®
www.BDTIC.com/Intersil
ICL3207E, ICL3217E
Data Sheet June 2004
+/- 15kV ESD Protected, +3V to +5.5V, Low
Power, 250kbps, RS-232
Transmitters/Receivers
The Intersil ICL32X7E devices are 3V to 5.5V powered
RS-232 transmitters (five)/receivers (three) which meet
ElA/TIA-232 and V.28/V.24 specifications, even at
V
= 3.0V. Additionally, they provide ±15kV ESD
CC
protection (IEC61000-4-2 Air Gap) and
Model protection on transmitter outputs and receiver inputs
(RS-232 pins). Targeted applications are ISDN Terminal
Adaptors, PDAs, Palmtops, peripherals, and notebook and
laptop computers where the low operational, and even lower
standby, power consumption is critical. The ICL3217E’s
efficient on-chip charge pumps, coupled with an automatic
powerdown function, reduces the standby supply current to
a 1µA trickle. Small footprint packaging, and the use of
small, low value capacitors ensure board space savings as
well. Data rates greater than 250kbps are guaranteed at
worst case load conditions. This family is fully compatible
with 3.3V-only systems, mixed 3.3V and 5V systems, and
5V-only systems, and is a lower power, pin-for-pin
replacement for ‘207E and ‘237E type devices.
The ICL3217E features an automatic powerdown function
which powers down the on-chip power-supply and driver
circuits. This occurs when an attached peripheral device is
shut off or the RS-232 cable is removed, conserving system
power automatically, without changes to the hardware or
operating system. The ICL3217E powers up again when a
valid RS-232 voltage is applied to any receiver input.
Table 1 summarizes the features of the devices represented
by this data sheet, while application Note AN9863
summarizes the features of each device comprising the
ICL32XXE 3V family.
±15kV Human Body
FN4914.5
Features
• Pb-Free Available as an Option (see Ordering Info)
• ESD Protection for RS-232 I/O Pins to
±15kV (IEC61000)
• 5V Lower Power Replacement for MAX207E, HIN207E,
HIN237E
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• RS-232 Compatible with V
• Automatic Powerdown (I
= 2.7V
CC
= 1µA, ICL3217E Only)
CC
• Receiver Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
Applications
• Battery Powered, Hand-Held, and Portable Equipment
• Laptop Computers, Notebooks, Palmtops
• Modems, Printers and other Peripherals
• ISDN Terminal Adaptors and Set Top Boxes
• Related Literature
- Technical Brief TB363, Guidelines for Handling and
Processing Moisture Sensitive Surface Mount
Devices (SMDs)
Pinout
ICL3207E, ICL3217E (SOIC, SSOP)
T3
OUT
T1
OUT
T2
OUT
R1
IN
R1
OUT
T2
IN
T1
IN
GND
V
CC
C1+
V+
C1-
1
2
3
4
5
6
7
8
9
10
11
12
TOP VIEW
T4
24
OUT
R2
23
IN
R2
22
OUT
T5
21
IN
T5
20
OUT
T4
19
IN
T3
18
IN
R3
17
OUT
R3
16
IN
V-
15
C2-
14
C2+
13
TABLE 1. SUMMARY OF FEATURES
NO. OF TXNO. OF
PART NUMBER
ICL3207E 5 3 0 250 NO NO NO
ICL3217E 5 3 0 250 NO NO YES
RX
1
NO. OF MONITOR
RX (R
) DATA RATE
OUTB
RX ENABLE
(kbps)
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
FUNCTION?
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2001, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
MANUAL
POWER-
DOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Ordering Information
(NOTE 1)
PART NO.
ICL3207ECA 0 to 70 24 Ld SSOP M24.209
ICL3207ECAZ
(See Note 2)
ICL3207ECB 0 to 70 24 Ld SOIC M24.3
ICL3207ECBZ
(See Note 2)
ICL3217ECA 0 to 70 24 Ld SSOP M24.209
ICL3217ECAZ
(See Note 2)
ICL3217ECB 0 to 70 24 Ld SOIC M24.3
ICL3217ECBZ
(See Note 2)
ICL3217EIA -40 to 85 24 Ld SSOP M24.209
ICL3217EIAZ
(See Note 2)
ICL3217EIB -40 to 85 24 Ld SOIC M24.3
ICL3217EIBZ
(See Note 2)
NOTES:
1. Most surface mount devices are available on tape and reel; add
“-T” to suffix.
2. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
TEMP.
RANGE (°C) PACKAGE
0 to 70 24 Ld SSOP (Pb-Free) M24.209
0 to 70 24 Ld SOIC (Pb-Free) M24.3
0 to 70 24 Ld SSOP (Pb-Free) M24.209
0 to 70 24 Ld SOIC (Pb-Free) M24.3
-40 to 85 24 Ld SSOP (Pb-Free) M24.209
-40 to 85 24 Ld SOIC (Pb-Free) M24.3
PKG.
DWG. #
Pin Descriptions
PIN FUNCTION
System power supply input (3.0V to 5.5V).
V
CC
V+ Internally generated positive transmitter supply (+5.5V).
V- Internally generated negative transmitter supply (-5.5V).
GND Ground connection.
C1+ External capacitor (voltage doubler) is connect ed to this l ead.
C1- External capacitor (voltage doubler) is connect ed to this l ead.
C2+ External capacitor (voltage inverter) is connected to this lead.
C2- External capacitor (voltage inverter) is connected to this lead.
TTL/CMOS compatible transmitter inputs.
T
IN
±15kV ESD Protected, RS-232 level (nominally ±5.5V)
T
OUT
transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
R
IN
TTL/CMOS level receiver outputs.
R
OUT
2
Typical Operating Circuit
www.BDTIC.com/Intersil
VCC †
TTL/CMOS
LOGIC LEVELS
+
0.1µF
ICL3207E, ICL3217E
ICL32X7E
9
V
CC
T
T
T
T
T
C
1
C2 †
T1
T2
T3
T4
T5
10
C1+
+
†
12
C1-
13
C2+
+
14
C2-
7
IN
6
IN
18
IN
19
IN
21
IN
C3 (OPTIONAL CONNECTION)
+
11
V+
V-
1
2
3
4
5
+
C
†
3
15
C4 †
+
2
T1
OUT
3
T2
OUT
1
T3
24
T4
20
T5
OUT
OUT
OUT
RS-232
LEVELS
† - FOR V
FOR V
R1
R2
R3
= 3.3V, C1 - C4 = 0.1µF or 0.22µF
CC
= 5V, C1 - C4 = 0.1µF OR 1µF
CC
OUT
OUT
OUT
5kΩ
5kΩ
5kΩ
4
R1
IN
23
R2
16
R3
RS-232
IN
LEVELS
IN
5
R
R
2
R
3
GND
1
8
22
17
3
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
R
IN
Output Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
R
OUT
Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
T
OUT
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θ
JA
Thermal Resistance (Typical, Note 3)
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . 300°C
(Lead Tips Only)
θ
(‘/W)
JA
Operating Conditions
Temperature Range
ICL32X7ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
ICL32X7EIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Electrical Specifications Test Conditions: V
Typicals are at T
PARAMETER TEST CONDITIONS
DC CHARACTERISTICS
Supply Current, Automatic
Powerdown
Supply Current,
Automatic Powerdown Disabled
TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low T
Input Logic Threshold High T
Input Leakage Current T
Output Leakage Current
(ICL3217E Only)
Output Voltage Low I
Output Voltage High I
AUTOMATIC POWERDOWN (ICL3217E Only)
Receiver Input Thresholds to
Enable Transmitters
Receiver Input Thresholds to
Disable Transmitters
Receiver Threshold to
Transmitters Enabled Delay (t
Receiver Positive or Negative
Threshold to Transmitters
Disabled Delay
RECEIVER INPUTS
Input Voltage Range Full -25 - 25 V
Input Threshold Low V
Input Threshold High V
WU
)
Open (ICL3217E Only) 25 - 1.0 10 µA
All R
IN
All Outputs Unloaded 25 - 0.3 1.0 mA
IN
IN
IN
= 1.6mA Full - - 0.4 V
OUT
= -1.0mA Full VCC-0.6 VCC-0.1 - V
OUT
ICL3217E Powers Up (Figure 4) Full -2.7 - 2.7 V
