Intersil Corporation HS-RTX2010RH Datasheet

HS-RTX2010RH
Data Sheet March 2000
Radiation Hardened Real Time Express™ Microcontroller
The HS-RTX2010RH is a radiation-hardened 16-bit microcontroller with on-chip timers, an interrupt controller, a multiply-accumulator, and a barrel shifter. It is particularly well suited for space craft environments where very high speed control tasks which require arithmetically intensive calculations, including floating point math to be performed in hostile space radiation environments.
This processor incorporates two 256-word stacks with multitasking capabilities, including configurable stack partitioning and over/underflow control.
Instruction executiontimesof one or two machine cycles are achieved by utilizing a stack oriented, multiple bus architecture. The high performance ASIC Bus, which is unique to the RTX product, provides for extension of the microcontroller architecture using off-chip hardware and application specific I/O devices.
RTX Microcontrollers support the C and Forth programming languages. The advantages of this product are further enhanced through third party hardware and software support.
Combined, these features make the HS-RTX2010RH an extremely powerful processor serving numerous applications in high performance space systems. The HS-RTX2010RH has been designed for harsh space radiation environments and features outstanding Single Event Upset (SEU) resistance and excellent total dose response.
Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are contained in SMD 5962-95635. A “hot-link” is provided on our homepage for downloading. www.intersil.com/spacedefense/space.asp
Ordering Information
INTERNAL
ORDERING NUMBER
5962F9563501QXC HS8-RTX2010RH-8 55 to 125 5962F9563501QYC HS9-RTX2010RH-8 55 to 125 5962F9563501V9A HS0-RTX2010RH-Q 25 5962F9563501VXC HS8-RTX2010RH-Q 55 to 125 5962F9563501VYC HS9-RTX2010RH-Q 55 to 125 HS8-RTX2010RH/Proto HS8-RTX2010RH/Proto 55 to 125 HS9-RTX2010RH/Proto HS9-RTX2010RH/Proto 55 to 125
MKT. NUMBER
TEMP. RANGE
(oC)
File Number 3961.3
Features
• Electrically Screened to SMD # 5962-95635
• QML Qualified per MIL-PRF-38535 Requirements
• Fast 125ns Machine Cycle
• 1.2µM TSOS4 CMOS/SOS Process
• Total Dose Capability . . . . . . . . . . . . . . . . . . 300KRad(Si)
• Single Event Upset Critical LET . . . . . . . >120MeV/mg/cm
• Single Event Upset Error Rate . . . .<1 x 10
o
C - 125oC, 5V ±10% Operation
• -55
• Single Cycle Instruction Execution
• Fast Arithmetic Operations
- Single Cycle 16-Bit Multiply
- Single Cycle 16-Bit Multiply Accumulate
- Single Cycle 32-Bit Barrel Shift
- Hardware Floating Point Support
• C Software Development Environment
• Direct Execution of Fourth Language
• Single Cycle Subroutine Call/Return
• Four Cycle Interrupt Latency
• On-Chip Interrupt Controller
• Three On-Chip 16-Bit Timer/Counters
• Two On-Chip 256 Word Stacks
• ASIC Bus™ for Off-Chip Architecture Extension
• 1 Megabyte Total Address Space
• Word and Byte Memory Access
• Fully Static Design - DC to 8MHz Operation
• 84 Lead Quad Flat Package or 85 Pin Grid Array
• Third Party Software and Hardware Dev elopment Systems
NOTE: Single Event Upset error rates are Adams 10% worst case environment under worst case conditions for upset.
-10
Errors/Bit-Day
(Note)
Applications
• Space Systems Embedded Control
• Digital Filtering
• Image Processing
• Scientific Instrumentation
• Optical Systems
• Control Systems
• Attitude/Orbital Control
2
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
Real Time Express™, RTX™, and ASIC Bus™ are trademarks of Intersil Corporation.
