The ISL1218 device is a low power real time clock with
timing and crystal compensation, clock/calendar, power fail
indicator, periodic or polled alarm, intelligent battery backup
switching and battery-backed user SRAM.
The oscillator uses an external, low-cost 32.768kHz crystal.
The real time clock tracks time with separate registers for
hours, minutes, and seconds. The device has calendar
registers for date, month, year and day of the week. The
calendar is accurate through 2099, with automatic leap year
correction.
Ordering Information
PART
NUMBER
(Note)
ISL1218IBZ1218IBZ2.7V to
ISL1218IBZ-T1218IBZ2.7V to
ISL1218IUZ1218Z2.7V to
ISL1218IUZ-T1218Z2.7V to
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
PART
MARKING
V
DD
RANGE
5.5V
5.5V
5.5V
5.5V
TEMP.
RANGE
(°C)
-40 to +85 8 Ld SOIC
-40 to +85 8 Ld SOIC
-40 to +85 8 Ld MSOP
-40 to +85 8 Ld MSOP
PACKAGE
Tape and Reel
Tape and Reel
(Pb-Free)
Pinout
ISL1218
(8 LD MSOP, SOIC)
TOP VIEW
V
8
DD
7
IRQ/F
OUT
SCL
6
SDA
5
V
BAT
GND
X1
X2
1
2
3
4
FN6313.0
Features
• Real Time Clock/Calendar
- Tracks Time in Hours, Minutes, and Seconds
- Day of the Week, Day, Month, and Year
• 15 Selectable Frequency Outputs
• Single Alarm
- Settable to the Second, Minute, Hour, Day of the Week,
Day, or Month
- Single Event or Pulse Interrupt Mode
• Automatic Backup to Battery or Super Cap
• Power Failure Detection
• On-Chip Oscillator Compensation
• 8 Bytes Battery-Backed User SRAM
2
C Interface
•I
- 400kHz Data Transfer Rate
• 400nA Battery Supply Current
• Same Pin Out as ST M41Txx and Maxim DS13xx Devices
• Small Package Options
- 8 Ld MSOP and SOIC Packages
• Pb-Free Plus Anneal Available (RoHS Compliant)
Applications
• Utility Meters
• HVAC Equipment
• Audio/Video Components
• Set Top Box/Television
• Modems
• Network Routers, Hubs, Switches, Bridges
• Cellular Infrastructure Equipment
• Fixed Broadband Wireless Equipment
• Pagers/PDA
• POS Equipment
• Test Meters/Fixtures
• Office Automation (Copiers, Fax)
• Home Appliances
• Computer Products
• Other Industrial/Medical/ Automotive
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Copyright Intersil Americas Inc. 2006. All Rights Reserved
Block Diagram
ISL1218
TRIP
SDA
BUFFER
SCL
BUFFER
CRYSTAL
OSCILLATOR
POR
I2C
INTERFACE
SWITCH
INTERNAL
SUPPLY
RTC
DIVIDER
FREQUENCY
OUT
RTC
CONTROL
LOGIC
ALARM
SECONDS
MINUTES
HOURS
DA Y OF WEEK
DATE
MONTH
YEAR
CONTROL
REGISTERS
USER
SRAM
IRQ/
F
OUT
SDA
SCL
V
V
X1
X2
DD
V
BAT
Pin Descriptions
PIN
NUMBERSYMBOLDESCRIPTION
1X1The X1 pin is the input of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz
quartz crystal. X1 ca n al s o b e d ri v e n d i r e ct l y f r o m a 32 . 7 6 8 k H z so u r c e .
2X2The X2 pin is the output of an inverting amplifier and is intended to be connected to one pin of an external 32.768kHz
quartz crystal.
3V
BAT
4GNDGround.
5SDASerial Data (SDA) is a bidirectional pin used to transfer serial data into and out of the device. It has an open drain
6SCLThe Serial Clock (SCL) input is used to clock all serial data into and out of the device.
7IRQ
8V
/F
DD
This input provides a backup supply voltage to the device. V
V
supply fails. This pin should be tied to ground if not used.
DD
supplies power to the device in the event that the
BAT
output and may be wire OR’ed with other open drain or open collector outputs.
