Intersil Corporation HM-6642 Datasheet

HM-6642
March 1997
Features
• Low Power Standby and Operating Power
- ICCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .100µA
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . .20mA at 1MHz
• Industry Standard Pinout
• Single 5.0V Supply
• CMOS/TTL Compatible Inputs
• Field Programmable
• Synchronous Operation
• On-Chip Address Latches
• Separate Output Enable
512 x 8 CMOS PROM
Description
The HM-6642 is a 512 x 8 CMOS NiCr fusible link Programmable Read Only Memory in the popular 24 pin, byte wide pinout. Synchronous circuit design techniques combine with CMOS processing to give this device high speed performance with very low power dissipation.
On-chip address latches are provided, allowing easy interfacing with recent generation microprocessors that use multiplexed address/data bus structures, such as the 8085. The output enable controls, both active low and active high, further simplify microprocessor system interfacing by allowing output data bus control independent of the chip enable control. The data output latches allow the use of the HM-6642 in high speed pipelined architecture systems, and also in synchronous logic replacement functions.
Applications for the HM-6642 CMOS PROM include low power handheld microprocessor based instrumentation and communications systems, remote data acquisition and processing systems, processor control store, and synchro­nous logic replacement.
Ordering Information
PACKAGE TEMPERATURE RANGE 120ns 200ns PKG. NO.
SBDIP -40oC to +85oC HM1-6642B-9 HM1-6642-9 D24.6
SMD# -55oC to +125oC 5962-8869002JA 5962-8869001JA D24.6
SLIM SBDIP -40oC to +85oC HM6-6642B-9 HM6-6642-9 D24.3
SMD# -55oC to +125oC 5962-8869002LA 5962-8869001LA D24.3
CLCC -40oC to +85oC - HM4-6642-9 J28.A
SMD# -55oC to +125oC 5962-88690023A 5962-88690013A J28.A
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
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File Number 3012.1
Pinouts
HM-6642 (SBDIP)
TOP VIEW
HM-6642
HM-6642 (CLCC)
TOP VIEW
PIN DESCRIPTION
A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2
GND
1 2 3 4 5 6 7 8
9 10 11 12
24 23 22 21 20 19 18 17 16 15 14 13
Functional Diagram
A8 A7 A6 A5 A4
A3
A2 A1
A0
LATCHED
ADDRESS
REGISTER
LATCHED
ADDRESS
REGISTER
E
A
6
A
6
A
3
A
3
V A8 G1 G2 G3 E P Q7 Q6 Q5 Q4 Q3
CC
A4
A3
A2
A1
A0
NC
Q0
GATED
ROW
DECODER
CC
V
28 27 26
Q3Q5Q4
64 x 64
MATRIX
DECODER
A8
8 8
G1
25
G2
24
G3
23
E
P
22
21
NC
Q7
20
Q6
19
8
8
A6
A5
3 2 14
5
6
7
8
9
10
11
Q1
Q2
64
D
NC
A7
14 15 16 17 1812 13
NC
GND
8 8
8 8
GATED COLUMN
8-BIT DATA LATCH
PIN DESCRIPTION
NC No Connect
A0-A8 Address Inputs
E Chip Enable
Q Data Output
V
CC
Power (+5V)
G1, G2, G3 Output Enable
P (Note) Program Enable
NOTE: P should be hardwired to GND
except during programming.
ALL LINES POSITIVE LOGIC - ACTIVE HIGH THREE STATE BUFFERS:
A HIGH
DATA LATCHES:
L HIGH Q LATCHES ON RISING EDGE OF
ADDRESS LATCHES AND GATED DECODERS:
LATCH ON FALLING EDGE OF GATE ON FALLING EDGE OF
P SHOULD BE HARDWIRED TO GND EXCEPT
DURING PROGRAMMING
OUTPUT ACTIVE
Q = D
E
E
E
G1
G2
G3
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
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Programming
Introduction
HM-6642
The HM-6642 is a 512 word by 8-bit field Programmable Read Only Memory utilizing nicrome fusible links as pro­grammable memory elements. Selected memory locations are permanently changed from their manufactured state, of all low (V
) to a logical high (VOH), by the controlled
OL
application of programming potentials and pulses. Careful adherence to the following programming specifications will result in high programming yield. Both high V low V
(4.0V) verify cycles are specified to assure the
CC
(6.0V) and
CC
integrity of the programmed fuse. This programming specification, although complete, does not preclude rapid programming. The worst case programming time required is
37.4 seconds, and typical programming time can be approximately 4 seconds per device.
The chip (
E) and output enable (G) are used during the programming procedure. On PROMs which have more than one output enable control G3 is to be used. The other output enables must be held in the active, or enabled, state throughout the entire programming sequence. The program­mer designer is advised that all pins of the programmer’s socket should be at ground potential when the PROM is inserted into the socket. V
must be applied to the PROM
CC
before any input or output pin is allowed to rise (See Note).
Overall Programming Procedure
1. The address of the first bit to be programmed is presented, and latched by the chip enable (
E) falling edge. The output is disabled by taking the output enable G Low: The programming pin is enabled by taking (P) high.
is raised to the programming voltage level, 12.5V.
2. V
CC
3. All data output pins are pulled up to V
program. Then
CC
the data output pin corresponding to the bit to be programmed is pulled low for 100ms. Only one bit should be programmed at a time.
4. The data output pin is returned to V
, and the VCC pin
CC
is returned to 6.0V.
5. The address of the bit is again presented, and latched by a second chip enable falling edge.
6. The data outputs are enabled, and read, to verify that the bit was successfully programmed.
a). If verified, the next bit to be programmed is addressed
and programmed.
b). If not verified, the programs verify sequence is
repeated up to 8 times total.
7. After all bits to be programmed have been verified at 6.0V, the V
is lowered to 4.0V and all bits are verified.
CC
a). If all bits verify, the device is properly programmed. b). If any bit fails to verify, the device is rejected.
Programming System Requirements
1. The power supply for the device to be prog rammed must be able to be set to three voltages: 4.0V, 6.0V, 12.5V . This supply must be able to supply 500mA average, and 1A dynamic, currents to the PROM during programming. The power supply rise fall times when switching betw een volt­ages must be no quicker than 1ms.
2. The address drivers must be able to supply a V and 6.0V and V
when the system is at programming
IL
of 4.0V
IH
voltages. (See Note)
3. The control input buffers must be able to maintain input voltage levels of 70% and 20% VCC for VIH and V levels, respectively. Notice that chip enable (E) and G does not require a pull up to programming voltage levels. The program control (P) must switch from ground to VIH and from V
to the VCC PGM level. (See Note)
IH
4. The data input buffers must be able to sink up to 3mA from the PROM’s output pins without rising more than
0.7V above ground, be able to hold the other outputs high with a current source capability of 0.5mA to 2.0mA, and not interfere with the reading and verifying of the data output of the PROM. Notice that a bit to be programmed is changed from a low state (V
) to high (VOH) by pulling
OL
low on the output pin. A suggested implementation is open collector TTL buffers (or inverters) with 4.7k pull up resistors to V
NOTE: Never allow any input or output pin to rise more than 0.3V
above VCC, or fall more than 0.3V below ground.
. (See Note)
CC
IL
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