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ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E,
ISL3175E, ISL3176E, ISL3177E, ISL3178E
Data Sheet August 28, 2006
±
15kV ESD Protected, 3.3V, Full Fail-safe,
Low Power, High Speed or Slew Rate
Limited, RS-485/RS-422 Transceivers
The Intersil ISL317XE are ±15kV IEC61000 ESD Protected,
3.3V powered, single transceivers that meet both the
RS-485 and RS-422 standards for balanced communication.
These devices have very low bus currents (+125μA/-100μA),
so they present a true “1/8 unit load” to the RS-485 bus. This
allows up to 256 transceivers on the network without violating
the RS-485 specification’s 32 unit load maximum, and without
using repeaters. For example, in a remote utility meter reading
system, individual meter readings are routed to a concentrator
via an RS-485 network, so the high allowed node count
minimizes the number of repeaters required.
Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or terminated but undriven.
Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state while the power supply stabilizes.
The ISL3170E through ISL3175E utilize slew rate limited
drivers which reduce EMI, and minimize reflections from
improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications. Slew rate limited
versions also include receiver input filtering to enhance noise
immunity in the presence of slow input signals.
The ISL3170E, ISL3171E, ISL3173E, ISL3174E, ISL3176E,
ISL3177E are configured for full duplex (separate Rx input
and Tx output pins) applications. The half duplex versions
multiplex the Rx inputs and Tx outputs to allow transceivers
with output disable functions in 8 lead packages.
Features
• IEC61000 ESD Protection on RS-485 I/O Pins . . . . . ±15kV
- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM
• Pb-Free Plus Anneal Available (RoHS Compliant)
• Full Fail-safe (Open, Short, Terminated/Floating)
Receivers
• Hot Plug - Tx and Rx Outputs Remain Three-state During
Power-up
• True 1/8 Unit Load Allows up to 256 Devices on the Bus
• Single 3.3V Supply
• High Data Rates. . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
• Low Quiescent Supply Current . . . . . . . . . . .800
- Ultra Low Shutdown Supply Current . . . . . . . . . . .10nA
• -7V to +12V Common Mode Input/Output Voltage Range
• Half and Full Duplex Pinouts
• Three State Rx and Tx Outputs Available
• Current Limiting and Thermal Shutdown for driver
Overload Protection
• Tiny MSOP Packages Consume 50% Less Board Space
Applications
• Automated Utility Meter Reading Systems
• High Node Count Systems
• Field Bus Networks
• Security Camera Networks
FN6307.2
μA (Max)
• Building Environmental Control/ Lighting Systems
• Industrial/Process Control Networks
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
ISL3170E FULL 0.25 YES YES 256 YES 510 YES 10, 14
ISL3171E FULL 0.25 YES YES 256 NO 510 NO 8
ISL3172E HALF 0.25 YES YES 256 YES 510 YES 8
ISL3173E FULL 0.5 YES YES 256 YES 510 YES 10, 14
ISL3174E FULL 0.5 YES YES 256 NO 510 NO 8
ISL3175E HALF 0.5 YES YES 256 YES 510 YES 8
ISL3176E FULL 20 NO YES 256 YES 510 YES 10, 14
ISL3177E FULL 20 NO YES 256 NO 510 NO 8
ISL3178E HALF 20 NO YES 256 YES 510 YES 8
HALF/FULL
DUPLEX
DATA RATE
(Mbps)
SLEW-RATE
LIMITED?
HOT
PLUG?
# DEVICES
ON BUS
RX/TX
ENABLE?
QUIESCENT
I
(μA)
CC
LOW POWER
SHUTDOWN?
COUNT
PIN
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2006. All Rights Reserved
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Pinouts
ISL3172E, ISL3175E, ISL3178E
(MSOP, SOIC)
TOP VIEW
RO
RE
DE
1
R
2
3
D
4
DI
8
V
CC
7
B/Z
6
A/Y
5
GND
ISL3171E, ISL3174E, ISL3177E
(MSOP, SOIC)
TOP VIEW
V
CC
RO
GND
1
R
2
3
DI
D
4
8
A
7
B
6
Z
5
Y
ISL3170E, ISL3173E, ISL3176E
(MSOP)
TOP VIEW
RO
RE
DE
GND
1
R
2
3
DI
D
4
5
10
V
CC
A
9
B
8
Z
7
Y
6
ISL3170E, ISL3173E, ISL3176E
(SOIC)
TOP VIEW
NC
RO
RE
DE
GND
GND
1
2
R
3
4
DI
5
D
6
7
14
V
CC
NC
13
A
12
B
11
Z
10
9
Y
8
NC
Ordering Information(Notes 1, 2)
PART NUMBER PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. #
ISL3170EIBZ 3170EIBZ -40 to +85 14 Ld SOIC M14.15
ISL3170EIUZ 3170Z -40 to +85 10 Ld MSOP M10.118
ISL3171EIBZ 3171EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3171EIUZ 3171Z -40 to +85 8 Ld MSOP M8.118
ISL3172EIBZ 3172EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3172EIUZ 3172Z -40 to +85 8 Ld MSOP M8.118
ISL3173EIBZ 3173EIBZ -40 to +85 14 Ld SOIC M14.15
ISL3173EIUZ 3173Z -40 to +85 10 Ld MSOP M10.118
ISL3174EIBZ 3174EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3174EIUZ 3174Z -40 to +85 8 Ld MSOP M8.118
ISL3175EIBZ 3175EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3175EIUZ 3175Z -40 to +85 8 Ld MSOP M8.118
ISL3176EIBZ 3176EIBZ -40 to +85 14 Ld SOIC M14.15
ISL3176EIUZ 3176Z -40 to +85 10 Ld MSOP M10.118
ISL3177EIBZ 3177EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3177EIUZ 3177Z -40 to +85 8 Ld MSOP M8.118
ISL3178EIBZ 3178EIBZ -40 to +85 8 Ld SOIC M8.15
ISL3178EIUZ 3178Z -40 to +85 8 Ld MSOP M8.118
NOTES:
