Datasheet HI-574A, HI-674A Datasheet (intersil)

HI-574A, HI-674A

Data Sheet August 7, 2008

Complete, 12-Bit A/D Converters with Microprocessor Interface

The HI-X74(A) is a complete 12-bit, Analog-to-Digital Converter, including a +10V reference clock, three-state outputs and a digital interface for microprocessor control. Successive approximation conversion is performed by two monolithic dice housed in a 28 lead package. The bipolar analog die features the Intersil Dielectric Isolation process, which provides enhanced AC performance and freedom from latch-up.

Custom design of each IC (bipolar analog and CMOS digital) has yielded improved performance over existing versions of this converter. The voltage comparator features high PSRR plus a high speed current-mode latch, and provides precise decisions down to 0.1 LSB of input overdrive. More than 2X reduction in noise has been achieved by using current instead of voltage for transmission of all signals between the analog and digital ICs. Also, the clock oscillator is current controlled for excellent stability over temperature.

The HI-X74(A) offers standard unipolar and bipolar input ranges, laser trimmed for specified linearity, gain and offset accuracy. The low noise buried zener reference circuit is trimmed for minimum temperature coefficient.

Power requirements are +5V and ±12V to ±15V, with typical dissipation of 385mW (HI-574A, HI-674A) at 12V.

FN3096.6

Features

• Complete 12-Bit A/D Converter with Reference and Clock

• Full 8-Bit, 12-Bit or 16-Bit Microprocessor Bus Interface

• Bus Access Time . . . . . . . . . . . . . . . . . . . . . . . . . . . 150ns

• No Missing Codes Over Temperature

• Minimal Setup Time for Control Signals

• Fast Conversion Times

- HI-574A (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25µs

- HI-674A (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15µs

• Low Noise, via Current-Mode Signal Transmission Between Chips

• Byte Enable/Short Cycle (A

Input)

- Guaranteed Break-Before-Make Action, Eliminating Bus

Contention During Read Operation. Latched by Start Convert Input (To Set the Conversion Length)

• Supply Voltage. . . . . . . . . . . . . . . . . . . . . . ±12V to ±15V

• Pb-Free Available (RoHS Compliant)

Applications

• Military and Industrial Data Acquisition Systems

• Electronic Test and Scientific Instrumentation

• Process Control Systems

Pinout

+5V SUPPLY, V

DATA MODE SEL, 12/8

BYTE ADDR/SHORT

READ/CONVERT, R/C

CHIP ENABLE, CE

+12V/+15V SUPPLY, V

+10V REF, REF OUT

REFERENCE INPUT

-12V/-15V SUPPLY, V

BIPOLAR OFFSET

LOGIC

CHIP SEL, CS

CYCLE, A

ANALOG

COMMON, AC

BIP OFF

10V INPUT

20V INPUT

HI-574A, HI-674A

(28 LD PDIP, SBDIP)

TOP VIEW

STATUS, STS

DB11

DB10

DB9

DB8

DB7

DB6

DB5

DB4

DB3

DB2

DB1

DB0

DIG COMMON,

MSB

DIGITAL DATA OUTPUTS

LSB

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or 1-888-468-3774

| Intersil (and design) is a registered trademark of Intersil Americas Inc.

All other trademarks mentioned are the property of their respective owners.

HI-574A, HI-674A

Ordering Information

TEMPERATURE RANGE

PART NUMBER PART MARKING INL

HI3-574AJN-5 HI3-574AJN-5 ±1.0 LSB 0 to +75 28 Ld PDIP E28.6 HI3-574AJN-5Z (Notes 1, 3) HI3-574AJN-5Z ±1.0 LSB 0 to +75 28 Ld PDIP (Pb-Free) E28.6 HI3-574AKN-5 HI3-574AKN-5 ±0.5 LSB 0 to +75 28 Ld PDIP E28.6 HI3-574AKN-5Z (Notes 1, 3) HI3-574AKN-5Z ±0.5 LSB 0 to +75 28 Ld PDIP (Pb-Free) E28.6 HI1-574AJD-5 (Note 2) HI1-574AJD -5 ±1.0 LSB 0 to +75 28 Ld SBDIP (Pb-Free) D28.6 HI1-574AKD-5 (Note 2) HI1-574AKD -5 ±0.5 LSB 0 to +75 28 Ld SBDIP (Pb-Free) D28.6 HI1-574ASD-2 (Note 2) HI1-574ASD -2 ±1.0 LSB -55 to +125 28 Ld SBDIP (Pb-Free) D28.6 HI1-574ATD-2 (Note 2) HI1- 574ATD-2 ±0.5 LSB -55 to +125 28 Ld SBDIP (Pb-Free) D28.6 HI3-674AJN-5 HI3-674AJN-5 ±1.0 LSB 0 to +75 28 Ld PDIP E28.6 HI3-674AJN-5Z (Notes 1, 3) HI3-674AJN-5Z ±1.0 LSB 0 to +75 28 Ld PDIP (Pb-Free) E28.6 HI3-674AKN-5 HI3-674AKN-5 ±0.5 LSB 0 to +75 28 Ld PDIP E28.6 HI3-674AKN-5Z (Notes 1, 3) HI3-674AKN-5Z ±0.5 LSB 0 to +75 28 Ld PDIP (Pb-Free) E28.6 HI1-674AKD-5 (Note 2) HI1-674AKD -5 ±0.5 LSB 0 to +75 28 Ld SBDIP (Pb-Free) D28.6 HI1-674ATD/883 (Note 2) HI1-674ATD /883 ±0.5 LSB -55 to +125 28 Ld SBDIP (Pb-Free) D28.6

