intersil ICL3207E DATA SHEET

®
www.BDTIC.com/Intersil
Data Sheet June 2004
+/- 15kV ESD Protected, +3V to +5.5V, Low Power, 250kbps, RS-232 Transmitters/Receivers
The Intersil ICL32X7E devices are 3V to 5.5V powered RS-232 transmitters (five)/receivers (three) which meet ElA/TIA-232 and V.28/V.24 specifications, even at V
= 3.0V. Additionally, they provide ±15kV ESD
CC
protection (IEC61000-4-2 Air Gap) and Model protection on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are ISDN Terminal Adaptors, PDAs, Palmtops, peripherals, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. The ICL3217E’s efficient on-chip charge pumps, coupled with an automatic powerdown function, reduces the standby supply current to a 1µA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 250kbps are guaranteed at worst case load conditions. This family is fully compatible with 3.3V-only systems, mixed 3.3V and 5V systems, and 5V-only systems, and is a lower power, pin-for-pin replacement for ‘207E and ‘237E type devices.
The ICL3217E features an automatic powerdown function which powers down the on-chip power-supply and driver circuits. This occurs when an attached peripheral device is shut off or the RS-232 cable is removed, conserving system power automatically, without changes to the hardware or operating system. The ICL3217E powers up again when a valid RS-232 voltage is applied to any receiver input.
Table 1 summarizes the features of the devices represented by this data sheet, while application Note AN9863 summarizes the features of each device comprising the ICL32XXE 3V family.
±15kV Human Body
FN4914.5
Features
• Pb-Free Available as an Option (see Ordering Info)
• ESD Protection for RS-232 I/O Pins to
±15kV (IEC61000)
• 5V Lower Power Replacement for MAX207E, HIN207E, HIN237E
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• RS-232 Compatible with V
• Automatic Powerdown (I
= 2.7V
CC
= 1µA, ICL3217E Only)
CC
• Receiver Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
Applications
• Battery Powered, Hand-Held, and Portable Equipment
• Laptop Computers, Notebooks, Palmtops
• Modems, Printers and other Peripherals
• ISDN Terminal Adaptors and Set Top Boxes
• Related Literature
- Technical Brief TB363, Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices (SMDs)
Pinout
ICL3207E, ICL3217E (SOIC, SSOP)
T3
OUT
T1
OUT
T2
OUT
R1
IN
R1
OUT
T2
IN
T1
IN
GND
V
CC
C1+
V+
C1-
1 2 3 4 5 6 7 8
9 10 11 12
TOP VIEW
T4
24
OUT
R2
23
IN
R2
22
OUT
T5
21
IN
T5
20
OUT
T4
19
IN
T3
18
IN
R3
17
OUT
R3
16
IN
V-
15
C2-
14
C2+
13
TABLE 1. SUMMARY OF FEATURES
NO. OF TXNO. OF
PART NUMBER
ICL3207E 5 3 0 250 NO NO NO ICL3217E 5 3 0 250 NO NO YES
RX
1
NO. OF MONITOR
RX (R
) DATA RATE
OUTB
RX ENABLE
(kbps)
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
FUNCTION?
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2000, 2001, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
MANUAL
POWER-
DOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Ordering Information
(NOTE 1)
PART NO.
ICL3207ECA 0 to 70 24 Ld SSOP M24.209 ICL3207ECAZ
(See Note 2)
ICL3207ECB 0 to 70 24 Ld SOIC M24.3 ICL3207ECBZ
(See Note 2)
ICL3217ECA 0 to 70 24 Ld SSOP M24.209 ICL3217ECAZ
(See Note 2)
ICL3217ECB 0 to 70 24 Ld SOIC M24.3 ICL3217ECBZ
(See Note 2)
ICL3217EIA -40 to 85 24 Ld SSOP M24.209 ICL3217EIAZ
(See Note 2)
ICL3217EIB -40 to 85 24 Ld SOIC M24.3 ICL3217EIBZ
(See Note 2)
NOTES:
1. Most surface mount devices are available on tape and reel; add “-T” to suffix.
2. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
TEMP.