ICL3217E Powers Down (Figure 4) Full -0.3 - 0.3 V
= 3.3V 25 0.6 1.2 - V
CC
V
= 5.0V 25 0.8 1.5 - V
CC
= 3.3V 25 - 1.5 2.4 V
CC
= 5.0V 25 - 1.8 2.4 V
V
CC
= 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
CC
= 25°C
A
TEMP
(°C) MIN TYP MAX UNITS
Full - - 0.8 V
VCC = 3.3V Full 2.0 - - V
V
= 5.0V Full 2.4 - - V
CC
Full - ±0.01 ±1.0 µA
Full - ±0.05 ±10 µA
25 - 100 - µs
25 - 30 - µs
4
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Electrical Specifications Test Conditions: V
Typicals are at T
PARAMETER TEST CONDITIONS
Input Hysteresis 25 - 0.3 - V
Input Resistance 25357kΩ
TRANSMITTER OUTPUTS
Output Voltage Swing All Transmitter Outputs Loaded with 3kΩ to Ground Full ±5.0 ±5.4 - V
Output Resistance V
Output Short-Circuit Current Full - ±35 ±60 mA
Output Leakage Current
(ICL3217E Only)
TIMING CHARACTERISTICS
Maximum Data Rate
(One Transmitter Switching)
Receiver Propagation Delay Receiver Input to Receiver
Transmitter Skew t
Receiver Skew t
Transition Region Slew Rate V
ESD PERFORMANCE
RS-232 Pins (T
All Other Pins Human Body Model 25 - ±2-kV
, RIN) IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV
OUT
= V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M - Ω
CC
= ±12V, VCC = 0V or 3V to 5.5V
V
OUT
In Automatic Powerdown
= 3.15V, C1 - C4 = 0.1µF, RL = 3kΩ, CL = 1000pF Full 250 500 - kbps
V
CC
= 3.0V, C1 - C4 = 0.22µF, RL = 3kΩ, CL = 1000pF Full 250 286 - kbps
V
CC
≥ 4.5V, C1 - C4 = 0.1µF, RL = 3kΩ, CL = 1000pF Full 250 310 - kbps
V
CC
Output, C
PHL
PHL
CC
Measured From +3V to -3V or -3V
to +3V
IEC61000-4-2, Contact Discharge Method 25 - ±8-kV
Human Body Model 25 - ±15 - kV
= 150pF
L
- t
PLH
- t
PLH
= 3.3V, RL = 3kΩ to 7kΩ,
= 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
CC
= 25°C (Continued)
A
TEMP
(°C) MIN TYP MAX UNITS
Full - - ±25 µA
t
PHL
t
PLH
CL = 200pF to 2500pF 25 4 15 30 V/µs
= 200pF to 1000pF 25 6 15 30 V/µs
C
L
25 - 0.3 - µs
25 - 0.3 - µs
Full - 200 1000 ns
Full - 100 500 ns
Detailed Description
The ICL32X7E interface ICs operate from a single +3V to
+5.5V power supply, guarantee a 250kbps minimum data
rate, require only four small external 0.1µF capacitors,
feature low power consumption, and meet all ElA RS-232C
and V.28 specifications. The circuit is divided into three
sections: charge pump, transmitters and receivers.
Charge-Pump
Intersil’s new ICL32XXE family utilizes regulated on-chip
dual charge pumps as voltage doublers, and voltage
inverters to generate ±5.5V transmitter supplies from a V
supply as low as 3V. This allows these devices to maintain
RS-232 compliant output levels over the ±10% tolerance
range of 3.3V powered systems. The efficient on-chip power
supplies require only four small, external 0.1µF capacitors
for the voltage doubler and inverter functions at V
CC
See the Capacitor Selection section, and Table 3 for
capacitor recommendations for other operating conditions.
The charge pumps operate discontinuously (i.e., they turn off
as soon as the V+ and V- supplies are pumped up to the
nominal values), resulting in significant power savings.
