Intersil Corporation HS-82C85RH Datasheet

August 1995
HS-82C85RH
Radiation Hardened
CMOS Static Clock Controller/Generator
Features
• Radiation Hardened
- Total Dose > 10
- Transient Upset > 10
- Latch Up Free EPI-CMOS
• Very Low Power Consumption
• Pin Compatible with NMOS 8285 and Intersil 82C85
• Generates System Clocks for Microprocessors and Peripherals
• Complete Control Over System Clock Operation for Very Low System Power
- Stop-Oscillator
- Stop-Clock
- Low Frequency (Slo) Mode
- Full Speed Operation
• DC to 15MHz Operation (DC to 5MHz System Clock)
• Generates Both 50% and 33% Duty Cycle Clocks (Synchronized)
• Uses Either Parallel Mode Crystal Circuit or External Frequency Source
• Hardened Field, Self-Aligned, Junction Isolated CMOS Process
• Single 5V Supply
• Military Temperature Range -55
5
RAD (Si)
8
RAD (Si)/s
o
C to +125oC
Description
The Intersil HS-82C85RH is a high performance, radiation hardened CMOS Clock Controller/Generator designed to support systems utilizing radiation hardened static CMOS microprocessors such as the HS-80C86RH. The HS-82C85RH contains a crystal controlled oscillator, reset pulse conditioning, halt/restart logic, and divide-by-256 circuitry. These features provide the means to stop the system clock, stop the clock oscillator, or run the system at a low frequency (CLK/256), enhancing control of static system power dissipation and allowing system shut-down during periods of external stress.
Static CMOS circuit design insures low operating power and permits operation with an external frequency source from DC to 15MHz. Crystal controlled operation to 15MHz is guaranteed with the use of a parallel, fundamental mode crystal and two small load capacitors. Outputs are guaranteed compatible with both CMOS and TTL specifications. The Inter­sil hardened field CMOS process results in performance equal to or greater than existing radiation resistant products at a fraction of the power.
Pinouts
24 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T24
TOP VIEW
CSYNC
READY
SLO/FST
FLATPACK PACKAGE (FLATPACK)
CSYNC
PCLK AEN1 RDY1
READY
RDY2 AEN2
CLK
GND
CLK50
START
SLO/FST
1 2
PCLK
3
AEN1
RDY1
4 5 6
RDY2
7
AEN2
8
CLK
9
GND
10
CLK50
11
START
12
24 LEAD CERAMIC METAL SEAL
MIL-STD-1835 CDFP4-F24
TOP VIEW
1 2 3 4 5 6 7 8 9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
24 23 22 21 20 19 18 17 16 15 14 13
VDD X1 X2 ASYNC EFI F/C OSC RES RESET S2/STOP S1 S0
VDD X1 X2 ASYNC EFI F/ OSC RES RESET S2/STOP S1 S0
C
Ordering Information
PART NUMBER TEMPERATURE RANGE PACKAGE
HS1-82C85RH-Q -55oC to +125oC 24 Lead SBDIP HS1-82C85RH-8 -55oC to +125oC 24 Lead SBDIP HS1-82C85RH/Sample +25oC 24 Lead SBDIP HS9-82C85RH/Proto -55oC to +125oC 24 Lead Ceramic Flatpack HS9-82C85RH-Q -55oC to +125oC 24 Lead Ceramic Flatpack HS9-82C85RH-8 -55oC to +125oC 24 Lead Ceramic Flatpack HS9-82C85RH/Sample +25oC 24 Lead Ceramic Flatpack
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
992
Spec Number
518061
File Number 3044.1
DB NA
HS-82C85RH
Pin Description
PIN
PIN
X1 X2
EFI 20 I EXTERNAL FREQUENCY IN: When F/C is HIGH, CLK is generated from the EFI input signal.
