Intersil Corporation HS-26C31RH Datasheet
HS-26C31RH
Data Sheet August 1999
Radiation HardenedQuadDifferentialLine
Driver
The Intersil HS-26C31RH is a quad differential line driver
designed for digital data transmission over balanced lines
and meets the requirements of EIA standard RS-422.
Radiation hardened CMOS processing assures low power
consumption, high speed, and reliable operation inthemost
severe radiation environments.
The HS-26C31RH accepts CMOS signal levels and converts
them to RS-422 compatible outputs. This circuit uses special
outputs that enable the drivers to power down withoutloading
down the bus. Enable and disable pins allow several devices to
be connected to the same data source and addressed
independently.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96663. A “hot-link” is provided
on our homepage for downloading.
http://www.intersil.com/spacedefense/space.htm
Ordering Information
INTERNAL
ORDERING NUMBER
5962F9666301QEC HS1-26C31RH-8 -55 to 125
5962F9666301QXC HS9-26C31RH-8 -55 to 125
5962F9666301V9A HS0-26C31RH-Q 25
5962F9666301VEC HS1-26C31RH-Q -55 to 125
5962F9666301VXC HS9-26C31RH-Q -55 to 125
MKT. NUMBER
TEMP. RANGE
(oC)
File Number
3401.3
Features
• Electrically Screened to SMD # 5962-96663
• QML Qualified per MIL-PRF-38535 Requirements
• 1.2 Micron Radiation Hardened CMOS
- Total Dose Up to. . . . . . . . . . . . . . . . . . . . 300kRAD(Si)
- Dose Rate Upset . . . . . . . > 1x10
9
RAD/s (20ns Pulse)
• Latchup Free
• EIA RS-422 Compatible Outputs (Except for IOS)
• CMOS Inputs
• High Impedance Outputs when Disabled or Powered
Down
• Low Power Dissipation . . . . . . . . . 2.75mW Standby (Max)
• Single 5V Supply
• Low Output Impedance . . . . . . . . . . . . . . . . . 10Ω or Less
o
• Full -55
C to 125oC Military Temperature Range
Pinouts
HS1-26C31RH (SBDIP)
CDIP2-T16
TOP VIEW
VDD
AIN
AO
AO
ENABLE
BO
BO
BIN
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
DIN
DO
DO
ENABLE
CO
CO
CIN
HS1-26C31RH/PROTO HS1-26C31RH/PROT O -55 to 125
HS9-26C31RH/PROTO HS9-26C31RH/PROT O -55 to 125
Logic Diagram
ENABLE ENABLE
DIN
DO DO CO BO AO
CIN
CO
1
BIN
BO
AIN
AO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
HS9-26C31RH (FLATPACK)
CDFP4-F16
TOP VIEW
AIN
AO
AO
ENABLE
BO
BO
BIN
GND
http://www.intersil.com or 407-727-9207
116
2
3
4
5
6
7
8
VDD
15
14
13
12
11
10
9
| Copyright © Intersil Corporation 1999
DIN
DO
DO
ENABLE
CO
CO
CIN
Die Characteristics
HS-26C31RH
DIE DIMENSIONS:
96.5 mils x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 10k
Å ±1kÅ
Metallization:
M1: Mo/TiW
Thickness: 5800
Å
M2: Al/Si/Cu (Top)
Thickness: 10k
Å ±1kÅ
Metallization Mask Layout
AO (2)
(1) AIN
HS-26C31RH
(16) VDD
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
V
DD
ADDITIONAL INFORMATION:
Worst Case Current Density:
5
2
<2.0 x 10
A/cm
Bond Pad Size:
110µm x 100µm
(16) VDD
(15) DIN
(14) DO
(13)
(12)
(11)
(10) CO
CIN (9)
DO
ENABLE
CO
AO (3)
ENABLE (4)
BO (5)
BO (6)
BIN (7)
GND (8)
GND (8)
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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