Ultra Low ON-Resistance, +1.65V to +4.5V ,
Single Supply, Dual SPDT Analog Switch
The Intersil ISL54050 device is a low ON-resistance, low
voltage, bidirectional, dual single-pole/double-throw (SPDT)
analog switch designed to operate from a single +1.65V to
+4.5V supply . Targeted applications include battery powered
equipment that benefit from low r
switching speeds (t
ON
= 40ns, t
input is 1.8V logic-compatible when using a single +3V supp ly.
Cell phones, for example, often face ASIC functionality
limitations. The number of analog input or GPIO pins may be
limited and digital geometries are not well suited to analog
switch performance. This part may be used to “mux-in”
additional functionality while reducing ASIC design risk. The
ISL54050 is offered in small form factor package, alleviating
board space limitations.
The ISL54050 is a committed dual single-pole/double-throw
(SPDT) that consist of two normally open (NO) and two
normally closed (NC) switches. This configuration can be
used as a dual 2-to-1 multiplexer. The ISL5 4050 is pin
compatible with the NLAS5223 and NLAS5223L.
TABLE 1. FEATURES AT A GLANCE
Number of Switches2
SWSPDT or 2-1 MUX
4.3V R
ON
4.3V t
ON/tOFF
3V R
ON
3V t
ON/tOFF
1.8V r
ON
1.8V t
ON/tOFF
Package10 Ld 1.8mmx1.4mmx0.5mm µTQFN
0.29Ω
40ns/20ns
0.33Ω
50ns/27ns
0.55Ω
70ns/54ns
(0.29Ω) and fast
ON
= 20ns). The digital logic
OFF
ISL54050
FN6356.1
Features
• Pb-Free Plus Anneal Available (RoHS Compliant)
• Pin Compatible Replacement for the NLAS5223 and
NLAS5223L
• Battery powered, Handheld, and Portable Equipment
- Cellular/mobile Phones
- Pagers
- Laptops, Notebooks, Palmtops
• Portable Test an d Measurement
• Medical Equipment
• Audio and Video Switching
Ordering Information
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Application Note AN557 “Recommended Test Procedures
for Analog Switches”
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
TEMP.
PART NUMBER
(Note)
ISL54050IRUZ-T A-40 to +85 10 Ld µTQFN
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both
SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow t emperatures that meet or exce ed the Pbfree requirements of IPC/JEDEC J STD-020C.
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
PART
MARKING
Copyright Intersil Americas Inc. 2006, 2007. All Rights Reserved
RANGE
(°C)
PACKAGE
(Pb-free)
T ape and Reel
PKG.
DWG. #
L10.1.8x1.4A
ISL54050
Pinout (Note 1)
ISL54050
(10 LD µTQFN)
TOP VIEW
NC2GND
IN2
COM2
NO2
7
8
9
10
1
V+NO1
6
5
NC1
4
IN1
3
COM1
2
NOTE:
