intersil HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 DATA SHEET
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HIN232, HIN236, HIN237,HIN238,
HIN239, HIN240, HIN241
Data SheetSeptember 2004
+5V Powered RS-232
Transmitters/Receivers
The HIN232-HIN241 family of RS-232 transmitters/receivers
interface circuits meet all ElA RS-232E and V.28 specifications,
and are particularly suited for those applications where ±12V is
not available. They require a single +5V power supply (except
HIN239) and feature onboard charge pump voltage converters
which generate +10V and
The family of devices off er a wide variety of RS-232
transmitter/receiver combinations to accommodate various
applications (see Selection Table).
The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ
input impedance. The receivers also feature hysteresis to
greatly improve noise rejection.
C1+External capacitor (+ terminal) is connected to this lead.
C1-External capacitor (- terminal) is connected to this lead.
C2+External capacitor (+ terminal) is connected to this lead.
C2-External capacitor (- terminal) is connected to this lead.
T
IN
T
OUT
R
IN
R
OUT
EN
SDShutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the
NCNo Connect. No connections are made to these leads.
Power Supply Input 5V ±10%.
Transmitter Inputs. These leads accept TTL/CMOS levels. A n internal 400kΩ pull-up resistor to V
Transmitter Outputs. These are RS-232 levels (nominally ±10V).
Receiver Inputs. These inputs accept RS-232 input le vels . An internal 5kΩ pull-dow n resistor to GND is connected to each input.
Receiver Outputs. These are TTL/CMOS levels.
Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in
HIN232CB0 to 7016 Ld SOICM16.3
HIN232CB-T0 to 70Tape and Reel
HIN232CBZ
(See Note)
HIN232CBZ-T
(See Note)
HIN232CP0 to 7016 Ld PDIPE16.3
HIN232CPZ
(See Note)
HIN232IB-40 to 8516 Ld SOICM16.3
HIN232IB-T-40 to 85Tape and Reel
HIN232IBZ
(See Note)
HIN232IBZ-T
(See Note)
HIN232IP-40 to 8516 Ld PDIPE16.3
HIN232IPZ
(See Note)
HIN236CB0 to 7024 Ld SOICM24.3
HIN236CBZ
(See Note)
HIN237CB0 to 7024 Ld SOICM24.3
HIN237CB-T0 to 70Tape and Reel
HIN237CBZ
(See Note)
HIN237CBZ-T
(See Note)
HIN238CB0 to 7024 Ld SOICM24.3
HIN238CB-T0 to 70Tape and Reel
HIN238CBZ
(See Note)
HIN238CBZ-T
(See Note)
HIN238CP0 to 7024 Ld PDIPE24.3
HIN238IB-40 to 8524 Ld SOICM24.3
HIN238IBZ
(See Note)
HIN239CB0 to 7024 Ld SOICM24.3
HIN239CB-T0 to 70Tape and Reel
HIN239CBZ
(See Note)
HIN239CBZ-T
(See Note)
HIN239CP0 to 7024 Ld PDIPE24.3
HIN239CPZ
(See Note)
HIN240CN0 to 7044 Ld MQFPQ44.10X10
HIN241CA0 to 7028 Ld SSOPM28.209
TEMP.
RANGE (
o
C)PACKAGEPKG. DWG. #
0 to 7016 Ld SOIC
(Pb-free)
0 to 70Tape and Reel (Pb-free)
0 to 7016 Ld PDIP
(Pb-free)
-40 to 8516 Ld SOIC
(Pb-free)
-40 to 85Tape and Reel (Pb-free)
-40 to 8516 Ld PDIP
(Pb-free)
0 to 7024 Ld SOIC
(Pb-free)
0 to 7024 Ld SOIC
(Pb-free)
0 to 70Tape and Reel (Pb-free)
0 to 7024 Ld SOIC
(Pb-free)
0 to 70Tape and Reel (Pb-free)
-40 to 8524 Ld SOIC
(Pb-free)
0 to 7024 Ld SOIC
(Pb-free)
0 to 70Tape and Reel (Pb-free)
0 to 7024 Ld PDIP
(Pb-free)
M16.3
E16.3
M16.3
E16.3
M24.3
M24.3
M24.3
M24.3
M24.3
E24.3
Ordering Information (Continued)
PART
NUMBER
HIN241CAZ
(See Note)
HIN241CB0 to 7028 Ld SOICM28.3
HIN241CB-T0 to 70Tape and Reel
HIN241CBZ
(See Note)
HIN241CBZ-T
(See Note)
HIN241IB-40 to 8528 Ld SOICM28.3
HIN241IBZ
(See Note)
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.