RANGE (°C) PACKAGE
0 to 70 24 Ld SSOP (Pb-Free) M24.209
0 to 70 24 Ld SOIC (Pb-Free) M24.3
0 to 70 24 Ld SSOP (Pb-Free) M24.209
0 to 70 24 Ld SOIC (Pb-Free) M24.3
-40 to 85 24 Ld SSOP (Pb-Free) M24.209
-40 to 85 24 Ld SOIC (Pb-Free) M24.3
PKG.
DWG. #
Pin Descriptions
PIN FUNCTION
System power supply input (3.0V to 5.5V).
V
CC
V+ Internally generated positive transmitter supply (+5.5V).
V- Internally generated negative transmitter supply (-5.5V).
GND Ground connection.
C1+ External capacitor (voltage doubler) is connect ed to this l ead.
C1- External capacitor (voltage doubler) is connect ed to this l ead.
C2+ External capacitor (voltage inverter) is connected to this lead.
C2- External capacitor (voltage inverter) is connected to this lead.
TTL/CMOS compatible transmitter inputs.
T
IN
±15kV ESD Protected, RS-232 level (nominally ±5.5V)
T
OUT
transmitter outputs. ±15kV ESD Protected, RS-232 compatible receiver inputs.
R
IN
TTL/CMOS level receiver outputs.
R
OUT
2
Typical Operating Circuit
www.BDTIC.com/Intersil
VCC
TTL/CMOS
LOGIC LEVELS
+
0.1µF
ICL3207E, ICL3217E
ICL32X7E
9
V
CC
T
T
T
T
T
C
1
C2
T1
T2
T3
T4
T5
10
C1+
+
12
C1-
13
C2+
+
14
C2-
7
IN
6
IN
18
IN
19
IN
21
IN
C3 (OPTIONAL CONNECTION)
+
11
V+
V-
1
2
3
4
5
+
C
3
15
C4
+
2
T1
OUT
3
T2
OUT
1
T3
24
T4
20
T5
OUT
OUT
OUT
RS-232 LEVELS
- FOR V
FOR V
R1
R2
R3
= 3.3V, C1 - C4 = 0.1µF or 0.22µF
CC
= 5V, C1 - C4 = 0.1µF OR 1µF
CC
OUT
OUT
OUT
5k
5k
5k
4
R1
IN
23
R2
16
R3
RS-232
IN
LEVELS
IN
5
R
R
2
R
3
GND
1
8
22
17
3
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Absolute Maximum Ratings Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
T
IN
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
R
IN
Output Voltages
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
T
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V
R
OUT
Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
T
OUT
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θ
JA
Thermal Resistance (Typical, Note 3)
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . 300°C
(Lead Tips Only)
θ
(‘/W)
JA
Operating Conditions
Temperature Range
ICL32X7ECX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
ICL32X7EIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Electrical Specifications Test Conditions: V
Typicals are at T
PARAMETER TEST CONDITIONS
DC CHARACTERISTICS
Supply Current, Automatic Powerdown
Supply Current, Automatic Powerdown Disabled
TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low T Input Logic Threshold High T
Input Leakage Current T Output Leakage Current
(ICL3217E Only) Output Voltage Low I Output Voltage High I AUTOMATIC POWERDOWN (ICL3217E Only) Receiver Input Thresholds to
Enable Transmitters Receiver Input Thresholds to
Disable Transmitters Receiver Threshold to
Transmitters Enabled Delay (t Receiver Positive or Negative
Threshold to Transmitters Disabled Delay
RECEIVER INPUTS
Input Voltage Range Full -25 - 25 V Input Threshold Low V
Input Threshold High V
WU
)
Open (ICL3217E Only) 25 - 1.0 10 µA
All R
IN
All Outputs Unloaded 25 - 0.3 1.0 mA
IN IN
IN