1. Switches Shown for Logic “0” Input.
Truth T able
LOGICNC1 and NC2NO1 and NO2
0ONOFF
1OFFON
NOTE: Logic “0” ≤0.5V. Logic “1” ≥1.4V with a 3V supply.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. Extended operation above the recommended
operating conditions could result in decreased reliability. The Absolute Maximum Ratings are stress only ratings and operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NC, NO, IN, or COM exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 4.3V SupplyTest Conditions: V+ = +3.9V to +4.5V, GND = 0V, V
unless otherwise specified
PARAMETERTEST CONDITIONS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, V
ON-Resistance, r
ON
ANALOG
V+ = 3.9V, I
(See Figure 5)
r
Matching Between Channels,
ON
Δr
ON
Flatness, r
r
ON
FLAT(ON)
NO or NC OFF Leakage Current,
I
NO(OFF)
or I
NC(OFF)
COM ON Leakage Current,
I
COM(ON)
V+ = 3.9V, I
max r
V+ = 3.9V, I
(Note 6)
V+ = 4.5V, V
V+ = 4.5V, V
3V or floating
DYNAMIC CHARACTERISTICS
Turn-ON Time, t
Turn-OFF Time, t
ON
OFF
Break-Before-Make Time Delay, t
V+ = 3.9V, VNO or VNC = 3.0V, RL =50Ω, CL = 35pF,
(See Figure 1)
V+ = 3.9V, VNO or VNC = 3.0V, RL =50Ω, CL = 35pF,
(See Figure 1)
V+ = 4.5V, VNO or VNC = 3.0V, RL =50Ω, CL = 35pF,
D
(See Figure 3)
Charge Injection, QC
OFF IsolationR
L
L
(See Figure 4)
TEMP
= 100mA, VNO or VNC = 0V to V+,
COM
ON,
= 100mA, VNO or V
COM
(Note 7)
= 100mA, VNO or VNC = 0V to V+,
COM
= 0.3V, 3V, VNO or VNC = 3V, 0.3V25-100100nA
COM
= 0.3V, 3V, or VNO or VNC = 0.3V,
COM
= Volt age at
NC
= 1.0nF, VG = 0V, RG = 0Ω, See Figure 225170pC
= 50Ω, CL = 5pF, f = 100kHz, V
COM
= 1V
RMS
,
(NOTE 5)
(°C)
Full0V+V
250.30Ω
Full0.35Ω
250.06Ω
Full0.08Ω
250.03Ω
Full0.04Ω
Full-195195nA
25-100100nA
Full-195195nA
2540ns
Full50ns
2520ns
Full30ns
Full8ns
2562dB
= 1.6V, V
INH
MINTYP
= 0.5V (Note 4),
INL
(NOTE 5)
MAXUNITS
3
FN6356.1
March 28, 2007
ISL54050
Electrical Specifications - 4.3V SupplyTest Conditions: V+ = +3.9V to +4.5V, GND = 0V, V
= 1.6V, V
INH
= 0.5V (Note 4),
INL
unless otherwise specified (Continued)
PARAMETERTEST CONDITIONS
Crosstalk (Channel-to-Channel)RL = 50Ω, CL = 5pF, f = 100kHz, V
(See Figure 6)
Total Harmonic Distortionf = 20Hz to 20kHz, V
NO or NC OFF Capacitance, C
COM ON Capacitance, C
COM(ON)
f = 1MHz, VNO or VNC = V
OFF
f = 1MHz, VNO or VNC = V
COM
= 2V
P-P
= 0V, (See Figure 7)2562pF
COM
= 0V, (See Figure 7)25176pF
COM
TEMP
COM
= 1V
RMS
,
, RL = 600Ω250.005%
(°C)
(NOTE 5)
MINTYP
(NOTE 5)
MAXUNITS
25-85dB
POWER SUPPLY CHARACTERISTICS
Power Supply RangeFull1.654.5V
Positive Supply Current, I+V+ = +4.5V, V
= 0V or V+250.1µA
IN
Full1µA
Positive Supply Current, I+V+ = +4.2V, V
= 2.85V2512µA
IN
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, V
Input Voltage High, V
Input Current, I
INH
, I
INL
INH
INL
V+ = 4.5V, VIN = 0V or V+Full-0.50.5µA
Full0.5V
Full1.6-V
NOTES:
= input voltage to perform proper function.
4. V
IN
5. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
6. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range.
matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON
7. r
ON
value, between NC1 and NC2 or between NO1 and NO2.
