Intersil Corporation HS-1120RH Datasheet

August 1996
HS-1120RH
Radiation Hardened, Ultra High Speed
Current Feedback Amplifier with Offset Adjust
Features
• Electrically Screened to SMD 5962F9675601VPA
• MIL-PRF-38535 Class V Compliant
• Wide -3dB Bandwidth . . . . . . . . . . . . . . . 850MHz (Typ)
• Very High Slew Rate . . . . . . . . . . . . . . . 2300V/µs (Typ)
• Fast Settling (0.1%) . . . . . . . . . . . . . . . . . . . . 11ns (Typ)
• Excellent Gain Flatness (to 50MHz) . . . . . 0.05dB (Typ)
• High Output Current . . . . . . . . . . . . . . . . . . 65mA (Typ)
• Fast Overdrive Recovery. . . . . . . . . . . . . . . <10ns (Typ)
• Total Gamma Dose. . . . . . . . . . . . . . . . . . 300K RAD (Si)
• Latch Up . . . . . . . . . . . . . . . . . . . None (DI Technology)
Applications
• Video Switching and Routing
• Pulse and Video Amplifiers
• Wideband Amplifiers
• RF/IF Signal Processing
• Flash A/D Driver
Description
The HS-1120RH is a radiation hardened, high speed, wideband, fast settling current feedback amplifier. These devices are QML approved and are processed and screened in full compliance with MIL-PRF-38535. Built with Intersil’ proprietary, complementary bipolar UHF-1 (DI bonded wafer) process, it is the fastest monolithic amplifier available from any semiconductor manufacturer.
The HS-1120RH’s wide bandwidth, fast settling characteristic, and low output impedance, make this amplifier ideal for driving fast A/D converters. Additionally, it offers offset voltage nulling capabilities as described in the “Offset Adjustment” section of this datasheet.
Component and composite video systems will also benefit from this amplifier’s performance, as indicated by the excel­lent gain flatness, and 0.03%/0.05 Degree Differential Gain/Phase specifications (R
Detailed electrical specifications are contained in SMD 5962F9675601VPA, available on the Intersil Website or AnswerFAX systems (document #967560)
A Cross Reference Table is available on the Intersil Website for conv ersion of Intersil Part Numbers to SMDs. The address is (http://www.intersil.com/datasheets/smd/smd_xref. html). SMD numbers must be used to order Radiation Hard­ened Products.
= 75).
L
• Imaging Systems
Pinout
Ordering Information
PART NUMBER
5962F9675601VPA -55 to 125 8 Ld CERDIP GDIP1-T8 HFA1100IJ
(Sample) HFA11XXEVAL Evaluation Board
HS-1120RH
MIL-STD-1835, GDIP1-T8
(CERDIP)
TOP VIEW
BAL
1 2
-IN
+IN
V-
-
+
3 4
TEMP.
RANGE (oC) PACKAGE PKG. NO.
-40 to 85 8 Ld CERDIP F8.3A
8
NC
7
V+
6
OUT
5
BAL
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
File Number 4101.1
HS-1120RH
Application Information
Optimum Feedback Resistor
The enclosed plots of inverting and non-inverting frequency response illustrate the performance of the HS-1120RH in various gains. Although the bandwidth dependency on closed loop gain isn’t as severe as that of a v oltage feedback amplifier, there can be an appreciable decrease in bandwidth at higher gains. This decrease may be minimized by taking advantage of the current feedback amplifier’s unique relationship between bandwidth and R
. All current
F
feedback amplifiers require a feedback resistor, even for unity gain applications, and R
, in conjunction with the
F
internal compensation capacitor, sets the dominant pole of the frequency response. Thus, the amplifier’s bandwidth is inversely proportional to R optimized for a 510Ω R
. The HS-1120RH design is
F
at a gain of +1. Decreasing RF in a
F
unity gain application decreases stability, resulting in excessive peaking and overshoot. At higher gains the amplifier is more stable, so R
can be decreased in a trade-
F
off of stability for bandwidth. The table below lists recommended R
values for various
F
gains, and the expected bandwidth.
