Intersil Corporation HIP9011 Datasheet

HIP9011
Data Sheet November 1998 File Number
Engine Knock Signal Processor
The HIP9011 is used to provide a method of detecting premature detonation often referred to as “Knock or Ping” in internal combustion engines.
The IC is shown in the Simplified Block Diagram. The chip can select between one of two sensors, if needed for accurate monitoring orfor “V” typeengines. Internal control via the SPI bus is fast enough to switch sensors between each firing cycle. A programmable bandpass filter processes the signal from either of the sensor inputs. The bandpass filter can be selected to optimize the extraction the engine knock or ping signals from the engine background noise. Further single processing is obtained by full wave rectification of the filtered signal and applying it to an integrator whose output voltage level is proportional to the knock signal amplitude. The chip is under microprocessor control via a SPI interface bus.
Ordering Information
TEMP.
PART NUMBER
HIP9011AB -40 to 125
RANGE (oC) PACKAGE
20 Ld SOIC
PKG.
NO.
M20.3
4367.1
Features
• Two Sensor Inputs
• Microprocessor Programmable
• Accurate and Stable Filter Elements
• Digitally Programmable Gain
• Digitally Programmable Time Constants
• Digitally Programmable Filter Characteristics
• On-Chip Crystal Oscillator
• Programmable Frequency Divider
• External Clock Frequencies up to 24MHz
- 4, 5, 6, 8, 10, 12, 16, 20, and 24MHz
o
• Operating Temperature Range -40
C to 125oC
Applications
• Engine Knock Detector Processor
• Analog Signal Processing Where Controllable Filter Characteristics are Required
Simplified Block Diagram
CH0FB CH0IN
-
CH0NI
+
CH1FB CH1IN CH1NI
-
+
SWITCHES
3RD ORDER
CHANNEL SELECT
ANTIALIASING FILTER
VMID
PROGRAMMABLE
GAIN
STAGE
- 0.111
2
64 STEPS
POWER SUPPLY
AND
BIAS CIRCUITS
VDD GND
PROGRAMMABLE
BANDPASS
FILTER
1
-20kHz
64 STEPS
ACTIVE
FULL WAVE
RECTIFIER
TO SWITCHED
CAPACITOR NETWORKS
REGISTERS
AND
STATE MACHINE
TEST
PROGRAMMABLE
INTEGRATOR
- 600µs
40
32 STEPS
PROGRAMMABLE
DIVIDER
SPI
INTERFACE
OUTPUT
DRIVER
AND
SAMPLE
AND HOLD
CLOCK
INTOUT
OSCIN
OSCOUT
INT/
HOLD
SCK
CS
SI
SO
4-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
| Copyright © Intersil Corporation 1999
HIP9011
Pinout
HIP9011
(SOIC)
TOP VIEW
V
GND
VMID
INTOUT
INT/
HOLD
OSCIN
OSCOUT
DD
NC NC
CS
1 2 3 4 5 6 7 8 9
10
20 19 18 17 16 15 14 13 12 11
CH0NI CH0IN CH0FB CH1FB CH1IN CH1NI TEST SCK SI SO
Pin Descriptions
PIN
NUMBER DESIGNATION DESCRIPTION
1V
DD
2 GND This pin is tied to ground. 3V
MID
4 INTOUT Buffered output of the integrator. Output signal is held by an internal Sample and Hold circuit when INT/
5, 6 NC These pins are not internally connected. Do Not Use.
7 INT/HOLD Selects whether the chip is in the Integrate Mode (Input High) or in the Hold Mode (Input Low). This pin has an
8
CS A low input on this pin enables the chip to communicate over the SPI bus. This pin has an internal pull-up.
9 OSCIN Input to inverter used for the oscillator circuit. A 4MHz crystal or ceramic resonator is connected between this pin and
10 OSCOUT Output of the inverter used for the oscillator. See pin 9 above. 11 SO Output of the chip SPI data bus. This is a three-state output that is controlled via the SPI bus. The output is
12 SI Input of the chip SPI data bus. Data length is eight bits. This pin has an internal pull-up. 13 SCK Input from the SPI clock. Normally low, the data is transferred to the chip internal circuitry on the falling clock
14
TEST A low on this pin places the chip in the diagnostic mode. For normal operation this pin is tied high or left open.
