Ultra Low ON-Resistance, Single Supply,
Differential SPST Analog Switches
The Intersil ISL43L710, ISL43L711, ISL43L712 devices are
low ON-resistance, low voltage, bidirectional, precision,
differential single-pole/single-throw (SPST) analog switches
designed to operate from a single +1.65V to +3.6V supply.
Targeted applications include battery powered equipment
that benefit from low R
(0.12µW) and fast switching speeds (t
t
= 13ns).
OFF
Cell phones, for example, often face ASIC functionality
limitations. The number of analog input or GPIO pins may be
limited and digital geometries are not well suited to analog
switch performance. This family of parts may be used to
switch in additional functionality while reducing ASIC design
risk. The ISL43L71X are offered in small form factor
packages, alleviating board space limitations.
The ISL43L710, ISL43L711, ISL43L712 are differential
single-pole/single-throw (SPST) devices. The ISL43L710
has two normally open (NO) switches; the ISL43L711 has
two normally closed (NC) switches; the ISL43L712 has one
normally open (NO) and one normally closed (NC) switch
and can be used as an SPDT. The ISL43L712 is equipped
with an inhibit pin to simultaneously open all signal paths.
(0.16Ω), low power consumption
ON
ON =
13ns,
FN6092.1
Features
• Pb-Free Available (RoHS Compliant) (See Ordering info)
• Available in 8-Ld thin DFN and 8-Ld MSOP Packages
Applications
• Battery Powered, Handheld, and Portable Equipment
- Cellular/Mobile Phones
- Pagers
- Laptops, Notebooks, Palmtops
Table 1 summarizes the performance of this family.
TABLE 1. FEATURES AT A GLANCE
ISL43L710ISL43L711ISL43L712
NUMBER OF
SWITCHES
SW 1/SW 2NO/NONC/NCNO/NC
1.8V R
ON
1.8V tON/t
3V t
PACKAGES8 Ld 3x3 thin DFN, 8 Ld MSOP
3V R
ON/tOFF
OFF
ON
222
0.26Ω0.26Ω0.26Ω
30ns/25ns30ns/25ns30ns/25ns
0.16Ω0.16Ω0.16Ω
13ns/13ns13ns/13ns13ns/13ns
Related Literature
Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”.
Application Note AN557 “Recommended Test Procedures
for Analog Switches”.
• Portable Test and Measurement
• Medical Equipment
• Audio and Video Switching
Truth Table
ISL43L710ISL43L711
LOGIC
0OFFON
1ONOFF
INHLOGIC
1X OFFOFF
00 OFFON
01ONOFF
NOTE: Logic “0” ≤ 0.5V. Logic “1” ≥ 1.4V with a 3V Supply.
SW 1, 2SW 1, 2
ISL43L712
SW 1SW 2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2004. All Rights Reserved
Pinouts (Note 1)
ISL43L710 (MSOP, TDFN)
TOP VIEW
ISL43L710, ISL43L711, ISL43L712
ISL43L711 (MSOP, TDFN)
TOP VIEW
V+
1
NO
2
1
3
IN
4
NO
2
NOTE:
1. Switches Shown for Logic “0” Input.
Ordering Information
(Note 2)
PART NO.
(BRAND)
ISL43L710IU
(L710)
ISL43L710IR
(L70)
ISL43L711IU
(L711)
ISL43L711IR
(L71)
ISL43L712IU
(L712)
ISL43L712IR
(L72)
ISL43L710IUZ
(L710) (Note 3)
ISL43L710IRZ
(L70)
(Note 3)
ISL43L711IUZ
(L711)
(Note 3)
ISL43L711IRZ
(L71)
(Note 3)
TEMP.
RANGE (°C)PACKAGE
-40 to 858 Ld MSOPM8.118
-40 to 858 Ld 3x3 thin DFN L8.3x3A
-40 to 858 Ld MSOPM8.118
-40 to 858 Ld 3x3 thin DFN L8.3x3A
-40 to 858 Ld MSOPM8.118
-40 to 858 Ld 3x3 thin DFN L8.3x3A
-40 to 858 Ld MSOP
(Pb-free)
-40 to 858 Ld 3x3 thin DFN
(Pb-free)
-40 to 858 Ld MSOP
(Pb-free)
-40 to 858 Ld 3x3 thin DFN
(Pb-free)
COM
8
1
7
N.C.
6
COM
2
5
GND
NC
NC
V+
IN
1
2
1
3
4
2
8
COM
1
7
N.C.
6
COM
2
5
GND
ISL43L712 (MSOP, TDFN)
TOP VIEW
NO
NC
V+
IN
1
2
1
3
4
2
8
COM
1
7
INH
6
COM
2
5
GND
Ordering Information (Continued)
(Note 2)
PKG.
