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ISL3179E
DATA SHEET
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intersil ISL3179E DATA SHEET

®
ISL3179E
Data Sheet August 16, 2007
±15kV ESD Protected, +125°C, 40Mbps,
3.3V, Full Fail-Safe, RS-485/RS-422 Transceivers
Intersil’s ISL3179E is a ±15kV IEC61000 ESD Protected,
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which ensures a logic high Rx output if Rx inputs are floating, shorted, or terminated but undriven.
Hot Plug circuitry ensures that the Tx and Rx outputs remain in a high impedance state while the power supply stabilizes.
Ordering Information
PART
NUMBER
(Notes 1, 2)
ISL3179EFBZ 3179 EFBZ -40 to +125 8 Ld SOIC M8.15 ISL3179EFUZ 179FZ -40 to +125 8 Ld MSOP M8.118 ISL3179EFRZ 79FZ -40 to +125 10 Ld DFN L10.3x3C ISL3179EIBZ 3179 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL3179EIUZ 179IZ -40 to +85 8 Ld MSOP M8.118 ISL3179EIRZ 79IZ -40 to +85 10 Ld DFN L10.3x3C
NOTES:
1. Add “-T” suffix for tape and reel.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb­free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
PART
MARKING
TEMP.
RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
FN6365.1
Features
• IEC61000 ESD Protection on RS-485 I/O Pins . . . ±16.5kV
- Class 3 HBM ESD Level on all Other Pins. . . . . . .>9kV
• Specified for +125°C Operation
• High Data Rates. . . . . . . . . . . . . . . . . . . . . . up to 40Mbps
• 5V Tolerant Logic Inputs
• 1/5 Unit Load Allows up to 160 Devices on the Bus
• Full Fail-Safe (Open, Shorted, Terminated/Undriven) Receiver
• Hot Plug - Tx and Rx Outputs Remain Three-State During Power-Up
• Low Quiescent Current . . . . . . . . . . . . . . . . . . 4mA (Max)
• Low Current Shutdown Mode. . . . . . . . . . . . . . 1μA (Max)
• -7V to +12V Common Mode Input Voltage Range
• Three-State Rx and Tx Outputs
• 16/16.5ns (Max) Tx/Rx Propagation Delays; 1.5ns (Max) Skew
• Operates from a Single +3.3V Supply (10% Tolerance)
• Current Limiting and Thermal Shutdown for driver Overload Protection
• Pb-Free Plus (RoHS Compliant)
Applications
• Motor Controller/Position Encoder Systems
• Factory Automation
• Field Bus Networks
• Security Networks
• Building Environmental Control Systems
• Industrial/Process Control Networks
Pinouts
ISL3179E
(8 LD SOIC, MSOP)
TOP VIEW
RO
1
R
2
RE DE
3
D
4
DI
1
ISL3179E
(10 LD DFN)
TOP VIEW
8
V
CC
7
B/Z
6
A/Y
5
GND
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
RO
1
RE
2
DE
3
DI
4
NC
5
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
V
10
CC
NC
9
B/Z
8
A/Y
7
GND
6
ISL3179E
Truth T able
TRANSMITTING
INPUTS OUTPUTS
RE
X1101 X1010 0 0 X High-Z High-Z 1 0 X High-Z* High-Z*
NOTE: *Shutdown Mode
DE DI B/Z A/Y
Truth Table
RECEIVING
INPUTS OUTPUT
RE
00 ≥ -0.05V 1 00 ≤ -0.2V 0 0 0 Inputs Open/Shorted 1 1 1 X High-Z 1 0 X High-Z*
DE A-B RO
NOTE: *Shutdown Mode
Pin Descriptions
PIN FUNCTION
RO Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floa ting) o r shorte d, o r
connected to a terminated bus that is undriven.
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t required, connect RE
DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and they are high impedance when DE is low. If
the Tx enable function isn’t required, connect DE to V
DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
directly to GND.
through a 1kΩ or greater resistor.
CC
GND Ground connection.
A/Y ±16.5kV
IEC61000 ESD Protected RS-485/422 level, non-inverting receiver input and non-inverting driver output. Pin is an input (A)
if DE = 0; pin is an output (Y) if DE = 1.
B/Z ±16.5kV
IEC61000 ESD Protected RS-485/422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0;
pin is an output (Z) if DE = 1.
V
System power supply input (3.0V to 3.6V).
CC
NC No Connection.