F/C 19 I FREQUENCY/CRYSTAL SELECT: F/C selects either the crystal oscillator or the EFI input as the
START 11 I A low-to-high transition on START will restart the CLK, CLK50 and PCLK outputs after the
S0 S1
S2/STOP
SLO/FST 12 I SLO/FST is a level-triggered input. When HIGH, the CLK and CLK50 outputs run at the maximum
CLK 8 O PROCESSOR CLOCK: CLK is the clock output used by the HS-80C86RH processor and other
CLK50 10 O 50% DUTY CYCLE CLOCK: CLK50 is an auxiliary clock with a 50% duty cycle and is synchro-
PCLK 2 O PERIPHERAL CLOCK: PCLK is a peripheral clock signal whose output frequency is equal to the
OSC 18 O OSCILLATOR OUTPUT: OSC is the output of the internal oscillator circuitry. Its frequency is
NUMBER TYPE DESCRIPTION
23 22
13 14 15
I
CRYSTAL CONNECTIONS: X1 and X2 are the crystal oscillator connections. The crystal
O
frequency must be three times the maximum desired processor clock frequency. X1 is the oscillator circuit input and X2 is the output of the oscillator circuit.
This input signal should be a square wave with a frequency of three times the maximum desired CLK output frequency.
main frequency source. When F/C is LOW, the HS-82C85RH clocks are derived from the crystal oscillator circuit. When F/C is HIGH, CLK is generated from the EFI input. F/C cannot be dynam­ically switched during normal operation.
appropriate restart sequence is completed. When in the crystal mode (F/C LOW) with the oscillator stopped, the oscillator will be restarted
when a Start command is received. The CLK, CLK50 and PCLK outputs will start after the oscil­lator input signal (X1) reaches the Schmitt trigger input threshold and an 8K internal counter reaches terminal count. If F/C is HIGH (EFI mode), CLK, CLK50 and PCLK will restart within 3 EFI cycles after START is recognized.
The HS-82C85RH will restart in the same mode (SLO/FST) in which it stopped. A high level on START disables the STOP mode.
I
S2/STOP, S1, S0 are used to stop the HS-82C85RH clock outputs (CLK, CLK50, PCLK) and are
I
sampled by the rising edge of CLK. CLK, CLK50 and PCLK are stopped byS2/STOP,S1, S0 being
I
in the LHH state on the low-to-high transition of CLK. This LHH state must follow a passive HHH state occurring on the previous low-to-high CLK transition. CLK and CLK50 stop in the high state. PCLK stops in it’s current state (high or low).
When in the crystal mode (F/C) low and a STOP command is issued, the HS-82C85RH oscillator will stop along with the CLK, CLK50 and PCLK outputs. When in the EFI mode, only the CLK, CLK50 and PCLK outputs will be halted. The oscillator circuit if operational, will continue to run. The oscillator and/or clock is restarted by the START input signal going true (HIGH) or the reset input (RES) going low.
frequency (crystal or EFI frequency divided by 3). When LOW, CLK and CLK50 frequencies are equal to the crystal or EFI frequency divided by 768. SLO/FST mode changes are internally synchronized to eliminate glitches on the CLK and CLK50. START and STOP control of the oscillator or EFI is available in either the SLOW or FAST frequency modes.
The SLO/FST input must be held LOW for at least 195 OSC/EFI clock cycles before it will be recognized. This eliminates unwanted frequency changes which could be caused by glitches or noise transients. The SLO/FST input must be held HIGH for at least 6 OSC/EFI clock pulses to guarantee a transition to FAST mode operation.
peripheral devices. When SLO/FST is high, CLK has an output frequency which is equal to the crystal or EFI input frequency divided by three. When SLO/FST is low, CLK has an output frequen­cy which is equal to the crystal or EFI input frequency divide by 768. CLK has a 33% duty cycle.
nized to the falling edge of CLK. When SLO/FST is high, CLK50 has an output frequency which is equal to the crystal or EFI input frequency divided by 3. When SLO/FST is low, CLK50 has an output frequency equal to the crystal or EFI input frequency divided by 768.
crystal or EFI input frequency divided by six and has a 50% duty cycle. PCLK frequency is unaffected by the state of the SLO/FST input.
equal to that of the crystal oscillator circuit. OSC is unaffected by the state of the SLO/FST input. When the HS-82C85RH is in the crystal mode (F/C LOW) and a STOP command is issued, the
OSC output will stop in the HIGH state. When the HS-82C85RH is in the EFI mode (F/C HIGH), the oscillator (if operational) will continue to run when a STOP command is issued and OSC remains active.