= 1.6mA Full - - 0.4 V
OUT
= -1.0mA Full VCC-0.6 VCC-0.1 - V
OUT
ICL3217E Powers Up (Figure 4) Full -2.7 - 2.7 V
ICL3217E Powers Down (Figure 4) Full -0.3 - 0.3 V
= 3.3V 25 0.6 1.2 - V
CC
V
= 5.0V 25 0.8 1.5 - V
CC
= 3.3V 25 - 1.5 2.4 V
CC
= 5.0V 25 - 1.8 2.4 V
V
CC
= 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
CC
= 25°C
A
TEMP
(°C) MIN TYP MAX UNITS
Full - - 0.8 V VCC = 3.3V Full 2.0 - - V V
= 5.0V Full 2.4 - - V
CC
Full - ±0.01 ±1.0 µA
Full - ±0.05 ±10 µA
25 - 100 - µs
25 - 30 - µs
4
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Electrical Specifications Test Conditions: V
Typicals are at T
PARAMETER TEST CONDITIONS
Input Hysteresis 25 - 0.3 - V Input Resistance 25357k
TRANSMITTER OUTPUTS
Output Voltage Swing All Transmitter Outputs Loaded with 3k to Ground Full ±5.0 ±5.4 - V Output Resistance V Output Short-Circuit Current Full - ±35 ±60 mA Output Leakage Current
(ICL3217E Only)
TIMING CHARACTERISTICS
Maximum Data Rate (One Transmitter Switching)
Receiver Propagation Delay Receiver Input to Receiver
Transmitter Skew t Receiver Skew t Transition Region Slew Rate V
ESD PERFORMANCE
RS-232 Pins (T
All Other Pins Human Body Model 25 - ±2-kV
, RIN) IEC61000-4-2, Air-Gap Discharge Method 25 - ±15 - kV
OUT
= V+ = V- = 0V, Transmitter Output = ±2V Full 300 10M -
CC
= ±12V, VCC = 0V or 3V to 5.5V
V
OUT
In Automatic Powerdown
= 3.15V, C1 - C4 = 0.1µF, RL = 3kΩ, CL = 1000pF Full 250 500 - kbps
V
CC
= 3.0V, C1 - C4 = 0.22µF, RL = 3kΩ, CL = 1000pF Full 250 286 - kbps
V
CC
4.5V, C1 - C4 = 0.1µF, RL = 3kΩ, CL = 1000pF Full 250 310 - kbps
V
CC
Output, C
PHL PHL
CC
Measured From +3V to -3V or -3V to +3V
IEC61000-4-2, Contact Discharge Method 25 - ±8-kV Human Body Model 25 - ±15 - kV
= 150pF
L
- t
PLH
- t
PLH
= 3.3V, RL = 3kto 7kΩ,
= 3V to 5.5V, C1 - C4 = 0.1µF; Unless Otherwise Specified.
CC
= 25°C (Continued)
A
TEMP
(°C) MIN TYP MAX UNITS
Full - - ±25 µA
t
PHL
t
PLH
CL = 200pF to 2500pF 25 4 15 30 V/µs
= 200pF to 1000pF 25 6 15 30 V/µs
C
L
25 - 0.3 - µs
25 - 0.3 - µs Full - 200 1000 ns Full - 100 500 ns
Detailed Description
The ICL32X7E interface ICs operate from a single +3V to +5.5V power supply, guarantee a 250kbps minimum data rate, require only four small external 0.1µF capacitors, feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: charge pump, transmitters and receivers.
Charge-Pump
Intersil’s new ICL32XXE family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate ±5.5V transmitter supplies from a V supply as low as 3V. This allows these devices to maintain RS-232 compliant output levels over the ±10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1µF capacitors for the voltage doubler and inverter functions at V
CC
See the Capacitor Selection section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.
5
CC
=3.3V.
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip ±5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages.
ICL3217E transmitter outputs disable and assume a high impedance state when the device enters the automatic powerdown mode. These outputs may be driven to ±12V when disabled.