1. Units also available in Tape and Reel; Add “-T” to suffix.
2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Truth Ta bles
TRANSMITTING
INPUTS OUTPUTS
RE
X1101
X1010
0 0 X High-Z High-Z
1 0 X High-Z * High-Z *
NOTE: *Shutdown Mode (See Note 9), except for ISL3171E,
ISL3174E, ISL3177E
DE DI Z Y
RE
00 X≥ -0.05V 1
00 X≤ -0.2V 0
0 0 X Inputs
1 0 0 X High-Z *
1 1 1 X High-Z
NOTE: *Shutdown Mode (See Note 9), except for ISL3171E,
ISL3174E, ISL3177E
DE
Half DuplexDEFull Duplex
RECEIVING
INPUTS OUTPUT
A-B RO
1
Open/Shorted
Pin Descriptions
PIN FUNCTION
RO Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating ) or sho rted.
RE
DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high, and are high impedance when DE is low. If the
DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND Ground connection.
A/Y ±15kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if
B/Z ±15kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0;
V
NC No Connection.
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high. If the Rx enable function isn’t used,
connect RE
Tx enable function isn’t used, connect DE to V
DE = 0; pin is an output if DE = 1.
pin is an output if DE = 1.
A ±15kV
B ±15kV
Y ±15kV
Z ±15kV
System power supply input (3.0V to 3.6V).
CC
directly to GND or through a 1kΩ to 3kΩ resistor to GND.
through a 1kΩ to 3kΩ resistor.
CC
IEC61000 ESD Protected RS-485/422 level, noninverting receiver input.
IEC61000 ESD Protected RS-485/422 level, inverting receiver input.
IEC61000 ESD Protected RS-485/422 level, noninverting driver output.
IEC61000 ESD Protected RS-485/422 level, inverting driver output.
3
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Typical Operating Circuits
ISL3172E, ISL3175E, ISL3178E
+3.3V
+
8
V
RO
1
2
RE
3
DE
DI
4
CC
R
B/Z
A/Y
D
GND
5
0.1μF
R
T
7
6
0.1μF
R
T
+
ISL3171E, ISL3174E, ISL3177E
+3.3V
+
1
V
CC
RO
2
R
0.1μF
A
B
R
8
T
7
0.1μF
+3.3V
8
V
CC
7
B/Z
6
A/Y
R
GND
5
+3.3V
+
1
V
CC
Y
5
Z
6
4
DI
D
3
DE
2
RE
1
RO
3
DI
D
6
GND
Z
5
Y
4
DI
3
D
R
T
B
7
R
A
8
GND
4
RO
2
ISL3170E, ISL3173E, ISL3176E
+3.3V
+
14
V
2
RO
3
RE
4
DE
5
DI
CC
R
D
GND
6, 7
0.1μF
R
12
A
B
Z
Y
T
11
10
9
(PIN NUMBERS FOR SOIC)
0.1μF
R
T
+3.3V3
+
14
V
CC
Y
9
Z
10
B
11
A
12
GND
6, 7
DI
5
D
4
DE
3
RE
RO
R
2
4
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input/Output Voltages
A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +13V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V
CC
+0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 3)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . +105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . +140
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . +190
14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . +128
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
(Lead Tips Only)
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θ
JA
θ
JA
(°C/W)
Electrical Specifications Test Conditions: V
Note 4
PARAMETER SYMBOL TEST CONDITIONS
DC CHARACTERISTICS
Driver Differential V
OUT
Change in Magnitude of Driver
Differential V
OUT
for
Complementary Output States
Driver Common-Mode V
OUT
Change in Magnitude of Driver
Common-Mode V
OUT
for
Complementary Output States
Logic Input High Voltage V
Logic Input Low Voltage V
Logic Input Hysteresis V
Logic Input Current I
Input Current (A, B, A/Y, B/Z) I
Output Leakage Current (Y , Z) (Full
Duplex Versions Only, Note 12)
Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex,
Note 12)
Driver Short-Circuit Current,
= High or Low
V
O
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis ΔV
Receiver Output High Voltage V
V
OD
ΔV
V
OC
ΔV
HYS
IN1
IN2
I
IN3
I
IN4
I
OSD1
V
TH
OH
RL = 100Ω (RS-422) (Figure 1A, Note 15) Full 2 2.3 - V
R
No Load - - V
RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 1.5 2.2 - V
RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
OD
RL = 54Ω or 100Ω (Figure 1A) Full - 2 3 V
RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V
OC
DI, DE, RE Full 2 - - V
IH
DI, DE, RE Full - - 0.8 V
IL
DE, RE (Note 14) 25 - 100 - mV
DI = DE = RE = 0V or VCC (Note 17) Full -2 - 2 μA
DE = 0V, VCC = 0V or
3.6V
RE = 0V, DE = 0V,
V
RE = VCC, DE = 0V,
V
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 6) Full - - ±250 mA
-7V ≤ VCM ≤ 12V Full -200 -125 -50 mV
VCM = 0V 25 - 15 - mV
TH
IO = -4mA, VID = -50mV Full VCC - 0.6 - - V
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
TEMP
(°C) MIN TYP MAX UNITS
= 54Ω (RS-485) (Figure 1A) Full 1.5 2 V
L
VIN = 12V Full - 80 125 μA
= -7V Full -100 -50 - μA
V
IN
= 12V Full - 10 40 μA
V
= 0V or 3.6V
CC
= 0V or 3.6V
CC
IN
= -7V Full -40 -10 - μA
V
IN
= 12V Full - 10 40 μA
V
IN
V
= -7V Full -40 -10 - μA
IN
CC
CC
V
5
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Electrical Specifications Test Conditions: V
Note 4 (Continued)
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
TEMP
PARAMETER SYMBOL TEST CONDITIONS
Receiver Output Low Voltage V
Three-State (high impedance)
Receiver Output Current (Note 12)
Receiver Input Resistance R
Receiver Short-Circuit Current I
Thermal Shutdown Threshold T
OL
I
OZR
OSR
SD
IO = -4mA, VID = -200mV Full - 0.17 0.4 V
0.4V ≤ VO ≤ 2.4V Full -1 0.015 1 μA
-7V ≤ VCM ≤ 12V Full 96 150 - kΩ
IN
0V ≤ VO ≤ V
CC
(°C) MIN TYP MAX UNITS
Full ±730±60 mA
Full - 150 - °C
SUPPLY CURRENT
No-Load Supply Current (Note 5) I
Shutdown Supply Current
CC
I
SHDN
DI = 0V or V
CC
DE = 0V, RE = VCC, DI = 0V or V
DE = VCC,
RE
= 0V or V
DE = 0V, RE
CC
Full - 510 800 μA
CC
= 0V Full - 480 700 μA
Full - 0.01 12 μA
(Note 12)
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y, B/Z) IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV
IEC61000-4-2, Contact Discharge Method 25 - ±8-kV
Human Body Model, From Bus Pins to GND 25 - ±15 - kV
All Pins HBM, per MIL-STD-883 Method 3015 25 - ±7-kV
MM 25 - 200 - V
DRIVER SWITCHING CHARACTERISTICS (ISL3170E, ISL3171E, ISL3172E, 250kbps)
Maximum Data Rate f
Driver Differential Output Delay t
Driver Differential Output Skew t
Driver Differential Rise or Fall Time t
Driver Enable to Output High t
Driver Enable to Output Low t
Driver Disable from Output High t
Driver Disable from Output Low t
Time to Shutdown t
Driver Enable from Shutdown to
t
ZH(SHDN)RL
Output High
Driver Enable from Shutdown to
Output Low
t
ZL(SHDN)RL
MAX
DD
SKEW
R
ZH
ZL
HZ
LZ
SHDN
VOD = ±1.5V, CD = 820pF (Figure 4, Note 16) Full 250 800 - kbps
R
= 54Ω, CD = 50pF (Figure 2) Full 250 1100 1500 ns
DIFF
R
= 54Ω, CD = 50pF (Figure 2) Full - 6 100 ns
DIFF
, t
R
F
= 54Ω, CD = 50pF (Figure 2) Full 350 960 1600 ns
DIFF
RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
Full - 26 600 ns
(Notes 7, 12)
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
Full - 200 600 ns
(Notes 7, 12)
RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
Full - 28 55 ns
(Note 12)
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
Full - 30 55 ns
(Note 12)
(Notes 9, 12) Full 50 200 600 ns
= 500Ω, CL = 50pF, SW = GND (Figure 3),
Full - 180 700 ns
(Notes 9, 10, 12)
= 500Ω, CL = 50pF, SW = VCC (Figure 3),
Full - 100 700 ns
(Notes 9, 10, 12)
DRIVER SWITCHING CHARACTERISTICS (ISL3173E, ISL3174E, ISL3175E, 500kbps)
Maximum Data Rate f
Driver Differential Output Delay t
Driver Differential Output Skew t
Driver Differential Rise or Fall Time t
Driver Enable to Output High t
MAX
DD
SKEW
R
ZH
VOD = ±1.5V, CD = 820pF (Figure 4, Note 16) Full 500 1600 - kbps
R
= 54Ω, CD = 50pF (Figure 2) Full 180 350 800 ns
DIFF
R
= 54Ω, CD = 50pF (Figure 2) Full - 1 30 ns
DIFF
, t
R
F
= 54Ω, CD = 50pF (Figure 2) Full 200 380 800 ns
DIFF
RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
Full - 26 350 ns
(Notes 7, 12)
6