993
Spec Number 518061
HS-82C85RH
Pin Description
(Continued)
PIN
PIN
NUMBER TYPE DESCRIPTION
RES 17 I RESET IN: RES is an active LOW signal which is used to generate RESET. The HS-82C85RH
provides a Schmitt trigger input so that an RC connection can be used to establish the power-up reset of proper duration. RES starts crystal oscillator operation.
RESET 16 O RESET: RESET is an active HIGH signal which is used to reset the HS-80C86RH processor. Its
timing characteristics are determined by RES. RESET is guaranteed to be HIGH for a minimum of 16 CLK pulses after the rising edge of RES.
CSYNC 1 I CLOCK SYNCHRONIZATION: CSYNC is an active HIGH signal which allows multiple HS-
82C85RHs to be synchronized to provide multiple in-phase clock signals. When CSYNC is HIGH, the internal counters are reset and force CLK, CLK50 and PCLK into a HIGH state. When CSYNC is LOW, the internal counters are allowed to count and the CLK,CLK50 and PCLK outputs are active. CSYNC must be externally synchronized to EFI.
AEN1 AEN2
3 7
I
ADDRESS ENABLE: AEN is an active LOW signal. AEN serves to qualify its respective Bus
I
Ready Signal (RDY1 or RDY2). AEN1 validates RDY1 while AEN2 validates RDY2. Two AEN signal inputs are useful in system configurations which permit the processor to access two Multi­Master System Buses.
RDY1 RDY2
4 6
I
BUS READY: (Transfer Complete). RDY is an active HIGH signal which is an indication from a
I
device located on the system data bus that data has been received, or is available. RDY1 is qualified by AEN1 while RDY2 is qualified by AEN2.
ASYNC 21 I READY SYNCHRONIZATION SELECT: ASYNC is an input which defines the synchronization
mode of the READY logic. When ASYNC is LOW, two stages of READY synchronization are pro­vided. When ASYNC is left open or HIGH a single stage of READY synchronization is provided.
READY 5 O READY: READY is an active HIGH signal which is used to inform the HS-80C86RH that it may
conclude a pending data transfer. GND 9 I Ground VDD 24 I +5V power supply
Functional Diagram
RES (17)
START (11)
CSYNC (1)
SLO/FST (12)
C (19)
F/
EFI (20)
X2 (22)
X1 (23)
S2/STOP (15)
S1 (14)
SO (13)
RDY1 (4) AEN1 (3) AEN2 (7) RDY2 (6)
ASYNC (21)
RESTART
LOGIC
EXTERNAL
FREQUENCY
SELECT
OSC
OSCILLATOR
STOP
LOGIC
READY
SELECT
RESTART
HALT
RESET PULSE
CONDITIONING
LOGIC
SYNC
LOGIC
SPEED SELECT
÷ 256 OR ÷ 1
SELECTED OSC
READY
SYNC
SYNC
MASTER
OSC
CLOCK
LOGIC
(÷ 3)
PERIPHERAL
CLOCK
(
÷ 6)
(24) VDD
(9) GND
(16) RESET
(8) CLK
(10) CLK50
(2) PCLK
(18) OSC
(5) READY
994
Spec Number 518061
Specifications HS-82C85RH
Absolute Maximum Ratings Reliability Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+6.5V
Input, Output or I/O Voltage . . . . . . . . . . . . .VSS-0.3V to VDD+0.3V
Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +300oC
Typical Derating Factor. . . . . . . . . .5.33mA/MHz Increase in IDDOP