Electrical Specifications - 3V SupplyTest Conditions: V+ = +2.7V to +3.3V, GND = 0V, V
unless otherwise specified
PARAMETERTEST CONDITIONS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, V
ON-Resistance, r
Matching Between Channels,
r
ON
Δr
ON
Flatness, r
r
ON
FLAT(ON)
ON
ANALOG
V+ = 2.7V, I
(See Figure 5)
V+ = 2.7V, I
max r
V+ = 2.7V, I
(Note 6)
NO or NC OFF Leakage Current,
I
NO(OFF)
or I
NC(OFF)
COM ON Leakage Current,
I
COM(ON)
V+ = 3.3V, V
V+ = 3.3V, V
or floating
DYNAMIC CHARACTERISTICS
Turn-ON Time, t
Turn-OFF Time, t
ON
OFF
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF,
(See Figure 1)
V+ = 2.7V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF,
(See Figure 1)
, (Note 7)
ON
TEMP
= 100mA, VNO or VNC = 0V to V+,
COM
= 100mA, VNO or V
COM
= 100mA, VNO or VNC = 0V to V+,
COM
= 0.3V, 3V, VNO or VNC = 3V, 0.3V250.9nA
COM
= 0.3V , 3V , or VNO or VNC = 0.3V , 3V ,
COM
= Volt age at
NC
(NOTE 5)
(°C)
Full0V+V
250.350.5Ω
Full0.7Ω
250.060.07Ω
Full0.08Ω
250.030.15Ω
Full0.15Ω
Full30nA
250.8nA
Full30nA
2550ns
Full60ns
2527ns
Full35ns
= 1.4V, V
INH
MINTYP
= 0.5V (Note 4),
INL
(NOTE 5)
MAXUNITS
4
FN6356.1
March 28, 2007
ISL54050
Electrical Specifications - 3V SupplyTest Conditions: V+ = +2.7V to +3.3V, GND = 0V, V
unless otherwise specified (Continued)
PARAMETERTEST CONDITIONS
Break-Before-Make Time Delay, tDV+ = 3.3V, VNO or VNC = 1.5V, RL = 50Ω, CL = 35pF,
(See Figure 3)
Charge Injection, QC
OFF IsolationR
= 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)2594pC
L
= 50Ω, CL = 5pF, f = 100kHz, V
L
COM
= 1V
RMS
,
(See Figure 4)
Crosstalk (Channel-to-Channel)R
= 50Ω, CL = 5pF, f = 100kHz, V
L
COM
= 1V
RMS
,
(See Figure 6)
= 2V
Total Harmonic Distortionf = 20Hz to 20kHz, V
NO or NC OFF Capacitance, C
COM ON Capacitance, C
COM(ON)
f = 1MHz, VNO or VNC = V
OFF
f = 1MHz, VNO or VNC = V
COM
, RL = 600Ω250.005%
P-P
= 0V, (See Figure 7)2565pF
COM
= 0V, (See Figure 7)25181pF
COM
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+V+ = +3.6V, V
= 0V or V+250.01μA
IN
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, V
Input Voltage High, V
Input Current, I
INH
INL
INH
, I
INL
V+ = 3.3V, VIN = 0V or V+Full-0.50.5μA
TEMP
(NOTE 5)
(°C)
Full9ns
2562dB
25-85dB
Full0.52μA
250.5V
251.4V
= 1.4V, V
INH
MINTYP
= 0.5V (Note 4),
INL
(NOTE 5)
MAXUNITS
Electrical Specifications - 1.8V SupplyTest Conditions: V+ = +1.65V to +2V, GND = 0V, V
(See Figure 3)
Charge Injection, QC
NO or NC OFF Capacitance, C
COM ON Capacitance, C
COM(ON)
L
f = 1MHz, VNO or VNC = V
OFF
f = 1MHz, VNO or VNC = V
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, V
Input Voltage High, V
Input Current, I
INH
INL
INH
, I
INL
V+ = 2.0V, VIN = 0V or V+Full-0.50.5μA
TEMP
= 100mA, VNO or VNC = 0V to V+,
COM
= 1.0nF, VG = 0V, RG = 0Ω, (See Figure 2)2542pC
= 0V, (See Figure 7)2570pF
COM
= 0V, (See Figure 7)25186pF
COM
(NOTE 5)
(°C)
Full0V+V
250.70.8Ω
Full0.85Ω
2570ns
Full80ns
2554ns
Full65ns
Full10ns
250.4V
251.0V
= 1.0V, V
INH
INL
MINTYP
= 0.4V (Note 4),
(NOTE 5)
MAXUNITS
5
FN6356.1
March 28, 2007
Test Circuits and Waveforms
V+
LOGIC
INPUT
SWITCH
INPUT
SWITCH
OUTPUT
0V
V
NO
0V
50%
t
ON
90%
t
OFF
V
OUT
Logic input waveform is inverted for switches that have the opposite
logic sense.
tr < 5ns
< 5ns
t
f
90%
ISL54050
SWITCH
LOGIC
INPUT
INPUT
NO or NC
IN
Repeat test for all switches. C
capacitance.