Interrupt Output/Frequency Output is a multi-functional pin that can be used as interrupt or frequency output pin. The
OUT
function is set via the configuration register.
Power supply.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
1. θ
JA
DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOLPARAMETERCONDITIONSMIN
V
DD
V
BAT
I
DD1
I
DD2
I
DD3
I
BAT
I
BATLKG
I
LI
I
LO
V
TRIP
V
TRIPHYS
V
BATHYS
IRQ
/F
V
OL
I
LO
OUT
Main Power Supply2.75.5V
Battery Supply Voltage1.85.5V
Supply CurrentVDD = 5V26µA2, 3
V
= 3V1.24µA
DD
Supply Current With I2C ActiveVDD = 5V40120µA2, 3
Supply Current (Low Power Mode)VDD = 5V, LPMODE = 11.45µA2, 7
Battery Supply CurrentV
= 3V400950nA2
BAT
Battery Input LeakageVDD = 5.5V, V
Input Leakage Current on SCL100nA
I/O Leakage Current on SDA100nA
V
Maximum Junction Temperature (Plastic Package). . . . . . . . . 150°C
TYP
(Note 5)MAXUNITSNOTES
= 1.8V100nA
BAT
100400nA
JA
(°C/W)
Power-Down Timing Temperature = -40°C to +85°C, unless otherwise stated.
TYP
SYMBOLPARAMETERCONDITIONSMIN
V
DD SR-
VDD Negative Slewrate10V/ms4
(Note 5)MAXUNITSNOTES
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified.
TYP
SYMBOLPARAMETERTEST CONDITIONSMIN
SERIAL INTERFACE SPECS
V
IL
V
IH
SDA and SCL Input Buffer LOW
Voltage
SDA and SCL Input Buffer HIGH
Voltage
3
0.7 x
V
(Note 5) MAXUNITS NOTES
-0.30.3 x
DD
V
DD
VDD +
0.3
V
V
FN6313.0
June 22, 2006
ISL1218
Serial Interface Specifications Over the recommended operating conditions unless otherwise specified. (Continued)
TYP
SYMBOLPARAMETERTEST CONDITIONSMIN
HysteresisSDA and SCL Input Buffer Hysteresis0.05 x
V
V
OL
SDA Output Buffer LOW Voltage,
Sinking 3mA
CpinSDA and SCL Pin CapacitanceT
f
SCL
t
IN
t
AA
SCL Frequency400kHz
Pulse Width Suppression Time at SDA
and SCL Inputs
SCL Falling Edge to SDA Output Data
Valid
= 25°C, f = 1MHz, VDD = 5V,
A
V
=0V, V
IN
OUT
= 0V
Any pulse narrower than the max spec
is suppressed.
SCL falling edge crossing 30% of VDD,
until SDA exits the 30% to 70% of V
DD
window.
t
BUF
t
LOW
t
HIGH
t
SU:STA
t
HD:STA
t
SU:DAT
t
HD:DAT
t
SU:STO
t
HD:STO
t
DH
t
R
t
F
Time the Bus Must be Free before the
Start of a New Transmission
SDA crossing 70% of VDD during a
STOP condition, to SDA crossing 70%
of V
during the following START
DD
condition.
Clock LOW TimeMeasured at the 30% of VDD crossing.1300ns
Clock HIGH TimeMeasured at the 70% of VDD crossing.600ns
START Condition Setup TimeSCL rising edge to SDA falling edge.
Both crossing 70% of V
DD
.
STAR T Condition Hold TimeFrom SDA falling edge crossing 30% of
V
to SCL falling edge crossing 70%
DD
of V
.
DD
Input daTa Setup TimeFrom SDA exiting the 30% to 70% of
V
window, to SCL rising edge
DD
crossing 30% of V
DD
Input Data Hold TimeFrom SCL falling edge crossing 30% of
V
to SDA entering the 30% to 70%
DD
of V
window.
DD
STOP Condition Setup TimeFrom SCL rising edge crossing 70% of
V
, to SDA rising edge crossing 30%
DD
of V
.
DD
STOP Condition Hold TimeFrom SDA rising edge to SCL falling
edge. Both crossing 70% of V
DD
.