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Operating Voltage Range. . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range. . . . . . . . . . . . . . . . -55oC to +125oC
RESET Input High Voltage. . . . . . . . . . . . . . . . . . . . . . 3.5V to VDD
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS
Thermal Resistance θ
SBDIP Package. . . . . . . . . . . . . . . . . . . . 52oC/W 12oC/W
Ceramic Flatpack Package . . . . . . . . . . . 70oC/W 10oC/W
Maximum Package Power Dissipation at +125oC Ambient
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.96W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.71W
If device power exceeds package dissipation capability, provide heat sinking or derate linearly at the following rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19.2mW/C
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . .14.3mW/C
Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to +0.8V
Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5V to VDD
GROUP A
SUBGROUP TEMPERATURE
JA
LIMITS
θ
JC
UNITSMIN MAX
CLK or CLK50 Output High Voltage
Output High Voltage VOH VDD = 4.5V, IO = -2.5mA,
Output Low Voltage VOL VDD = 4.5V, IO = 5.0mA,
Input Leakage Cur­rent
Bus Hold High Leak­age Current (Note 1)
Standby Power Sup­ply Current
Operating Power Supply Current
Functional Tests FT VDD = 4.5V and 5.5V,
Noise Immunity Functional Test
VOH VDD = 4.5V, IO = -5.0mA,
VIN = 0V or 4.5V
VIN = 0V or 4.5V
VIN = 0V or 4.5V
IIL or IIH VDD = 5.5V, VIN = 0V or
5.5V, Input Pins except: 11 to 15, 21, 23
IBHH VDD = 4.5V, 5.5V, VIN =
3.0V, Pins: 11 to 15, 21
IDDSB VDD = 5.5V, VIN = GND or
VDD, IO = 0mA
IDDOP VDD = 5.5V, VIN = GND or
VDD, IO = 0mA, Crystal Frequency = 15MHz
VIN = GND or VDD, f = 1MHz
FN VDD = 5.5V,
VIN = GND or 3.5V and VDD = 4.5V, VIN = 0.8V or VDD
1, 2, 3 -55oC, +25oC,
+125oC
1, 2, 3 -55oC, +25oC,
+125oC
1, 2, 3 -55oC, +25oC,
+125oC
1, 2, 3 -55oC, +25oC,
+125oC
1, 2, 3 -55oC, +25oC,
+125oC
1, 2, 3 -55oC, +25oC,
+125oC
1, 2, 3 -55oC, +25oC,
+125oC
7, 8A, 8B -55oC, +25oC,
+125oC
7, 8A, 8B -55oC, +25oC,
+125oC
VDD
-0.4
VDD
-0.4
- 0.4 V
-1.0 1.0 µA
-200 -20 µA
- 100 µA
-80mA
-- -
-- -
-V
-V
NOTE:
1. IBHH should be measured after raising VIN to VDD and then lowering to 3.0V
995
Spec Number 518061
Specifications HS-82C85RH
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS VDD = 4.5V, TA = -55oC to +125oC
GROUP A
PARAMETER SYMBOL CONDITIONS
TIMING REQUIREMENTS External Frequency High
Time External Frequency Low
Time EFI or Crystal Period TELEL 9, 10, 11 -55oC, +25oC, +125oC65 -ns External Frequency Input
Duty Cycle Crystal Frequency FX 9, 10, 11 -55oC, +25oC, +125oC 2.4 15 MHz RDY1, RDY2 Active Setup
to CLK RDY1, RDY2 Active Setup
to CLK RDY1, RDY2 Inactive Setup
to CLK RDY1, RDY2 Hold to CLK TCLR1X 9, 10, 11 -55oC, +25oC, +125oC0 -ns ASYNC Setup to CLK TAYVCL 9, 10, 11 -55oC, +25oC, +125oC84 -ns ASYNC Hold to CLK TCLAYX 9, 10, 11 -55oC, +25oC, +125oC0 -ns AEN1, AEN2 Setup to