Both devices guarantee a 250kbps data rate for full load conditions (3k and 1000pF), V
3.0V, with one
CC
transmitter operating at full speed. Under more typical conditions of V
3.3V, RL=3kΩ, and CL= 250pF, one
CC
transmitter easily operates at 800kbps. Transmitter inputs float if left unconnected, and may cause
I
increases. Connect unused inputs to GND for the best
CC
performance.
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Receivers
The ICL32X7E each contain inverting receivers that convert RS-232 signals to CMOS output levels and accept inputs up to ±25V while presenting the required 3k to 7k input impedance (see Figure 1) even if the power is off (V
= 0V). The receivers’ Schmitt trigger input stage uses
CC
hysteresis to increase noise immunity and decrease errors due to slow input signal transitions.
Receivers on the ICL3207E are always active. The ICL3217E receivers disable when in the automatic powerdown state, thereby eliminating the possible current path through a shutdown peripheral’s input protection diode (see Figures 2 and 3).
Low Power Operation
These 3V devices require a nominal supply current of
0.3mA, even at V powerdown mode). This is considerably less than the 11mA current required by comparable 5V RS-232 devices, allowing users to reduce system power simply by replacing the old style device with the ICL3207E.
Low Power, Pin Compatible Replacement
Pin compatibility with existing 5V products (e.g., MAX207E), coupled with the wide operating supply range, make the ICL32X7E potential lower power, higher performance drop­in replacements for existing ‘2X7E 5V applications. As long as the ±5V RS-232 output swings are acceptable, the ICL32X7E devices should work in most 5V applications.
-25V V
FIGURE 1. INVERTING RECEIVER CONNECTIONS
V
CC
= 5.5V, during normal operation (not in
CC
V
CC
RIN
R
XIN
+25V
GND
5k
V
CC
R
GND V
V
CURRENT FLOW
XOUT
CC
ROUT
V
CC
V
CC
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
V
CC
R
X
POWERED
DOWN
UART
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
T
X
* IN AUTOMATIC
POWERDOWN
V
OUT =
HI-Z*
ICL3217E
V-
When replacing a ‘207E or ‘237E device in an existing 5V application, it is acceptable to terminate C
to VCC as shown
3
on the Typical Operating Circuit. Nevertheless, terminate C to GND if possible, as slightly better performance results from this configuration.
Automatic Powerdown (ICL3217E Only)
Even greater power savings is available by using the ICL3217E which features an automatic powerdown function. When no valid RS-232 voltages (see Figure 4) are sensed on any receiver input for 30µs, the ICL3217E automatically enters its powerdown state (see Figure 5). In powerdown, supply current drops to 1µA, because the on-chip charge pump turns off (V+ collapses to V and the receiver and transmitter outputs three-state (see Table 2). This micro-power mode makes the ICL3217E ideal for battery powered and portable applications. Invalid receiver levels occur whenever the driving peripheral’s outputs are shut off (powered down) or when the RS-232 interface cable is disconnected. The ICL3217E powers back up whenever it detects a valid RS-232 voltage level on any receiver input (such as when the RS-232 cable is reconnected). The time to recover from automatic powerdown mode is typically 100µs.
, V- collapses to GND),
CC
3
V
OUT = VCC
Rx
POWERED
DOWN
UART
Tx
GND
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
SHDN = GND
OLD
RS-232 CHIP
TABLE 2. ICL3217E AUTOMATIC POWERDOWN OPERATION
RS-232 SIGNAL
PRESENT AT
RECEIVER
INPUT?
YES Active Active Normal
NO High-Z High-Z Powerdown
6
TRANSMITTER
OUTPUTS
RECEIVER
OUTPUTS
MODE
OF
OPERATION
Operation
Due to Auto Powerdown Logic
2.7V
www.BDTIC.com/Intersil
0.3V
-0.3V
-2.7V
FIGURE 4. DEFINITION OF VALID RS-232 RECEIVER
TRANSMITTER
VALID RS-232 LEVEL - ICL3217E IS ACTIVE
INDETERMINATE - POWERDOWN MAY OR
MAY NOT OCCUR
INVALID LEVEL - POWERDOWN OCCURS AFTER 30µs
INDETERMINATE - POWERDOWN MAY OR
MAY NOT OCCUR
VALID RS-232 LEVEL - ICL3217E IS ACTIVE
LEVELS
RECEIVER
INPUTS
OUTPUTS
ICL3207E, ICL3217E
reduces ripple on the transmitter outputs and slightly reduces power consumption. C increased without increasing C increase C maintain the proper ratios (C
When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-
INVALID
}
REGION
3.15 to 3.6 0.1 0.1
, C3, and C4 can be
2
’s value, however, do not
without also increasing C2, C3, and C4 to
1
1
to the other capacitors).
