVoltage TOP select i.e. 18V, 19V for channels 1 and 2
VBOTVoltage BOTtom select i.e. 13V, 14V for channels 1 and 2
ENTENable Tone
MSELModulation SELect
DCLDynamic Current Limit select
VSPENVoltage Select Pin ENable
ISELH
and ISELL
OTFOver Temperature Fault bit
CABFCABle Fault or open status bit
OUVFOver and Under Voltage Fault status bit
OLFOver Load Fault status bit
BCFBackward Current Fault bit
TTHTone THreshold is the OR of the signal pin TXT
Current limit “I” SELect High and Low bit
PARAMETER
Input Logic
High, VIH
Input Logic
Low, VIL
Input Logic
Current, IIL
Input Logic
Current IOL
Input
Hysteresis
SCL Clock
Frequency
Input Filter
Spike reject
TABLE 12.
TEST
CONDITIONMINT YPMAX
SDA, SCL2.0V
SDA, SCL0.8V
SDA, SCL;
0.4V < V
VOL = 0.4V3mA
SDA, SCL165mV200mV235mV
DD
< 3.3V
0100kHz400kHz
50ns
10μA
14
FN6412.1
April 10, 2007
Package Outline Drawing
www.BDTIC.com/Intersil
L24.4x4D
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 10/06
4.00
4X
A
B
19
20X
2.5
0.50
24
PIN #1 CORNER
(C 0 . 25)
INDEX AREA
(4X)
( 3 . 8 TYP )
( 2 . 50 )
PIN 1
0.15
TOP VIEW
4.00
0 . 90 ± 0 . 1
( 20X 0 . 5 )
712
1
0.10 M C A B
24X 0 . 23
+ 0 . 07
SEE DETAIL "X"
BASE PLANE
2 . 50 ± 0 . 15
4
- 0 . 05
C
0.10
SEATING PLANE
0.08 C
C
18
13
24X 0 . 4 ± 0 . 1
BOTTOM VIEW
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
15
( 24X 0 . 25 )
( 24X 0 . 6 )
C
0 . 2 REF
0 . 00 MIN.
0 . 05 MAX.
DETAIL "X"
5
NOTES:
Dimensions are in millimeters.1.
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
Tiebar shown (if present) is a non-functional feature.
5.
The configuration of the pin #1 identifier is optional, but must be
6.
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
FN6412.1
April 10, 2007
Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)
www.BDTIC.com/Intersil
N
INDEX
AREA
123
TOP VIEW
0.05(0.002)
-AD
e
b
0.10(0.004)C AMBS
123
N
P
BOTTOM VIEW
E1
E
-B-
SEATING PLANE
A
-C-
A1
M
P1
0.25(0.010)BMM
GAUGE
PLANE
0.25
0.010
α
0.10(0.004)
A2
M28.173B
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHESMILLIMETERS
SYMBOL
A-0.047-1.20-
A10.0020.0060.050.15-
L
A20.0310.0510.801.05-
b0.00750.01180.190.309
c0.00350.00790.090.20-
D0.3780.3869.609.803
E10.1690.1774.304.504
e0.026 BSC0.65 BSC-
c
E0.2460.2566.256.50-
L0.01770.02950.450.756
N28287
α
0°8°0°8°-
P-0.138-5.5011
P1 -0.118-3.0 11
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AET, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
NOTESMINMAXMINMAX
Rev. 0 6/05
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implic atio n or other wise u nde r any p a tent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
16
FN6412.1
April 10, 2007
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