TM
HUF76105DK8
Data Sheet June 2000 File Number 4380.6
5A, 30V, 0.050 Ohm, Dual N-Channel,
Logic Level UltraFET Power MOSFET
This N-Channel power MOSFET is
®
manufactured using the innov ative
UltraFET™ process. This advanced
process technology achieves the
lowest possible on-resistance per silicon area, resulting in
outstanding performance. This device is capable of
withstanding high energy in the avalanche mode and the
diode exhibits very low reverse recovery time and stored
charge. It was designed for use in applications where po w er
efficiency is important, such as switching regulators, switching
converters, motor drivers, rela y driv ers , low-voltage bus
switches, and power management in portable and battery
operated products.
Formerly developmental type TA76105.
Ordering Information
PART NUMBER PACKAGE BRAND
HUF76105DK8 MS-012AA 76105DK8
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF76105DK8T.
Features
• Logic Level Gate Drive
• 5A, 30V
• Ultra Low On-Resistance, r
• Temperature Compensating PSPICE
• Temperature Compensating SABER
DS(ON)
= 0.050Ω
®
Model
©
Model
• Thermal Impedance SPICE Model
• Thermal Impedance SABER Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Symbol
D1(8)
D1(7)
S1(1)
G1(2)
Packaging
BRANDING DASH
JEDEC MS-012AA
1
2
3
4
D2(6)
D2(5)
S2(3)
G2(4)
5
1
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation. SABER™ is a trademark of Analogy, Inc.
UltraFET® is a registered trademark of Intersil Corporation.
HUF76105DK8
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
A
HUF76105DK8 UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20kΩ ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
DGR
GS
30 V
30 V
± 16 V
Drain Current
Continuous (TA= 25oC, VGS = 10V) (Figure 2) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA= 100oC, VGS = 5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Continuous (TA= 100oC, VGS = 4.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .E
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
D
D
D
DM
AS
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
5
1.4
1.3
Figure 4
Figures 6, 17, 18
2.5
0.02
-55 to 150
300
260
A
A
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ = 25oC to 125oC.
2. 50oC/W measured using FR-4 board at 1 second.
3. 228oC/W measured using FR-4 board with 0.006 in2 of copper at 1000 seconds.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV
Zero Gate Voltage Drain Current I
Gate to Source Leakage Current I
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V
Drain to Source On Resistance r
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Ambient R
SWITCHING SPECIFICATIONS (VGS = 4.5V)
Turn-On Time t
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Turn-Off Time t
DSSID
DSS
VDS = 25V, VGS = 0V - - 1 µ A
VDS = 25V, VGS = 0V, TC = 150oC - - 250 µ A
GSS
GS(TH)VGS
DS(ON)ID
VGS = ± 16V - - ± 100 nA
ID = 1.4A, VGS = 5V (Figure 9) - 0.055 0.072 Ω
ID = 1.3A, VGS = 4.5V (Figure 9) - 0.060 0.078 Ω
θ JA
Pad Area = 0.76 in2 (Note 2) - - 50
Pad Area = 0.027 in2 (See TB377) - - 191
Pad Area = 0.006 in2 (See TB377) - - 228
ON
VDD = 15V, ID≅ 1.3A,
