intersil ISL54000, ISL54001, ISL54002 DATA SHEET

ISL54000, ISL54001, ISL54002

Data Sheet June 28, 2007

Integrated Audio Amplifier Systems

The Intersil ISL54000, ISL54001, ISL54002 family of devices are integrated audio power amplifier systems that combine stereo BTL 8Ω amplifiers in a single package. The devices are designed to operate from a single +2.7V to +5V power supply . All devices are offered in a 2 0 Ld 4x4 thin QFN p ackag e. Targeted applications include handheld equipment such as cell-phones, MP3 players, and games/toys.

The ISL54000, ISL54001, ISL54002 parts contain two class AB bridge-tied (BTL) type power amplifiers for driving stereo 8Ω speakers. Each BTL is capable of delivering 800mW (typ) with 0.4% THD+N and 941mW (typ) with 1% THD+N of continuous average power into an 8Ω BTL speaker load when using a 5V supply.

The ISL54001 and ISL54002 feature a 2:1 stereo input multiplexer front-end. This allows selection between two stereo sources. In addition the ISL54002 has the capability of mixing the stereo inputs.

All devices in this family feature low power shutdown, thermal overload protection and click/pop suppression. The click and pop circuitry eliminates audible transients during audio source changes and transitioning in and out of shutdown.

FN6458.1

Features

• Pb-Free Plus Anneal (RoHS Compliant)

• Class AB 941mW Stereo BTL Speaker Amplifiiers

• Single Supply Operation . . . . . . . . . . . . . . . . .+2.7V to +5.5V

• THD+N at 1kHz, 800mW into 8Ω . . . . . . . . . . . . . . . . . .0.4%

• THD+N at 1kHz, 941mW into 8Ω . . . . . . . . . . . . . . . . . . . 1%

• Low Power Shutdown

• Thermal Shutdown Protection

• “Click and Pop” Suppression Circuitry

• 2:1 Stereo Input Mux (ISL54001, ISL54002)

• Mixing of Two Stereo Inputs (ISL54002)

• TTL Logic-Compatible

• Available in 20 Ld 4x4 Thin QFN

Applications

• Battery powered, Handheld, and Portable Equipment

- Cellular/mobile Phones

- PDA’s, MP3 Players, DVD Players, Cameras

- Laptops, Notebooks, Palmtops

- Handheld Games and Toys

• Desktop Computers

ISL54002 Typical Application Circuit and Block Diagram

RIGHT AUDIO 1

RIGHT AUDIO 2

LEFT AUDIO 1

LEFT AUDIO 2

CONTROLLER

0.22µF

MICRO

CLICK AND POP

SD INS MIX

MUX/MIXER

THERMAL

PROTECTION

LOGIC CONTROL

BTL

BIAS

GND

0.1µF

OUTR+

OUTR-

OUTL+

OUTL-

REF

1µF

REF

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

| Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

ISL54000, ISL54001, ISL54002

Pinouts

OUTL+

OUTR+

OUTL+

OUTR+

OUTL-

GND

OUTL-

GND

ISL54000

(20 LD 4X4 TQFN)

TOP VIEW

GND

20 19 18 17 16

678910

OUTR-

ISL54001

(20 LD 4X4 TQFN)

TOP VIEW

GND

20 19 18 17 16

678910

INS

GND

N.C.

REF

N.C.

Pin Descriptions

NAME FUNCTIONISL54000 ISL54001 ISL54002

3, 6, 8, 12 3, 6, 8, 12 3, 6, 8, 12 V

4, 9, 20 4, 9, 20 4, 9, 20 GND Ground Connection

N.C.

11 11 11 IN

-1313IN

17 17 17 IN

-1919IN

2, 5 2, 5 2, 5 OUT_+ Positive Speaker

1, 7 1, 7 1, 7 OUT_- Negative Speaker

14 14 14 SD Shutdown, High to

- 18 18 INS Input Select

- - 16 MIX Mixer, High to mix

10 10 10 REF Common-mode Bias

System Power Supply

Left Channel Audio Input 1

Left Channel Audio Input 2

Right Channel Audio Input 1

Right Channel Audio Input 2

Output

disable amplifiers, Low for normal operation.

Right and Left Audio Inputs, Low to pass Audio Inputs without mixing

Voltage, Bypass with a 1µF capacitor to GND.

OUTL-

OUTL+

GND

OUTR+

OUTR-

ISL54002

(20 LD 4X4 TQFN)

TOP VIEW

GND

20 19 18 17 16

678910

INS

OUTR-

GND

REF

MIX

REF

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Ordering Information

TEMP.

