intersil ISL3155E, ISL3156E, ISL3158E DATA SHEET

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®

ISL3150E, ISL3152E, ISL3153E,

ISL3155E, ISL3156E, ISL3158E

Data Sheet

±16.5kV ESD (IEC61000-4-2) Protected,
Large Output Swing, 5V, Full Fail-Safe, 1/8
Unit Load, RS-485/RS-422 Transceivers

The ISL315XE are BiCMOS, IEC61000 ESD protected, 5V
powered, single transceivers that meet both the RS-485 and
RS-422 standards for balanced communication. Each driver
output and receiver input is protected against
strikes without latch-up.

The ISL315XE transmitters all deliver exceptional differential
output voltages (2.4V min), into the RS-485 required 54Ω
load, for better noise immunity or to allow up to eight 120Ω
terminations in “star” or other non-standard bus topologies.

These devices have very low bus currents (+125μA/-75μA),
so they present a true “1/8 unit load” to the RS-485 bus. This
allows up to 256 transceivers on the network without violating
the RS-485 specification’s 32 unit load maximum, and without
using repeaters.

Receiver (Rx) inputs feature a “Full Fail-Safe” design, which
ensures a logic high Rx output if Rx inputs are floating,
shorted, or on a terminated but undriven bus. Rx output s
feature high drive levels - typically 28mA @ V
the design of optocoupled isolated interfaces).

The ISL3150E, ISL3152E, ISL3153E, ISL3155E utilize slew
rate limited drivers which reduce EMI, and minimize reflections
from improperly terminated transmission lines, or unterminated
stubs in multidrop and multipoint applications.

±16.5kV ESD

= 1V (to ease

OL

December 14, 2006

FN6363.0

Features

• High Driver VOD. . . . . . . . . . . . . .2.4V (Min) @ RD = 54Ω

Better Noise Immunity, or Drive Up to 8 Terminations

• IEC61000 ESD Protection on RS-485 I/O Pins

- Class 3 ESD Level on all Other Pins . . . . . . >7kV HBM

• Tiny MSOP Packages Save 50% Board Space

• Full Fail-safe (Open, Short, Terminated and Undriven)
Receivers

• High Rx I

to Drive Opto-Couplers for Isolated

OL

Applications

• Hot Plug Circuitry - Tx and Rx Outputs Remain
Three-State During Power-up/Power-Down

• True 1/8 Unit Load Allows up to 256 Devices on the Bus

• Specified for Single 5V, 10% Tolerance, Supplies

• High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 20Mbps

• Low Quiescent Supply Current . . . . . . . . . . . . . . . 600

Ultra Low Shutdown Supply Current . . . . . . . . . . . . 70nA

• -7V to +12V Common Mode Input Voltage Range

• Half and Full Duplex Pinouts

• Pb-Free Packaging (RoHS Compliant)

• Three-State Rx and Tx Outputs

• Current Limiting and Thermal Shutdown for Driver
Overload Protection

. . . ±16.5kV

μA

Hot Plug circuitry ensures that the Tx and Rx outputs remain
in a high impedance state until the power supply has
stabilized, and the Tx outputs are fully sho rt circuit protected.

The ISL3150E, ISL3153E, ISL3156E are configured for full
duplex applications. The half duplex versions multiplex the
Rx inputs and Tx outputs to allow transceivers with output
disable functions in 8 Ld packages.

Applications

• Utility Meters and Automated Meter Reading Systems

• High Node Count Systems

• PROFIBUS® and Field Bus Networks, and Factory
Automation

• Security Camera Networks

• Building Lighting and Environmental Control Systems

• Industrial/Process Control Networks

TABLE 1. SUMMARY OF FEATURES

PART

NUMBER

ISL3150E Full 0.115 Yes Yes 256 Yes 600 Yes 10, 14
ISL3152E Half 0.115 Yes Yes 256 Yes 600 Yes 8
ISL3153E Full 1 Yes Yes 256 Yes 600 Yes 10, 14
ISL3155E Half 1 Yes Yes 256 Yes 600 Yes 8
ISL3156E Full 20 No Yes 256 Yes 600 Yes 10, 14
ISL3158E Half 20 No Yes 256 Yes 600 Yes 8

HALF/FULL

DUPLEX

DAT A RA TE

(Mbps)

1

SLEW-RATE

LIMITED? HOT PLUG

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

# DEVICES

ON BUS

Rx/Tx

ENABLE?

| Intersil (and design) is a registered trademark of Intersil Americas Inc.

Copyright © Intersil Americas Inc. 2004-2006. All Rights Reserved

All other trademarks mentioned are the property of their respective owners.

QUIESCENT

I

(μA)

CC

LOW POWER
SHUTDOWN?

PIN

COUNT

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Pinouts

ISL3152E, ISL3155E, ISL3158E

(8 LD MSOP, 8 LD SOIC)

TOP VIEW

RO

RE
DE

1

R

2
3

D

4

DI

8

V

CC

7

B/Z

6

A/Y

5

GND

ISL3150E, ISL3153E, ISL3156E

(10 LD MSOP)

TOP VIEW

RO

RE
DE

GND

1

R

2
3

DI

D

4
5

V

10

CC

9

A

8

B

7

Z

6

Y

ISL3150E, ISL3153E, ISL3156E

(14 LD SOIC)