5
CC
=3.3V.
Transmitters
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
ICL3217E transmitter outputs disable and assume a high
impedance state when the device enters the automatic
powerdown mode. These outputs may be driven to ±12V
when disabled.
Both devices guarantee a 250kbps data rate for full load
conditions (3kΩ and 1000pF), V
≥ 3.0V, with one
CC
transmitter operating at full speed. Under more typical
conditions of V
≥ 3.3V, RL=3kΩ, and CL= 250pF, one
CC
transmitter easily operates at 800kbps.
Transmitter inputs float if left unconnected, and may cause
I
increases. Connect unused inputs to GND for the best
CC
performance.
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Receivers
The ICL32X7E each contain inverting receivers that convert
RS-232 signals to CMOS output levels and accept inputs up
to ±25V while presenting the required 3kΩ to 7kΩ input
impedance (see Figure 1) even if the power is off
(V
= 0V). The receivers’ Schmitt trigger input stage uses
CC
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
Receivers on the ICL3207E are always active. The
ICL3217E receivers disable when in the automatic
powerdown state, thereby eliminating the possible current
path through a shutdown peripheral’s input protection diode
(see Figures 2 and 3).
Low Power Operation
These 3V devices require a nominal supply current of
0.3mA, even at V
powerdown mode). This is considerably less than the 11mA
current required by comparable 5V RS-232 devices,
allowing users to reduce system power simply by replacing
the old style device with the ICL3207E.
Low Power, Pin Compatible Replacement
Pin compatibility with existing 5V products (e.g., MAX207E),
coupled with the wide operating supply range, make the
ICL32X7E potential lower power, higher performance dropin replacements for existing ‘2X7E 5V applications. As long
as the ±5V RS-232 output swings are acceptable, the
ICL32X7E devices should work in most 5V applications.
-25V ≤ V
FIGURE 1. INVERTING RECEIVER CONNECTIONS
V
CC
= 5.5V, during normal operation (not in
CC
V
CC
RIN
R
XIN
≤ +25V
GND
5kΩ
V
CC
R
GND ≤ V
V
CURRENT
FLOW
XOUT
CC
ROUT
≤ V
CC
V
CC
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
V
CC
R
X
POWERED
DOWN
UART
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
T
X
* IN AUTOMATIC
POWERDOWN
V
OUT =
HI-Z*
ICL3217E
V-
When replacing a ‘207E or ‘237E device in an existing 5V
application, it is acceptable to terminate C
to VCC as shown
3
on the Typical Operating Circuit. Nevertheless, terminate C
to GND if possible, as slightly better performance results
from this configuration.
Automatic Powerdown (ICL3217E Only)
Even greater power savings is available by using the
ICL3217E which features an automatic powerdown function.
When no valid RS-232 voltages (see Figure 4) are sensed
on any receiver input for 30µs, the ICL3217E automatically
enters its powerdown state (see Figure 5). In powerdown,
supply current drops to 1µA, because the on-chip charge
pump turns off (V+ collapses to V
and the receiver and transmitter outputs three-state (see
Table 2). This micro-power mode makes the ICL3217E ideal
for battery powered and portable applications. Invalid
receiver levels occur whenever the driving peripheral’s
outputs are shut off (powered down) or when the RS-232
interface cable is disconnected. The ICL3217E powers back
up whenever it detects a valid RS-232 voltage level on any
receiver input (such as when the RS-232 cable is
reconnected). The time to recover from automatic
powerdown mode is typically 100µs.
, V- collapses to GND),
CC
3
V
OUT = VCC
Rx
POWERED
DOWN
UART
Tx
GND
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
SHDN = GND
OLD
RS-232 CHIP
TABLE 2. ICL3217E AUTOMATIC POWERDOWN OPERATION
RS-232 SIGNAL
PRESENT AT
RECEIVER
INPUT?