PART

NUMBER

PART

MARKING

RANGE

(°C) PACKAGE

ISL54000IR* 540 00IR -40 to +85 20 Ld 4x4 TQFN L20.4x4A ISL54000IRTZ*

(Note)

540 00IRTZ -40 to +85 20 Ld 4x4 TQFN

(Pb-free) ISL54001IR* 540 01IRT -40 to +85 20 Ld 4x4 TQFN L20.4x4A ISL54001IRTZ*

(Note)

540 01IRTZ -40 to +85 20 Ld 4x4 TQFN

(Pb-free) ISL54002IR* 540 02IRT -40 to +85 20 Ld 4x4 TQFN L20.4x4A ISL54002IRTZ*

(Note)

540 02IRTZ -40 to +85 20 Ld 4x4 TQFN

(Pb-free)

*Add “-T” suffix for tape and reel. NOTE: Intersil Pb-free products employ special Pb-free material sets;

molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C.

PKG.

DWG. #

L20.4x4A

ISL54000 Truth Table

SD OUTR+ OUTR- OUTL+ OUTL-

1 Disabled Disabled Disabled Disabled 0IN

ISL54001 Truth Table

SD INS OUTR+ OUTR- OUTL+ OUTL-

1 X Disabled Disabled Disabled Disabled 00 IN 01 IN

1R 2R

IN IN

1R 2R

IN IN

ISL54002 Truth Table

SD MIX INS OUTR+ OUTR- OUTL+ OUTL-

1 X X Disabled Disabled Disabled Disabled 000 IN 001 IN

1R 2R

01XIN1R +

IN1R +

IN1L +

IN IN

IN1L +

1L 2L

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Absolute Maximum Ratings Thermal Information

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V

Input Voltages

In_R, In_L, SD, INS, MIX . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)

Output Voltages

OUT_+, OUT_-. . . . . . . . . . . . . . . . . . . . . . -0.3V to (VDD + 0.3V)

Continuous Current (VDD, OUT_, GND). . . . . . . . . . . . . . . . 750mA

ESD Rating

Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV

Machine Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>200V

Charged Device Model. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>1kV

Operating Conditions

Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.

NOTE:

is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. θ

1. θ

“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.

2. For θ

, the “case temp” location is the center of the exposed metal pad on the package underside.

Thermal Resistance (Typical, Notes 1, 2) θ

(°C/W) θJC (°C/W)

20 Ld 4x4 TQFN Package . . . . . . . . . . 45 6.5

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C

Maximum Stor age Temperat ure Rang e. . . . . . . . . . . -65°C to +150°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

the

JC,

Electrical Specifications - 5V Supply Test Conditions: V

= 1µF, RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified

REF

= +5V, GND = 0V, V

= 2.4V, V

INH

= 0.8V, SD = MIX = INS = V

INL

(Note 3).

PARAMETER TEST CONDITIONS

TEMP

(°C)

MIN

(Notes 4, 5) TYP

MAX

(Notes 4, 5) UNITS

GENERAL

Power Supply Range, V

Quiescent Supply Current, I

Shutdown Supply Current, I

Input Resistance, R Thermal Shutdown, T

INS = MIX = V coupled to ground (0.1μF)

SD = V

INH

or V

INL

INH

or V

INL

INH

, INS = MIX = V

, RL = 8Ω (BTL) , Inputs A C

, RL = None, Inputs AC

or V

INL

INH

Inputs AC coupled to ground (0.1μF)

INS = 0V or V INS = MIX = 0V or V

, RL = 8Ω (BTL),

Full 2.7 - 5.5 V

25 - 4.7 50 mA

Full - 10 - mA

25 - 4.6 12 mA

Full - 5.5 - mA

25 - 28 50 μA

Full - 31 - μA

25 - 100 - kΩ

25 - 150 - °C Thermal Shutdown Hysteresis 25 - 10 - °C SD to Full Operation, t

SD(ON)

INS = 0V or 5V, MIX = 0V or 5V Full - 1 - ms

BTL AMPLIFIER DRIVER

Output Offset Voltage, V

Power Supply Rejection Ratio, PSRR

Output Power, P

OUT

Total Harmonic Distortion + Noise, THD + N

Max Output V oltage Swing, V

OUT

Signal to Noise Ratio, SNR RL = 8Ω, P

Measured OUT_+ and OUT_-, Input AC coupled to ground (0.1μF)