NOTES:

1. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

2. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.

3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-

020.

(°C) PACKAGE

PKG.

DWG. #

FN3096.6

August 7, 2008

Functional Block Diagram

HI-574A, HI-674A

BIT OUTPUTS

MSB LSB

12/8

R/C

REF

OUT

REF

CONTROL

LOGIC

OSCILLATOR

DIGITAL CHIP

ANALOG CHIP

+10V

REF

THREE-STATE BUFFERS AND CONTROL

POWER-UP RESET

CLK

12 BITS

10k

NIBBLE B (NOTE) NIBBLE C (NOTE)NIBBLE A (NOTE)

LOGIC

12 BITS

SAR

STROBE

COMP

DAC

10k

2.5k

DIGITAL COMMON

STS

ANALOG

COMMON

NOTE: “Nibble” is a 4-bit digital word.

BIP

OFF

20V

INPUT

10V

INPUT

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August 7, 2008

HI-574A, HI-674A

Absolute Maximum Ratings Thermal Information

Supply Voltage

to Digital Common . . . . . . . . . . . . . . . . . . . . . . 0V to +16.5V

to Digital Common . . . . . . . . . . . . . . . . . . . . . . .0V to -16.5V

to Digital Common . . . . . . . . . . . . . . . . . . . . . .0V to +7V

LOGIC

Analog Common to Digital Common . . . . . . . . . . . . . . . . . . . .±1V

Control Inputs

(CE, CS

, AO, 12/8, R/C) to Digital Common . . -0.5V to V

Analog Inputs

LOGIC

+0.5V

(REFIN, BIPOFF, 10VIN) to Analog Common . . . . . . . . . . ±16.5V

20VIN to Analog Common . . . . . . . . . . . . . . . . . . . . . . . . . . ±24V

REFOUT . . . . .Indefinite Short T o Common, Momentary Short T o V

Operating Conditions

Temperature Range

HI3-574Axx-5, HI1-674Axx-5 . . . . . . . . . . . . . . . . . . 0°C to +75°C

HI1-574AxD-2, HI1-674AxD-2 . . . . . . . . . . . . . . .-55°C to +125°C

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.

NOTE:

is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

4. θ

Thermal Resistance (Typical, Note 4) θ

SBDIP Package . . . . . . . . . . . . . . . . . . 55 18

(°C/W) θJC (°C/W)

PDIP Package*. . . . . . . . . . . . . . . . . . . 60 N/A

Maximum Junction Temperature

PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C

SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C

Maximum Storage Temperature Range

PDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

SBDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.

Die Characteristics

Transistor Count

HI-574A, HI-674A. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1117

DC and Transfer Accuracy Specifications Typical at +25°C with V

= +15V or +12V, V

= +5V, VEE = -15V or -12V;

LOGIC

Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested.

TEMPERATURE RANGE

-5 (0°C to +75°C)

PARAMETER

UNITSJ SUFFIX K SUFFIX

DYNAMIC CHARACTERISTICS

Resolution (Max) 12 12 Bits Linearity Error

+25°C (Max) ±1 ± 0°C to +75°C (Max) ±1 ±

Max Resolution For Which No Missing Codes Is Guaranteed

+25°C 12 12 Bits T

MIN

to T

MAX

11 12 Bits

Unipolar Offset (Max)

Adjustable to Zero ±2 ±1.5 LSB

Bipolar Offset (Max)

= 0V (Adjustable to Zero) ±4 ±4 LSB

= -10V ±0.15 ±0.1 % of FS

Full Scale Calibration Error

+25°C (Max), With Fixed 50Ω Resistor From REF OUT To REF IN

±0.25 ±0.25 % of FS

(Adjustable to Zero) T T

MIN MIN

to T to T

(No Adjustment At +25°C) ±0.475 ±0.375 % of FS

MAX

(With Adjustment To Zero +25°C) ±0.22 ±0.12 % of FS

MAX

LSB LSB

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August 7, 2008

HI-574A, HI-674A

DC and Transfer Accuracy Specifications Typical at +25°C with V

= +15V or +12V, V

= +5V, VEE = -15V or -12V;