15 CH1NI Non-inverting input of Channel one. 16 CH1IN Inverting input to channel one amplifier. A resistor is tied from this summing input to the transducer. A second
17 CH1FB Output of the channel one amplifier. This pin is used to apply feedback. 18 CH0FB Output of the channel zero amplifier. This pin is used to apply feedback. 19 CH0IN Inverting input to channel zero amplifier. Remainder same as channel one amplifier except feedback is applied
20 CH0NI Non-inverting input of Channel 0. Remainder the same as pin 16, except feedbac k is applied from terminal 18.
Five volt power input.
This pin is connected to the internal mid-supply generator and is brought out for bypassing bya 0.022µF capacitor.
low.
internal pull down.
pin 10. To bias the inverter, a 1.0M to 10MΩ resistor is usually connected between this pin and pin 10.
placed in the high impedance state by setting
CS high when the chip is not selected. This high impedance state can also be programmed by setting the LSB of the prescaler word to 1. This will take precedence over CS. A 0 enables the active state. The Diagnostic Mode overrides these conditions.
edge. This pin has an internal pull up.
This pin has an internal pull up.
resistor is tied between this pin and pin 17, CH1FB to establish the gain of the amplifier.
from pin 18.
HOLD is
4-2
HIP9011
Absolute Maximum Ratings
DC Logic Supply, VDD. . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Output Voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V Max
Thermal Information
Thermal Resistance (Typical, Note 1) θJA (oC/W)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Maximum Pow er Dissipation, P
D
For TA = -40oC to 70oC . . . . . . . . . . . . . . . . . . . . . . .400mW Max
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 125oC
For TA = 70oC to 125oC, Derate Linearly at . . . . . . . . . . 6mW/oC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range, T
. . . . -65oC to 150oC
STG
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
At a Distance 1/16 ±1/32 inch, (1.59 ±0.79mm) from Case for
10s Max. (SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications V
= 5V ±5%, GND = 0V, Clock Frequency 4MHz ±0.1%, TA = -40oC to 125oC,
DD
Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
DC ELECTRICAL SPECIFICATIONS
Quiescent Supply Current I Midpoint Voltage, Pin 3 V Midpoint Voltage, Pin 3 V Low Input V oltage , Pins INT/
HOLD,CS, SI, SCK V High Input Voltage , Pins INT/HOLD, CS, SI, SCK V Hysteresis voltage, Pins INT/HOLD, CS, SI, SCK V
DD MID MID
IL IH
HYST
Internal Pull-Up Current ISourceCS,SI,
TEST
SCK,
Internal Pull-Down Current I Sink,
HOLD
INT/ Low Level Output, Pin SO V High Level Output, Pin SO V Three-State Leakage Pin SO I Low Level Output, Pin 10, OSCOUT V High Level Output, Pin 10, OSCOUT V
OL
OH
L
OL
OH
VDD = 5.25V, GND = 0V - 5.0 8.0 mA VDD = 5.0V, IL = 2mA Source 2.3 2.45 2.55 V VDD = 5.0V, IL = 0mA 2.4 2.5 2.6 V
- - 30 % of V
70 - - % of V
0.85 - - V