YES Active Active Normal
NO High-Z High-Z Powerdown
6
TRANSMITTER
OUTPUTS
RECEIVER
OUTPUTS
MODE
OF
OPERATION
Operation
Due to Auto
Powerdown
Logic
2.7V
www.BDTIC.com/Intersil
0.3V
-0.3V
-2.7V
FIGURE 4. DEFINITION OF VALID RS-232 RECEIVER
TRANSMITTER
VALID RS-232 LEVEL - ICL3217E IS ACTIVE
INDETERMINATE - POWERDOWN MAY OR
MAY NOT OCCUR
INVALID LEVEL - POWERDOWN OCCURS AFTER 30µs
INDETERMINATE - POWERDOWN MAY OR
MAY NOT OCCUR
VALID RS-232 LEVEL - ICL3217E IS ACTIVE
LEVELS
RECEIVER
INPUTS
OUTPUTS
ICL3207E, ICL3217E
reduces ripple on the transmitter outputs and slightly
reduces power consumption. C
increased without increasing C
increase C
maintain the proper ratios (C
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-
INVALID
}
REGION
3.15 to 3.6 0.1 0.1
, C3, and C4 can be
2
’s value, however, do not
without also increasing C2, C3, and C4 to
1
1
to the other capacitors).
1
.
TABLE 3. REQUIRED CAPACITOR VALUES
(V) C1 (µF) C2, C3, C4 (µF)
V
CC
3.0 to 3.6 0.22 0.22
4.5 to 5.5 0.1 to 1.0 0.1 to 1.0
3.0 to 5.5 0.22 0.22
AUTOPWDN
V+
V
CC
0
V-
FIGURE 5. AUTOMATIC POWERDOWN TIMING DIAGRAM
PWR UP (tWU)
This automatic powerdown feature provides additional
system power savings without changes to the existing
operating system or hardware.
Utilizing power management circuitry, to power down the
rest of the communication circuitry (e.g., the UART) when
the ICL3217E powers down, produces even greater power
savings. Connecting a transition detector to the V- pin (see
Figure 3) is an easy way for the power management logic to
determine when the ICL3217E enters and exits powerdown.
Capacitor Selection
The charge pumps require 0.1µF, or greater, capacitors for
3.3V operation. With 0.1µF capacitors, five percent tolerance
supplies (e.g., 3.14V minimum) deliver greater than ±5V
transmitter swings at full data rate, while ten percent
tolerance supplies (e.g., 2.97V minimum) deliver ±4.95V
transmitter swings. If greater than ±5V transmitter swings
are required with a 10% tolerance 3.3V supply, 0.22µF
capacitors are recommended (see Table 3). Existing 5V
applications typically utilize either 0.1µF or 1µF capacitors,
and the ICL32X7E works well with either value. New 5V
designs should use 0.22µF capacitors for the best results.
For other supply voltages refer to Table 3 for capacitor
values. Do not use values smaller than those listed in
Table 3. Increasing the capacitor values (by a factor of two)
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple V
capacitor of the same value as the charge-pump capacitor C
to ground with a
CC
1
Connect the bypass capacitor as close as possible to the IC.
Transmitter Outputs when Exiting
Powerdown
Figure 6 shows the response of two ICL3217E transmitter
outputs when exiting powerdown mode. As they activate, the
two transmitter outputs properly go to opposite RS-232
levels, with no glitching, ringing, nor undesirable transients.
Each transmitter is loaded with 3kΩ in parallel with 2500pF.
Note that the transmitters enable only when the magnitude
of the supplies exceed approximately 3V.
.
5V/DIV
2V/DIV
FIGURE 6. TRANSMITTER OUTPUTS WHEN EXITING
RX
IN
VCC = +3.3V
C1 - C4 = 0.1µF
TIME (20µs/DIV.)
POWERDOWN (ICL3217E ONLY)
T1
T2
.
7
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Operation down to 2.7V
ICL32X7E transmitter outputs meet RS-562 levels (±3.7V)
with V
as low as 2.7V. RS-562 levels typically ensure inter
CC
operability with RS-232 devices.
High Data Rates
The ICL32XX maintain the RS-232 ±5V minimum transmitter
output voltages even at high data rates. Figure 7 details a
transmitter loopback test circuit, and Figure 8 illustrates the
loopback test result at 120kbps. For this test, all transmitters
were simultaneously driving RS-232 loads in parallel with
1000pF, at 120kbps. Figure 9 shows the loopback results for
a single transmitter driving 1000pF and an RS-232 load at
250kbps. The static transmitters were also loaded with an
RS-232 receiver.