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Electrical Specifications Test Conditions: V
Note 4 (Continued)
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
PARAMETER SYMBOL TEST CONDITIONS
Driver Enable to Output Low t
ZL
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 7, 12)
Driver Disable from Output High t
HZ
RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Note 12)
Driver Disable from Output Low t
LZ
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Note 12)
Time to Shutdown t
Driver Enable from Shutdown to
t
Output High
Driver Enable from Shutdown to
t
Output Low
SHDN
ZH(SHDN)RL
ZL(SHDN)RL
(Notes 9, 12) Full 50 200 600 ns
= 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 9, 10, 12)
= 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 9, 10, 12)
DRIVER SWITCHING CHARACTERISTICS (ISL3176E, ISL3177E, ISL3178E, 20Mbps)
Maximum Data Rate f
Driver Differential Output Delay t
Driver Differential Output Skew t
Driver Output Skew, Part-to-Part Δt
Driver Differential Rise or Fall Time t
Driver Enable to Output High t
Driver Enable to Output Low t
Driver Disable from Output High t
Driver Disable from Output Low t
Time to Shutdown t
Driver Enable from Shutdown to
Output High
Driver Enable from Shutdown to
Output Low
t
ZH(SHDN)RL
t
ZL(SHDN)RL
MAX
DD
SKEW
DSKEWRDIFF
R
ZH
ZL
HZ
LZ
SHDN
VOD = ±1.5V, CD = 350pF (Figure 4, Note 16) Full 20 28 - Mbps
R
= 54Ω, CD = 50pF (Figure 2) Full - 27 40 ns
DIFF
R
= 54Ω, CD = 50pF (Figure 2) Full - 1 3 ns
DIFF
= 54Ω, CD = 50pF (Figure 2, Note 13) Full - - 11 ns
, t
R
F
= 54Ω, CD = 50pF (Figure 2) Full - 9 15 ns
DIFF
RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 7, 12)
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 7, 12)
RL = 500Ω, CL = 50pF, SW = GND (Figure 3),
(Note 12)
RL = 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Note 12)
(Notes 9, 12) Full 50 200 600 ns
= 500Ω, CL = 50pF, SW = GND (Figure 3),
(Notes 9, 10, 12)
= 500Ω, CL = 50pF, SW = VCC (Figure 3),
(Notes 9, 10, 12)
RECEIVER SWITCHING CHARACTERISTICS (All Versions)
Maximum Data Rate f
MAX
VID = ±1.5V (Note 16) ISL3170E-75E Full 12 20 - Mbps
ISL3176E-78E Full 20 35 - Mbps
, t
Receiver Input to Output Delay t
PLH
(Figure 5) ISL3170E-75E Full 25 70 120 ns
PHL
ISL3176E-78E Full 25 33 60 ns
Receiver Skew | t
Receiver Skew, Part-to-Part Δt
Receiver Enable to Output High t
Receiver Enable to Output Low t
Receiver Disable from Output High t
PLH
- t
|t
PHL
SKD
RSKEW
ZH
ZL
HZ
(Figure 5) Full - 1.5 4 ns
(Figure 5, Note 13) Full - - 15 ns
RL = 1kΩ, CL = 15pF,
SW = GND (Figure 6),
(Notes 8, 12)
RL = 1kΩ, CL = 15pF,
SW = V
(Notes 8, 12)
(Figure 6),
CC
RL = 1kΩ, CL = 15pF,
SW = GND (Figure 6),
(Note 12)
ISL3170E-75E Full 5 15 20 ns
ISL3176E-78E Full 5 11 17 ns
ISL3170E-75E Full 5 15 20 ns
ISL3176E-78E Full 5 11 17 ns
ISL3170E-75E Full 5 12 20 ns
ISL3176E-78E Full 4 7 15 ns
TEMP
(°C) MIN TYP MAX UNITS
Full - 100 350 ns
Full - 28 55 ns
Full - 30 55 ns
Full - 180 700 ns
Full - 100 700 ns
Full - 17 50 ns
Full - 16 40 ns
Full - 25 40 ns
Full - 28 50 ns
Full - 180 700 ns
Full - 90 700 ns
7
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Electrical Specifications Test Conditions: V
Note 4 (Continued)
= 3.0V to 3.6V; Unless Otherwise Specified. Typicals are at VCC = 3.3V, TA = +25°C,
CC
TEMP
PARAMETER SYMBOL TEST CONDITIONS
Receiver Disable from Output Low t
Time to Shutdown t
Receiver Enable from Shutdown to
t
ZH(SHDN)RL
Output High
Receiver Enable from Shutdown to
t
ZL(SHDN)RL
Output Low
LZ
SHDN
RL = 1kΩ, CL = 15pF,
SW = V
(Note 12)
(Figure 6),
CC
ISL3170E-75E Full 5 13 20 ns
ISL3176E-78E Full 4 7 15 ns
(Notes 9, 12) Full 50 180 600 ns
= 1kΩ, CL = 15pF, SW = GND (Figure 6),
(Notes 9, 11, 12)
= 1kΩ, CL = 15pF, SW = VCC (Figure 6),
(Notes 9, 11, 12)
(°C) MIN TYP MAX UNITS
Full - 240 500 ns
Full - 240 500 ns
NOTES:
4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
5. Supply current specification is valid for loaded drivers when DE = 0V.
6. Applies to peak current. See “Typical Performance Curves” for more information.
7. When testing devices with the shutdown feature, keep RE
8. When testing devices with the shutdown feature, the RE
= 0 to prevent the device from entering SHDN.
signal high time must be short enough (typically <100ns) to prevent the device from
entering SHDN.
9. Versions with a shutdown feature are put into shutdown by bringing RE high and DE low . If the inputs are in this state for less than 50ns, the parts
are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See
“Low-Power Shutdown Mode” section.
10. Keep RE
11. Set the RE
= VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
signal high time >600ns to ensure that the device enters SHDN.
12. Does not apply to the ISL3171E, ISL3174E and ISL3177E.
13. Δt
is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC,
SKEW
temperature, etc.). Only applies to the ISL3176E - 78E.
14. ISL3170E - ISL3 175E only.
CC
≥ 3.15V
15. V
16. Guaranteed by design and characterization, but not production tested.
17. If the Tx or Rx enable function isn’t needed, connect the enable pin to the appropriate supply (see “Pin Descriptions” table) through a 1kΩ to 3kΩ
resistor.
Test Circuits and Waveforms
DE
V
CC
DI
Z
D
Y
V
OD
FIGURE 1A. VOD AND V
8
RL/2
V
/2
R
OC
OC
L
FIGURE 1. DC DRIVER TEST CIRCUITS
DE
V
CC
DI
Z
D
Y
V
OD
RL = 60Ω
FIGURE 1B. VOD WITH COMMON MODE LOAD
375Ω
VCM
-7V to +12V
375Ω
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V1.5V
0V
DE
V
CC
SIGNAL
GENERATOR
DI
Z
D
Y
R
DIFF
C
D
FIGURE 2A. TEST CIRCUIT
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
SIGNAL
GENERATOR
DI
Z
D
Y
500Ω
SW
50pF
PARAMETER OUTPUT RE DI SW
t
HZ
t
LZ
t
ZH
t
ZL
t
ZH(SHDN)
t
ZL(SHDN)
Y/Z X 1/0 GND
Y/Z X 0/1 V
Y/Z 0 (Note 7) 1/0 GND
Y/Z 0 (Note 7) 0/1 V
Y/Z 1 (Note 10) 1/0 GND
Y/Z 1 (Note 10) 0/1 V
FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E)
V
CC
GND
CC
CC
CC
OUT (Z)
OUT (Y)
DIFF OUT (Y - Z)
FIGURE 2B. MEASUREMENT POINTS
DE
NOTE 9
tZH, t
ZH(SHDN)
NOTE 9
OUT (Y, Z)
, t
t
ZL
ZL(SHDN)
NOTE 9
OUT (Y, Z)
PLH
- t
t
PHL
t
t
PHL
HZ
|
1.5V1.5V
VOH - 0.25V
LZ
VOL + 0.25V
t
PLH
90% 90%
10% 10%
t
R
SKEW = |t
OUTPUT HIGH
50%
50%
OUTPUT LOW
V
OH
V
OL
+V
OD
-V
OD
t
F
3V
0V
V
OH
0V
V
CC
V
OL
V
CC
SIGNAL
GENERATOR
DE
DI
Z
D
Y
54Ω
FIGURE 4A. TEST CIRCUIT
9
+
C
D
V
OD
-
FIGURE 4. DRIVER DATA RATE
DI
DIFF OUT (Y - Z)
FIGURE 4B. MEASUREMENT POINTS
3V
0V
+V
OD
-V
OD
0V
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Test Circuits and Waveforms (Continued)
RE
B
GND
SIGNAL
GENERATOR
A
RO
R
FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS
RE
B
A
RO
R
SIGNAL
GENERATOR
GND
PARAMETER DE A SW
t
HZ
t
LZ
X +1.5V GND
X -1.5V V
tZH (Note 8) 0 +1.5V GND
(Note 8) 0 -1.5V V
t
ZL
t
ZH(SHDN)
t
ZL(SHDN)
(Note 11) 0 +1.5V GND
(Note 11) 0 -1.5V V
FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES (EXCEPT ISL3171E, ISL3174E, ISL3177E)
15pF
A
RO
FIGURE 5. RECEIVER PROPAGATION DELAY
RE
tZH, t
RO
t
ZL
RO
NOTE 9
ZH(SHDN)
NOTE 9
, t
ZL(SHDN)
NOTE 9
1kΩ
15pF
SW
CC
CC
CC
V
CC
GND
t
PLH
1.5V 1.5V
OUTPUT HIGH
1.5V
1.5V
OUTPUT LOW
t
PHL
0V0V
1.5V1.5V
t
HZ
t
LZ
+1.5V
-1.5V
3V
0V
VOH - 0.25V
VOL + 0.25V
V
CC
0V
V
OH
0V
V
CC
V
OL
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
10
Receiver Features
These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is better than ±200mV , as require d by the RS-422 and RS-485
specifications.