RDY1, RDY2 AEN1, AEN2 Hold to CLK TCLA1X 9, 10, 11 -55oC, +25oC, +125oC0 -ns CSYNC Setup to EFI TYHEH 9, 10, 11 -55oC, +25oC, +125oC17 -ns CSYNC Hold to EFI TEHYL 9, 10, 11 -55oC, +25oC, +125oC17 -ns CSYNC Pulse Width TYHYL 9, 10, 11 -55oC, +25oC, +125oC 2TELEL - ns RES Setup to CLK TI1HCL Note 3 9, 10, 11 -55oC, +25oC, +125oC 105 - ns S0, S1, S2/STOP Setup to
CLK S0, S1, S2/STOP Hold to
CLK RES, START Setup to CLK TRSVCH Note 3 9, 10, 11 -55oC, +25oC, +125oC 105 - ns RES (Low) or START (High)
Pulse Width SLO/FST Setup to PCLK TSFPC Note 3 9, 10, 11 -55oC, +25oC, +125oC TEHEL+170 - ns TIMING RESPONSES CLK/CLK50 Cycle Period TCLCL 9, 10, 11 -55oC, +25oC, +125oC 200 - ns CLK HIGH Time TCHCL 9, 10, 11 -55oC, +25oC, +125oC (1/3 TCLCL)+3-ns
TEHEL 90% - 90%
VIN
TELEH 10% - 10%
VIN
TEFIDC 9, 10, 11 -55oC, +25oC, +125oC45 55%
TR1VCL ASYNC =
High
TR1VCH ASYNC = Low 9, 10, 11 -55oC, +25oC, +125oC55 -ns
TR1VCL 9, 10, 11 -55oC, +25oC, +125oC55 -ns
TA1VR1V 9, 10, 11 -55oC, +25oC, +125oC25 -ns
TSVCH 9, 10, 11 -55oC, +25oC, +125oC55 -ns
TCHSX 9, 10, 11 -55oC, +25oC, +125oC55 -ns
TSHSL 9, 10, 11 -55oC, +25oC, +125oC 2/3 TCLCL - ns
SUBGROUP TEMPERATURE
9, 10, 11 -55oC, +25oC, +125oC25 -ns
9, 10, 11 -55oC, +25oC, +125oC25 -ns
9, 10, 11 -55oC, +25oC, +125oC55 -ns
LIMITS
UNITSMIN MAX
CLK LOW TCLCH 9, 10, 11 -55oC, +25oC, +125oC (2/3 TCLCL)
-15
CLK50 HIGH Time T5CHCL 9, 10, 11 -55oC, +25oC, +125oC (1/2 TCLCL)
-7.5
CLK50 LOW Time T5CLCH 9, 10, 11 -55oC, +25oC, +125oC (1/2 TCLCL)
-7.5
PCLK HIGH Time TPHPL 9, 10, 11 -55oC, +25oC, +125oC TCLCL-20 - ns
-ns
-ns
-ns
Spec Number 518061
996
Specifications HS-82C85RH
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS VDD = 4.5V, TA = -55oC to +125oC (Continued)
GROUP A
PARAMETER SYMBOL CONDITIONS
PCLK LOW Time TPLPH 9, 10, 11 -55oC, +25oC, +125oC TCLCL-20 - ns Ready Inactive to CLK TRYLCL Note 4 9, 10, 11 -55oC, +25oC, +125oC-8 -ns Ready Active to CLK TRYHCH Note 3 9, 10, 11 -55oC, +25oC, +125oC 2/3(TCLCL)
CLK to Reset Delay TCLIL 9, 10, 11 -55oC, +25oC, +125oC - 65 ns CLK to PCLK HIGH Delay TCLPH 9, 10, 11 -55oC, +25oC, +125oC - 40 ns CLK to PCLK LOW Delay TCLPL 9, 10, 11 -55oC, +25oC, +125oC - 40 ns OSC to CLK HIGH Delay TOHCH 9, 10, 11 -55oC, +25oC, +125oC-5 60ns OSC to CLK LOW Delay TOHCL 9, 10, 11 -55oC, +25oC, +125oC 2 70 ns OSC LOW to CLK50 HIGH
Delay CLK LOW to CLK50 LOW
Skew
NOTES:
1. ACs tested at worst case VDD, guaranteed over full operating range
2. Setup and hold necessary only to guarantee recognition at next clock
3. Applies only to T3, TW states
4. Applies only to T2 states
5. All timing delays are measured at 1.5V, unless otherwise noted
6. Timing measurements made with EFI duty cycle = 50%
TOLCH 9, 10, 11 -55oC, +25oC, +125oC-5 60ns
TCLC50L 9, 10, 11 -55oC, +25oC, +125oC - 10 ns
SUBGROUP TEMPERATURE
LIMITS
UNITSMIN MAX
-ns
-15
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
LIMITS
PARAMETER SYMBOL CONDITION TEMPERATURE