| Copyright © Intersil Corporation 2000
Block Diagram
HS-RTX2010RH
CONTROL
INPUTS
INTERRUPT
INPUTS
TIMER
INPUTS
CLOCK AND
CONFIGURATION
CONTROL
INTERRUPT
CONTROL
TIMER/
COUNTERS
BARREL SHIFTER
OFF CHIP
PERIPHERALS
ASIC BUS
INTERFACE
RTX CORE
PROCESSOR
MAC
MAIN
MEMORY
MEMORY BUS
INTERFACE
MEMORY
PAGE
CONTROL
HS-RTX2010RH
256-WORD
RETURN
STACK
STACK
CONTROLLERS
256-WORD
PARAMETER
STACK
Pinouts
HS8-RTX2010RH
MIL-STD-1835 CMGA3-P85C
BACDEFGHJKL
11
MD08
MD07
MD11
10
PIN A1
MD09
MD12
MD10
9
MD14
MD13
8
GA00
MD15
7
GND
TCLK
6
INTA
5
4
3
2 RESET
1
NMI
VDD MA02 MA03E I1
E I2 GD14 GD11 GD10E I4
E I3 WAIT GD13 GD12 GD06 GD03 GD02 GD00GD08
E I5 GD15
ICLK
ABCDEFGHJKL
NOTE: An overbar on a signal name represents an active LOW signal.
MD06
VDD
GA01
GA02
INT-
SUP
GR/W
GND
MD05
GIO
MD02
MD01
MD03
NEW
MD04
MD00
HS-RTX2010RH
TOP VIEW
PINS DOWN
GND
GD07
PCLK
BOOT
MR/
UDS
LDS
W
VDD
GND
MA18
GND
MA08
MA04
GD05
MA19
MA16
MA17
MA14
VDD
MA15
MA13
MA12
MA10
MA09
MA07
MA11
MA05
MA06
GD01 MA01
GD04
GNDGD09
MA16
MA14
VDD
MA12
MA09
MA11
MA06
MA03
MA01
GD00
GND
MA19
MA17
MA15
MA13
MA10
MA07
MA05
MA02
GD01
GD02
GD04
GND
MA18
GND
MA08
MA04
GD03
GD05
UDS PCLK
LDS
BOOT
MR/
BOTTOM VIEW
GD10
GD06
GD08
VDD
GD09
MD01
NEW
W
MD00
PINS UP
GD11
GD12
GD07
MD02
MD03
MD04
GD14
GD13
GND
CJKLHGFEDBA
MD10
MD13
W
MD07
MD09
MD15
GND
E I1
E I4
ICLK
MD08
MD11
MD12
MD14
GA00
TCLK
INTA
VDD
E I2
E I5
GND
MD06
MD05
VDD
GA01
GA02
INTSUP NMI
ALIGN.
PIN
GIO
WAIT RESET E I3
GR/
GD15
CJKLHGFEDBA
PIN
A1
11
10
9
8
7
6
5
4
3
2
1
2
Pinouts (Continued)
HS-RTX2010RH
HS9-RTX2010RH
(LEAD LENGTH NOT TO SCALE) SEE INTERSIL OUTLINE R84.A
RESET
WAIT
ICLK
GR/W
GIO GD15 GD14 GD13
GND GD12 GD11 GD10 GD09 GD08 GD07
VDD GD06 GD05 GD04 GD03
GND
EI5
EI2
EI3
EI4
8
9
10
11
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
36
35
34
GD00
GD01
GD02
MA01
VDD
EI1
38
37
MA03
MA02
INTSUP
567
39
MA04
NMI
4
HS-RTX2010RH
40
MA05
NOTE: An overbar on a signal name represents an active LOW signal.