V
OUT
V
=
(NO or NC)
V+
C
COM
R
+
RL
50Ω
L
ON()
GND
includes fixture and stray
L
----------------------------
RLr
V
OUT
C
L
35pF
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
V+
R
G
SWITCH
OUTPUT
V
OUT
LOGIC
INPUT
ON
Q = ΔV
OUT
ΔV
x C
OUT
L
OFF
ON
V+
0V
V
G
NO or NC
GND
Repeat test for all switches.
FIGURE 2A. MEASUREMENT POINTSFIGURE 2B. TEST CIRCUIT
FIGURE 2. CHARGE INJECTION
C
V
COM
IN
LOGIC
INPUT
OUT
C
L
LOGIC
INPUT
SWITCH
OUTPUT
V
OUT
V+
0V
0V
t
D
FIGURE 3A. MEASUREMENT POINTS
FIGURE 3. BREAK-BEFORE-MAK E TIME
6
90%
V
NX
LOGIC
INPUT
NO
NC
IN
Repeat test for all switches. C
capacitance.
FIGURE 3B. TEST CIRCUIT
V+
C
COM
GND
includes fixture and stray
L
R
50Ω
V
L
OUT
C
L
35pF
FN6356.1
March 28, 2007
Test Circuits and Waveforms (Continued)
V+
C
SIGNAL
GENERATOR
ANALYZER
R
L
NO or NC
COM
GND
IN
0V or V+
ISL54050
rON = V1/100mA
V
NX
100mA
V
1
NO or NC
COM
GND
V+
IN
C
0V or V+
Signal direction through switch is reversed, worst case values
are recorded. Repeat test for all switches.
FIGURE 4. OFF ISOLATION TEST CIRCUITFIGURE 5. RON TEST CIRCUIT
V+
C
SIGNAL
GENERATOR
0V or V+
ANALYZER
R
L
Signal direction through switch is reversed, worst case values
are recorded. Repeat test for all switches.
NO or NC
IN
1
COM
COM
NC or NO
GND
50Ω
N.C.
FIGURE 6. CROSSTALK TEST CIRCUITFIGURE 7. CAPACITANCE TEST CIRCUIT
Detailed Description
The ISL54050 is a bidirectional, dual single pole/double
throw (SPDT) analog switch that offers precise switching
capability from a single 1.65V to 4.5V supply with low
on-resistance (0.29Ω) and high speed operation
(t
=40ns, t
ON
suited for portable battery powered equipment due to its low
operating supply voltage (1.65V), low power consumption
(4.5μW max), low leakage currents (195nA max), and the tiny
μTQFN package. The ultra low on-resistance and r
flatness provide very low insertion loss and distortion to
applications that require signal reproduction.
Supply Sequencing and Overvoltage Protection
With any CMOS device, proper power supply sequencing is
required to protect the device from excessive input currents
which might permanently damage the IC. All I/O pins contain
= 20ns). The device is especially well
OFF
ON
Repeat test for all switches.
V+
C
NO or NC
0V or V+
IN
IMPEDANCE
ANALYZER
COM
GND
Repeat test for all switches.
ESD protection diodes from the pin to V+ and to GND (see
Figure 8). To prevent forward biasing these diodes, V+ must
be applied before any input signals, and the input signal
voltages must remain between V+ and GND.
If these conditions cannot be guaranteed, then precautions
must be implemented to prohibit the current and voltage at
the logic pin and signal pins from exceeding the maximum
ratings of the switch. The following two methods can be used
to provided additional protection to limit the current in the
event that the voltage at a signal pin or logic pin goes below
ground or above the V+ rail.
Logic inputs can be protected by adding a 1kΩ resistor in
series with the logic input (see Figure 8). The resistor limits
the input current below the threshold that produces
permanent damage, and the sub-microamp input current
7
FN6356.1
March 28, 2007
ISL54050
produces an insignificant voltage drop during normal
operation.
This method is not acceptab l e for the signal path inputs.