GAIN (ACL)R
-1 430 580 +1 510 850 +2 360 670 +5 150 520
+10 180 240 +19 270 125
F
()
BANDWIDTH
(MHz)
PC Board Layout
The frequency response of this amplifier depends greatly on the amount of care taken in designing the PC board. The
use of low inductance components such as chip resis­tors and chip capacitors is strongly recommended, while a solid ground plane is a must!
Attention should be given to decoupling the power supplies. A large value (10µF) tantalum in parallel with a small value (0.1µF) chip capacitor works well in most cases.
Terminated microstrip signal lines are recommended at the input and output of the device. Capacitance directly on the output must be minimized, or isolated as discussed in the next section.
Care must also be taken to minimize the capacitance to ground seen by the amplifier’s inverting input (-IN). The larger this capacitance, the worse the gain peaking, resulting in pulse overshoot and possible instability. To this end, it is recommended that the ground plane be removed under traces connected to -IN, and connections to -IN should be kept as short as possible.
An example of a good high frequency layout is the Evalua­tion Board shown in Figure 2.
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly terminated transmission line will degrade the amplifier’s phase margin resulting in frequency response peaking and possible oscillations. In most cases, the oscillation can be avoided by placing a resistor (R
) in series with the output
S
prior to the capacitance. Figure 1 details starting points for the selection of this resis-
tor. The points on the curve indicate the R
and CL combina-
S
tions for the optimum bandwidth, stability, and settling time, but experimental fine tuning is recommended. Picking a point above or to the right of the curve yields an overdamped response, while points below or left of the curve indicate areas of underdamped performance.
R
and CLform a low pass network at the output, thus
S
limiting system bandwidth well below the amplifier band­width of 850MHz. By decreasing R
as CLincreases (as
S
illustrated in the curves), the maximum bandwidth is obtained without sacrificing stability. Even so, bandwidth does decrease as you move to the right along the curve. For example, at A
= +1, RS = 50, CL = 30pF, the overall
V
bandwidth is limited to 300MHz, and bandwidth drops to 100MHz at A
50 45 40 35 30
()
25
S
R
20 15 10
5
AV = +2
0
0 40 80 120 160 200 240 280 320 360 400
FIGURE 1. RECOMMENDED SERIES OUTPUT RESISTOR vs
= +1, RS = 5, CL = 340pF.
V
AV = +1
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE
Evaluation Board
The performance of the HS-1120RH may be evaluated using the HFA11XXEVAL Evaluation Board.
The layout and schematic of the board are shown in Figure 2. To order evaluation boards, please contact your local sales office.
Offset Adjustment
The output offset voltage of the HS-1120RH may be nulled via connections to the BAL pins. Unlike a voltage feedback amplifier, offset adjustment is accomplished by varying the sign and/or magnitude of the inverting input bias current (-I With voltage feedback amplifiers, bias currents are matched and bias current induced offset errors are nulled by matching the impedances seen at the positive and negative inputs. Bias
BIAS
).
2
HS-1120RH
currents are uncorrelated on current feedback amplifiers, so this technique is inappropriate.
flows through RFcausing an output offset error.
-I
BIAS
Likewise, any change in -I
forces a corresponding
BIAS
change in output voltage, providing the capability for output offset adjustment. By nulling -I
to zero, the offset error
BIAS
due to this current is eliminated. In addition, an adjustment limit greater than the -I contributions from other error sources, such as V
limit allows the user to null the
BIAS
500 500 R
1
50
IN
10µF
0.1µF
, or +IN
IO
1 2 3 4
-5V
FIGURE 2A. SCHEMATIC
source impedance. For example, the excess adjust current of 50µA [I
ADJ (Min) - I
BN
an additional 26mV of output offset error (with R
(Max)] allows for the nulling of
BSN
= 510) at
F
room temperature. The amount of adjustment is a function of R
, so adjust range increases with increased RF. If allowed
F
by other considerations, such as bandwidth and noise, R can be increased to provide more adjustment range.
The recommended offset adjustment circuit is shown in Figure 3.
