The HIP9011 is used to provide a method of detecting
premature detonation often referred to as “Knock or Ping” in
internal combustion engines.
The IC is shown in the Simplified Block Diagram. The chip
can select between one of two sensors, if needed for
accurate monitoring orfor “V” typeengines. Internal control
via the SPI bus is fast enough to switch sensors between
each firing cycle. A programmable bandpass filter
processes the signal from either of the sensor inputs. The
bandpass filter can be selected to optimize the extraction
the engine knock or ping signals from the engine
background noise. Further single processing is obtained by
full wave rectification of the filtered signal and applying it to
an integrator whose output voltage level is proportional to
the knock signal amplitude. The chip is under
microprocessor control via a SPI interface bus.
Ordering Information
TEMP.
PART NUMBER
HIP9011AB-40 to 125
RANGE (oC)PACKAGE
20 Ld SOIC
PKG.
NO.
M20.3
4367.1
Features
• Two Sensor Inputs
• Microprocessor Programmable
• Accurate and Stable Filter Elements
• Digitally Programmable Gain
• Digitally Programmable Time Constants
• Digitally Programmable Filter Characteristics
• On-Chip Crystal Oscillator
• Programmable Frequency Divider
• External Clock Frequencies up to 24MHz
- 4, 5, 6, 8, 10, 12, 16, 20, and 24MHz
o
• Operating Temperature Range -40
C to 125oC
Applications
• Engine Knock Detector Processor
• Analog Signal Processing Where Controllable Filter
Characteristics are Required
Simplified Block Diagram
CH0FB
CH0IN
-
CH0NI
+
CH1FB
CH1IN
CH1NI
-
+
SWITCHES
3RD ORDER
CHANNEL SELECT
ANTIALIASING FILTER
VMID
PROGRAMMABLE
GAIN
STAGE
- 0.111
2
64 STEPS
POWER SUPPLY
AND
BIAS CIRCUITS
VDD GND
PROGRAMMABLE
BANDPASS
FILTER
1
-20kHz
64 STEPS
ACTIVE
FULL WAVE
RECTIFIER
TO SWITCHED
CAPACITOR
NETWORKS
REGISTERS
AND
STATE MACHINE
TEST
PROGRAMMABLE
INTEGRATOR
- 600µs
40
32 STEPS
PROGRAMMABLE
DIVIDER
SPI
INTERFACE
OUTPUT
DRIVER
AND
SAMPLE
AND HOLD
CLOCK
INTOUT
OSCIN
OSCOUT
INT/
HOLD
SCK
CS
SI
SO
4-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
CH0NI
CH0IN
CH0FB
CH1FB
CH1IN
CH1NI
TEST
SCK
SI
SO
Pin Descriptions
PIN
NUMBERDESIGNATIONDESCRIPTION
1V
DD
2GNDThis pin is tied to ground.
3V
MID
4INTOUTBuffered output of the integrator. Output signal is held by an internal Sample and Hold circuit when INT/
5, 6NCThese pins are not internally connected. Do Not Use.
7INT/HOLDSelects whether the chip is in the Integrate Mode (Input High) or in the Hold Mode (Input Low). This pin has an
8
CSA low input on this pin enables the chip to communicate over the SPI bus. This pin has an internal pull-up.
9OSCINInput to inverter used for the oscillator circuit. A 4MHz crystal or ceramic resonator is connected between this pin and
10OSCOUTOutput of the inverter used for the oscillator. See pin 9 above.
11SOOutput of the chip SPI data bus. This is a three-state output that is controlled via the SPI bus. The output is
12SIInput of the chip SPI data bus. Data length is eight bits. This pin has an internal pull-up.
13SCKInput from the SPI clock. Normally low, the data is transferred to the chip internal circuitry on the falling clock
14
TESTA low on this pin places the chip in the diagnostic mode. For normal operation this pin is tied high or left open.
15CH1NINon-inverting input of Channel one.
16CH1INInverting input to channel one amplifier. A resistor is tied from this summing input to the transducer. A second
17CH1FBOutput of the channel one amplifier. This pin is used to apply feedback.
18CH0FBOutput of the channel zero amplifier. This pin is used to apply feedback.
19CH0INInverting input to channel zero amplifier. Remainder same as channel one amplifier except feedback is applied
20CH0NINon-inverting input of Channel 0. Remainder the same as pin 16, except feedbac k is applied from terminal 18.
Five volt power input.
This pin is connected to the internal mid-supply generator and is brought out for bypassing bya 0.022µF capacitor.
low.
internal pull down.
pin 10. To bias the inverter, a 1.0MΩ to 10MΩ resistor is usually connected between this pin and pin 10.
placed in the high impedance state by setting
CS high when the chip is not selected. This high impedance state
can also be programmed by setting the LSB of the prescaler word to 1. This will take precedence over CS. A 0
enables the active state. The Diagnostic Mode overrides these conditions.
edge. This pin has an internal pull up.
This pin has an internal pull up.
resistor is tied between this pin and pin 17, CH1FB to establish the gain of the amplifier.
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
At a Distance 1/16 ±1/32 inch, (1.59 ±0.79mm) from Case for
10s Max. (SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical SpecificationsV
= 5V ±5%, GND = 0V, Clock Frequency 4MHz ±0.1%, TA = -40oC to 125oC,
HOLD,CS, SI, SCKV
High Input Voltage , Pins INT/HOLD, CS, SI, SCKV
Hysteresis voltage, Pins INT/HOLD, CS, SI, SCKV
DD
MID
MID
IL
IH
HYST
Internal Pull-Up CurrentISourceCS,SI,
TEST
SCK,
Internal Pull-Down CurrentI Sink,
HOLD
INT/
Low Level Output, Pin SOV
High Level Output, Pin SOV
Three-State Leakage Pin SOI
Low Level Output, Pin 10, OSCOUTV
High Level Output, Pin 10, OSCOUTV
OL
OH
L
OL
OH
VDD = 5.25V, GND = 0V-5.08.0mA
VDD = 5.0V, IL = 2mA Source2.32.452.55V
VDD = 5.0V, IL = 0mA2.42.52.6V
--30% of V
70--% of V
0.85--V
VDD = 5.0V, Measured at GND-50-µA
VDD = 5.0V, Measured at V
I
SOURCE
I
SINK
= 1.6mA, VDD = 5.0V0.01-0.30V
= 200µA, VDD = 5.0V4.84.95.0V
DD
--50-µA
Measured at GND; VDD = 5.0V--±10µA
I
SOURCE
I
SINK
= 500µA; VDD= 5.0V--1.5V
= -500µA; VDD= 5.0V4.4--V
DD
DD
SPI BUS INTERFACE AC Parametrics
CS Falling to SCLK Risingt
CS Rising to SCLK Fallingt
SCLK Lowt
SCLK Hight
SCLK Falling to CS Risingt
Data High Setup Timet
Data Low Setup Timet
Data High Hold Timet
Data Low Hold Timet
Min Time Between 2 Programmed Wordst
CS Rising to INT/Hold Risingt