Input Capacitance CIN VDD = Open, f = 1MHz, Note 2 TA = +25oC-5pF Output Capacitance COUT VDD = Open, f = 1MHz, Note 2 TA = +25oC - 15 pF RESET Input
Hysteresis TIMING REQUIREMENTS RES or START Valid
to CLK Low STOP Command
Valid to CLK High TIMING RESPONSES CLK/CLK50 Rise
Time CLK/CLK50 Fall Time TCL1CL2 VDD = 4.5V and 5.5V, 3.5V to
Output Rise Time (Except CLK)
Output Fall Time (Except CLK)
(+)VT - (-)VT VDD = 4.5V and 5.5V -55oC < TA < +125oC 0.25 - V
TSTART VDD = 4.5V and 5.5V -55oC < TA < +125oC 2TELEL
+3
TSTOP VDD = 4.5V and 5.5V -55oC < TA < +125oC TCLCL +
TCLCH
TCH1CH2 VDD = 4.5V and 5.5V, 1.0V to
3.5V
1.0V
TOLOH VDD = 4.5V and 5.5V, 0.8V to
2.0V
TOHOL VDD = 4.5V and 5.5V, 2.0V to
0.8V
-55oC < TA < +125oC - 15 ns
-55oC < TA < +125oC - 15 ns
-55oC < TA < +125oC - 25 ns
-55oC < TA < +125oC - 25 ns
-ns
3TCHCH
+55
UNITSMIN MAX
ns
997
Spec Number 518061
Specifications HS-82C85RH
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER SYMBOL CONDITION TEMPERATURE
LIMITS
UNITSMIN MAX
Start/Reset Valid to CLK Low
RESET Output Time High
NOTES:
1. The parameters listed in table 3 are controlled via design or process parameters and are not directly tested. These parameters are characterized upon initial design release and upon design changes which would affect these characteristics.
2. All measurements referenced to device ground.
3. Oscillator start-up time depends on several factors including crystal frequency, crystal manufacturer, capacitive load, temperature, power supply voltage, etc. This parameter is given for information only.
See +25oC limits in Table 1 and Table 2 for Post RAD limits (Subgroups 1, 7, 9)
TOST VDD = 4.5V and 5.5V (TYP)
Note 3
TRST VDD = 4.5V and 5.5V -55oC < TA < +125oC16
TABLE 4. POST 100K RAD ELECTRICAL PERFORMANCE CHARACTERISTICS
TABLE 5. BURN-IN DELTA PARAMETERS (+25oC)
PARAMETER SYMBOL DELTA LIMITS
Static Current IDDSB ±20µA Input Leakage Current IIL, IIH ±200nA Low Level Output Voltage VOL ±80mV High Level Output Voltage VOH ±150mV
-55oC < TA < +125oC- 3 ms
(TCLCL)
-ms
TABLE 6. APPLICABLE SUBGROUPS
GROUP A SUBGROUPS
CONFORMANCE
GROUP
Initial Test 100% 5004 1, 7, 9 1 (Note 2) 1, 7, 9 Interim Test 100% 5004 1, 7, 9, 1, (Note 2) 1, 7, 9 PDA 100% 5004 1, 7, - 1, 7 Final Test 100% 5004 2, 3, 8A, 8B, 10, 11 - 2, 3, 8A, 8B, 10, 11 Group A (Note 1) Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11 - 1, 2, 3, 7, 8A, 8B, 9,
Subgroup B5 Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, 1, 2, 3, (Note 2) N/A Subgroup B6 Sample 5005 1, 7, 9 - N/A Group C Sample 5005 N/A N/A 1, 2, 3, 7, 8A, 8B, 9,
Group D Sample 5005 1, 7, 9 - 1, 7, 9 Group E, Subgroup 2 Sample 5005 1, 7, 9 - 1, 7, 9
NOTES:
1. Alternate Group A testing in accordance with MIL-STD-883 method 5005 may be exercised.
2. Table 5 parameters only
MIL-STD-883
METHOD
TESTED FOR -Q
RECORDED
FOR -Q TESTED FOR -8
10, 11
10, 11
RECORDED
FOR -8
998
Spec Number 518061
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