TOP VIEW

NC
RO
RE
DE

GND
GND

1
2

R

3
4

DI

D

5
6
7

14

V

CC

NC

13

A

12

B

11

Z

10

9

Y
NC

8

Ordering Information

PART NUMBER (Notes 1, 2) PART MARKING TEMP. RANGE (°C) PACKAGE PKG. DWG. #
ISL3150EIBZ 3150EIBZ -40 to +85 14 Ld SOIC (Pb-free) M14.15
ISL3150EIUZ 3150Z -40 to +85 10 Ld MSOP (Pb-free) M10.118
ISL3152EIBZ 3152EIBZ -40 to +85 8 Ld SOIC (Pb-free) M8.15
ISL3152EIUZ 3152Z -40 to +85 8 Ld MSOP (Pb-free) M8.118
ISL3153EIBZ 3153EIBZ -40 to +85 14 Ld SOIC (Pb-free) M14.15
ISL3153EIUZ 3153Z -40 to +85 10 Ld MSOP (Pb-free) M10.118
ISL3155EIBZ 3155EIBZ -40 to +85 8 Ld SOIC (Pb-free) M8.15
ISL3155EIUZ 3155Z -40 to +85 8 Ld MSOP (Pb-free) M8.118
ISL3156EIBZ 3156EIBZ -40 to +85 14 Ld SOIC (Pb-free) M14.15
ISL3156EIUZ 3156Z -40 to +85 10 Ld MSOP (Pb-free) M10.118
ISL3158EIBZ 3158EIBZ -40 to +85 8 Ld SOIC (Pb-free) M8.15
ISL3158EIUZ 3158Z -40 to +85 8 Ld MSOP (Pb-free) M8.118

NOTES:

1. Units also available in Tape and Reel; Add “-T” to suffix.

2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

2

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ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Truth Ta bles

TRANSMITTING

INPUTS OUTPUTS

RE

X1101
X1010
0 0 X High-Z High-Z
1 0 X High-Z * High-Z *

NOTE: *Shutdown Mode (See Note 9).

DE DI Z Y

RE

00 X≥ -0.05V 1
00 X≤ -0.2V 0
0 0 X Inputs

1 0 0 X High-Z *
1 1 1 X High-Z

NOTE: *Shutdown Mode (See Note 9).

DE

Half DuplexDEFull Duplex

RECEIVING

INPUTS OUTPUT

A-B RO

Open/Shorted

Pin Descriptions

PIN FUNCTION

RO Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected (floating ) or sho rted.

RE
DE Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.

DI Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.

Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.

1

GND Ground connection.

A/Y ±16.5kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input if

B/Z ±16.5kV IEC61000 ESD Protected RS-485/422 level, Inverting receiver input and inverting driver output. Pin is an input if DE = 0; pin

V

NC No Connection.

DE =0; pin is an output if DE = 1.

is an output if DE = 1.
A ±16.5kV IEC61000 ESD Protected RS-485/422 level, noninverting receiver input.
B ±16.5kV IEC61000 ESD Protected RS-485/422 level, inverting receiver input.
Y ±16.5kV IEC61000 ESD Protected RS-485/422 level, noninverting driver output.
Z ±16.5kV IEC61000 ESD Protected RS-485/422 level, inverting driver output.

System power supply input (4.5V to 5.5V).

CC

3

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Typical Operating Circuit

+5V

8

V

RO

1
2

RE

3

DE

DI

4

2

RO

3

RE

4

DE

5

DI

CC

R

B/Z
A/Y

D

GND

5

+5V

14

V

CC

A

R

B

Z

D

Y

GND

6, 7

ISL3152E, ISL3155E, ISL3158E

+

0.1μF

R

T

7
6

0.1μF

R

T

+

7
6

ISL3150E, ISL3153E, ISL3156E (SOIC PIN NUMBERS SHOWN)

+

0.1μF

R

12
11

10
9

T

0.1μF

R

T

+

+5V

8

V

CC

B/Z
A/Y

R

GND

5

+5V

14

V

CC

Y

9

Z

10

B

11

R

A

12

GND

6, 7

4

DI

D

3

DE

2

RE

1

RO

DI

5

D

4

DE

3

RE

RO

2

4

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Absolute Maximum Ratings Thermal Information

VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V

Input Voltages

DI, DE, RE

. . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)

Input/Output Voltages

A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . -9V to +13V

A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω). . . . . . ±25V

RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (V

Short Circuit Duration

CC

+0.3V)

Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous

ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

3. θ

JA

Thermal Resistance (Typical, Note 3)

θ

(°C/W)

JA

8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 105

8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . . 140

10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . 130

14 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 130

Maximum Junction Temperature (Plastic Package) . . . . . . +150°C

Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C

(Lead Tips Only)

Operating Conditions

Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

Electrical Specifications Test Conditions: V

(Note 4)

PARAMETER SYMBOL TEST CONDITIONS

DC CHARACTERISTICS

Driver Differential V
Driver Differential V

Change in Magnitude of Driver
Differential V
Complementary Output States

OUT

Driver Common-Mode V
Change in Magnitude of Driver

Common-Mode V
Complementary Output States

Logic Input High Voltage V
Logic Input Low Voltage V
DI Input Hysteresis Voltage V
Logic Input Current I
Input Current (A, B, A/Y, B/Z) I

Output Leakage Current (Y , Z) (Full
Duplex Versions Only)

Output Leakage Current (Y, Z)
in Shutdown Mode (Full Duplex)

Driver Short-Circuit Current,
V

= High or Low

O

Receiver Differential Threshold
Voltage

(No load) V

OUT

(Loaded) V

OUT

for

OUT

for

OUT

OD1
OD2

ΔV

V

OC

ΔV

HYS
IN1
IN2

I

IN3

I

IN4

I

OSD1

V

TH

RL = 100Ω (RS-422) (Figure 1A) Full 2.8 3.6 - V
R
RL = 15Ω (Eight 120Ω terminations) (Note 13) 25 - 1.65 - V
R
RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V