Receiver input resistance of 96kΩ surpasses the RS-422
spec of 4kΩ, and is eight times the RS-485 “Unit Load (UL)”
requirement of 12kΩ minimum. Thus, these products are
known as “one-eighth UL” transceivers, and there can be up
to 256 of these devices on a network while still complying
with the RS-485 loading spec.
Receiver inputs function with common mode volta ges as great
as +9V/-7V outside the power supplies (i.e., +12V and -7V),
making them ideal for long networks where induced voltages,
and ground potential differences, are realistic concerns.
All the receivers include a “full fail-safe” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating) or shorted. Fail-safe with shorted
inputs is achieved by setting the Rx upper switching point to
-50mV , thereby ensuring that the Rx sees 0V differential as a
high input level.
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs - except on the
ISL3171E, ISL3174E and ISL3177E- are tri-statable via the
active low RE
input.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485), and at
least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI.
All drivers are tri-statable via the active high DE input, except
on the ISL3171E, ISL3174E and ISL3177E.
The 250kbps and 500kbps driver outputs are slew rate
limited to minimize EMI, and to reduce reflections in
unterminated or improperly terminated networks. Outputs of
the ISL3176E - ISL3178E drivers are not limited, so faster
output transition times allow data rates of at least 20Mbps.
Hot Plug Function
When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS-485 control
lines (DE, RE
Rx outputs are kept disabled. If the equipment is connected
to the bus, a driver activating prematurely during power up
may crash the bus. To avoid this scenario, the ISL317XE
family incorporates a “Hot Plug” function. During power up,
circuitry monitoring V
remain disabled for a period of time, regardless of the state of
DE and RE
stabilize and drive the RS-485 control lines to the proper states.
) is unable to ensure that the RS-485 Tx and
ensures that the Tx and Rx outputs
CC
. This gives the processor/ASIC a chance to
ESD Protection
All pins on these devices include class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
incorporate advanced structures allowing them to survive
ESD events in excess of ±15kV HBM and ±15kV
IEC61000. The RS-485 pins are particularly vulnerable to
ESD damage because they typically connect to an exposed
port on the exterior of the finished product. Simply touching
the port pins, or connecting a cable, can cause an ESD
event that might destroy unprotected ICs. These new ESD
structures protect the device whether or not it is powered
up, and without degrading the RS-485 common mode
range of -7V to +12V. This built-in ESD protection
eliminates the need for board level protection structures
(e.g., transient suppression diodes), and the associated,
undesirable capacitive load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-485 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-485 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The ISL317XE RS-485 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. The ISL317XE survive ±8kV contact
discharges on the RS-485 pins.
Data Rate, Cables, and Termination s
RS-485/422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 250kbps
versions can operate at full data rates with lengths of several
thousand feet.
Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
250kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.
In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its ch ara c t eri st ic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These
devices meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.
11
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes. Additionally, these devices utilize a
foldback circuit which reduces the short circuit current, and
thus the power dissipation, whenever the contending voltage
exceeds either supply.
In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to coo l. The
drivers automatically re-enable after the die tempe rature
drops about 15 degrees. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared .
Receivers stay operational during thermal shutdown.
Typical Performance Curves V
120
100
80
60
40
20
DRIVER OUTPUT CURRENT (mA)
0
00.511.522.533.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
FIGURE 7. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
= 3.3V, TA = +25°C; Unless Otherwise Specified
CC
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but some also include
a shutdown feature that reduces the already low quiescent
to a 10nA trickle. These devices enter shutdown
I
CC
whenever the receiver and driver are simultaneously
disabled (RE
600ns. Disabling both the driver and the receiver for less
than 50ns guarantees that the transceiver will not enter
shutdown.