1
.
TABLE 3. REQUIRED CAPACITOR VALUES
(V) C1 (µF) C2, C3, C4 (µF)
V
CC
3.0 to 3.6 0.22 0.22
4.5 to 5.5 0.1 to 1.0 0.1 to 1.0
3.0 to 5.5 0.22 0.22
AUTOPWDN
V+
V
CC
0
V-
FIGURE 5. AUTOMATIC POWERDOWN TIMING DIAGRAM
PWR UP (tWU)
This automatic powerdown feature provides additional system power savings without changes to the existing operating system or hardware.
Utilizing power management circuitry, to power down the rest of the communication circuitry (e.g., the UART) when the ICL3217E powers down, produces even greater power savings. Connecting a transition detector to the V- pin (see Figure 3) is an easy way for the power management logic to determine when the ICL3217E enters and exits powerdown.
Capacitor Selection
The charge pumps require 0.1µF, or greater, capacitors for
3.3V operation. With 0.1µF capacitors, five percent tolerance supplies (e.g., 3.14V minimum) deliver greater than ±5V transmitter swings at full data rate, while ten percent tolerance supplies (e.g., 2.97V minimum) deliver ±4.95V transmitter swings. If greater than ±5V transmitter swings are required with a 10% tolerance 3.3V supply, 0.22µF capacitors are recommended (see Table 3). Existing 5V applications typically utilize either 0.1µF or 1µF capacitors, and the ICL32X7E works well with either value. New 5V designs should use 0.22µF capacitors for the best results. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of two)
Power Supply Decoupling
In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple V capacitor of the same value as the charge-pump capacitor C
to ground with a
CC
1
Connect the bypass capacitor as close as possible to the IC.
Transmitter Outputs when Exiting Powerdown
Figure 6 shows the response of two ICL3217E transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3kin parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V.
.
5V/DIV
2V/DIV
FIGURE 6. TRANSMITTER OUTPUTS WHEN EXITING
RX
IN
VCC = +3.3V C1 - C4 = 0.1µF
TIME (20µs/DIV.)
POWERDOWN (ICL3217E ONLY)
T1
T2
.
7
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Operation down to 2.7V
ICL32X7E transmitter outputs meet RS-562 levels (±3.7V) with V
as low as 2.7V. RS-562 levels typically ensure inter
CC
operability with RS-232 devices.
High Data Rates
The ICL32XX maintain the RS-232 ±5V minimum transmitter output voltages even at high data rates. Figure 7 details a transmitter loopback test circuit, and Figure 8 illustrates the loopback test result at 120kbps. For this test, all transmitters were simultaneously driving RS-232 loads in parallel with 1000pF, at 120kbps. Figure 9 shows the loopback results for a single transmitter driving 1000pF and an RS-232 load at 250kbps. The static transmitters were also loaded with an RS-232 receiver.
V
CC
0.1µF
+
C
1
+
C
2
FIGURE 7. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV.
T1
IN
T1
OUT
R1
OUT
VCC = +3.3V C1 - C4 = 0.1µF
FIGURE 8. LOOPBACK TEST AT 120kbps
C1+
C1-
C2+
C2-
T
IN
R
OUT
+
V
CC
ICL32X7E
5µs/DIV.
T
OUT
V+
V-
R
IN
5k
+
C
3
C
4
+
1000pF
5V/DIV.
T1
IN
T1
OUT
R1
OUT
VCC = +3.3V C1 - C4 = 0.1mF
2µs/DIV.
