intersil ISL6209 DATA SHEET

®

www.BDTIC.com/Intersil

ISL6209

Data Sheet March 23, 2007

High Voltage Synchronous Rectified Buck
MOSFET Driver

The ISL6209 is a high frequency, dual MOSFET driver,
optimized to drive two N-Channel power MOSFETs in a
synchronous-rectified buck converter topology in mobile
computing applications. This driver, combined with an Intersil
Multi-Phase Buck PWM controller, such as ISL6216, ISL6244,
and ISL6247, forms a complete single-stage core-voltage
regulator solution for advanced mobile microprocessors.

The ISL6209 features 4A typical sink current for the lower gate
driver. The 4A typical sink current is capable of holding the
lower MOSFET gate during the PHASE node rising edge to
prevent the shoot-through power loss caused by the high dv/dt
of the PHASE node. The operation voltage matches the 30V
breakdown voltage of the MOSFETs commonly used in mobile
computer power supplies.

The ISL6209 also features a three-state PWM input that,
working together with most of Intersil multiphase PWM
controllers, will prevent a negative transient on the output
voltage when the output is being shut down. This feature
eliminates the Schottky diode, that is usually seen in a
microprocessor power system for protecting the
microprocessor, from reversed-output-voltage damage.

The ISL6209 has the capacity to efficiently switch power
MOSFET s at frequencies up to 2MHz. Each driver is capable of
driving a 3000pF load with a 8ns propagation delay and less
than a 10ns transition time. This product implements
bootstrapping on the upper gate with an internal bootstrap
Schottky diode, reducing implementation cost, complexity, and
allowing the use of higher performance, cost effective
N-Channel MOSFETs. Programmable dead-time with gate
threshold monitoring is integrated to prevent both MOSFETs
from conducting simultaneously.

Related Literature

• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”

• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN Packages”

• Technical Brief TB447 “Guidelines for Preventing Boot-to­Phase Stress on Half-Bridge MOSFET Driver ICs”

FN9132.2

Features

• Drives Two N-Channel MOSFETs

• Shoot-Through Protection

- Active gate threshold monitoring

- Programmable dead-time

• 30V Operation Voltage

•0.4Ω On-Resistance and 4A Sink Current Capability

• Supports High Switching Frequency

- Fast output rise time

- Propagation delay 8ns

• Three-State PWM Input for Power Stage Shutdown

• Internal Bootstrap Schottky Diode

• QFN Package:

- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package outline

- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile

• Pb-Free Plus Anneal Available (RoHS Compliant)

Applications

• Core Voltage Supplies for Intel and AMD® Mobile
Microprocessors

• High Frequency Low Profile DC/DC Converters

• High Current Low Output Voltage DC/DC Converters

• High Input Voltage DC/DC Converter

Ordering Information

PART

NUMBER

ISL6209CB* ISL6209CB -10 to +100 8 Ld SOIC M8.15
ISL6209CBZ*

(Note)
ISL6209CR* 209C -10 to +100 8 Ld 3x3 QFN L8.3x3
*Add “-T” suffix for tape and reel.

NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.

PART

MARKING

ISL6209CBZ -10 to +100 8 Ld SOIC

TEMP.

RANGE

(°C) PACKAGE

(Pb-free)

PKG.

DWG. #

M8.15

1

AMD® is a registered trademark of Advanced Micro Devices, Inc. All other trademarks mentioned are the property of their respective owners.

Copyright © Intersil Americas Inc. 2004, 2005, 2007. All Rights Reserved. Intel® is a registered trademark of Intel Corporation.

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

| Intersil (and design) is a registered trademark of Intersil Americas Inc.

Pinouts

www.BDTIC.com/Intersil

ISL6209

(8 LD SOIC)

TOP VIEW

ISL6209

ISL6209

(8 LD QFN)

TOP VIEW

UGATE

BOOT

PWM

GND

1
2
3
4

ISL6209 Block Diagram

VCC

DELAY

PWM

8
7
6
5

10K

PHASE
DELAY
VCC
LGATE

CONTROL

LOGIC

SHOOT-

THROUGH

PROTECTION

VCC

BOOT

PWM

UGATE

PHASE

7

8

1

2

GND

BOOT

UGATE

PHASE

LGATE

6

6

DELAY

5

VCC

43

LGATE

Timing Diagram

PWM

UGATE

LGATE

t

FL

t

PDLL

t

PDHU

1V

GND

THERMAL PAD (FOR QFN PACKAGE ONLY)

FIGURE 1. BLOCK DIAGRAM

2.5V

t

PDLU

t

RU

t

FU

t

PTS

1V

t

RL

t

t

PDHL

TSSHD

t

FL

t

TSSHD

t

RU

t

FU

t

PTS

2

ISL6209

www.BDTIC.com/Intersil

Typical Application - Two Phase Converter Using ISL6209 Gate Drivers

V

BAT

+5V

PGOOD

VID

+5V

FB

VSEN

CONTROL

+5V

COMP

VCC

PWM1
PWM2

MAIN

ISEN1
ISEN2

PWM

DELAY

VCC

DRIVE

ISL6209

+5V

BOOT

UGATE

PHASE

LGATE

V

BAT

+V

CORE

FS

DACOUT

GND

VCC

PWM

DELAY

DRIVE

ISL6209

BOOT

UGATE

PHASE

LGATE

FIGURE 2. TYPICAL APPLICATION

3