Output Data Hold TimeFrom SCL falling edge crossing 30% of
V
, until SDA enters the 30% to 70%
DD
of V
window.
DD
SDA and SCL Rise TimeFrom 30% to 70% of V
SDA and SCL Fall TimeFrom 70% to 30% of V
DD
DD
1300ns
20 +
0.1 x Cb
20 +
0.1 x Cb
CbCapacitive Loading of SDA or SCLTotal on-chip and off-chip10400pF6
RpuSDA and SCL Bus Pull-up Resistor
Off-chip
Maximum is determined by t
For Cb = 400pF , max is about 2~2.5kΩ.
and tF.
R
For Cb = 40pF, max is about 15~20kΩ
NOTES:
2. IRQ
and F
OUT
Inactive.
3. LPMODE = 0 (default).
4. In order to ensure proper timekeeping, the V
specification must be followed.
DD SR-
5. Typical values are for T = 25°C and 3.3V supply voltage.
2
6. These are I
7. A write to register 08h should only be done if V
C specific parameters and are not directly tested, however they are used during device testing to validate device specification.
> V
DD
, otherwise the device will be unable to communicate using I2C.
BAT
(Note 5) MAXUNITS NOTES
V
DD
00.4V
10pF
50ns
900ns
600ns
600ns
100ns
0900ns
600ns
600ns
0ns
300ns6
300ns6
1kΩ6
4
FN6313.0
June 22, 2006
SDA vs SCL Timing
ISL1218
t
F
SCL
(INPUT TIMING)
(OUTPUT TIMING)
SDA
SDA
t
SU:STA
t
HD:STA
t
Symbol Table
WAVEFORMINPUTSOUTPUTS
Must be steadyWill be steady
May change
from LOW
to HIGH
May change
from HIGH
to LOW
Will change
from LOW
to HIGH
Will change
from HIGH
to LOW
SU:DAT
t
HIGH
t
LOW
t
HD:DAT
t
R
t
SU:STO
t
DH
t
AA
t
BUF
Don’t Care:
Changes Allowed
N/ACenter Line is
Changing:
State Not Known
High Impedance
5
FN6313.0
June 22, 2006
ISL1218
Typical Performance Curves Temperature is +25°C unless otherwise specified
900E-9
800E-9
700E-9
600E-9
(A)
500E-9
BAT
I
400E-9
300E-9
200E-9
100E-9
000E+0
2.4E-06
2.2E-06
2.0E-06
1.8E-06
(A)
1.6E-06
DD1
I
1.4E-06
1.2E-06
1.0E-06
1E-6
1.52.02.53.03.54.04.55.05.5
(V)
V
BAT
FIGURE 1. I
-40-200 20406080
TEMPERATURE (°C)
FIGURE 3. I
DD1
vs V
BAT
VCC= 5V
VCC= 3.3V
BAT
vs TEMPERATUREFIGURE 4. I
1E-6
800E-9
600E-9
(A)
BAT
I
400E-9
200E-9
000E+0
FIGURE 2. I
2.4E-6
2.2E-6
2.0E-6
1.8E-6
1.6E-6
(A)
1.4E-6
DD1
I
1.2E-6
1.0E-6
800.0E-9
600.0E-9
400.0E-9
-40-200 20406080
TEMPERATURE (°C)
vs TEMPERATURE AT V
BAT
LPMODE = 0
LPMODE = 1
2.53.03.54.04.55.05.5
V
CC (V)
vs VCC WITH LPMODE ON AND OFF
DD1
BAT
= 3V
(A)
DD1
I
2.1E-6
2.0E-6
1.9E-6
1.8E-6
1.7E-6
1.6E-6
1.5E-6
1.4E-6
1.3E-6
1.2E-6
1/8
1/32
1/16
FIGURE 5. I
1/4
DD1
1
1/2
F
OUT (Hz)
vs F
6
2
OUT
4
AT V
3.0E-6
2.9E-6
2.8E-6
2.7E-6
2.6E-6
2.5E-6
(A)
2.4E-6
DD1
2.3E-6
I
2.2E-6
2.1E-6
2.0E-6
1.9E-6
8
16
64
32
DD
4096
1024
32768
= 3.3VFIGURE 6. I
1.8E-6
1
4
2
8
16
64
1/16
DD1
F
OUT (Hz)
vs F
OUT
1/2
1/4
1/8
1/32
32
AT VDD = 5V
4096
1024
June 22, 2006
32768
FN6313.0
ISL1218
EQUIVALENT AC OUTPUT LOAD CIRCUIT FOR V
5.0V
1533Ω
SDA
AND
IRQ
/FOUT
FIGURE 7. STANDARD OUTPUT LOAD FOR TESTING THE
DEVICE WITH V
DD
100pF
= 5.0V
FOR VOL= 0.4V
AND I
DD
OL
= 5V
= 3mA
General Description
The ISL1218 device is a low power real time clock with
timing and crystal compensation, clock/calendar, power fail
indicator, periodic or polled alarm, intelligent battery backup
switching, and battery-backed user SRAM.