Adding a series resistor to the switch input defeats the
purpose of using a low R
switch. Connecting schottky
ON
diodes to the signal pins as shown in Figure 8 will shunt the
fault current to the supply or to ground thereby protecting the
switch. These schottky diodes must be sized to handle the
expected fault current.
OPTIONAL
SCHOTTKY
DIODE
V+
OPTIONAL
PROTECTION
RESISTOR
OPTIONAL
SCHOTTKY
DIODE
FIGURE 8. OVERVOLTAGE PROTECTION
IN
X
V
NX
GND
V
COM
Power-Supply Considerations
The ISL54050 construction is typical of most single supply
CMOS analog switches, in that they have two supply pins:
V+ and GND. V+ and GND drive the internal CMOS
switches and set their analog voltage limits. Unlike switches
with a 4V maximum supply voltage, the ISL54050 5.5V
maximum supply voltage provides plenty of room for the
10% tolerance of 4.3V supplies, as well as room for
overshoot and noise spikes.
The minimum recommended supply voltage is 1.65V. It is
important to note that the input signal range, switching times,
and on-resistance degrade at lower supply voltages. Refer
to the Electrical Specification tables and “Typical
Performance Curves” on page 9 for details.
V+ and GND also power the internal logic and level shifters.
The level shifters convert the input logic levels to switched
V+ and GND signals to drive the analog switch gate
terminals.
This family of switches cannot be operated with bipolar
supplies, because the input switching point becomes
negative in this configuration.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Driving
the digital input signals from GND to V+ with a fast transition
time minimizes power dissipation.
The ISL54050 has been designed to minimize the supply
current whenever the digital input voltage is not driven to the
supply rails (0V to V+). For example, driving the device with
2.85V logic (0V to 2.85V) while operating with a 4.2V supply,
the device draws only 12
V
=2.85V).
IN
μA of current (see Figure 16 for
Frequency Performance
In 50Ω systems, the ISL54050 has a -3dB bandwidth of
120MHz (see Figure 21). The frequency response is very
consistent over a wide V+ range and for varying analog
signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feedthrough from a switch’s input to its output. Off isolation is
the resistance to this feedthrough, while crosstalk indicates
the amount of feedthrough from one switch to another.
Figure 22 details the high off isolation and crosstalk rejection
provided by this part. At 100kHz, off isolation is about 62dB
in 50Ω systems, decreasing approximately 20dB per decade
as frequency increases. Higher load impedances decrease
off isolation and crosstalk rejection due to the voltage divider
action of the switch OFF impedance and the load
impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected
between each analog-signal pin and both V+ and GND. One of
these diodes conducts if any analog signal exceeds V+ or
GND.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or GND and the analog signal. This means their leakages
will vary as the signal varies. The difference in the two diode
leakages to the V+ and GND pins constitutes the
analog-signal-path leakage current. All analog leakage
current flows between each pin and one of the supply
terminals, not to the other switch terminal. This is why both
sides of a given switch can show leakage currents of the
same or opposite polarity. There is no connection between
the analog signal paths and V+ or GND.
Logic-Level Thresholds
This switch family is 1.8V CMOS compatible (0.5V and 1.4V)
over a supply range of 2.7V to 4.5V (see Figure 16). At 2.7V
the V
level is about 0.53V. This is still above the 1.8V
IL
CMOS guaranteed low output maximum level of 0.5V, but
noise margin is reduced.