V
CC
0.1µF
+
C
1
+
C
2
FIGURE 7. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV.
T1
IN
T1
OUT
R1
OUT
VCC = +3.3V
C1 - C4 = 0.1µF
FIGURE 8. LOOPBACK TEST AT 120kbps
C1+
C1-
C2+
C2-
T
IN
R
OUT
+
V
CC
ICL32X7E
5µs/DIV.
T
OUT
V+
V-
R
IN
5k
+
C
3
C
4
+
1000pF
5V/DIV.
T1
IN
T1
OUT
R1
OUT
VCC = +3.3V
C1 - C4 = 0.1mF
2µs/DIV.
FIGURE 9. LOOPBACK TEST AT 250kbps
Interconnection with 3V and 5V Logic
The ICL32X7E directly interface with 5V CMOS and TTL
logic families. Nevertheless, with the ICL32X7E at 3.3V, and
the logic supply at 5V, AC, HC, and CD4000 outputs can
drive ICL32X7E inputs, but ICL32X7E outputs do not reach
the minimum V
for these logic families. See Table 4 for
IH
more information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
SYSTEM
POWER-SUPPLY
VOLTAGE
(V)
3.3 3.3 Compatible with all CMOS
5 5 Compatible with all TTL and
5 3.3 Compatible with ACT and HCT
V
CC
SUPPLY
VOLTAGE
(V) COMPATIBILITY
families.
CMOS logic families.
CMOS, and with TTL. ICL32X7
outputs are incompatible with AC,
HC, and CD4000 CMOS inputs.
E
±15kV ESD Protection
All pins on ICL32XX devices include ESD protection
structures, but the ICL32X7E incorporate advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
8
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
Typical Performance Curves V
6.0
4.0
2.0
1 TRANSMITTER AT 250kbps
OTHER TRANSMITTERS AT 30kbps
0
= 3.3V, TA = 25°C
CC
V
+
OUT
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
25
20
15
-SLEW
-2.0
V
-
-4.0
TRANSMITTER OUTPUT VOLTAGE (V)
-6.0
FIGURE 10. TRANSMITTER OUTPUT VOLTAGE vs LOAD
1000 2000 3000 4000 50000
LOAD CAPACITANCE (pF)
CAPACITANCE
OUT
+SLEW
SLEW RATE (V/µs)
10
5
0 1000 2000 3000 4000 5000
LOAD CAPACITANCE (pF)
FIGURE 11. SLEW RATE vs LOAD CAPACITANCE
-SLEW
9
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Typical Performance Curves V
55
1 TRANSMITTER SWITCHING
50
45
40
35
30
25
SUPPLY CURRENT (mA)
20
15
0 1000 2000 3000 4000 5000
LOAD CAPACITANCE (pF)
FIGURE 12. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
250kbps
= 3.3V, TA = 25°C (Continued)
CC
120kbps
20kbps
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
ICL3207E: 469
ICL3217E: 488
3.5
3.0
2.5
2.0
1.5
1.0
SUPPLY CURRENT (mA)
0.5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
SUPPLY VOLTAGE (V)
FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE
NO LOAD
ALL OUTPUTS STATIC
PROCESS:
Si Gate CMOS
10
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX
AREA
123
-AD
e
B
0.25(0.010) C AM BS
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
E
-B-
SEATING PLANE
A
-C-
M
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
C
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.078 - 2.00 A1 0.002 - 0.05 - A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.312 0.334 7.90 8.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N24 247
α 0
o
o
8
o
0
NOTESMIN MAX MIN MAX
o
8
Rev. 1 3/95
-
11
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
123
-AD
e
B
0.25(0.010) C AM BS
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
E
-B-
SEATING PLANE
A
-C-
M
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
h x 45
o
C
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC H 0.394 0.419 10.00 10.65 h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N24 247
α 0
o
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold b y de scr ip tion on ly. In tersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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12
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