Note that receiver and driver enable times increase when the
transceiver enables from shutdown. Refer to Notes 7-11, at the
end of the Electrical Specification table, for more information.
2.35
2.3
2.25
2.2
2.15
2.1
2.05
1.95
1.9
DIFFERENTIAL OUTPUT VOLTAGE (V)
1.85
FIGURE 8. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
=VCC and DE = GND) for a period of at least
R
= 100Ω
DIFF
2
R
= 54Ω
DIFF
-40 05085
-25 25 75
TEMPERATURE (°C)
TEMPERATURE
200
150
Y OR Z = LOW
100
50
0
-50
OUTPUT CURRENT (mA)
-100
-150
-7 -6 -4 -2 0 2 4 6 8 10 12
ISL317XE
OUTPUT VOLTAGE (V)
Y OR Z = HIGH
ISL3176E/77/78E
ISL3170E thru ISL3175E
FIGURE 9. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
0.52
ISL3172/5/8E, DE = VCC, RE = X
0.51
0.5
0.49
(mA)
CC
I
0.48
0.47
0.46
-40 0 50 85
ISL3170/3/6E, DE = X, RE = 0V; ISL3171/4/7E
ISL3172/5/8E, DE = 0V, RE = 0V
-25 25 75
TEMPERATURE (°C)
FIGURE 10. SUPPLY CURRENT vs TEMPERATURE
12
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Typical Performance Curves V
1220
1200
1180
1160
1140
1120
PROPAGATION DELAY (ns)
1100
1080
-40 0 50 85
-25 25 75
t
PHL
t
PLH
TEMPERATURE (°C)
= 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
CC
FIGURE 11. DRIVER DIFFERENTIAL PROPAGA TION DELA Y
vs TEMPERATURE (ISL3170E, 71E, 72E)
370
365
360
8
7.5
7
SKEW (ns)
6.5
6
|CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑|
5.5
-40 0 50 85
-25 25 75
TEMPERATURE (°C)
FIGURE 12. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3170E, 71E, 72E)
1.4
1.2
1
355
350
PROPAGATION DELAY (ns)
345
340
-40 0 50 85
-25 25 75
TEMPERATURE (°C)
t
PHL
t
PLH
FIGURE 13. DRIVER DIFFERENTIAL PROPAGA TION DELAY
vs TEMPERATURE (ISL3173E, 74E, 75E)
32
31
30
29
28
27
26
25
PROPAGATION DELAY (ns)
24
23
22
-40 0 50 85
t
PHL
t
PLH
-25 25 75
TEMPERATURE (°C)
FIGURE 15. DRIVER DIFFERENTIAL PROPAGA TION DELAY
vs TEMPERATURE (ISL3176E, 77E, 78E)
0.8
SKEW (ns)
0.6
0.4
|CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑|
0.2
-40 0 50 85
-25 25 75
TEMPERATURE (°C)
FIGURE 14. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3173E, 74E, 75E)
0.95
0.9
0.85
0.8
0.75
SKEW (ns)
0.7
0.65
|CROSS PT. OF Y↑ & Z↓ - CROSS PT. OF Y↓ & Z↑|
0.6
-40 0 50 85
-25 25 75
TEMPERATURE (°C)
FIGURE 16. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3176E, 77E, 78E)
13
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Typical Performance Curves V
R
DIFF
DI
5
0
RECEIVER OUTPUT (V)
3
2.5
2
1.5
1
0.5
0
DRIVER OUTPUT (V)
RO
B/Z
A/Y
TIME (400ns/DIV)
CC
= 54Ω, CD = 50pF
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3170E, 71E, 72E)
R
= 54Ω, CD = 50pF
DIFF
DI
5
0
RECEIVER OUTPUT (V)
3
2.5
2
1.5
1
0.5
0
DRIVER OUTPUT (V)
RO
B/Z
A/Y
TIME (200ns/DIV)
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3173E, 74E, 75E)
= 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
5
0
DRIVER INPUT (V)
5
0
RECEIVER OUTPUT (V)
3
2.5
2
1.5
1
0.5
0
DRIVER OUTPUT (V)
DI
A/Y
B/Z
TIME (400ns/DIV)
FIGURE 18. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL3170E, 71E, 72E)
5
0
5
DRIVER INPUT (V)
0
RECEIVER OUTPUT (V)
3
2.5
2
1.5
1
0.5
0
DRIVER OUTPUT (V)
DI
A/Y
B/Z
TIME (200ns/DIV)
FIGURE 20. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL3173E, 74E, 75E)
RO
RO
R
R
DIFF
DIFF
= 54Ω, CD = 50pF
5
0
DRIVER INPUT (V)
= 54Ω, CD = 50pF
5
0
DRIVER INPUT (V)
R
= 54Ω, CD = 50pF
DIFF
DI
5
0
RECEIVER OUTPUT (V)
3
2.5
B/Z
2
1.5
A/Y
1
0.5
0
DRIVER OUTPUT (V)
RO
TIME (10ns/DIV)
FIGURE 21. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL3176E, 77E, 78E)
14
R
= 54Ω, CD = 50pF
5
0
DRIVER INPUT (V)
5
0
RECEIVER OUTPUT (V)
3
2.5
2
1.5
1
0.5
0
DRIVER OUTPUT (V)