8
FN6356.1
March 28, 2007
ISL54050
Typical Performance Curves T
0.30
0.29
0.28
(Ω)
ON
r
0.27
0.26
0.25
012345
V+ = 3.9V
V+ = 4.3V
V
COM
V+ = 4.5V
(V)
= +25°C, Unless Otherwise Specified
A
I
COM
FIGURE 9. ON-RESISTANCE vs SUPPL Y VOLTAGE vs
SWITCH VOLTAGE
0.70
0.65
0.60
0.55
(Ω)
0.50
ON
r
0.45
0.40
V+ = 1.65V
V+ = 1.8V
V+ = 2V
I
COM
= 100mA
= 100mA
0.35
0.34
0.33
0.32
(Ω)
ON
0.31
r
0.30
0.29
0.28
00.51.01.52.02.53.03.5
V+ = 2.7V
V+ = 3V
V+ = 3.3V
V
COM
(V)
I
COM
= 100mA
FIGURE 10. ON-RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
0.35
0.30
(Ω)
ON
r
0.25
+85°C
+25°C
V+ = 4.3V
I
COM
= 100mA
0.35
0.30
00.51.01.52.0
V
COM
(V)
FIGURE 11. ON-RESISTANCE vs SUPPLY VOLTAGE vs
0.20
012345
FIGURE 12. ON-RESISTANCE vs SWITCH VOLTAGE
-40°C
V
COM
(V)
SWITCH VOLTAGE
0.40
0.35
(Ω)
0.30
ON
r
0.25
0.20
0 0.51.01.52.02.53.03.5
+85°C
+25°C
-40°C
V
COM
(V)
V+ = 3.3V
I
COM
= 100mA
0.40
+85°C
0.35
(Ω)
ON
r
0.30
0.25
00.51.01.52.02.53.0
+25°C
-40°C
V
COM
(V)
V+ = 2.7V
I
COM
FIGURE 13. ON-RESISTANCE vs SWITCH VOLTAGEFIGURE 14. ON-RESISTANCE vs SWITCH VOLTAGE
= 100mA
9
FN6356.1
March 28, 2007
ISL54050
Typical Performance Curves T
0.60
0.55
0.50
0.45
(Ω)
ON
r
0.40
0.35
0.30
0.25
00.51.01.52.0
+85°C
+25°C
-40°C
V
COM
(V)
= +25°C, Unless Otherwise Specified (Continued)
A
V+ = 1.8V
I
COM
= 100mA
200
150
100
(μA)
ON
i
50
0
SWEEPING BOTH LOGIC INPUTS
12345
V
IN1
AND V
IN2
(V)
FIGURE 15. ON-RESISTANCE vs SWITCH VOLTAGEFIGURE 16. SUPPLY CURRENT vs VLOGIC VOLTAGE
200
150
100
50
Q (pC)
V+ = 1.8V
0
-50
V+ = 4.3V
V+ = 3V
(V)
AND V
V
INL
INH
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
V
INH
V
INL
V+ = 4.2V
-100
012345
V
(V)
COM
0.3
1.52.02.53.03.54.04.5
V+ (V)
FIGURE 17. CHARGE INJECTION vs SWITCH VOLTAGEFIGURE 18. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
(ns)
OFF
t
200
150
100
50
+85°C
+25°C
-40°C
0
1.52.02.53.03.54.04.5
1.0
V+ (V)
250
200
(ns)
150
ON
t
100
25
1.01.52.02.53.03.54.04.5
+85°C
+25°C
-40°C
V+ (V)
FIGURE 19. TURN-ON TIME vs SUPPLY VOLTAGEFIGURE 20. TURN-OFF TIME vs SUPPLY VOLTAGE
10
FN6356.1
March 28, 2007
ISL54050
Typical Performance Curves T
V+ = 3V
0
GAIN
-20
PHASE
NORMALIZED GAIN (dB)
RL = 50Ω
VIN = 0.2V
110100600
to 2V
P-P
FREQUENCY (MHz)
P-P
A
FIGURE 21. FREQUENCY RESPONSEFIGURE 22. CROSSTALK AND OFF ISOLATION
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
E
SYMBOL
21
A0.450.500.55-
MILLIMETERS
NOTESMINNOMINALMAX
A1--0.05A30.127 REF-
b0.150.200.255
D1.751.801.85-
C
E1.351.401.45e0.40 BSCL0.350.400.45-
L10.450.500.55-
N102
Nd23
NX L
21
5
5
NX b
10X
0.10 M C A B
0.05 M C
(DATUM B)
Ne33
θ
0-12
Rev. 3 6/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
4
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
C
L
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identi fier may be
L
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
TERMINAL TIP
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
0.50
1.80
0.40
0.20
10
LAND PATTERN
0.40
0.20
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiari es.
For information regarding Intersil Corporation and its products, see www.intersil.com
12
FN6356.1
March 28, 2007
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