Intersil Corporation HMU17-883 Datasheet

HMU17/883
October 1997
Features
• This Circuit is Processed in Accordance to MIL-STD­883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
• High-Speed (45ns) Clocked Multiply Time
• Low Power CMOS Operation
-I
-I
= 500µA Maximum
CCSB
= 7.0mA Maximum at 1MHz
CCOP
• HMU17/883 is Compatible with the AM29517, LMU17, IDT7217, and the CY7C517
• Supports Two’s Complement, Unsigned Magnitude and Mixed Mode Multiplication
• TTL Compatible Inputs/Outputs
- Three-State Output
Ordering Information
TEMP.
PART NUMBER
HMU17GM-45/883 -55 to 125 68 Ld PGA HMU17GM-60/883 -55 to 125 68 Ld PGA
RANGE (oC) PACKAGE
PKG.
NO.
16 x 16-Bit CMOS Parallel Multiplier
Description
The HMU17/883 is a high speed, low power CMOS 16 x 16-bit parallel multiplier ideal for fast, real time digital signal processing applications. The 16-bit X and Y operands may be independently specified as either two’s complement or unsigned magnitude for­mat, thereby allowing mixed mode multiplication operations.
Additional inputs are provided to accommodate format adjust­ment and rounding of the 32-bit product. The Format Adjust con­trol allows the user the option of selecting a 31-bit product with the sign bit replicated LSP. The Round control is provided to accommodate rounding of the most significant portion of the result. This is accomplished by adding one to the most signifi­cant bit of the LSP.
Two 16-bit output registers (MSP and LSP) are provided to hold the most and least significant portions of the result, respectively. These registers may be made transparent for asynchronous operation through the use of the Feedthrough Control (FT). The two halves of the product may be routed to a single 16-bit three­state output port via the output multiplexer control, and in addi­tion, the LSP is connected to the Y-input port through a separate three-state buffer.
The HMU17/883 utilizes a single clock signal (CLK) along with three register enables ( operands and the output product registers. The inputs enable the X and Y input registers, while the LSP and MSP output registers. This configuration facilitates the use of the HMU17/883 for micro-programmed systems.
All outputs of the HMU17/883 also offer three-state control for multiplexing onto multiuse system busses.
ENX, ENY, and ENP) to latch the input
ENX and ENY
ENP enables both
Functional Block Diagram
X0-15 Y0-15/P0-15
TCX RND TCY
REGISTERREGISTERREGISTER
CLK
ENX
ENY
MULTIPLIER ARRAY
FA FT
ENP
MSPSEL
OEP
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
FORMAT ADJUST MSP
REGISTER
MULTIPLEXER
3-36
REGISTER
P16-31/P0-15
OEL
LSP
File Number 2805.2
HMU17/883
Absolute Maximum Ratings Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8.0V
Input or Output Voltage Applied . . . . . . . . .GND 0.5V to VCC +0.5V
ESD Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
TABLE 1. DC ELECTRICAL PERFORMANCE SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS
Logical One Input Voltage
Logical Zero Input Voltage
Output HIGH Voltage V
Output LOW Voltage V
Input Leakage Current I
Output or I/O Leakage Current
Standby Power Supply Current
Operating Power Supply Current
Functional Test FT (Note 4) 7, 8 -55 TA≤ 125 - -
NOTES:
2. Interchanging of force and sense conditions is permitted.
3. Operating Supply Current is proportional to frequency, typical rating is 5mA/MHz.
4. Tested as follows: f = 1MHz, VIH (Clock Inputs) = 3.0, VIH (All other inputs) = 2.6, VIL = 0.4, VOH≥ 1.5V, and VOL≤ 1.5V.
V
V
OH
OL
I
O
I
CCSB
I
CCOP
IH
IL
I
VCC = 5.5V 1, 2, 3 -55 TA≤ 125 2.2 - V
VCC = 4.5V 1, 2, 3 -55 TA≤ 125 - 0.8 V
IOH = 400µA VCC = 4.5V (Note 2)
IOL = +4.0mA VCC = 4.5V (Note 2)
VIN = VCC or GND VCC = 5.5V
V
= VCC or GND
OUT
VCC = 5.5V VIN = VCC or GND,
VCC = 5.5V, Outputs Open
f = 1.0 MHz, VIN = VCC or GND VCC = 5.5V (Note 3)
Thermal Resistance (Typical, Note 1) θJA (oC/W) θJC (oC/W)
PGA Package . . . . . . . . . . . . . . . . . . . 42.69 10.0
Maximum Package Power Dissipation at 125
PGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.17
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . 175oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
Die Characteristics
Number of Gates. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4,500
GROUP A
SUBGROUPS
1, 2, 3 -55 TA≤ 125 2.6 - V
1, 2, 3 -55 TA≤ 125 - 0.4 V
1, 2, 3 -55 TA≤ 125 -10 +10 µA
1, 2, 3 -55 TA≤ 125 -10 +10 µA
1, 2, 3 -55 TA≤ 125 - 500 µA
1, 2, 3 -55 TA≤ 125 - 7.0 mA
TEMPERATURE
(oC) MIN MAX UNITS
3-37
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