PGA And CQFP Pin/Signal Assignments
PGA
CQFP
PIN
1 C6 GA02 Output; Address Bus 2 A6 TCLK Output 3 A5 INTA Output 4 B5 NMI Input 5 C5 INTSUP Input 6 A4 VDD Power 7 B4 EI1 Input 8 A3 EI2 Input
9 A2 EI3 Input 10 B3 EI4 Input 11 A1 EI5 Input 12 B2 RESET Input 13 C2 WAIT Input 14 B1 ICLK Input 15 C1 GR/W Output 16 D2 GIO Output 17 D1 GD15 I/O; Data Bus 18 E3 GD14 I/O; Data Bus 19 E2 GD13 I/O; Data Bus 20 E1 GND Ground 21 F2 GD12 I/O; Data Bus 22 F3 GD11 I/O; Data Bus 23 G3 GD10 I/O; Data Bus
SIGNAL
NAME TYPE
GA02
TCLK
INTA
1
2
3
TOP VIEW
43
42
41
MA08
MA07
MA06
MD09
MD10
MD11
MD12
MD13
MD14
GND
MD15
GA00
GA01
75
76
77
78
79
80
81
82
83
84
44
GND
46
45
MA10
MA09
48
47
MA12
MA11
MA13
503349
VDD
52
51
MA15
MA14
74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54
53
MA16
MD08 VDD MD07 MD06 MD05 GND MD04 MD03 MD02 MD01 MD00 MR/ PCLK BOOT NEW UDS LDS GND MA19 MA18 MA17
W
PGA And CQFP Pin/Signal Assignments
PGA
CQFP
PIN
24 G1 GD09 I/O; Data Bus 25 G2 GD08 I/O; Data Bus 26 F1 GD07 I/O; Data Bus 27 H1 VDD Power 28 H2 GD06 I/O; Data Bus 29 J1 GD05 I/O; Data Bus 30 K1 GD04 I/O; Data Bus 31 J2 GD03 I/O; Data Bus 32 L1 GND Ground 33 K2 GD02 I/O; Data Bus 34 K3 GD01 I/O; Data Bus 35 L2 GD00 I/O; Data Bus 36 L3 MA01 Output; Address Bus 37 K4 MA02 Output; Address Bus 38 L4 MA03 Output; Address Bus 39 J5 MA04 Output; Address Bus 40 K5 MA05 Output; Address Bus 41 L5 MA06 Output; Address Bus 42 K6 MA07 Output; Address Bus 43 J6 MA08 Output; Address Bus 44 J7 GND Ground 45 L7 MA09 Output; Address Bus 46 K7 MA10 Output; Address Bus
SIGNAL
NAME TYPE
(Continued)
3
HS-RTX2010RH
PGA And CQFP Pin/Signal Assignments
PGA
CQFP
47 L6 MA11 Output; Address Bus 48 L8 MA12 Output; Address Bus 49 K8 MA13 Output; Address Bus 50 L9 VDD Power 51 L10 MA14 Output; Address Bus 52 K9 MA15 Output; Address Bus 53 L11 MA16 Output; Address Bus 54 K10 MA17 Output; Address Bus 55 J10 MA18 Output; Address Bus 56 K11 MA19 Output; Address Bus 57 J11 GND Ground 58 H10 LDS Output 59 H11 UDS Output 60 F10 NEW Output 61 G10 BOOT Output 62 G11 PCLK Output 63 G9 MR/W Output 64 F9 MD00 I/O; Data Bus 65 F11 MD01 I/O; Data Bus
PIN
SIGNAL
NAME TYPE
(Continued)
PGA And CQFP Pin/Signal Assignments
PGA
CQFP
66 E11 MD02 I/O; Data Bus 67 E10 MD03 I/O; Data Bus 68 E9 MD04 I/O; Data Bus 69 D11 GND Ground 70 D10 MD05 I/O; Data Bus 71 C11 MD06 I/O; Data Bus 72 B11 MD07 I/O; Data Bus 73 C10 VDD Power 74 A11 MD08 I/O; Data Bus 75 B10 MD09 I/O; Data Bus 76 B9 MD10 I/O; Data Bus 77 A10 MD11 I/O; Data Bus 78 A9 MD12 I/O; Data Bus 79 B8 MD13 I/O; Data Bus 80 A8 MD14 I/O; Data Bus 81 B6 GND Ground 82 B7 MD15 I/O; Data Bus 83 A7 GA00 Output; Address Bus 84 C7 GA01 Output; Address Bus
- C3 - Isolated Alignment Pin
PIN
SIGNAL
NAME TYPE
(Continued)
Output Signal Descriptions
RESET
SIGNAL CQFP OUTPUTS
NEW 60 1 NEW: A HIGH on this pin indicates that an Instruction Fetch is in progress. BOOT 61 1 BOOT: A HIGH on this pin indicates that Boot Memory is being accessed. This pin can be set or reset by accessing
MR/W 63 1 MEMORY READ/WRITE: A LOW on this pin indicates that a Memory Write operation is in progress. UDS 59 1 UPPER DATA SELECT: A HIGH on this pin indicates that the high byte of memory (MD15-MD08) is being
LDS 58 1 LOWER DATA SELECT: A HIGH on this pin indicates that the low byte of memory (MD07-MD00) is being
GIO 16 1 ASIC I/O: A LOW on this pin indicates that an ASIC Bus operation is in progress. GR/W 15 1 ASIC READ/WRITE: A LOW on this pin indicates that an ASIC Bus Write operation is in progress. PCLK 62 0 PROCESSOR CLOCK: Runs at half the frequency of ICLK. All processor cycles begin on the rising edge of PCLK.