V
H
GND
8
0.1µF
7
50
6 5
GND
OUT V
L
10µF
+5V
F
V
H
1
+IN
OUT
V
L
V+
V-
GND
FIGURE 2B. TOP LAYOUT FIGURE 2C. BOTTOM LAYOUT
FIGURE 2. EVALUATION BOARD SCHEMATIC AND LAYOUT
510
2
-
HS-1120RH
V
IN
3
+
4
1
10K
6
5
V
OUT
V-
FIGURE 3. OFFSET VOLTAGE ADJUSTMENT CIRCUIT
3
Typical Performance Characteristics
HS-1120RH
Device Characterized at: V
= ±5V, RF = 360, AV = +2V/V, RL = 100, Unless Otherwise Specified
SUPPLY
PARAMETERS CONDITIONS TEMPERATURE TYPICAL UNITS
Input Offset Voltage (Note 1) V Average Offset Voltage Drift Versus Temperature Full 10 µV/
CMRR VCM = ±2V +25oC46dB
V
IO
V
PSRR VS = ±1.25V +25oC50dB
IO
+Input Current (Note 1) V Average +Input Current Drift Versus Temperature Full 40 nA/
-Input Current (Note 1) V Average -Input Current Drift Versus Temperature Full 40 nA/
-Input Current Adjust Range V +Input Resistance V
-Input Resistance +25 Input Capacitance +25 Input Noise Voltage (Note 1) f = 100kHz +25 +Input Noise Current (Note 1) f = 100kHz +25
-Input Noise Current (Note 1) f = 100kHz +25
= 0V +25oC2mV
CM
= 0V +25oC25µA
CM
= 0V +25oC12µA
CM
= 0V +25oC ±200 µA
CM
= ±2V +25oC50k
CM
o
C16
o
C 2.2 pF
o
C 4 nV/Hz
o
C 18 pA/Hz
o
C 21 pA/Hz
o
C
o
C
o
C
Input Common Mode Range Full ±3.0 V Open Loop Transimpedance AV = -1 +25oC 500 k Output Voltage A
Output Current (Note 1) A
DC Closed Loop Output Resistance +25 Quiescent Supply Current (Note 1) R
-3dB Bandwidth (Note 1) A
Slew Rate A
Full Power Bandwidth V Gain Flatness (Note 1) To 30MHz, R
Linear Phase Deviation (Note 1) To 100MHz, R 2nd Harmonic Distortion (Note 1) 30MHz, V
3rd Harmonic Distortion (Note 1) 30MHz, V
3rd Order Intercept (Note 1) 100MHz, R 1dB Compression 100MHz, R Reverse Isolation (S
) 40MHz, RF = 510 +25oC -70 dB
12
= -1, RL = 100 +25oC ±3.3 V
V
A
= -1, RL = 100 Full ±3.0 V
V
= -1, RL = 50 +25oC to +125oC ±65 mA
V
A
= -1, RL = 50 -55oC to 0oC ±50 mA
V
= Open Full 24 mA
L
= -1, RF = 430, V
V
A
= +1, RF = 510, V
V
A
= +2, RF = 360, V
V
= +1, RF = 510, V
V
A
= +2, V
V
= 5V
OUT
To 50MHz, R To 100MHz, R
50MHz, V 100MHz, V
50MHz, V 100MHz, V
100MHz, R 600MHz, R
= 5V
OUT
P-P
= 510 +25oC ±0.014 dB
F
= 510 +25oC ±0.05 dB
F
F F
= 2V
OUT
= 2V
OUT
OUT
= 2V
OUT
= 2V
OUT
OUT
= 510 +25oC 30 dBm
F
= 510 +25oC 20 dBm
F
= 510 +25oC -60 dB
F
= 510 +25oC -32 dB
F
= 510 +25oC ±0.14 dB = 510 +25oC ±0.6 Degrees
= 2V
= 2V
P-P
P-P P-P
P-P P-P
P-P
P-P
OUT
OUT OUT OUT
= 200mV
= 200mV = 200mV = 5V
P-P
P-P
P-P P-P
o
C 0.1
+25oC 580 MHz +25oC 850 MHz +25oC 670 MHz +25oC 1500 V/µs +25oC 2300 V/µs +25oC 220 MHz
+25oC -55 dBc +25oC -49 dBc +25oC -44 dBc +25oC -84 dBc +25oC -70 dBc +25oC -57 dBc
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