DWG. #
PART NO.
(BRAND)
ISL43L712IUZ *
(L712)
TEMP.
RANGE (°C)PACKAGE
-40 to 858 Ld MSOP
(Pb-free)
PKG.
DWG. #
M8.118
(Note 3)
ISL43L712IRZ *
(L72)
-40 to 858 Ld 3x3 thin DFN
(Pb-free)
L8.3x3A
(Note 3)
NOTES:
2. Most surface mount devices are available on tape and reel; add
“-T” to suffix.
3. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak
M8.118
reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020C.
L8.3x3A
Pin Descriptions
M8.118
L8.3x3A
PINFUNCTION
V+System Power Supply Input (+1.65V to +3.6V)
GNDGround Connection
INDigital Control Input
COMAnalog Switch Common Pin
NOAnalog Switch Normally Open Pin
NCAnalog Switch Normally Closed Pin
INHDigital Control Input. Connect to GND for Normal
Operation. Connect to V+ to turn all switches off.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
4. Signals on NC , NO , COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications - 1.8V SupplyTest Conditions: V+ = +1.65V to +2.0V, GND = 0V, V
= 1.0V, V
INH
= 0.4V (Notes 6, 8),
INL
Unless Otherwise Specified (Continued)
TEMP
PARAMETERTEST CONDITIONS
OFF IsolationRL = 50Ω, CL = 5pF, f = 100kHz, V
Crosstalk (Channel-to-Channel)25--94-dB
NO or NC OFF Capacitance, C
COM OFF Capacitance,
C
COM(OFF)
COM ON Capacitance, C
COM(ON)
Figure 3 and Figure 5)
f = 1MHz, VNO or VNC = V
OFF
f = 1MHz, VNO or VNC = V
f = 1MHz, VNO or VNC = V
COM
COM
COM
COM
= 1 V
RMS,
(See
= 0V, (See Figure 6)25-182-pF
= 0V, (See Figure 6)25-182-pF
= 0V, (See Figure 6)25-290-pF
(°C)
25-62-dB
MIN
(NOTE 7)TYP
MAX
(NOTE 7)UNITS
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+V+ = 1.65V to 3.6V, V
off
= 0V or V+, all channels on or
IN
25--30nA
Full--750nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage Low, V
Input Voltage High, V
Input Current, I
INH
, I
INL
INH
INL
V+ = 2.0V, VIN = 0V or V+ (Note 9)Full-0.5-0.5µA
Full--0.4V
Full1.0--V
Test Circuits and Waveforms
tr < 5ns
< 5ns
t
f
90%
LOGIC
INPUT
SWITCH
INPUT
SWITCH
OUTPUT
V+
50%
0V
t
OFF
V
NO
0V
t
ON
90%
V
OUT
Logic input waveform is inverted for switches that have the opposite
logic sense.
SWITCH
LOGIC
INPUT
INPUT
NO or NC
IN
Repeat test for all switches. C
capacitance.
V
OUT
V+
C
GND
includes fixture and stray
L
V
=
(NO or NC)
COM
R
L
------------------------------
RLR
+
ON()
RL
50Ω
V
OUT
C
35pF
L
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
V+
C
R
SWITCH
OUTPUT
V
OUT
LOGIC
INPUT
ON
Q = ∆V
OUT
∆V
x C
OUT
L
OFF
ON
V+
0V
V
G
G
NO or NC
GND
FIGURE 2A. MEASUREMENT POINTSFIGURE 2B. TEST CIRCUIT
FIGURE 2. CHARGE INJECTION
5
COM
IN
LOGIC
INPUT
V
OUT
C
L
FN6092.1
November 4, 2004
ISL43L710, ISL43L711, ISL43L712
Test Circuits and Waveforms (Continued)
SIGNAL
GENERATOR
ANALYZER
FIGURE 3. OFF ISOLATION TEST CIRCUITFIGURE 4. RON TEST CIRCUIT
SIGNAL
GENERATOR
R
L
0V or V+
NO or NC
COM
NO1 or NC1
IN
1
GND
V+
IN
V+
COM1
IN
C
X
C
0V or V+
2
0V or V+
50Ω
RON = V1/100mA
V
NX
IMPEDANCE
ANALYZER
1mA
V
1
NO or NC
COM
NO or NC
GND
V+
C
0V or V+
IN
V+
C
IN
0V or V+
X
ANALYZER
COM2
R
L
NO2 or NC2
GND
NC
FIGURE 5. CROSSTALK TEST CIRCUITFIGURE 6. CAPACITANCE TEST CIRCUIT
Detailed Description
The ISL43L71x family of devices are bidirectional, single
pole/single throw (SPST) analog switches that offer precise
switching capability from a single 1.65V to 3.6V supply with
low on-resistance (0.16Ω) and high speed operation
(t
= 13ns, t
ON
suited for portable battery powered equipment due to its low
operating supply voltage (1.65V), low power consumption
(2.7µW max), low leakage currents (80nA max), and the tiny
TDFN and MSOP packaging. The ultra low on-resistance and
R
flatness provide very low insertion loss and distortion to
ON
application that require signal reproduction.