VDD = 5.0V, Measured at GND - 50 - µA
VDD = 5.0V, Measured at V
I
SOURCE
I
SINK
= 1.6mA, VDD = 5.0V 0.01 - 0.30 V
= 200µA, VDD = 5.0V 4.8 4.9 5.0 V
DD
- -50 - µA
Measured at GND; VDD = 5.0V - - ±10 µA I
SOURCE
I
SINK
= 500µA; VDD= 5.0V - - 1.5 V
= -500µA; VDD= 5.0V 4.4 - - V
DD DD
SPI BUS INTERFACE AC Parametrics CS Falling to SCLK Rising t CS Rising to SCLK Falling t SCLK Low t SCLK High t SCLK Falling to CS Rising t Data High Setup Time t Data Low Setup Time t Data High Hold Time t Data Low Hold Time t Min Time Between 2 Programmed Words t CS Rising to INT/Hold Rising t
CCH CCL PWL
PWH
SCCH
SUH
SUL
HH HL
CSH
CIH
10 - - ns 80 - - ns 60 - - ns 60 - - ns 60 - - ns 20 - - ns 20 - - ns 10 - - ns 10 - - ns
200 - - ns
8-- µs
4-3
HIP9011
Electrical Specifications V
= 5V ±5%, GND = 0V, Clock Frequency 4MHz ±0.1%, TA = -40oC to 125oC,
DD
Unless Otherwise Specified (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
INPUT AMPLIFIERS
CH0 and CH1 High Output Voltage V CH0 and CH1 Low Output Voltage V Voltage Gain A
OUT
OUT
CL
HI I
LO I
= 100µA, VDD = 5.0V 4.7 4.9 - V
SINK SOURCE
Input R = 47.5K, Feedback
= 100µA; VDD = 5.0V - 15 200 mV
+18 +20 +21 dB
R = 475k
ANTIALIASING FILTER
Response 1kHz to 20kHz, Referenced to 1kHz BW Test Mode - -0.5 - dB Attenuation at 180kHz, Referenced
ATTEN Test Mode -10 -15 - dB
to 1kHz
PROGRAMMABLE FILTERS
Peak to Peak Voltage Output V
OUT
Run Mode 3.5 4.0 - V
P-P
Filters Q (Note 2) Q Run Mode - 2.5 - Q
PROGRAMMABLE GAIN AMPLIFIERS
Percent Amplifier Gain Deviation %G Run Mode - ±1- %
INTEGRATOR
Integrator Reset Voltage V
RESET
Pin 4 Voltage at Start of
75 125 175 mV Integration Cycle; VDD = 5.0V
Integrator Droop after 500µsV
DROOP
Hold Mode, Pin 7 = 0V,
- ±3 ±50 mV VDD= 5.0V Pin 4 set to 20% to 80% of V
DD
DIFFERENTIAL CONVERTER
Differential to Single Ended Converter Offset
DIFV
By Design - 0.1 - mV
IO
Voltage Change In Converter Output DIFOUT Run Mode, 500µA Sinking Load
- ±1 ±10 mV to No Load Condition
SYSTEM GAIN DEVIATION
Gain Deviation from “Ideal Equation” Correlation Factor + 5.0% (Note 3)
V
OUT
V
RESET
Run Mode, maximum signal output from Input Amplifier <2.25V
, Equation Output X
P-P
0.95 + Device Reset Voltage; For Total V
OUT
4.7V
-8%,
±100mV
Equa-
tion
X 0.95
- V
RE-
SET
8%,
±100mV
V
-
NOTES:
2. Q = fo/BW, where: fo = Center Frequency, BW = 3dB Bandwidth
3. Ideal Equation: INTOUT (Volts) = [V Where: VIN = input signal amplitude (V
GIN =External Input Gain; GIN = RF/R
* GIN * GPR * G
IN
)
P-P
IN
* 1/π * (N/tC(ms) *fQ(kHz)) * G
BPF
DSE
] + V
RESET
GPR =Programmed Gain
G
=Gain of Bandpass Filter (2 for Ideal Case at Center)
BPF
t
=Integration Time; t
INT
INT
= N/f
Q
0.318 =1/π
N =Number of Cycles of Input Signal
fQ =Frequency of Input Signal
RF =Feedback Resistor Value
RIN =Signal Input Resistor Value
tC =Programmed Time Constant
G
=Gain of DSE Converter (2 for Ideal Case)
DSE
V
=Integrator Reset Voltage = 0.125V, Typ
RESET
4-4
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