OD

RL = 54Ω or 100Ω (Figure 1A) Full - - 3.15 V
RL = 54Ω or 100Ω (Figure 1A) Full - 0.01 0.2 V

OC

DE, DI, RE Full 2 - - V

IH

DE, DI, RE Full - - 0.8 V

IL

DE, DI, RE Full -2 - 2 μA
DE = 0V, VCC = 0V or 5.5V VIN = 12V Full - 70 125 μA

RE = 0V , DE = 0V, VCC = 0V
or 5.5V

RE = VCC, DE = 0V, VCC =
0V or 5.5V

DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 6) Full - - ±250 mA

-7V ≤ VCM ≤ 12V Full -200 -90 -50 mV

= 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C

CC

TEMP

(°C) MIN TYP MAX UNITS

Full - - V

= 54Ω (RS-485) (Figure 1A) Full 2.4 3.1 V

L

= 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) Full 2.4 3 - V

L

CC

CC

25 - 100 - mV

V

= -7V Full -75 55 - μA

IN

VIN = 12V Full - 1 40 μA
V

= -7V Full -40 -9 - μA

IN

VIN = 12V Full - 1 20 μA

= -7V Full -20 -9 - μA

V

IN

V

V

5

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Electrical Specifications Test Conditions: V

(Note 4) (Continued)

= 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C

CC

TEMP

PARAMETER SYMBOL TEST CONDITIONS

Receiver Input Hysteresis ΔV
Receiver Output High Voltage V
Receiver Output Low Voltage V
Receiver Output Low Current I
Three-State (high impedance)

OH
OL

OL

I

OZR

VCM = 0V 25 - 20 - mV

TH

IO = -8mA, VID = -50mV Full VCC - 1.2 4.3 - V
IO = -8mA, VID = -200mV Full - 0.25 0.4 V
VO = 1V, VID = -200mV Full 20 28 - mA

0.4V ≤ VO ≤ 2.4V Full -1 0.03 1 μA

(°C) MIN TYP MAX UNITS

Receiver Output Current
Receiver Input Resistance R
Receiver Short-Circuit Current I

OSR

-7V ≤ VCM ≤ 12V Full 96 160 - kΩ

IN

0V ≤ VO ≤ V

CC

Full ±765±85 mA

SUPPLY CURRENT

No-Load Supply Current (Note 5) I

Shutdown Supply Current I

CC

SHDN

Half Duplex Versions, DE = VCC, RE = X,
DI = 0V or V

All Versions, DE = 0V, RE
Versions, DE = V

DE = 0V, RE = VCC, DI = 0V or V

CC

, RE = X. DI = 0V or V

CC

= 0V, or Full Duplex

CC

Full - 650 800 μA

Full - 550 700 μA

CC

Full - 0.07 3 μA

ESD PERFORMANCE

RS-485 Pins (A, Y, B, Z, A/Y, B/Z) IEC61000-4-2, Air-Gap

Discharge Method

1/2 Duplex 25 - ±16.5 - kV

Full Duplex 25 - ±10 - kV
IEC61000-4-2, Contact Discharge Method 25 - ±9-kV
Human Body Model, From Bus Pins to GND 25 - ±16.5 - kV

All Pins HBM, per MIL-STD-883 Method 3015 25 - ±7-kV

MM 25 - 400 - V

DRIVER SWITCHING CHARACTERISTICS (115kbps Versions; ISL3150E, ISL3152E)

Driver Differential Output Delay t

PLH, tPHLRDIFF

Driver Differential Output Skew t
Driver Differential Rise or Fall Time t
Maximum Data Rate f
Driver Enable to Output High t

SKEW

, t

R
MAX

ZH

F

= 54Ω, CL = 100pF (Figure 2) Full 500 970 1300 ns

R

= 54Ω, CL = 100pF (Figure 2) Full - 12 50 ns

DIFF

R

= 54Ω, CL = 100pF (Figure 2) Full 700 1100 1600 ns

DIFF

CD = 820pF (Figure 4, Note 12) Full 115 2000 - kbps
RL = 500Ω, CL = 100pF, SW = GND (Figure 3),

Full - 300 600 ns

(Note 7)

Driver Enable to Output Low t

Driver Disable from Output Low t
Driver Disable from Output High t
Time to Shutdown t
Driver Enable from Shutdown to

Output High
Driver Enable from Shutdown to

t

ZH(SHDN)RL

t

ZL(SHDN)RL

Output Low

ZL

LZ
HZ

SHDN

RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),

Full - 130 500 ns

(Note 7)
RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) Full - 50 65 ns
RL = 500Ω, CL = 15pF, SW = GND (Figure 3) Full - 35 60 ns
(Notes 9, 12) Full 60 160 600 ns

= 500Ω, CL = 100pF, SW = GND (Figure 3),

Full - - 250 ns

(Notes 9, 10)

= 500Ω, CL = 100pF, SW = VCC (Figure 3),

Full - - 250 ns

(Notes 9, 10)

DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL3153E, ISL3155E)

Driver Differential Output Delay t
Driver Differential Output Skew t

PLH, tPHLRDIFF

SKEW

= 54Ω, CL = 100pF (Figure 2) Full 150 270 400 ns

R

= 54Ω, CL = 100pF (Figure 2) Full - 3 10 ns

DIFF

6

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Electrical Specifications Test Conditions: V

(Note 4) (Continued)

= 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C

CC

TEMP

PARAMETER SYMBOL TEST CONDITIONS

Driver Differential Rise or Fall Time tR, t
Maximum Data Rate f
Driver Enable to Output High t