Supply Sequencing and Overvoltage Protection
With any CMOS device, proper power supply sequencing is
required to protect the device from excessive input currents
which might permanently damage the IC. All I/O pins contain
ESD protection diodes from the pin to V+ and to GND (See
Figure 7). To prevent forward biasing these diodes, V+ must
= 13ns). The device is especially well
OFF
COM
GND
be applied before any input signals, and the input signal
voltages must remain between V+ and GND. If these
conditions cannot be guaranteed, then one of the following
two protection methods should be employed.
Logic inputs can easily be protected by adding a 1kΩ
resistor in series with the input (See Figure 7). The resistor
limits the input current below the threshold that produces
permanent damage, and the sub-microamp input current
produces an insignificant voltage drop during normal
operation.
This method is not acceptable for the signal path inputs.
Adding a series resistor to the switch input defeats the
purpose of using a low R
switch, so two small signal
ON
diodes can be added in series with the supply pins to provide
overvoltage protection for all pins (See Figure 7). These
additional diodes limit the analog signal from 1V below V+ to
1V above GND. The low leakage current performance is
6
FN6092.1
November 4, 2004
ISL43L710, ISL43L711, ISL43L712
unaffected by this approach, but the switch signal range is
reduced and the resistance may increase, especially at low
supply voltages.
OPTIONAL PROTECTION
DIODE
OPTIONAL
PROTECTION
RESISTOR
IN
X
V
NO or NC
FIGURE 7. OVERVOLTAGE PROTECTION
V+
GND
OPTIONAL PROTECTION
DIODE
V
COM
Power-Supply Considerations
The ISL43L71x construction is typical of most single supply
CMOS analog switches, in that they have two supply pins:
V+ and GND. V+ and GND drive the internal CMOS
switches and set their analog voltage limits. Unlike switches
with a 4V maximum supply voltage, the ISL43L71x 4.7V
maximum supply voltage provides plenty of room for the
10% tolerance of 3.6V supplies, as well as room for
overshoot and noise spikes.
The minimum recommended supply voltage is 1.65V but the
part will operate with a supply below 1.5V. It is important to
note that the input signal range, switching times, and onresistance degrade at lower supply voltages. Refer to the
electrical specification tables and Typical Performance
curves for details.
V+ and GND also power the internal logic and level shifters.
The level shifters convert the input logic levels to switched
V+ and GND signals to drive the analog switch gate
terminals.
This family of switches cannot be operated with bipolar
supplies, because the input switching point becomes
negative in this configuration.
Logic-Level Thresholds
This switch family is 1.8V CMOS compatible (0.5V and 1.4V)
over a supply range of 2V to 3.6V (See Figure 14). At 3.6V
the V
level is about 1.27V. This is still below the 1.8V
IH
CMOS guaranteed high output minimum level of 1.4V, but
noise margin is reduced.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Driving
the digital input signals from GND to V+ with a fast transition
time minimizes power dissipation.
High-Frequency Performance
In 50Ω systems, signal response is reasonably flat even past
20MHz with a -3dB bandwidth of 175MHz (See Figure 15).
The frequency response is very consistent over a wide V+
range, and for varying analog signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
feedthrough from a switch’s input to its output. Off Isolation is
the resistance to this feedthrough, while Crosstalk indicates
the amount of feedthrough from one switch to another.
Figure 16 details the high Off Isolation and Crosstalk
rejection provided by this family. At 100kHz, Off Isolation is
about 62dB in 50Ω systems, decreasing approximately 20dB
per decade as frequency increases. Higher load
impedances decrease Off Isolation and Crosstalk rejection
due to the voltage divider action of the switch OFF
impedance and the load impedance.
Leakage Considerations
Reverse ESD protection diodes are internally connected
between each analog-signal pin and both V+ and GND. One of
these diodes conducts if any analog signal exceeds V+ or
GND.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or GND and the analog signal. This means their leakages
will vary as the signal varies. The difference in the two diode
leakages to the V+ and GND pins constitutes the analogsignal-path leakage current. All analog leakage current flows
between each pin and one of the supply terminals, not to the
other switch terminal. This is why both sides of a given
switch can show leakage currents of the same or opposite
polarity. There is no connection between the analog signal
paths and V+ or GND.