TCLK 2 0 TIMING CLOCK: Same frequency and phase as PCLK but continues running during Wait cycles. INTA 3 0 INTERRUPT ACKNOWLEDGE: A HIGH on this pin indicates that an Interrupt Acknowledge cycle is in progress.
LEVEL DESCRIPTION
bit 3 of the Configuration Register.
accessed.
accessed.
Held low extra cycles when WAIT is asserted.
Input Signal, Bus, and Power Connection Descriptions
CQFP
SIGNAL
INPUTS
WAIT 13 WAIT: A HIGH on this pin causes PCLK to be held LOW and the current cycle to be extended. ICLK 14 INPUT CLOCK: Internally divided by 2 to generate all on-chip timing (CMOS input levels). RESET 12 A HIGH level on this pin resets the RTX. Must be held high for at least 4 rising edges of ICLK plus 12 ICLK cycle
LEAD DESCRIPTION
setup and hold times.
4
HS-RTX2010RH
Input Signal, Bus, and Power Connection Descriptions (Continued)
CQFP
SIGNAL
EI2, EI1 8, 7 EXTERNALINTERRUPTS 2, 1: Active HIGH level-sensitive inputs to the Interrupt Controller. Sampled on the rising
EI5-EI3 11-9 EXTERNAL INTERRUPTS 5, 4, 3: Dual purpose inputs; active HIGH level-sensitive Interrupt Controller inputs;
NMI 4 NON-MASKABLE INTERRUPT: Active HIGH edge-sensitive Interrupt Controller input capable of interrupting any
INTSUP 5 INTERRUPT SUPPRESS: A HIGH on this pin inhibits all maskable interrupts, internal and external.
ADDRESS BUSES (OUTPUTS)
GA02 1 ASIC ADDRESS: 3-bit ASIC Address Bus, which carries address information for external ASIC devices. GA01 84 GA00 83 MA19-MA14 56-51 MEMORY ADDRESS: 19-bit Memory Address Bus, which carries address information for Main Memory. MA13-MA09 49-45 MA08-MA01 43-36
DATA BUSES (I/O)
GD15-GD13 17-19 ASIC DATA: 16-bit bidirectional external ASIC Data Bus, which carries data to and from off-chip I/O devices. GD12-GD07 21-26 GD06-GD03 28-31 GD02-GD00 33-35 MD15 82 MEMORY DATA: 16-bit bidirectional Memory Data Bus, which carries data to and from Main Memory. MD14-MD08 80-74 MD07-MD05 72-70 MD04-MD00 68-64
POWER CONNECTIONS
VDD 6, 27,
GND 20, 32,
LEAD DESCRIPTION
edge of PCLK. See Timing Diagrams for detail.
active HIGH edge-sensitive Timer/Counter inputs. As interrupt inputs, they are sampled on the rising edge of PCLK. See Timing Diagrams for detail.
processor cycle when NMI is set to Mode 0. See the Interrupt Suppression and Interrupt Controller Sections.
Power supply +5V connections. A 0.1µF, low impedance decoupling capacitor should be placed between VDD and
50, 73
GND. This should be located as close to the RTX package as possible. Power supply ground return connections.
44, 57,
69, 81
TYPICAL
CLOCK OR
STROBE
TYPICAL
INPUT
TYPICAL
OUTPUT
TYPICAL
DAT A
OUTPUT
4.0V
0.5V
4.0V
0.5V
t
PULSE WIDTH
2.25V
t
DELAY
t
VALID
t
SETUP
2.25V
2.25V
2.75V
1.75V
t
PULSE WIDTH
2.25V
t
HOLD
2.25V
t
DELAY
t
HOLD
2.75V
1.75V
FIGURE 1. AC DRIVE AND MEASURE POINTS - CLK INPUT
5
2.25V
2.25V
Timing Diagrams
ICLK
HS-RTX2010RH
t
1
t
t
3
2
t
TCLK
WAIT
PCLK
(NOTE 1)
PCLK
(NOTE 2)
GIO
(NOTE 3)
11
t
13
t
15
t
17
t
51
t
19
t
12
t
5
t
20
t
16
t
20
t
4
t
5
t
50
t
4
NOTES:
1. NORMAL CYCLE: This waveform describes a normal PCLK cycle and a PCLK cycle with a Wait state.
2. EXTENDED CYCLE: This waveform describes a PCLK cycle for a USER memory access or an external ASIC Bus read cycle when the CYCEXT bit or ARCE bit is set.