RIPPLE

= 200mV

, RL = 8Ω,

P-P

Input AC coupled to ground (0.1μF)

RIPPLE

= 217Hz 25 - 49 - dB = 1kHz 25 - 47 - dB

25 -150 45 150 mV

Full - 49 - mV

RL = 8Ω, THD + N = 1%, f = 1kHz 25 - 941 - mW

= 8Ω, THD + N = 10%, f = 1kHz 25 - 1.23 - W

= 8Ω, P

RL = 8Ω, V

= 800mW, f = 1kHz 25 - 0.4 - %

OUT

= 800mW, f = 20Hz to 20kHz 25 - 0.7 - %

OUT

= 5V

SIGNAL

= 900mW, f = 1kHz 25 - 85 - dB

OUT

, f = 1kHz 25 7.2 7.7 - V

P-P

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Electrical Specifications - 5V Supply Test Conditions: V

= 1µF, RL is terminated between OUT_+ and OUT_ -, Unless Otherwise Specified

REF

(Note 3). (Continued)

PARAMETER TEST CONDITIONS

Output Noise, N

OUT

Crosstalk R

to LCH, LCH to R

Off-Isolation SD = V

Channel Gain Matching R

to L

Channel Phase Matching R

to L

LOGIC INPUT

Input Leakage Current, I

INH

INL

, I

INS

, I

INS

A - Weight filter, BW = 22Hz to 22kHz 25 - 125 - μV RL = 8Ω, P

from the input of active amplifier to the output of an

= 800mW, f = 1kHz, Signal coupled

OUT

adjacent amplifier with its input AC coupled to ground.

INH, POUT

coupled from input to output of a disabled amplifier.

= 800mW, f = 10kHz, Signal

RL = 8Ω, VINxR = VINxL = 3.88V same source)

RL = 8Ω, VINxR = VINxL= 3.88V same source)

, I

MIXVDD

, I

MIXVDD

= 5V, SD = 0V, INS = 0V, MIX = 0V 25 -3 1.9 3 μA

= 5V, SD = VDD, INS = VDD, MIX = V

= +5V, GND = 0V, V

(Connect to the

P-P

(Connect to the

P-P

INH

TEMP

(°C)

= 2.4V, V

(Notes 4, 5) TYP

= 0.8V, SD = MIX = INS = V

INL

MIN

(Notes 4, 5) UNITS

INL

MAX

25 - 80 - dB

25 - 110 - dB

25 - +-0.1 - dB

25 - 0.01 - °

Full - 1.9 - μA

25 -1 0.02 -1 μA

Full - 0.02 - μA Full 2.4 - - V Full - - 0.8 V

RMS

Electrical Specifications - 3.6V Supply Test Conditions: V

GSO = GS1 = V Unless Otherwise Specified (Note 3).

PARAMETER TEST CONDITIONS

GENERAL

Quiescent Supply Current, I

Shutdown Supply Current, I

BTL AMPLIFIER DRIVER, HD = V

Output Offset Voltage, V

Power Supply Rejection Ratio, PSRR V

Output Power, P

OUT

Total Harmonic Distortion + Noise, THD + N

Max Output Voltage Swing, V

OUT

INS = 0V or VDD, MIX = 0V or VDD, RL = 8Ω (BTL) , Input AC coupled to ground (0.1μF)

INS = 0V or V

, MIX = 0V or VDD, RL = None, Input

AC coupled to ground (0.1μF)

INS = 0V or VDD, MIX = 0V or VDD, RL = 8Ω (BTL), Input AC coupled to ground (0.1μF)

INH,

HO = V

UNLESS OTHERWISE SPECIFIED

INH,

Measured between OUT_+ and OUT_-, Input AC coupled to ground (0.1μF)

= 200mV

RIPPLE

Input AC coupled to ground

, RL = 8Ω,

P-P

(0.1μF)

F F

RL = 8Ω, THD + N = 1%, f = 1kHz 25 - 310 - mW R

= 8Ω, THD + N = 10%, f = 1kHz 25 - 528 - mW

= 8Ω, P

RL = 8Ω, V

= 200mW, f = 1kHz 25 - 0.4 - %

OUT

= 200mW, f = 20Hz to 20kHz 25 - 0.4 - %

OUT SIGNAL

= 3.6V

, f = 1kHz 25 - 5.8 - V

P-P

= +3.6V, GND = 0V, V

, C

INL

= 1µF. RLis terminated between OUT_+ and OUT_ -,

REF

TEMP

(°C)