Driver Enable to Output Low t

MAX

ZH

ZL

R

F

= 54Ω, CL = 100pF (Figure 2) Full 150 325 450 ns

DIFF

CD = 820pF (Figure 4, Note 12) Full 1 8 - Mbps
RL = 500Ω, CL = 100pF, SW = GND (Figure 3),

(Note 7)
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),

(°C) MIN TYP MAX UNITS

Full - 110 200 ns

Full - 60 200 ns

(Note 7)

Driver Disable from Output Low t
Driver Disable from Output High t
Time to Shutdown t
Driver Enable from Shutdown to

Output High
Driver Enable from Shutdown to

Output Low

t

ZH(SHDN)RL

t

ZL(SHDN)RL

LZ
HZ

SHDN

RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) Full - 50 65 ns
RL = 500Ω, CL = 15pF, SW = GND (Figure 3) Full - 35 60 ns
(Notes 9, 12) Full 60 160 600 ns

= 500Ω, CL = 100pF, SW = GND (Figure 3),

Full - - 250 ns

(Notes 9, 10)

= 500Ω, CL = 100pF, SW = VCC (Figure 3),

Full - - 250 ns

(Notes 9, 10)

DRIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E)

Driver Differential Output Delay t
Driver Differential Output Skew t

PLH, tPHLRDIFF

SKEW

Driver Differential Rise or Fall Time tR, t
Maximum Data Rate f
Driver Enable to Output High t

Driver Enable to Output Low t

MAX

ZH

ZL

F

= 54Ω, CL = 100pF (Figure 2) Full - 21 30 ns

R

= 54Ω, CL = 100pF (Figure 2) Full - 0.2 3 ns

DIFF

R

= 54Ω, CL = 100pF (Figure 2) Full - 12 16 ns

DIFF

CD = 470pF (Figure 4, Note 12) Full 20 55 - Mbps
RL = 500Ω, CL = 100pF, SW = GND (Figure 3),

Full - 30 45 ns

(Note 7)
RL = 500Ω, CL = 100pF, SW = VCC (Figure 3),

Full - 28 45 ns

(Note 7)

Driver Disable from Output Low t
Driver Disable from Output High t
Time to Shutdown t
Driver Enable from Shutdown to

Output High
Driver Enable from Shutdown to

Output Low

t

ZH(SHDN)RL

t

ZL(SHDN)RL

LZ
HZ

SHDN

RL = 500Ω, CL = 15pF, SW = VCC (Figure 3) Full - 50 65 ns
RL = 500Ω, CL = 15pF, SW = GND (Figure 3) Full - 38 60 ns
(Notes 9, 12) Full 60 160 600 ns

= 500Ω, CL = 100pF, SW = GND (Figure 3),

Full - - 200 ns

(Notes 9, 10)

= 500Ω, CL = 100pF, SW = VCC (Figure 3),

Full - - 200 ns

(Notes 9, 10)

RECEIVER SWITCHING CHARACTERISTICS (115kbps and 1Mbps Versions; ISL3150E through ISL3155E)

Maximum Data Rate f
Receiver Input to Output Delay t
Receiver Skew | t

PLH

- t

|t

PHL

PLH

Receiver Enable to Output Low t

Receiver Enable to Output High t

MAX

SKD

ZL

ZH

(Figure 5, Note 12) Full 1 12 - Mbps

, t

(Figure 5) Full - 100 150 ns

PHL

(Figure 5) Full - 4 10 ns
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),

Full - 9 20 ns

(Note 8)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),

Full - 7 20 ns

(Note 8)

Receiver Disable from Output Low t
Receiver Disable from Output High t
Time to Shutdown t
Receiver Enable from Shutdown to

Output High

t

ZH(SHDN)RL

LZ
HZ

SHDN

RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) Full - 8 15 ns
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) Full - 8 15 ns
(Notes 9, 12) Full 60 160 600 ns

= 1kΩ, CL = 15pF, SW = GND (Figure 6),

Full - - 200 ns

(Notes 9, 11)

7

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Electrical Specifications Test Conditions: V

(Note 4) (Continued)

= 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C

CC

TEMP

PARAMETER SYMBOL TEST CONDITIONS

Receiver Enable from Shutdown to
Output Low

t

ZL(SHDN)RL

= 1kΩ, CL = 15pF, SW = VCC (Figure 6),

(Notes 9, 11)

(°C) MIN TYP MAX UNITS

Full - - 200 ns

RECEIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E)

Maximum Data Rate f
Receiver Input to Output Delay t
Receiver Skew | t

PLH

- t

|t

PHL

PLH

Receiver Enable to Output Low t

Receiver Enable to Output High t

Receiver Disable from Output Low t
Receiver Disable from Output High t
Time to Shutdown t
Receiver Enable from Shutdown to

t

ZH(SHDN)RL

Output High
Receiver Enable from Shutdown to

Output Low

t

ZL(SHDN)RL

MAX

SKD

ZL

ZH

LZ
HZ

SHDN

(Figure 5, Note 12) Full 20 30 - Mbps

, t

(Figure 5) Full - 33 45 ns

PHL

(Figure 5) Full - 2.5 5 ns
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6),

Full - 8 15 ns

(Note 8)
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6),

Full - 7 15 ns

(Note 8)
RL = 1kΩ, CL = 15pF, SW = VCC (Figure 6) Full - 8 15 ns
RL = 1kΩ, CL = 15pF, SW = GND (Figure 6) Full - 8 15 ns
(Notes 9, 12) Full 60 160 600 ns

= 1kΩ, CL = 15pF, SW = GND (Figure 6),

Full - - 200 ns

(Notes 9, 11)

= 1kΩ, CL = 15pF, SW = VCC (Figure 6),

Full - - 200 ns

(Notes 9, 11)

NOTES:

4. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.