3. EXTENDED CYCLE: This waveform describes a GIO cycle for an external ASIC Bus read when the ARCE bit is set.
4. An active HIGH signal on the RESET input is guaranteed to reset the processor if its duration is greater than or equal to 4 rising edges of ICLK plus 1/2 ICLK cycle setup and hold times. If the RESET input is active for less than four rising edges of ICLK, the processor will not reset.
FIGURE 2. CLOCK AND WAIT TIMING
EI5 - EI3
t
6
t
7
t
8
FIGURE 3. TIMER/COUNTER TIMING
6
Timing Diagrams (Continued)
PCLK
HS-RTX2010RH
MA
LDS
UDS
NEW
BOOT
MR/
MD
MD
OUT
t
26
t
29
t
W
IN
t
t
34
32
21
t
28
t
31
t
22
t
35
t
33
NOTES:
5. If both LDS and UDS are low, no memory access is taking place in the current cycle. This only occurs during streamed instructions that do not access memory.
6. During a streamed single cycle instruction, the Memory Data Bus is driven by the processor.
FIGURE 4. MEMORY BUS TIMING
ICLK
GIO
PCLK
GR/
OUT
GA
GD
GD
t
50
t
48
t
52
t
56
W
IN
t
61
t
49
t
40A, B
t
41A, B
t
62
t
51
t
69
t
54
t
58
t
43
t
42
t
65
t
63
NOTES:
7. GIO remains high for internal ASIC bus cycles.
8. GR/W goes low and GD is driven for all ASIC write cycles, including internal ones.
9. During non-ASIC write cycles, GD is not driven by the HS-RTX2010RH. Therefore, it is recommended that all GD pins be pulled to VCC or GND to minimize power supply current and noise.
10. t
40B
and t
specifications are for Streamed Mode of operation only.
41B
FIGURE 5. ASIC BUS TIMING
7
Timing Diagrams (Continued)
HS-RTX2010RH
PCLK
INTSUP
INTA
MA
e
EI
e
1
2
t
44
e
3
t
46t47
e
4
t
46t47
e
5
t
67
t
26
INT VECTOR
t
68
t
28
NOTES:
11. Events in an interrupt sequence are as follows: e1. The Interrupt Controller samples the interrupt request inputs on the rising edge of PCLK. If NMI rises between e1and the rising edge of
PCLK prior to e5, the interrupt vector will be for NMI. e2. If any interrupt requests were sampled, the Interrupt Controller issues an interrupt request to the core on the falling edge of PCLK. e3. The core samples the state of the interrupt requests from the Interrupt Controller on the falling edge of PCLK. If INTSUP is high, maskable
interrupts will not be detected at this time. e4. When the core samples an interrupt request on the falling edge of PCLK, an Interrupt Acknowledge cycle will begin on the next rising edge
of PCLK. e5. Following the detection of an interrupt request by the core, an Interrupt Acknowledge cycle begins. The interrupt vector will be based on the
highest priority interrupt request active at this time.
12. t44 is only required to determine when the Interrupt Acknowledge cycle will occur.
13. Interrupt requests should be held active until the Interrupt Acknowledge cycle for that interrupt occurs.
FIGURE 6. INTERRUPT TIMING: WITH INTERRUPT SUPPRESSION
PCLK
INTSUP
INTA
MA
EI
e
e
1
2
t
44
e
4
t
46t47
e
5
t
67
t
26
INT VECTOR
t
68
t
28
FIGURE 7. INTERRUPT TIMING: WITH NO INTERRUPT SUPPRESSION
8
Timing Diagrams (Continued)
HS-RTX2010RH
e
1
PCLK
t
44
NMI
INTA
MA
NOTES:
14. Events in an interrupt sequence are as follows: e1. The Interrupt Controller samples the interrupt request inputs on the rising edge of PCLK. If NMI rises between e1and the rising edge of
PCLK prior to e5, the interrupt vector will be for NMI. e2. If any interrupt requests were sampled, the Interrupt Controller issues an interrupt request to the core on the falling edge of PCLK. e4. When the core samples an interrupt request on the falling edge of PCLK, an Interrupt Acknowledge cycle will begin on the next rising edge
of PCLK. e5. Following the detection of an interrupt request by the core, an Interrupt Acknowledge cycle begins. The interrupt vector will be based on the
highest priority interrupt request active at this time.