DI
A/Y
B/Z
TIME (10ns/DIV)
DIFF
RO
5
0
DRIVER INPUT (V)
FIGURE 22. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL3176E, 77E, 78E)
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Typical Performance Curves V
35
30
25
VOH, +25°C
20
15
10
5
RECEIVER OUTPUT CURRENT (mA)
0
01233.5
VOH, +85°C
1.5 2.50.5
RECEIVER OUTPUT VOLTAGE (V)
VOL, +25°C
= 3.3V, TA = +25°C; Unless Otherwise Specified (Continued)
CC
VOL, +85°C
FIGURE 23. RECEIVER OUTPUT CURRENT vs RECEIVER
OUTPUT VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
535
PROCESS:
Si Gate BiCMOS
15
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Mini Small Outline Plastic Packages (MSOP)
N
EE1
INDEX
AREA
AA1A2
TOP VIEW
-H-
SIDE VIEW
12
b
e
D
-B-
0.20 (0.008) A
GAUGE
PLANE
SEATING
PLANE
0.10 (0.004) C
-A-
0.20 (0.008) C
0.20 (0.008) C
-C-
0.25
(0.010)
B
4X θ
SEATING
PLANE
a
C
D
4X θ
L1
C
L
E
1
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
- H -
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
- B -
- H -
-A -
.
10. Datums and to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
R1
R
L
C
-B-
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.037 0.043 0.94 1.10 A1 0.002 0.006 0.05 0.15 A2 0.030 0.037 0.75 0.95 -
b 0.010 0.014 0.25 0.36 9
c 0.004 0.008 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4
e 0.026 BSC 0.65 BSC -
E 0.187 0.199 4.75 5.05 -
L 0.016 0.028 0.40 0.70 6
L1 0.037 REF 0.95 REF -
N8 87
R 0.003 - 0.07 - R1 0.003 - 0.07 - -
0 5
α
o
o
0
15
o
o
6
o
5
o
0
15
o
o
6
Rev. 2 01/03
NOTESMIN MAX MIN MAX
-
-
16
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
-A-
E
-B-
SEATING PLANE
D
A
-C-
0.25(0.010) BM M
H
L
h x 45°
α
e
B
0.25(0.010) C AM BS
M
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
A1
C
0.10(0.004)
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.1890 0.1968 4.80 5.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N8 87
α
0° 8° 0° 8° -
NOTESMIN MAX MIN MAX
Rev. 1 6/05
17
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
EE1
INDEX
AREA
AA1A2
TOP VIEW
-H-
SIDE VIEW
12
b
e
D
-B-
0.20 (0.008) A
GAUGE
PLANE
SEATING
PLANE
0.10 (0.004) C
-A-
0.20 (0.008) C
0.20 (0.008) C
-C-
0.25
(0.010)
B
4X θ
SEATING
PLANE
a
C
D
4X θ
L1
C
L
E
1
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
- H -
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
- B -
- H -
-A -
.
10. Datums and to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
R1
R
L
C
-B-
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
NOTESMIN MAX MIN MAX
A 0.037 0.043 0.94 1.10 -
A1 0.002 0.006 0.05 0.15 -
A2 0.030 0.037 0.75 0.95 -
b 0.007 0.011 0.18 0.27 9
c 0.004 0.008 0.09 0.20 -
D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4
e 0.020 BSC 0.50 BSC -
E 0.187 0.199 4.75 5.05 -
L 0.016 0.028 0.40 0.70 6
L1 0.037 REF 0.95 REF -
N10 107
R 0.003 - 0.07 - -
R1 0.003 - 0.07 - -
o
θ
α
5
o
0
15
o
o
6
o
5
o
0
15
o
o
6
-
-
Rev. 0 12/02
18
FN6307.2
August 28, 2006
ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
-A-
E
-B-
SEATING PLANE
D
A
-C-
0.25(0.010) BM M
H
L
h x 45
o
α
e
B
0.25(0.010) C AM BS
M
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “ E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
A1
C
0.10(0.004)
M14.15 (JEDEC MS-012-AB ISSUE C)
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.3367 0.3444 8.55 8.75 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N14 147
o
α
0
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiari es.
For information regarding Intersil Corporation and its products, see www.intersil.com
19
FN6307.2
August 28, 2006
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