RL = 11.5Ω , VGS= 4.5V,
d(ON)
d(OFF)
OFF
r
f
RGS = 27Ω
(Figure 15)
= 250µ A, VGS = 0V (Figure 12) 30 - - V
= VDS, ID = 250µ A (Figure 11) 1 - 3 V
= 5A, VGS = 10V (Figures 9, 10) - 0.040 0.050 Ω
o
C/W
o
C/W
o
C/W
- - 60 ns
-1 2-n s
-2 8-n s
-3 1-n s
-2 1-n s
- - 80 ns
2
HUF76105DK8
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
A
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
SWITCHING SPECIFICATIONS (V GS = 10V)
Turn-On Time t
Turn-On Delay Time t
Rise Time t
Turn-Off Delay Time t
Fall Time t
Turn-Off Time t
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q
Gate Charge at 5V Q
Threshold Gate Charge Q
Gate to Source Gate Charge Q
Gate to Drain “Miller” Charge Q
CAPACITANCE SPECIFICATIONS
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
ON
VDD = 15V, ID≅ 5A,
RL = 3Ω , VGS= 10V,
d(ON)
d(OFF)
OFF
g(TOT)VGS
g(5)
g(TH)
ISS
RGS = 27Ω
(Figure 16)
r
f
VGS = 0V to 5V - 5.3 6.4 nC
VGS = 0V to 1V - 0.35 0.45 nC
gs
gd
VDS = 25V, VGS = 0V,
f = 1MHz
OSS
RSS
(Figure 13)
= 0V to 10V VDD = 15V, ID≅ 1.4A,
RL = 10.7Ω
I
= 1.0mA
g(REF)
(Figure 14)
- - 60 ns
-1 7-n s
-2 1-n s
-6 0-n s
-2 0-n s
- - 120 ns
- 9 11 nC
- 1.00 - nC
- 2.40 - nC
- 325 - pF
- 180 - pF
-3 5-p F
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
Reverse Recovery Time t
Reverse Recovered Charge Q
Typical Performance Curves
1.2
1.0
0.8
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
TA, AMBIENT TEMPERATURE (oC)
SD
rr
RR
ISD = 5A - - 1.25 V
ISD = 1.4A 1.00 V
ISD = 1.4A, dISD/dt = 100A/µ s- - 3 9 n s
ISD = 1.4A, dISD/dt = 100A/µ s- - 4 2 n C
6
125
5
4
3
2
, DRAIN CURRENT (A)
D
I
VGS= 4.5V, R
1
0
25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (oC)
= 228oC/W
JA
θ
VGS= 10V, R
JA
θ
= 50oC/W
FIGURE 1. NORMALIZED POWER DISSIPATIONvs AMBIENT
TEMPERATURE
3
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENTvs
AMBIENT TEMPERATURE
Typical Performance Curves (Continued)
2
DUTY CYCLE - DESCENDING ORDER
1
0.5
0.2
0.1
0.05
0.02
0.01
0.1
HUF76105DK8
R
= 228oC/W
JA
θ
P
DM
, NORMALIZED
JA
θ
0.01
Z
THERMAL IMPEDANCE
0.001
-5
10
500
100
10
, PEAK CURRENT (A)
DM
I
1
10
VGS = 10V
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
-5
SINGLE PULSE
-4
10
-3
10
-2
10
-1
10
0
10
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
R
= 228oC/W
JA
θ
VGS = 5V
-4
10
-3
10
-2
10
-1
10
0
10
t, PULSE WIDTH (s)
NOTES:
DUTY FACTOR: D = t
PEAK TJ = PDM x Z
1
10
TA = 25oC
FOR TEMPERATURES
ABOVE 25
CURRENT AS FOLLOWS:
I = I
25
1
10
t
1
t
2
1/t2
x R
JA
θ
o
+ T
JA
θ
2
10
C DERATE PEAK
150 - T
A
125
2
10
A
3
10
3
10
FIGURE 4. PEAK CURRENT CAPABILITY
200
100
10
1
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS
AREA MAY BE
0.1
LIMITED BY r
DS(ON)
V
DSS(MAX)
1 10 100
, DRAIN TO SOURCE VOLTAGE (V)
V
DS
TJ = MAX RATED
= 25oC
T
A
100µ s
1ms
10ms
= 30V
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
4
20
STARTING TJ = 25oC
10
STARTING TJ = 150oC
If R = 0
, AVALANCHE CURRENT (A)
tAV = (L)(IAS)/(1.3*RATED BV
AS
I
If R ≠ 0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
1
DSS
- VDD)
DSS
- VDD) +1]
0.01 0.1 1 10
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVESWITCHING
CAPABILITY