15. t44 is only required to determine when the Interrupt Acknowledge cycle will occur.
16. Interrupt requests should be held active until the Interrupt Acknowledge cycle for that interrupt occurs.
17. NMI has a glitch filter which requires the signal that initiates NMI last at least two rising and two falling edges of ICLK.
FIGURE 8. NON-MASKABLE INTERRUPT TIMING
e
2
e
e
4
5
t
67
t
26
NMI
VECTOR
t
68
t
28
HS-RTX2010RH Microcontroller
The HS-RTX2010RH is designed around the RTX Processor core, which is part of the Intersil Standard Cell Library.
This processor core has eight 16-bit internal registers, an ALU, internal data buses, and control hardware to perform instruction decoding and sequencing.
On-chip peripherals which the HS-RTX2010RH includes are Memory Page Controller, an Interrupt Controller, three Timer/Counters, and two Stack Controllers. Also included are a Multiplier-Accumulator (MAC), a Barrel Shifter, and a Leading Zero Detector for floating point support.
Off-chip user interfaces provide address and data access to Main Memory and ASIC I/O devices, user defined interrupt signals, and Clock/Reset controls.
Figure 9 shows the data paths between the core, on-chip peripherals, and off-chip interfaces.
The HS-RTX2010RH microcontroller is based on a two-stack architecture. These two stacks, which are Last-In-First-Out (LIFO) memories, are called the Parameter Stack and the Return Stack.
Two internal registers, and , provide the top two elements of the 16-bit wide Parameter Stack, while the
TOP NEXT
remaining elements are contained in on-chip memory (“stack memory”).
The top element of the Return Stack is 21 bits wide, and is stored in registers and , while the remaining
I IPR
elements are contained in stack memory. The highly parallel architecture of the RTX is optimized for
minimal Subroutine Call/Return overhead. As a result, a Subroutine Call takes one Cycle, while a Subroutine Return is usually incorporated into the preceding instruction and does not add any processor cycles. This parallelism provides for peak execution rates during simultaneous bus operations which can reach the equivalent of 32 million Forth language operations per second at a clock rate of 8MHz. Typical execution rates exceed 8 million operations per second.
Intersil factory applications support for this device is limited. RTS-C C-Compiler support is provided by Highland Software at highlandsoft@compuserve.com. Development system tools are supported by Micro Processor Engineering Limited (UK) at 441 703 631441. A HS-RTX2010RH programmers reference manual can be obtained through your local Intersil Sales Office.
9
OFF-CHIP USER INTERFACES
MA01
MA19-
UDS
LDS
NEW
BOOT
MR/W
MD15-
MD00
HS-RTX2010RH
GIO
GA2-
GR/W
GA0
GD15-
GD00
INTA
NMI
INTSUP
EI5-EI3
EI2-EI1
ICLK
WAIT
PCLK
TCLK
RESET
+1
PC
INSTRUCTION
MEMORY BUS
INTERFACE
BYTE
SWAP
IR
DECODER
NEXT
256 x 16
PARAMETER
STACK
MEMORY
HS-RTX2010RH
-1
I
256 x 21 RETURN
STACK
MEMORY
NOTE: contains the 5 most significant bits (20-16) of the top element of the Return Stack.
IPR
ASIC BUS
INTERFACE
TOPCR MD SR
YT
ALU
MEMORY
PAGE
CONTROL
(NOTE)
STACK
CONTROL
IPR
DPR UPR CPR UBR
SPR SVR SUR
FIGURE 9. HS-RTX2010RH FUNCTIONAL BLOCK DIAGRAM
INTERRUPT
CONTROL
IMR IVR IBC
TIMER/COUNTERS
TC0 TC1 TC2
BARREL SHIFTER
LEADING ZERO
DETECTOR
16 x 16
MAC
MXR MHR MLR
CLOCK AND
CONTROLRESET
TP0 TP1 TP2
HS-RTX2010RH Operation
Control of all data paths and the Program Counter Register, ( ), is provided by the Instruction Decoder. This hardware
PC
determines what function is to be performed by looking at the contents of the Instruction Register, ( ), and subsequently determines the sequence of operations through data path control.