FIGURE 9. LOOPBACK TEST AT 250kbps
Interconnection with 3V and 5V Logic
The ICL32X7E directly interface with 5V CMOS and TTL logic families. Nevertheless, with the ICL32X7E at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ICL32X7E inputs, but ICL32X7E outputs do not reach the minimum V
for these logic families. See Table 4 for
IH
more information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
SYSTEM
POWER-SUPPLY
VOLTAGE
(V)
3.3 3.3 Compatible with all CMOS
5 5 Compatible with all TTL and
5 3.3 Compatible with ACT and HCT
V
CC
SUPPLY
VOLTAGE
(V) COMPATIBILITY
families.
CMOS logic families.
CMOS, and with TTL. ICL32X7 outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
E
±15kV ESD Protection
All pins on ICL32XX devices include ESD protection structures, but the ICL32X7E incorporate advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to ±15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don’t interfere with RS-232 signals as large as ±25V.
8
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5k current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330 limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on “E” family devices can withstand HBM ESD events to ±15kV.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than
Typical Performance Curves V
6.0
4.0
2.0 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps
0
= 3.3V, TA = 25°C
CC
V
+
OUT
the HBM test. The extra ESD protection built into this device’s RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The “E” device RS-232 pins withstand ±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than ±8kV. All “E” family devices survive ±8kV contact discharges on the RS-232 pins.
25
20
15
-SLEW
-2.0
V
-
-4.0
TRANSMITTER OUTPUT VOLTAGE (V)
-6.0
FIGURE 10. TRANSMITTER OUTPUT VOLTAGE vs LOAD
1000 2000 3000 4000 50000
LOAD CAPACITANCE (pF)
CAPACITANCE
OUT
+SLEW
SLEW RATE (V/µs)
10
5
0 1000 2000 3000 4000 5000
LOAD CAPACITANCE (pF)
FIGURE 11. SLEW RATE vs LOAD CAPACITANCE
-SLEW
9
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Typical Performance Curves V
55
1 TRANSMITTER SWITCHING
50
45
40
35
30
25
SUPPLY CURRENT (mA)
20
15
0 1000 2000 3000 4000 5000
LOAD CAPACITANCE (pF)
FIGURE 12. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
250kbps
= 3.3V, TA = 25°C (Continued)
CC
120kbps
20kbps
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
ICL3207E: 469 ICL3217E: 488
3.5
3.0
2.5
2.0
1.5
1.0
SUPPLY CURRENT (mA)
0.5
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 SUPPLY VOLTAGE (V)
FIGURE 13. SUPPLY CURRENT vs SUPPLY VOLTAGE
NO LOAD ALL OUTPUTS STATIC
PROCESS:
Si Gate CMOS
10
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX AREA
123
-A­D
e
B
0.25(0.010) C AM BS
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen­sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
E
-B-
SEATING PLANE
A
-C-
M
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
GAUGE
PLANE
0.25
0.010
A2
L
C
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A - 0.078 - 2.00 ­A1 0.002 - 0.05 - ­A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.312 0.334 7.90 8.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N24 247
α 0
o
o
8
o
0
NOTESMIN MAX MIN MAX
o
8
Rev. 1 3/95
-
11
ICL3207E, ICL3217E
www.BDTIC.com/Intersil
Small Outline Plastic Packages (SOIC)
N
INDEX AREA
123
-A­D
e
B
0.25(0.010) C AM BS
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
E
-B-
SEATING PLANE
A
-C-
M
0.25(0.010) BM M
H
α
µ
A1
0.10(0.004)
L
h x 45
o
C
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 ­D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e 0.05 BSC 1.27 BSC ­H 0.394 0.419 10.00 10.65 ­h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N24 247 α 0
o
o
8
o
0
o
8
Rev. 0 12/93
NOTESMIN MAX MIN MAX
-
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold b y de scr ip tion on ly. In tersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with­out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or othe rwise under any patent or patent rights of Intersil or its subsidia ries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
12
Loading...