5. Supply current specification is valid for loaded drivers when DE = 0V.

6. Applies to peak current. See “Typical Performance Curves” for more information.

7. Keep RE

8. The RE

Transceivers are put into shutdown by bringing RE high and DE low. If the input s are in this state for less than 60ns, the part s are guaranteed

9.

= 0 to prevent the device from entering SHDN.

signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.

not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See “Low-Power
Shutdown Mode” section.

10. Keep RE

11. Set the RE

= VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.

signal high time >600ns to ensure that the device enters SHDN.

12. Guaranteed by characterization but not tested.

13. See Figure 8 for more information, and for performance over temperature.

Test Circuits and Waveforms

DE

V

CC

DI

Z

D

Y

V

OD

FIGURE 1A. VOD AND V

8

RL/2

V

R

/2

OC

L

OC

FIGURE 1. DC DRIVER TEST CIRCUITS

DE

V

CC

DI

Z

D

Y

V

OD

RL = 60Ω

FIGURE 1B. VOD WITH COMMON MODE LOAD

375Ω

VCM

-7V to +12V

375Ω

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Test Circuits and Waveforms (Continued)

3V

DI

1.5V1.5V
0V

CL = 100pF

C

= 100pF

L

V

CC

SIGNAL
GENERATOR

DE

DI

Z

D

Y

R

DIFF

FIGURE 2A. TEST CIRCUIT

FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES

DE

SIGNAL
GENERATOR

DI

Z

D

Y

500Ω

C

L

SW

V

CC

GND

PARAMETER OUTPUT RE DI SW CL (pF)

t

HZ

t

LZ

t

ZH

t

ZL

t

ZH(SHDN)

t

ZL(SHDN)

Y/Z X 1/0 GND 15
Y/Z X 0/1 V

CC

15
Y/Z 0 (Note 7) 1/0 GND 100
Y/Z 0 (Note 7) 0/1 V

CC

100
Y/Z 1 (Note 10) 1/0 GND 100
Y/Z 1 (Note 10) 0/1 V

CC

100

OUT (Z)

OUT (Y)

DIFF OUT (Y - Z)

FIGURE 2B. MEASUREMENT POINTS

DE

NOTE 9

tZH, t

ZH(SHDN)

NOTE 9

OUT (Y, Z)

, t

t

ZL

ZL(SHDN)

NOTE 9

OUT (Y, Z)

PLH

- t

t

PHL

PHL

1.5V1.5V

t

HZ

t

LZ

|

VOH - 0.5V

VOL + 0.5V

t

PLH

90% 90%

10% 10%

t

R

SKEW = |t

OUTPUT HIGH

2.3V

2.3V

OUTPUT LOW

V

OH

V

OL

+V

OD

-V

OD

t

F

3V

0V

V

OH

0V

V

CC

V

OL

FIGURE 3A. TEST CIRCUIT FIGURE 3B. MEASUREMENT POINTS

FIGURE 3. DRIVER ENABLE AND DISABLE TIMES

9

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Test Circuits and Waveforms (Continued)

V

CC

SIGNAL
GENERATOR

SIGNAL
GENERATOR

DE

DI

Z

D

Y

60Ω

FIGURE 4A. TEST CIRCUIT

RE

B

0V

A

RO

R

+

V

C

D

OD

-

FIGURE 4. DRIVER DATA RATE

15pF

DI

DIFF OUT (Y - Z)

FIGURE 4B. MEASUREMENT POINTS

A

RO

-V

OD

t

PLH

1.5V 1.5V

t

PHL

3V

0V

+V

OD

0V

+1.5V

0V0V

-1.5V

V

CC

0V

FIGURE 5A. TEST CIRCUIT FIGURE 5B. MEASUREMENT POINTS

FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE

RE

B
A

RO

R

SIGNAL
GENERATOR

GND

PARAMETER DE A SW

t

HZ

t

LZ

0 +1.5V GND

0 -1.5V V
tZH (Note 8) 0 +1.5V GND
t

(Note 8) 0 -1.5V V

ZL

t

ZH(SHDN)

t

ZL(SHDN)

(Note 11) 0 +1.5V GND
(Note 11) 0 -1.5V V

1kΩ

15pF

SW

CC

CC

CC

V

CC

GND

RE

tZH, t

RO

t

ZL

RO

NOTE 9

ZH(SHDN)

NOTE 9

, t

ZL(SHDN)

NOTE 9

OUTPUT HIGH

1.5V

1.5V

OUTPUT LOW

1.5V1.5V

t

HZ

t

LZ

3V

0V

VOH - 0.5V

VOL + 0.5V

V

OH

0V

V

CC

V

OL

FIGURE 6A. TEST CIRCUIT FIGURE 6B. MEASUREMENT POINTS

FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES

10

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Application Information

RS-485 and RS-422 are differential (balanced) data
transmission standards used for long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a point­to-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.

Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range from
+12V to -7V. RS-422 and RS-485 are intended for runs as
long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.

Receiver (Rx) Features

These devices utilize a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivi ty
is better than ±200mV , as required by the RS-422 and RS-485
specifications.

Rx outputs feature high drive levels - typically 28mA @
V

= 1V (to ease the design of optically coupled isol ated

OL

interfaces).
Receiver input resistance of 96kΩ surpasses the RS-422

spec of 4kΩ, and is eight times the RS-485 “Unit Load (UL)”
requirement of 12kΩ minimum. Thus, these products are
known as “one-eighth UL” transceivers, and there can be up
to 256 of these devices on a network while still complying
with the RS-485 loading spec.

Rx inputs function with common mode voltages as great as
±7V outside the power supplies (i.e., +12V and -7V), making
them ideal for long networks where induced voltages are a
realistic concern.