= 1.4V. V

INH

INL

MIN

(Notes 4, 5) TYP

= 0.4V, SD = MIX = INS =

25 - 4 50 mA

Full - 10 - mA

25 - 2.7 12 mA

Full - 3 - mA

25 - 13 50 μA

Full - 15 - μA

25 -150 38 150 mV

Full - 58 - mV

= 217Hz 25 - 49 - dB

RIPPLE

= 1kHz 25 - 47 - dB

RIPPLE

MAX

(Notes 4, 5) UNITS

P-P

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Electrical Specifications - 3.6V Supply Test Conditions: V

GSO = GS1 = V Unless Otherwise Specified (Note 3). (Continued)

PARAMETER TEST CONDITIONS

= +3.6V, GND = 0V, V

, C

INL

= 1µF. RLis terminated between OUT_+ and OUT_ -,

REF

TEMP

(°C)

= 1.4V. V

INH

INL

MIN

(Notes 4, 5) TYP

= 0.4V, SD = MIX = INS =

MAX

(Notes 4, 5) UNITS

LOGIC INPUT

Input Leakage Current, I

INS

, I

MIXVDD

= 5V, SD = 0V, INS = 0V, MIX = 0V 25 -3 1.9 3 μA

, I

Full - 1.9 - μA

Input Leakage Current, I

, I

INS

, I

MIXVDD

= 5V, SD = VDD, INS = VDD, MIX = V

25 -1 0.02 1 μA

Full - 0.02 - μA

INH

INL

Full 1.4 - - V Full - - 0.4 V

NOTES:

= input voltage to perform proper function.

3. V

4. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.

5. Parts are 100% tested at +25°C. Over temperature limits established by characterization and are not production tested.

ISL54000 Typical Application Circuit and Block Diagram

0.1µF

RIGHT AUDIO

LEFT AUDIO

CONTROLLER

MICRO

0.22µF

CLICK AND POP

THERMAL

PROTECTION

LOGIC CONTROL

BTL

BIAS

GND

OUTR+

OUTR-

OUTL+

OUTL-

REF

1µF

REF

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

ISL54001 Typical Application Circuit and Block Diagram

0.1µF

RIGHT 1 AUDIO

RIGHT 2 AUDIO

LEFT 1 AUDIO

LEFT 2 AUDIO

CONTROLLER

0.22µF

MICRO

CLICK AND POP

INS

MUX

THERMAL

PROTECTION

LOGIC CONTROL

BTL

ISL54002 Typical Application Circuit and Block Diagram

BIAS

GND

OUTR+

OUTR-

OUTL+

OUTL-

REF

1µF

REF

RIGHT 1 AUDIO

RIGHT 2 AUDIO

LEFT 1 AUDIO

LEFT 2 AUDIO

CONTROLLER

MICRO

0.22µF

CLICK AND POP

INS MIX

MUX/MIXER

THERMAL

PROTECTION

LOGIC CONTROL

BLT

BIAS

GND

0.1µF

OUTR+

OUTR-

OUTL+

OUTL-

REF

1µF

REF

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Detailed Description

The Intersil ISL54000, ISL54001, ISL54002 family of devices are integrated audio power amplifier systems designed to drive 8

Ω speaker loads. They can operate with a supply

voltage of +2.7V to +5V and provide good quality audio, while requiring minimal external components. Its low 0.4% THD+N while driving 800mW into an 8 distortion amplification of the audio signals. The devices are offered in a 20 Ld 4x4 TQFN package. Targeted applications include handheld equipment such as cell-phones, MP3 players, and games/toys.

The ISL54000, ISL54001, ISL54002 parts contain two class AB bridge-tied (BTL) type power amplifiers for driving stereo 8Ω speakers. When powered with a 5V supply, each BTL is capable of delivering 941mW (typ) of continuous average power to an 8Ω speaker load with 1% THD+N performance. When the speaker load is connected across the positive and negative terminals of the BTL driver, the voltage is doubled across the load and the power is quadrupled.

The ISL54001 and ISL54002 feature a 2:1 stereo input multiplexer front-end. This allows selection between two stereo sources. The INS control pin determines which stereo input is active. Applying a logic “0” to the INS control pin selects stereo input 1 (R1 and L1). Applying a logic “1” to the INS control pin selects stereo input 2 (R2 and L2).