Instructions which do not perform memory accesses execute in a single clock cycle while the next instruction is being fetched.
As shown in Figure 10, the instruction is latched into at the beginning of a clockcycle. The instructionis then decoded by the processor. All necessary internal operations are performed simultaneously with fetching the ne xt instruction.
IR
IR
Instructions which access memory require two clock cycles to be executed. During the first cycle of a memory access instruction, the instruction is decoded, the address of the memory location to be accessed is placed on the Memory Address Bus (MA19-MA01), and the memory data (MD15-MD00), is read or written. During the second cycle, ALU operations are performed, the address of the next instruction to be executedis placed on the Memory Address Bus, and the next instruction is fetched, as indicated in the bottom half of Figure 10.
10
PCLK
HS-RTX2010RH
EXECUTION SEQUENCE WITH NO MEMORY DATA ACCESS:
BEGIN FIRST CLOCK CYCLE
PERFORM INTERNAL OPERATIONS AND
ALU OPERATIONS, AS REQUIRED
INSTRUCTION
LATCHES INTO
IR
EXECUTION SEQUENCE WITH MEMORY DATA ACCESS:
BEGIN FIRST CLOCK CYCLE
INSTRUCTION
LATCHES
INTO
IR
ADDRESS OF
INSTRUCTION
IS PLACED ONTO
MA19-MA01
DECODE
ADDRESS OF
MEMORY
LOCATION
IS PLACED ONTO
MA19-MA01
DECODE
CONCURRENT
OPERATIONS
NEXT
BUS
ASIC BUS OPERATIONS
READ OR WRITE
MEMORY DATA
BUS
FETCH
END OF
FIRST
CLOCK
CYCLE
END OF
FIRST
CLOCK
CYCLE
BEGIN SECOND CLOCK CYCLE
BEGIN SECOND CLOCK CYCLE
PLACE ADDRESS OF
NEXT INSTRUCTION
ONTO MA19-MA01
CONCURRENT
OPERATIONS
PERFORM ALU OPERATIONS
FETCH NEXT
INSTRUCTION
END OF
SECOND
CLOCK
CYCLE
FIGURE 10. INSTRUCTION EXECUTION SEQUENCE
RTX Data Buses and Address Buses
The RTX core bus architecture provides for unidirectional data paths and simultaneous operation of some data buses. This parallelism allows for maximum efficiency of data flow internal to the core.
Addresses for accessing external (off-chip) memory or ASIC devices are output via either the Memory Data Bus (MA19-MA01) or the ASIC Address Bus (GA02-GA00). See Table 3. External data is transferred by the ASIC Data Bus (GD15-GD00) and the Memory Data Bus (MD15-MD00), both of which are bidirectional.
RTX Internal Registers
The core of the HS-RTX2010RH is a macrocell available through the Intersil Standard Cell Library. This core contains eight 16-bit internal registers, which may be accessed implicitly or explicitly, depending upon the register accessed and the function being performed.
: The Top Register contains the top element of the
TOP
Parameter Stack++. is the implicit data source or destination for certain instructions, and has no ASIC address assignment. The contents of this register may be directed to any I/O device or to any processor register except the Instruction Register. is also the T input to the ALU. Input to must come through the ALU. This register
TOP
TOP
TOP
also holds the most significant 16 bits of 32-bit products and 32-bit dividends.
: The Next Register holds the second element of the
NEXT
Parameter Stack. is the implicit data source or
EXT
destination for certain instructions, and has no ASIC address assignment. During a stack “push”, the contents of are transferred to stack memory, and the contents of are put into . This register is used to hold the least
NEXT
NEXT
TOP
significant 16 bits of 32-bit products. Memory data is accessed through , as described in the Memory
NEXT
Access section of this document.
: The Instruction Register is actually a latch which
IR
contains the instruction currently being executed, and has no ASIC address assignment. In certain instructions, an operand can be embedded in the instruction code, making
the implicit source for that operand (as in the case of
IR
short literals). Input to this register comes from Main Memory (see Tables 6 thru 22 for code information).
: The Configuration Register is used to indicate and
CR
control the current status/setup of the RTX microcontroller, through the bit assignments shown in Figure 11. This register is accessed explicitly through read and write operations, which cause interrupts to be suppressed for one cycle, guaranteeing that the next instruction will be performed before an Interrupt Acknowledge cycle is allowed to be performed.
11
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