All the receivers include a “full fail-safe” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating), shorted together, or connected to
a terminated bus with all the transmitters disabled.

Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs are three­statable via the active low RE

Driver (Tx) Features

The RS-485/422 driver is a differential output device that
delivers at least 2.4V across a 54Ω load (RS-485), and at
least 2.8V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width, and to
minimize EMI, and all drivers are three-statable via the
active high DE input.

input.

The 115kbps and 1Mbps driver outputs are slew rate limited
to minimize EMI, and to minimize reflections in untermina ted
or improperly terminated networks. Outputs of the
ISL3156Eand ISL3158E drivers are not limited, so faster
output transition times allow data rates of at least 20Mbps

High V

Improves Noise Immunity and Flexibilit y

OD

The ISL315XE driver design delivers larger differential
output voltages (VOD) than the RS-485 standard requires, or
than most RS-485 transmitters can deliver. The minimum
±2.4V V
immunity than networks built using standard 1.5V V

guarantees at least ±900mV more noise

OD

OD

transmitters.
Another advantage of the large V

is the ability to drive

OD

more than two bus terminations, which allows for utilizing the
ISL315XE in “star” and other multi-terminated, “non­standard” network topologies. Figure 8, details the
transmitter’s V

OD

vs. I

characteristic, and includes load

OUT

lines for six (20Ω) and eight (15Ω) 120Ω terminations. The
figure shows that the driver typically delivers 1.65/1.5V into
6/8 terminations, even at the worst case temperature of
+85

°C.The RS-485 standard requires a minimum 1.5V V

OD

into two terminations, but the ISL315XE delivers RS-485
voltage levels with 3X to 4X the number of terminations.

Hot Plug Function

When a piece of equipment powers up, there is a period of
time where the processor or ASIC driving the RS -485 control
lines (DE, RE
Rx outputs are kept disabled. If the equipment is connected
to the bus, a driver activating prematurely during power up
may crash the bus. To avoid this scenario, the ISL315XE
devices incorporate a “Hot Plug” function. Circuitry monitoring
V

ensures that, during power up and power down, the Tx

CC

and Rx outputs remain disabled, regardless of the state of DE
and RE
processor/ASIC a chance to stabilize and drive the RS-485
control lines to the proper states.

5

2.5

0

DRIVER Y OUTPUT (V)

FIGURE 7. HOT PLUG PERFORMANCE (ISL315XE) vs

) is unable to ensure that the RS-485 Tx and

, if VCC is less than ~3.4V . This gives the

DE, DI = V

3.5V

V

CC

A/Y

RO

ISL83088E WITHOUT HOT PLUG CIRCUITRY

ISL315XE

ISL315XE

TIME (40μs/DIV)

3.3V

RE = GND

CC

RL = 1kΩ

RL = 1kΩ

5

2.5
0

5

2.5
0

(V)

CC

V

RECEIVER OUTPUT (V)

11

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

ESD Protection

All pins on these devices include class 3 (>7kV) Human
Body Model (HBM) ESD protection structures, but the
RS-485 pins (driver outputs and receiver inputs)
incorporate advanced structures allowing them to survive
ESD events in excess of ±16.5kV HBM and ±16.5kV (1/2
duplex) IEC61000-4-2. The RS-485 pins are particularly
vulnerable to ESD strikes because they typically connect to
an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or
not it is powered up, and without degrading the RS-485
common mode range of -7V to +12V. This built-in ESD
protection eliminates the need for board level protection
structures (e.g., transient suppression diodes), and the
associated, undesirable capacitive load they present.

IEC61000-4-2 Testing

The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-485 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The
IEC61000 standard’s lower current limiting resistor coupled
with the larger charge storage capacitor yields a test that is
much more severe than the HBM test. The extra ESD
protection built into this device’s RS-485 pins allows the
design of equipment meeting level 4 criteria without the need
for additional board level protection on the RS-485 port.

AIR-GAP DISCHARGE TEST METHOD

For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The ISL315XE 1/2 duplex RS-485 pins
withstand ±16.5kV air-gap discharges.

CONTACT DISCHARGE TEST METHOD

During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±9kV. The RS-485 pins of all the ISL315XE
versions survive ±9kV contact discharges.

Data Rate, Cables, and Terminations

RS-485/422 are intended for network lengths up to 4000’,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 20Mbps
are limited to lengths less than 100’, while the 115kbps
versions can operate at full data rates with lengths of several
thousand feet.

Twisted pair is the cable of choice for RS-485/422 networks.
Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common mode
signals, which are effectively rejected by the differential
receivers in these ICs.

Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using the
115kbps versions need not be terminated, but, terminations
are recommended unless power dissipation is an overriding
concern.

In point-to-point, or point-to-multipoint (single driver on bus)
networks, the main cable should be terminated in its
characteristic impedance (typically 120Ω) at the end farthest
from the driver. In multi-receiver applications, stubs
connecting receivers to the main cable should be kept as
short as possible. Multipoint (multi-driver) systems require
that the main cable be terminated in its ch ara c t eri st ic
impedance at both ends. Stubs connecting a transceiver to
the main cable should be kept as short as possible.

Built-In Driver Overload Protection

As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. These
devices meet this requirement via driver output short circuit
current limits, and on-chip thermal shutdown circuitry.

The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes.

In the event of a major short circuit condition, devices also
include a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool. The
drivers automatically re-enable after the die temperature
drops about 15 degrees. If the contention persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown .

Low Power Shutdown Mode

These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but they also include a
shutdown feature that reduces the already low quiescent I
to a 70nA trickle. These devices enter shutdown whenever
the receiver and driver are simultaneously disabled

=VCC and DE = GND) for a period of at least 600ns.