The ISL54002 has the capability of mixing the two stereo inputs. When in MIX Mode (MIX = “1”) the ISL54002 mixes the R1 input with the R2 input and sends the combined signal to the OUTR_ BTL driver and it mixes the L1 input with the L2 input and sends the combined signal to the OUTL_ BTL driver.

All devices in this family feature low power shutdown, thermal overload protection and click/pop suppression. The click and pop circuitry prohibits switching between input channels until the audio input signals are at their lowest point, which eliminates audible transients in the speakers when changing audio input sources. The click/pop circuitry also keeps speaker transients to an inaudibile level when entering and leaving shutdown.

Typical application circuits and block diagrams for each device in the family are on page 6 and page 7.

Ω speaker ensures clean, low

required to calculate the capacitor value is:

C 1 6.28 f 100kΩ••⁄≥

The 100k ISL54000, ISL54001, and ISL54002 devices.

Ω is the impedance looking into the input of the

(EQ. 1)

BTL Speaker Amplifiers

The ISL54000, ISL54001, and ISL54002 contains two bridge-tied load (BTL) amplifiers designed to drive a speaker load differentially. The output from one BTL is OUTL+ and OUTL-. The output of the other BTL is OUTR+ and OUTR-.

A single BTL driver consists of inverting and non-inverting power op amps. The AC signal out of each op amp are equal in magnitude but 180° out of phase,so the AC signal at OUTL+ and OUTL- have the same amplitude but are 180° out of phase. The same is true of OUTR+ and OUTR-. The speaker load gets connected between the + terminal and terminal outputs.

Driving the load differentially using a BTL configuration doubles the output voltage across the speaker load and quadruples the power to the load. In effect you get a gain of two due to this configuration at the load as compared to driving the load with a single-ended amplifier with its load connected between a single amplifier ’s output and ground.

The outputs of each BTL are biased at V load gets connected across the + and - terminal of the BTL, the mid supply DC bias voltage at each output gets cancelled out eliminating the need for large bulky output coupling capacitors.

/2. When the

Low Power Shutdown

With a logic “1” at the SD control pin the device enters the low power shutdown state. When in shutdown the output amplifiers go into an high impedance state and supply current is reduced to 26

In shutdown mode before the amplifiers enter the high impedance/low current drive state, the bias voltage of V remains connected at the output through a 100kΩ resistor. This resistor is not present during active operation of the drivers but gets switched in when the SD pin goes high and disconnected when the SD pin goes low.

μA (typ).

DC Bias Voltage

The ISL54000, ISL54001, and ISL54002 have internal DC bias circuitry, which DC offsets the incoming audio signal at V

/2. When using a 5V supply, the DC offset will be 2.5V.

When using a 3.6V supply, the DC offset will be 1.8V. Since the signal gets biased internally at V

signals need to be AC coupled to the inputs of the device. The value of the AC coupling capacitor depends on the low frequency range required for the application. A capacitor of

0.22

μF will pass a signal as low as 7.2Hz. The formula

/2, the audio

Leaving the DC bias voltage connected through this 100kΩ resistor reduces the transient that is generated across the speaker, while going into or out of shutdown, to a level that does not produce clicking or popping in the speaker.

QFN Thermal Pad Considerations

The QFN package features an exposed thermal pad on its underside. This pad lowers the package’s thermal resistance by providing a direct heat conduction path from the die to the PCB. Connect the exposed thermal pad to GND by using a large copper pad and multiple vias to the GND plane. The

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

vias should be plugged and tented with plating and solder mask to ensure good thermal conductivity.

Best thermal performance is achieved with the largest practical copper ground plane area.

PCB Layout Considersations and Power Supply Bypassing

To maintain the highest load dissipation and widest output voltage swing the power supply PCB traces and the traces that connect the output of the drivers to the speaker loads should be made as wide as possible to minimize losses due to parasitic trace resistance.

Typical Performance Curves T

1.0

0.9

VDD = 5V

0.8

BTL

= 8Ω

0.7

= 800mW

0.6

0.5

0.4

0.3

THD+N (%)

0.2

= +25°C, Unless Otherwise Specified.

Proper supply bypassing is necessary for high power supply rejection and low noise performance. A filter network consisting of a 10µF capacitor in parallel with a 0.1µF capacitor is recommended at the voltage regulator that is providing the power to the ISL54000, ISL54001, and ISL54002 IC.

Local bypass capacitors of 0.1µF should be put at each V

pin of the ISL54000, ISL54001, ISL54002 devices. They should be located as close as possible to the pin, keeping the length of leads and traces as short as possible.