Typical Operating Circuit
+3.3V
8
V
RO
1 2
RE
3
DE
DI
4
CC
R
B/Z A/Y
D
GND
5
ISL3179E
SOIC AND MSOP PIN NUMBERS SHOWN
+
0.1μF
R
T
7 6
0.1μF
R
T
+
+3.3V
8
V
CC
B/Z
7 6
A/Y
R
GND
5
4
DI
D
3
DE
2
RE
1
RO
2
FN6365.1
August 16, 2007
ISL3179E
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
CC
+0.3V)
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Operating Conditions
Temperature Range
ISL3179EF . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
ISL3179EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTE:
is measured with the component mounted on a high effective thermal conductivity (with direct attach for DFN) test board in free air. See T ech
3. θ
JA
Brief TB379 for details.
Thermal Resistance (Typical, Note 3)
θ
JA
(°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 160
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 137
10 Ld DFN Package. . . . . . . . . . . . . . . . . . . . . . . . . 46
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Electrical Specifications Test Conditions: V
(Note 4)
PARAMETER SYMBOL TEST CONDITIONS
DC CHARACTERISTICS
Driver Differential V
OUT
Change in Magnitude of Driver Differential V Complementary Output States
Driver Common-Mode V
OUT
for
OUT
Change in Magnitude of Driver Common-Mode V Complementary Output States
OUT
for
Logic Input High Voltage V Logic Input Low Voltage V Logic Input Current I Input Current (A/Y, B/Z) I
Driver Short-Circuit Current,
= High or Low
V
O
Receiver Differential Threshold Voltage
Receiver Input Hysteresis ΔV Receiver Output High Voltage V Receiver Output Low Voltage V Receiver Output Low Current I
V
OD
ΔV
ODRL
V
OC
ΔV
OCRL
IH
IL IN1 IN2
I
OSD1
V
TH
TH
OHIO OLIO
OL
RL = 100Ω (RS-422) (Figure 1A), (Note 13) Full 2 2.3 - V R
L
No Load Full - - V RL = 60Ω, -7V ≤VCM ≤12V (Figure 1B),
(Note 13)
RL = 54Ω or 100Ω (Figure 1A) Full - 2 2.5 V
DI, DE, RE Full 2 - - V DI, DE, RE Full - - 0.8 V DI = DE = RE = 0V or V DE = 0V, VCC = 0V or
3.6V
DE = VCC, -7V ≤VY or VZ ≤12V (Note 6) Full - - ±250 mA
-7V ≤ VCM ≤ 12V Full -200 - -50 mV
VCM = 0V 25 - 28 - mV
= -12mA, VID = -50mV Full VCC - 0.5 - - V = +10mA, VID = -200mV Full - - 0.4 V
VOL = 1V, VID = -200mV Full 25 - - mA
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
TEMP
(°C)
= 54Ω (RS-485) (Figure 1A) Full 1.5 2.1 V
MIN
(Note 14) TYP
MAX
(Note 14) UNITS
CC CC
Full 1.5 2 - V
= 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
= 54Ω or 100Ω (Figure 1A) Full - 0.02 0.2 V
CC
Full -2 - 2 μA
VIN = 12V Full - - 220 μA
= -7V Full -160 - - μA
V
IN
V
3
FN6365.1
August 16, 2007
ISL3179E
Electrical Specifications Test Conditions: V
(Note 4) (Continued)
PARAMETER SYMBOL TEST CONDITIONS
Three-State (high impedance)
I
OZR
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
TEMP
(°C)
MIN
(Note 14) TYP
MAX
(Note 14) UNITS
0.4V ≤ VO ≤ 2.4V Full -1 0.015 1 μA
Receiver Output Current Receiver Input Resistance R Receiver Short-Circuit Current I
OSR
-7V ≤ VCM ≤ 12V Full 54 80 - kΩ
IN
0V ≤ VO ≤ V
CC
Full ±20 - ±110 mA
SUPPLY CURRENT
No-Load Supply Current (Note 5) I Shutdown Supply Current I
SHDN
DI = DE = 0V or V
CC
DE = 0V, RE = VCC, DI = 0V or V
CC
CC
Full - 2.6 4 mA Full - 0.05 1 μA
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z) IEC61000-4-2, Air-Gap Discharge Method 25 - ±16.5 - kV
IEC61000-4-2, Contact Discharge Method 25 - ±9-kV Human Body Model, From Bus Pins to GND 25 - ±16.5 - kV
All Pins HBM, per MIL-STD-883 Method 3015 25 - >±9- kV
Machine Model 25 - >±400 - V
DRIVER SWITCHING CHARACTERISTICS
Maximum Data Rate f
MAX
VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 4) -40 to 85 40 60 - Mbps
125 16 32 - Mbps Driver Differential Output Delay t Prop Delay Part-to-Part Skew t Driver Differential Output Skew t Driver Differential Rise or Fall Time t Driver Enable to Output High t