(RE
Disabling both the driver and the receiver for less than 60ns
guarantees that the transceiver will not enter shutdown.

Note that receiver and driver enable times increase when
the transceiver enables from shutdown. Refer to Notes 7, 8,
9, 10 and 11, at the end of the Electrical Specification table
on page 8, for more information.

CC

12

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Typical Performance Curves V

140
130

120
110
100

90
80
70

RD = 15Ω

60
50

40
30
20

DRIVER OUTPUT CURRENT (mA)

10

0

012345

+25°C

+85°C

RD = 20Ω

DIFFERENTIAL OUTPUT VOLTAGE (V)

= 5V, TA = +25°C; Unless Otherwise Specified

CC

RD = 54Ω

RD = 100Ω

FIGURE 8. DRIVER OUTPUT CURRENT vs DIFFERENTIAL

OUTPUT VOLTAGE

200

150

100

Y OR Z = LOW

3.7

3.6

3.5

3.4

3.3

3.2

3.1

3.0

DIFFERENTIAL OUTPUT VOLTAGE (V)

2.9

-40 0 50 85

-25 25 75

R

= 100Ω

DIFF

TEMPERATURE (°C)

R

DIFF

= 54Ω

FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs

TEMPERATURE

660

640

620

DE = VCC, RE = X

50

0

-50

-100

OUTPUT CURRENT (mA)

-150

-200

-7 -6 -4 -2 0 2 4 6 8 10 12
OUTPUT VOLTAGE (V)

Y OR Z = HIGH

FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT

VOLTAGE

1010
1005
1000

995
990

985
980

975

PROPAGATION DELAY (ns)

970

965
960

-40 0 50 85

-25 25 75
TEMPERATURE (°C)

t

PLH

t

PHL

FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION DELAY

vs TEMPERATURE (ISL3150E, ISL3152E)

600

580

(μA)

CC

I

560

540

520

500

-40 0 50 85

-25 25 75

DE = GND, RE = GND

TEMPERATURE (°C)

FIGURE 11. SUPPLY CURRENT vs TEMPERATURE

4

|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|

5

6

7

8

SKEW (ns)

9

10

11

12

-40 0 50 85

-25 25 75
TEMPERATURE (°C)

FIGURE 13. DRIVER DIFFERENTIAL SKEW vs

TEMPERATURE (ISL3150E, ISL3152E)

13

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Typical Performance Curves V

290
288
286
284
282
280
278
276

PROPAGATION DELAY (ns)

274
272
270

-40 0 50 85

-25 25 75
TEMPERATURE (°C)

= 5V, TA = +25°C; Unless Otherwise Specified (Continued)

CC

FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION DELAY

vs TEMPERATURE (ISL3153E, ISL3155E)

24

23

22

1.0

1.5

2.0

SKEW (ns)

2.5

3.0
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|

3.5

-40 0 50 85

-25 25 75
TEMPERATURE (°C)

FIGURE 15. DRIVER DIFFERENTIAL SKEW vs

TEMPERATURE (ISL3153E, ISL3155E)

0.10

0.12

0.14

0.16

21

20

19

PROPAGATION DELAY (ns)

18

17

-40 0 50 85

-25 25 75
TEMPERATURE (°C)

FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY

vs TEMPERATURE (ISL3156E, ISL3158E)

R

= 54Ω, CL = 100pF

DI

5
0

RECEIVER OUTPUT (V)

5
4

B/Z
3
2

A/Y
1

DRIVER OUTPUT (V)

RO

DIFF

TIME (1μs/DIV)

5
0

FIGURE 18. DRIVER AND RECEIVER WA VEFORMS,

(ISL3150E, ISL3152E)

0.18

0.20

SKEW (ns)

0.22

0.24

0.26

0.28

|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|

-40 0 50 85

-25 25 75
TEMPERATURE (°C)

FIGURE 17. DRIVER DIFFERENTIAL SKEW vs

TEMPERATURE (ISL3156E, ISL3158E)

R

= 54Ω, CL = 100pF

DIFF

DI

DRIVER INPUT (V)

5
0

RECEIVER OUTPUT (V)

5
4

B/Z
3
2

A/Y
1

DRIVER OUTPUT (V)

RO

TIME (400ns/DIV)

5
0

DRIVER INPUT (V)

FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,

(ISL3153E, ISL3155E)

14

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Typical Performance Curves V

R

DIFF

DI

5
0

RECEIVER OUTPUT (V)

5
4

B/Z

3
2

A/Y

1

DRIVER OUTPUT (V)

RO

TIME (20ns/DIV)

CC

= 54Ω, CL = 100pF

FIGURE 20. DRIVER AND RECEIVER WA VEFORMS,

(ISL3156E, ISL3158E)

Die Characteristics

SUBSTRATE POTENTIAL (POWERED UP):

GND

= 5V, TA = +25°C; Unless Otherwise Specified (Continued)

60

5
0

DRIVER INPUT (V)

50

40

VOL, +25°C

30

VOH, +25°C

20

VOH, +85°C

10

RECEIVER OUTPUT CURRENT (mA)

0

012345

RECEIVER OUTPUT VOLTAGE (V)

FIGURE 21. RECEIVER OUTPUT CURRENT vs RECEIVER

OUTPUT VOLTAGE

VOL, +85°C

TRANSISTOR COUNT:

530

PROCESS:

Si Gate BiCMOS

15

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Mini Small Outline Plastic Packages (MSOP)

N

EE1

INDEX

AREA

AA1A2

TOP VIEW

-H-

SIDE VIEW

12

b

e

D

NOTES:

1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.