7
FN6092.1
November 4, 2004
ISL43L710, ISL43L711, ISL43L712
Typical Performance Curves T
0.26
0.24
V+ = 1.8V
0.22
0.2
(Ω)
ON
R
0.18
0.16
0.14
0.12
01234
V+ = 2.7V
V+ = 3V
V
COM
(V)
= 25°C, Unless Otherwise Specified
A
I
= 100mA
COM
V+ = 3.6V
FIGURE 8. ON RESISTANCE vs SUPPLY VOLTAGE vs
SWITCH VOLTAGE
0.3
0.25
85°C
V+ = 1.8V
I
COM
= 100mA
0.19
0.18
0.17
0.16
(Ω)
0.15
ON
R
0.14
0.13
0.12
0.11
00.511.522.53
85°C
25°C
-40°C
V
COM
(V)
I
COM
V+ = 3V
= 100mA
FIGURE 9. ON RESISTANCE vs SWITCH VOLTAGE
50
0
-50
V+ = 3V
(Ω)
0.2
ON
R
-40°C
0.15
0.1
00.511.52
V
(V)
COM
25°C
-100
Q (pC)
-150
-200
-250
00.511.522.53
V+ = 1.8V
V
COM
(V)
FIGURE 10. ON RESISTANCE vs SWITCH VOLTAGEFIGURE 11. CHARGE INJECTION vs SWITCH VOLTAGE
80
70
60
50
(ns)
40
ON
t
30
20
10
0
11.522.533.544.5
-40°C
85°C
25°C
V+ (V)
50
40
85°C
30
(ns)
OFF
t
-40°C
20
10
0
1.522.533.544.5
1
25°C
V+ (V)
FIGURE 12. TURN-ON TIME vs SUPPLY VOLTAGEFIGURE 13. TURN-OFF TIME vs SUPPLY VOLTAGE
8
FN6092.1
November 4, 2004
V
AND
V
(V)
ISL43L710, ISL43L711, ISL43L712
Typical Performance Curves T
1.8
1.6
1.4
1.2
INL
1
0.8
INH
0.6
0.4
0.2
11.522.533.544.5
V
INH
V+ (V)
= 25°C, Unless Otherwise Specified (Continued)
A
-20
NORMALIZED GAIN (dB)
V
INL
V+ = 3V
0
GAIN
PHASE
RL = 50Ω
VIN = 0.2V
110100600
P-P
to 2V
P-P
FREQUENCY (MHz)
FIGURE 14. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGEFIGURE 15. FREQUENCY RESPONSE
-10
V+ = 3V
-20
-30
-40
-50
-60
-70
CROSSTALK (dB)
-80
-90
ISOLATION
CROSSTALK
10
20
30
40
50
60
70
OFF ISOLATION (dB)
80
90
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
114
PROCESS:
Submicron CMOS
0
20
40
60
80
100
PHASE (DEGREES)
-100
-110
1k100k1M100M 500M10k10M
FREQUENCY (Hz)
FIGURE 16. CROSSTALK AND OFF ISOLATION
9
100
110
FN6092.1
November 4, 2004
ISL43L710, ISL43L711, ISL43L712
Thin Dual Flat No-Lead Plastic Package (TDFN)
(DATUM B)
6
INDEX
AREA
(DATUM A)
NX (b)
5
SECTION "C-C"
A
6
INDEX
AREA
SEATING
PLANE
NX L
8
C
12
N
(A1)
D
TOP VIEW
SIDE VIEW
D2
D2/2
N-1
e
(Nd-1)Xe
REF.
BOTTOM VIEW
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
2X
2X
ABC0.15
0.15
CB
L8.3x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
NOTESMINNOMINALMAX
A0.700.750.80-
E
A1--0.05-
A30.20 REF-
b0.250.300.355,8
D3.00 BSC-
D22.202.302.407,8
E3.00 BSC-
E21.401.501.607,8
e0.65 BSC-
k0.25 - - -
L0.200.300.408
A3
C
0.10
//
A
0.08
C
L1--0.151
N82
87
Nd43
Rev. 2 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
NX k
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
E2
E2/2
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
NX b
5
0.10
BAMC
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
C
L
L1
e
L
10
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
10. COMPLIANT TO JEDEC MO-229-WEEC-1 except for
dimensions E2 & D2.
10
FN6092.1
November 4, 2004
ISL43L710, ISL43L711, ISL43L712
Mini Small Outline Plastic Packages (MSOP)
N
EE1
INDEX
AREA
AA1A2
-H-
SIDE VIEW
12
TOP VIEW
b
e
D
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane.Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
- H -
-A -
.
10. Datumsandto be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN6092.1
November 4, 2004
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