SKP-PRD SKEWRD
R
RD = 54Ω, CD = 50pF (Figure 2) Full - 11 16 ns
DD
= 54Ω, CD = 50pF (Figure 2), (Note 12) Full - - 4 ns = 54Ω, CD = 50pF (Figure 2) Full - 0 1.5 ns
, tFRD = 54Ω, CD = 50pF (Figure 2) Full - 4 7 ns
RL = 110Ω, CL = 50pF, SW = GND (Figure 3),
ZH
Full - 18 25 ns
(Note 7)
Driver Enable to Output Low t
RL = 110Ω, CL = 50pF, SW = VCC (Figure 3),
ZL
Full - 16 25 ns
(Note 7) Driver Disable from Output High t Driver Disable from Output Low t Time to Shutdown t Driver Enable from Shutdown to
t
ZH(SHDN)RL
Output High Driver Enable from Shutdown to
t
ZL(SHDN)RL
Output Low
SHDN
RL = 110Ω, CL = 50pF, SW = GND (Figure 3), Full - 15 25 ns
HZ
RL = 110Ω, CL = 50pF, SW = VCC (Figure 3), Full - 18 25 ns
LZ
(Note 9) Full 60 - 600 ns
= 110Ω, CL = 50pF, SW = GND (Figure 3),
Full - - 1000 ns
(Notes 9, 10)
= 110Ω, CL = 50pF, SW = VCC (Figure 3),
Full - - 1000 ns
(Notes 9, 10)
RECEIVER SWITCHING CHARACTERISTICS
Maximum Data Rate f Receiver Input to Output Delay t
PLH
Prop Delay Part-to-Part Skew t
- t
Receiver Skew | t
PLH
|t
PHL
Receiver Enable to Output High t
MAX
SKP-P
SKD
VID = ±1.5V Full 40 60 - Mbps
, t
(Figure 5) Full - 10 16.5 ns
PHL
(Figure 5), (Note 12) Full - - 4 ns
(Figure 5) Full - 0 1.5 ns
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),
ZH
Full - 10 15 ns
(Note 8) Receiver Enable to Output Low t
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),
ZL
Full - 11 15 ns
(Note 8) Receiver Disable from Output High t Receiver Disable from Output Low t
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) Full - 10 15 ns
HZ
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) Full - 10 15 ns
LZ
4
FN6365.1
August 16, 2007
ISL3179E
Electrical Specifications Test Conditions: V
(Note 4) (Continued)
PARAMETER SYMBOL TEST CONDITIONS
Time to Shutdown t Receiver Enable from Shutdown to
Output High Receiver Enable from Shutdown to
Output Low
SHDN
t
ZH(SHDN)RL
t
ZL(SHDN)RL
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
TEMP
(°C)
MIN
(Note 14) TYP
MAX
(Note 14) UNITS
(Note 9) Full 60 - 600 ns
= 1kΩ, CL = 15pF, SW = GND (Figure 6),
Full - - 1000 ns
(Notes 9, 11)
= 1kΩ, CL = 15pF, SW = VCC (Figure 6),
Full - - 1000 ns
(Notes 9, 11)
NOTES:
4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified.
5. Supply current specification is valid for loaded drivers when DE = 0V.
6. Applies to peak current. See “Typical Performance Curves” on page 10 for more information.
7. Because of the shutdown feature, keep RE
8. Because of the shutdown feature, the RE
9. These IC’s are put into shutdown by bringing RE
= 0 to prevent the device from entering SHDN.
signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
high and DE low. If the inputs are in this st ate for less than 60ns, the p art s are guaranteed not to enter shutdown. If the inputs are in this state for at least 700ns, the parts are guaranteed to have entered shutdown. See “Low Power Shutdown Mode” on page 9.
10. Keep RE
11. Set the RE
12. This is the part-to-part skew between any two units tested with identical test conditions (Temperature, V
13. V
= VCC, and set the DE signal low time >700ns to ensure that the device enters SHDN.
signal high time >700ns to ensure that the device enters SHDN.
= 3.3V ±5%
CC
CC
, etc.).
14. Parts are 100% tested at +25°C. Over temperature limits established by characterization and are not production tested.
Test Circuits and Waveforms
DE
V
CC
DI
Z
D
Y
V
OD
FIGURE 1A. VOD AND V
RL/2
V
R
/2
OC
L
OC
FIGURE 1. DC DRIVER TEST CIRCUITS
DE
V
CC
DI
Z
D
Y
V
OD
RL = 60Ω
FIGURE 1B. VOD WITH COMMON MODE LOAD
375Ω
VCM
-7V TO +12V
375Ω
5
FN6365.1
August 16, 2007
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