2. Dimensioning and tolerancing per ANSI Y14.5M-1994.

3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.

5. Formed leads shall be planar with respect to one another within

0.10mm (0.004) at seating Plane.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).

- H -

-A -

.

10. Datums and to be determined at Datum plane

11. Controlling dimension: MILLIMETER. Converted inch dimen­sions are for reference only.

-B-

0.20 (0.008) A

GAUGE

PLANE

SEATING

PLANE

0.10 (0.004) C

-A-

0.20 (0.008) C

- B -

0.25

(0.010)

-C-

SEATING
PLANE

a

0.20 (0.008) C

- H -

B

4X θ

C

D

4X θ

L1

C

C

L

E

1

END VIEW

R1

R

L

-B-

M8.118 (JEDEC MO-187AA)

8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE

INCHES MILLIMETERS

SYMBOL

A 0.037 0.043 0.94 1.10 ­A1 0.002 0.006 0.05 0.15 ­A2 0.030 0.037 0.75 0.95 -

b 0.010 0.014 0.25 0.36 9
c 0.004 0.008 0.09 0.20 -

D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4

e 0.026 BSC 0.65 BSC -

E 0.187 0.199 4.75 5.05 -

L 0.016 0.028 0.40 0.70 6

L1 0.037 REF 0.95 REF -

N8 87

R 0.003 - 0.07 - ­R1 0.003 - 0.07 - -

0 5

α

o

o

0

15

o

o

6

o

5

o

0

15

o

o

6

Rev. 2 01/03

NOTESMIN MAX MIN MAX

-

-

16

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Mini Small Outline Plastic Packages (MSOP)

N

EE1

INDEX

AREA

AA1A2

TOP VIEW

-H-

SIDE VIEW

12

b

e

D

NOTES:

1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.

2. Dimensioning and tolerancing per ANSI Y14.5M-1994.

3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.

5. Formed leads shall be planar with respect to one another within

0.10mm (.004) at seating Plane.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).

- H -

-A -

.

10. Datums and to be determined at Datum plane

11. Controlling dimension: MILLIMETER. Converted inch dimen­sions are for reference only

-B-

0.20 (0.008) A

GAUGE

PLANE

SEATING

PLANE

0.10 (0.004) C

-A-

0.20 (0.008) C

- B -

0.25

(0.010)

-C-

SEATING
PLANE

a

0.20 (0.008) C

- H -

B

4X θ

C

D

4X θ

L1

C

C

L

E

1

END VIEW

R1

R

L

-B-

M10.118 (JEDEC MO-187BA)

10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE

INCHES MILLIMETERS

SYMBOL

A 0.037 0.043 0.94 1.10 ­A1 0.002 0.006 0.05 0.15 ­A2 0.030 0.037 0.75 0.95 -

b 0.007 0.011 0.18 0.27 9
c 0.004 0.008 0.09 0.20 -

D 0.116 0.120 2.95 3.05 3
E1 0.116 0.120 2.95 3.05 4

e 0.020 BSC 0.50 BSC -

E 0.187 0.199 4.75 5.05 -

L 0.016 0.028 0.40 0.70 6

L1 0.037 REF 0.95 REF -

N10 107

R 0.003 - 0.07 - ­R1 0.003 - 0.07 - -

o

θ

α

5

o

0

15

o

o

6

o

5

o

0

15

o

o

6

Rev. 0 12/02

NOTESMIN MAX MIN MAX

-

-

17

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Small Outline Plastic Packages (SOIC)

N

INDEX
AREA

123

-A-

E

-B-

SEATING PLANE

D

A

-C-

0.25(0.010) BM M

H

L

h x 45

o

α

e

B

0.25(0.010) C AM BS

M

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.

A1

C

0.10(0.004)

M14.15 (JEDEC MS-012-AB ISSUE C)

14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE

INCHES MILLIMETERS

SYMBOL

A 0.0532 0.0688 1.35 1.75 -

A1 0.0040 0.0098 0.10 0.25 -

B 0.013 0.020 0.33 0.51 9

C 0.0075 0.0098 0.19 0.25 -

D 0.3367 0.3444 8.55 8.75 3

E 0.1497 0.1574 3.80 4.00 4

e 0.050 BSC 1.27 BSC -

H 0.2284 0.2440 5.80 6.20 -

h 0.0099 0.0196 0.25 0.50 5

L 0.016 0.050 0.40 1.27 6

N14 147

o

α

0

o

8

o

0

o

8

Rev. 0 12/93

NOTESMIN MAX MIN MAX

-

18

FN6363.0

December 14, 2006

ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E

Small Outline Plastic Packages (SOIC)

N

INDEX
AREA

123

-A-

E

-B-

SEATING PLANE

D

A

-C-

0.25(0.010) BM M

H

L

h x 45°

α

e

B

0.25(0.010) C AM BS

M

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.

5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.

A1

C

0.10(0.004)

M8.15 (JEDEC MS-012-AA ISSUE C)

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE

INCHES MILLIMETERS

SYMBOL

A 0.0532 0.0688 1.35 1.75 -

A1 0.0040 0.0098 0.10 0.25 -

B 0.013 0.020 0.33 0.51 9

C 0.0075 0.0098 0.19 0.25 -

D 0.1890 0.1968 4.80 5.00 3

E 0.1497 0.1574 3.80 4.00 4

e 0.050 BSC 1.27 BSC -

H 0.2284 0.2440 5.80 6.20 -

h 0.0099 0.0196 0.25 0.50 5

L 0.016 0.050 0.40 1.27 6

N8 87

α

0° 8° 0° 8° -

NOTESMIN MAX MIN MAX

Rev. 1 6/05

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

19

FN6363.0

December 14, 2006