A 1µF capacitor from the REF pin (pin 10) to ground is needed for optimum PSRR and internal bias voltage stability.

1.0

VDD = 3.6V

0.9

0.8

BTL R

0.7

= 8Ω

= 200mW

0.6

0.5

0.4

0.3

THD+N (%)

0.2

0.1 20 20k50 100 200 500 1k 2k 5k 10k

FREQUENCY (Hz)

FIGURE 1. THD+N vs FREQUENCY

VDD = 5V

BTL

= 8Ω

f = 1kHz

0.50

0.20

THD+N (%)

0.10

0.05

0.02

0.01 10m 120m 50m 100m 200m 500m

OUTPUT POWER (W)

FIGURE 3. THD+N vs OUTPUT POWER FIGURE 4. THD+N vs OUTPUT POWER

0.1 20 20k50 100 200 500 1k 2k 5k 10k

FREQUENCY (Hz)

FIGURE 2. THD+N vs FREQUENCY

VDD = 3.6V

BTL

= 8Ω

f = 1kHz

2 1

0.50

0.20

THD+N (%)

0.10

0.05

0.02

0.01 10m 600m20m 40m 70m 100m 200m

OUTPUT POWER (W)

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Typical Performance Curves T

-40

VDD = 5V

-45

= 800mW

-50

-55

-60

-65

-70

-75

-80

-85

-90

CROSSTALK (dB)

-95

-100

-105

-110

-115

-120 20 20k50 100 200 500 1k 2k 5k 10k

FIGURE 5. CROSSTALK vs FREQUENCY FIGURE 6. OFFISOLATION vs FREQUENCY

-20

-22

VDD = 5V

-24

BTL

-26

-28

-30

-32

-34

-36

-38

-40

-42

-44

-46

-48

-50

PSRR (dB)

-52

-54

-56

-58

-60

-62

-64

-66

-68

-70 10 20k20 50 100 200 500 1k 2k 5k 10k

RIPPLE

= 200mV

P-P

FIGURE 7. PSRR vs FREQUENCY

RCH TO L

LCH TO R

FREQUENCY (Hz)

= +25°C, Unless Otherwise Specified. (Continued)

-80

VDD = 5V

-82

= 800mW

-84

-86

-88

-90

-92

-94

-96

-98

-100

-102

-104

-106

-108

OFFISOLATION (dB)

-110

-112

-114

-116

-118

-120 20 20k50 100 200 500 1k 2k 5k 10k

700

VDD = 5V BTL

600

= 8Ω

500

400

300

200

POWER DISSIPATION (mW)

100

0 250 500 750 1000

FIGURE 8. POWER DISSIPATION vs OUTPUT POWER

FREQUENCY (Hz)

(mW)

OUT

400

VDD = 3.6V

BTL

350

= 8

300

250

200

150

100

POWER DISSIPATION (mW)

0 100 200 300 400 500

OUT

(mW)

FIGURE 9. POWER DISSIPATION vs OUTPUT POWER

Die Characteristics

SUBSTRATE POTENTIAL (POWERED UP):

GND

PROCESS:

Submicron CMOS

FN6458.1

June 28, 2007

ISL54000, ISL54001, ISL54002

Thin Quad Flat No-Lead Plastic Package (TQFN) Thin Micro Lead FramePlastic Package (TMLFP)

L20.4x4A

20 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220WGGD-1 ISSUE I)

MILLIMETERS

SYMBOL

A 0.70 0.75 0.80 -

A1 - 0.02 0.05 -

A2 - 0.55 0.80 9

A3 0.20 REF 9

b 0.18 0.25 0.30 5, 8

D 4.00 BSC -

D1 3.75 BSC 9

D2 1.95 2.10 2.25 7, 8

E 4.00 BSC -

E1 3.75 BSC 9

E2 1.95 2.10 2.25 7, 8

e 0.50 BSC -

k0.20 - - -

L 0.35 0.60 0.75 8

N202

Nd 5 3

Ne 5 3

P- -0.609

θ --129

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd and Ne refer to the number of terminals on each D and E.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389.

9. Features and dimensions A2, A3, D1, E1, P & θ are present when Anvil singulation method is used and not present for saw singulation.

NOTESMIN NOMINAL MAX

Rev. 0 11/04

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6458.1

June 28, 2007

intersil ISL54000, ISL54001, ISL54002 DATA SHEET

Specifications and Main Features

Frequently Asked Questions

User Manual