HUF75332G3, HUF75332P3, HUF75332S3S
Data Sheet June 1999 File Number
60A, 55V, 0.019 Ohm, N-Channel UltraFET
Power MOSFETs
These N-Channel powerMOSFETs
are manufactured using the
innovative UltraFET™ process.
This advanced process technology
achieves the lowest possible on-resistance per silicon area,
resulting in outstanding performance. This device is capable
of withstanding high energy in the avalanche mode and the
diode exhibits very low reverse recovery time and stored
charge. It was designed for use in applications where power
efficiency is important, such as switching regulators,
switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable
and battery-operated products.
Formerly developmental type TA75332.
Ordering Information
PART NUMBER PACKAGE BRAND
HUF75332G3 TO-247 75332G
HUF75332P3 TO-220AB 75332P
HUF75332S3S TO-263AB 75332S
NOTE: Whenordering, use the entire part number. Add the suffix T to
obtain the TO-263AB variant in tape and reel, e.g., HUF75332S3ST.
Features
• 60A, 55V
• Simulation Models
®
- Temper ature Compensated PSPICE
and SABER
Models
- SPICE and SABER Thermal Impedance Models
Available on the WEB at: www.intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Symbol
D
G
S
4489.3
©
Packaging
DRAIN
(TAB)
JEDEC STYLE TO-247 JEDEC TO-220AB
SOURCE
DRAIN
GATE
JEDEC TO-263AB
GATE
SOURCE
DRAIN
(FLANGE)
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
94
SABER is a Copyright of Analogy, Inc. http://www.intersil.com or 407-727-9207
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
UltraFET™ is a trademark of Intersil Corporation. PSPICE® is a registered trademark of MicroSim Corporation.
| Copyright © Intersil Corporation 1999
HUF75332G3, HUF75332P3, HUF75332S3S
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Drain to Gate Voltage (RGS = 20kΩ ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
DGR
GS
55 V
55 V
± 20 V
Drain Current
Continuous (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
DM
AS
D
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
60
Figure 4
Figures 6, 14, 15
145
0.97
-55 to 175
300
260
A
W
W/oC
o
C
o
C
o
C
NOTE:
1. TJ = 25oC to 150oC.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV
Zero Gate Voltage Drain Current I
DSSID
DSS
= 250µ A, VGS = 0V (Figure 11) 55 - - V
VDS = 50V, VGS = 0V - - 1 µ A
VDS = 45V, VGS = 0V, TC = 150oC - - 250 µ A
Gate to Source Leakage Current I
GSS
VGS = ± 20V - - ± 100 nA
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V
Drain to Source On Resistance r
GS(TH)VGS
DS(ON)ID
= VDS, ID = 250µ A (Figure 10) 2 - 4 V
= 60A, VGS = 10V (Figure 9) - 0.016 0.019 Ω
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case R
Thermal Resistance Junction to Ambient R
θJC
θJA
(Figure 3) - - 1.03
TO-247 - - 30
TO-220, TO-263 - - 62
o
C/W
o
C/W
o
C/W
SWITCHING SPECIFICATIONS (VGS = 10V)
Turn-On Time t
Turn-On Delay Time t
d(ON)
Rise Time t
Turn-Off Delay Time t
d(OFF)
Fall Time t
Turn-Off Time t
ON
OFF
VDD = 30V, ID≅ 60A,
RL = 0.50Ω , VGS= 10V,
RGS = 6.8Ω
r
f
- - 100 ns
-1 2- n s
-5 5- n s
-1 1- n s
-2 5- n s
- - 55 ns
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q
Gate Charge at 10V Q
Threshold Gate Charge Q
Gate to Source Gate Charge Q
Reverse Transfer Capacitance Q
g(TOT)VGS
g(10)
g(TH)
gs
gd
= 0V to 20V VDD = 30V,
VGS = 0V to 10V - 40 50 nC
VGS = 0V to 2V - 2.5 3.0 nC
ID≅ 60A,
RL = 0.50Ω
I
= 1.0mA
g(REF)
(Figure 13)
-7 08 5n C
-6-n C
-1 5-n C
95
HUF75332G3, HUF75332P3, HUF75332S3S
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
CAPACITANCE SPECIFICATIONS
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
Reverse Recovery Time t
Reverse Recovered Charge Q
Typical Performance Curves
1.2
1.0
0.8
ISS
OSS
RSS
SD
rr
RR
VDS = 25V, VGS = 0V,
f = 1MHz
(Figure 12)
- 1300 - pF
- 480 - pF
- 115 - pF
ISD = 60A - - 1.25 V
ISD = 60A, dISD/dt = 100A/µ s- - 7 5 n s
ISD = 60A, dISD/dt = 100A/µ s - - 140 nC