The oscillator uses an external, low-cost 32.768kHz crystal.
The real time clock tracks time with separate registers for
hours, minutes, and seconds. The device has calendar
registers for date, month, year and day of the week. The
calendar is accurate through 2099, with automatic leap year
correction.
The ISL1218's powerful alarm can be set to any
clock/calendar value for a match. For example, every
minute, every Tuesday or at 5:23 AM on March 21. The
alarm status is available by checking the Status Register, or
the device can be configured to provide a hardware interrupt
via the IRQ pin. There is a repeat mode for the alarm
allowing a periodic interrupt every minute, every hour, every
day, etc.
The device also offers a backup power input pin. This V
BAT
pin allows the device to be backed up by battery or
SuperCap with automatic switchover from V
DD
to V
BAT
. The
entire ISL1218 device is fully operational from 2.0V to 5.5V
and the clock/calendar portion of the device remains fully
operational down to 1.8V (Standby Mode).
Pin Description
X1, X2
The X1 and X2 pins are the input and output, respectively, of
an inverting amplifier. An external 32.768kHz quartz crystal
is used with the ISL1218 to supply a timebase for the real
time clock. Internal compensation circuitry provides high
accuracy over the operating temperature range from
-40°C to +85°C. This oscillator compensation network can
be used to calibrate the crystal timing accuracy over
temperature either during manufacturing or with an external
temperature sensor and microcontroller for active
compensation. The device can also be driven directly from a
32.768kHz source at pin X1.
X1
X2
FIGURE 8. RECOMMENDED CRYSTAL CONNECTION
V
BAT
This input provides a backup supply voltage to the device.
V
supplies power to the device in the event that the VDD
BAT
supply fails. This pin can be connected to a battery, a Super
Cap or tied to ground if not used.
IRQ/F
(Interrupt Output/Frequency Output)
OUT
This dual function pin can be used as an interrupt or
frequency output pin. The IRQ
/F
mode is selected via
OUT
the frequency out control bits of the control/status register.
• Interrupt Mode. The pin provides an interrupt signal
output. This signal notifies a host processor that an alarm
has occurred and requests action. It is an open drain
active low output.
• Frequency Output Mode. The pin outputs a clock signal
which is related to the crystal frequency. The frequency
output is user selectable and enabled via the I
2
C bus. It is
an open drain active low output.
Serial Clock (SCL)
The SCL input is used to clock all serial data into and out of
the device. The input buffer on this pin is always active (not
gated). It is disabled when the backup power supply on the
V
pin is activated to minimize power consumption.
BAT
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and out
of the device. It has an open drain output and may be ORed
with other open drain or open collector outputs. The input
buffer is always active (not gated) in normal mode.
An open drain output requires the use of a pull-up resistor.
The output circuitry controls the fall time of the output signal
with the use of a slope controlled pull-down. The circuit is
designed for 400kHz I
when the backup power supply on the V
2
C interface speeds. It is disabled
pin is activated.
BAT
VDD, GND
Chip power supply and ground pins. The device will operate
with a power supply from 2.0V to 5.5VDC. A 0.1µF capacitor
is recommended on the V
pin to ground.
DD
Functional Description
Power Control Operation
The power control circuit accepts a VDD and a V
Many types of batteries can be used with Intersil RTC
products. For example, 3.0V or 3.6V Lithium batteries are
appropriate, and battery sizes are available that can power
BAT
input.
7
FN6313.0
June 22, 2006
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