The ISL5571A is a solid state device designed to replace the
electromechanical relay used on Subscriber Line Cards. The
device contains two Line Break MOSFET switches, one Ring
Return MOSFET switch and one Ring Access SCR switch.
The ISL5571A is pin-for-pin compatible with the Lucent
L7581AAE LCAS and Clare CPCL7581A Products.
Improvements include: line break switches r
match (0.5Ω
ON
Max) higher dV/dt sensitivity (5000V/µs), protection SCR
hold current set to 110mA.
The line break MOSFETs have very low on resistance
(<16.0Ω Typ) and Ron match (<0.05Ω Typ, 0.5Ω Max) and a
blocking voltage >330V. The Ring Return MOSFET has a
typical Ron of 50Ω and a blocking voltage >330V. The
Ringing Access switch is implemented with a SCR device
with a blocking voltage >480V. The SCR switch inherently
offers low EMI connect and disconnect circuitry. All control
I/Os use TTL thresholds making the device compatible with
3V logic.
The ISL5571A also includes on-chip protection in the form of
an over-voltage clamping circuit, current-limited MOSFET
switches, and thermal shutdown circuitry. The over-voltage
clamping circuit consists of a diode bridge and SCR.
Ordering Information
PART
NUMBER
ISL5571AIBYes-40 to 8516 Ld SOICM16.3
ISL5571AIBZ
(Note)
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
Add “-T” for tape and reel.
PROT
SCR
Yes-40 to 8516 Ld SOIC
TEMP
RANGE (°C)
PACKAGE
TYPE
(Pb-free)
PKG.
DWG. #
M16.3
FN4920.5
Features
• Small Size/Surface-Mount Packaging
• Low Impulse Noise, Low EMI
• Clean, Bounce-Free Switching
• Line Break Switches
-0.5Ω Max r
-28Ω Max r
ON
ON
Match
• Built-In Current Limiting, Thermal Shutdown and
Secondary Protection for the SLIC
• Optimized for Short Loop High REN Applications
• 3V/5V Logic-Capable I/O
• Pb-free Available
Applications
• Central Office
• PBX
•DLC
•HFC
•FITL
•DAML
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB379 “Thermal Characterization of
Packages for ICs”
• Texas Instruments TISPL758LF3D Data Sheet
• Teccor Electronics Document DO-214AA
Pinout
ISL5571A
TOP VIEW
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
Electrical SpecificationsT
PARAMETERTEST CONDITIONMEASUREMINTYPMAXUNITS
OFF-State Leakage Current:
ON-Resistance:
ON-Resistance MatchPer ON-resistance Test Condition of SW1, SW2 Magnitude
ON-State Voltage (Note 2)Break Switches in ON-State; I
DC Current Limit:
Dynamic Current Limit
(t = <0.5µs)
Isolation:
dV/dt Sensitivity (Note 3)-5000-V/µs
NOTES:
2. Choice of secondary protection should ensure this rating is not exceeded.
3. Applied voltage is 100V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
V
V
V
V
V
V
T
T
T
50/60Hz
V
V
V
Break Switches in ON-state; Ringing Access
Switches OFF; Apply ±1000V at 10/1000µs
Pulse; Appropriate External Secondary
Protection in Place
V
Logic Inputs = GND
V
Logic Inputs = GND
V
Logic Inputs = GND