80
60
0.6
0.4
0.2
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 150
TC, CASE TEMPERATURE (oC)
125 175
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
0.1
, NORMALIZED
θ JC
Z
THERMAL IMPEDANCE
0.01
-5
10
SINGLE PULSE
-4
10
-3
10
t, RECTANGULAR PULSE DURATION (s)
40
20
, DRAIN CURRENT (A)
D
I
0
25
50 75 100 125 150 175
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
P
DM
t
1
NOTES:
DUTY FACTOR: D = t1/t
PEAK TJ = PDM x Z
-2
10
-1
10
10
2
x R
θ JC
0
t
θ JC
2
+ T
C
1
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
96
HUF75332G3, HUF75332P3, HUF75332S3S
Typical Performance Curves
1000
VGS = 10V
, PEAK CURRENT (A)
100
DM
I
500
100
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
50
-5
10
-4
10
(Continued)
-3
10
t, PULSE WIDTH (s)
-2
10
FIGURE 4. PEAK CURRENT CAPABILITY
500
TJ = MAX RATED
= 25oC
T
C
100µ s
100
TC = 25oC
FOR TEMPERATURES
ABOVE 25
CURRENT AS FOLLOWS:
I = I
-1
10
If R = 0
tAV = (L)(IAS)/(1.3*RATED BV
If R ≠ 0
= (L/R)ln[(IAS*R)/(1.3*RATED BV
t
AV
o
C DERATE PEAK
175 - T
25
0
10
- VDD)
DSS
STARTING TJ = 25oC
STARTING TJ = 25oC
150
- VDD) +1]
DSS
C
1
10
10
, DRAIN CURRENT (A)
D
I
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
V
DSS(MAX)
1
1 200
DS(ON)
= 55V
10 100
1ms
10ms
VDS, DRAIN TO SOURCE VOLTAGE (V)
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
150
V
= 20V
120
90
60
, DRAIN CURRENT (A)
D
I
30
0
0 1.5 3.0 4.5 6.0 7.5
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
GS
VGS = 10V
= 7V
V
GS
PULSE DURATION = 80µ s
DUTY CYCLE = 0.5% MAX
T
= 25oC
C
V
VGS= 5V
GS
= 6V
STARTING TJ = 150oC
, AVALANCHE CURRENT (A)
AS
I
10
0.001 0.01 0.1 1 10
t
, TIME IN AVALANCHE (ms)
AV
NOTE: Refer to Intersil Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
150
PULSE DURATION = 80µ s
DUTY CYCLE = 0.5% MAX
120
90
60
, DRAIN CURRENT (A)
D
I
30
0
0 1.5 3.0 4.5 6.0 7.5
V
, GATE TO SOURCE VOLTAGE (V)
GS
25oC
-55oC
175oC
VDD = 15V
FIGURE 7. SATURATION CHARACTERISTICS FIGURE 8. TRANSFER CHARACTERISTICS
97
HUF75332G3, HUF75332P3, HUF75332S3S
Typical Performance Curves
2.5
PULSE DURATION = 80µ s
DUTY CYCLE = 0.5% MAX
= 10V, ID = 60A
V
GS
2.0
1.5
ON RESISTANCE
1.0
NORMALIZED DRAIN TO SOURCE
0.5
-40 0 40 80 120 160 200
-80
TJ, JUNCTION TEMPERATURE (oC)
(Continued)
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
1.2
ID = 250µ A
1.1
NORMALIZED GATE
THRESHOLD VOLTAGE
1.2
1.0
0.8
0.6
-40 0 40 80 120 160 200
-80
TJ, JUNCTION TEMPERATURE (oC)
VGS = VDS, ID = 250µ A
FIGURE 10. NORMALIZED GATETHRESHOLD VOLTAGEvs
JUNCTION TEMPERATURE
2000
1500
1000
C
ISS
VGS= 0V, f = 1MHz
= CGS + C
C
C
C
ISS
RSS
OSS
= C
GD
≈ CDS + C
GD
GD
1.0
BREAKDOWN VOLTAGE
NORMALIZED DRAIN TO SOURCE
0.9
-40 0 40 80 120 160 200
-80
T
, JUNCTION TEMPERATURE (oC)
J
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
10
8
6
4
2
, GATE TO SOURCE VOLTAGE (V)
GS
V
0
10 20 30 40 50 60 0
Q
NOTE: Refer to Intersil Application Notes AN7254 and AN7260.
FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
C, CAPACITANCE (pF)
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
WAVEFORMS IN
DESCENDING ORDER:
VDD = 30V
, GATE CHARGE (nC)
g
C
500
0
0 1 02 03 04 05 06 0
V
DS
ID = 60A
= 45A
I
D
= 30A
I
D
= 15A
I
D
OSS
C
RSS
, DRAIN TO SOURCE VOLTAGE (V)
98
HUF75332G3, HUF75332P3, HUF75332S3S
Test Circuits and Waveforms
V
DS
BV
DSS
L
VARY t
TO OBTAIN
P
REQUIRED PEAK I
V
GS
AS
R
G
+
V
DD
-
DUT
0V
P
I
AS
0.01Ω
0
t
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
V
I
G(REF)
DS
R
L
V
GS
+
V
DD
-
DUT
V
DD
VGS= 2V
0
I
g(REF)
0
V
GS
Q
g(TH)
Q
gs
t
P
I
AS
t
AV
Q
g(TOT)
V
DS
Q
g(10)
VGS = 10V
Q
gd
V
DS
V
DD
VGS= 20V
FIGURE 16. GATE CHARGE TEST CIRCUIT FIGURE 17. GATE CHARGE WAVEFORM
V
DS
R
L
V
GS
+
V
DD
-
V
DS
0
DUT
R
GS
V
GS
V
GS
10%
0
t
d(ON)
90%
t
ON
50%
t
10%
r
PULSE WIDTH
FIGURE 18. SWITCHING TIME TEST CIRCUIT FIGURE 19. RESISTIVE SWITCHING WAVEFORMS
99
t
d(OFF)
90%
t
OFF
50%
t
f
90%
10%