LOGIC

Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued)

TEMPERATURE RANGE

-5 (0°C to +75°C)

PARAMETER

Temperature Coefficients Guaranteed Max Change, T

MIN

to T

(Using Internal Reference)

MAX

Unipolar Offset ±2 ±1 LSB Bipolar Offset ±2 ±1 LSB Full Scale Calibration ±9 ±2 LSB

Power Supply Rejection Max Change In Full Scale Calibration

+13.5V < V +4.5V < V

-16.5V < V

< +16.5V or +11.4V < VCC < +12.6V ±2 ±1 LSB

< +5.5V ±1/

LOGIC

< -13.5V or -12.6V < VEE < -11.4V ±2 ±1 LSB

±1/

ANALOG INPUTS

Input Ranges

Bipolar -5 to +5 (Note 6) V

-10 to +10 (Note 7) V

Unipolar 0 to +10 (Note 6) V

0 to +20 (Note 7) V

Input Impedance

10V Span 5k, ±25% Ω 20V Span 10k, ±25% Ω

POWER SUPPLIES

Operating Voltage Range

LOGIC

+4.5 to +5.5 V

+11.4 to +16.5 V

-11.4 to -16.5 V

Operating Current

LOGIC

+15V Supply 11 Typ, 15 Max mA

-15V Supply 21 Typ, 28 Max mA

7 Typ, 15 Max mA

Power Dissipation

±15V, +5V 515 Typ, 720 Max mW ±12V, +5V 385 Typ mW

Internal Reference Voltage

to T

MIN

MAX

Output Current, Available For External Loads (External Load Should Not

+10.00 ±0.05 Max V

2.0 Max mA

Change During Conversion).

UNITSJ SUFFIX K SUFFIX

LSB

FN3096.6

August 7, 2008

HI-574A, HI-674A

DC and Transfer Accuracy Specifications Typical at +25°C with V

Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued)

PARAMETER

DYNAMIC CHARACTERISTICS

Resolution (Max) 12 12 Bits Linearity Error

+25°C ±1 ±

-55°C to +125°C (Max) ±1 ±1 LSB

Max Resolution For Which No Missing Codes Is Guaranteed

+25°C 12 12 Bits T

to T

MIN

MAX

Unipolar Offset (Max)

Adjustable to Zero ±2 ±1.5 LSB

Bipolar Offset (Max)

= 0V (Adjustable to Zero) ±4 ±4 LSB

= -10V ±0.15 ±0.1 % of FS

Full Scale Calibration Error

+25°C (Max), With Fixed 50Ω Resistor From REF OUT To REF IN (Adjustable To Zero)

to T

MIN

to T

MIN

Temperature Coefficients Guaranteed Max Change, T

Unipolar Offset ±2 ±1 LSB Bipolar Offset ±2 ±2 LSB Full Scale Calibration ±20 ±10 LSB

Power Supply Rejection Max Change In Full Scale Calibration

+13.5V < V +4.5V < V

-16.5V < V

ANALOG INPUTS

Input Ranges

Bipolar -5 to +5 (Note 6) V

Unipolar 0 to +10 (Note 6) V

Input Impedance

10V Span 5k, ±25% Ω 20V Span 10k, ±25% Ω

POWER SUPPLIES

Operating Voltage Range

LOGIC

(No Adjustment At +25°C) ±0.75 ±0.50 % of FS

MAX

(With Adjustment To Zero At +25°C) ±0.50 ±0.25 % of FS

MAX

to T

MIN

< +16.5V or +11.4V < VCC < +12.6V ±2 ±1 LSB

< +5.5V ±1/

LOGIC

< -13.5V or -12.6V < VEE < -11.4V ±2 ±1 LSB

(Using Internal Reference)

MAX

= +15V or +12V, V

= +5V, VEE = -15V or -12V;

LOGIC

TEMPERATURE RANGE

-2 (-55°C to +125°C)

11 12 Bits

±0.25 ±0.25 % of FS

±1/

-10 to +10 (Note 7) V

0 to +20 (Note 7) V

+4.5 to +5.5 V

+11.4 to +16.5 V

-11.4 to -16.5 V

UNITSS SUFFIX T SUFFIX

LSB

FN3096.6

August 7, 2008

HI-574A, HI-674A

DC and Transfer Accuracy Specifications Typical at +25°C with V

= +15V or +12V, V

= +5V, VEE = -15V or -12V;

LOGIC

Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. (Continued)

TEMPERATURE RANGE

-2 (-55°C to +125°C)

PARAMETER

UNITSS SUFFIX T SUFFIX

Operating Current

LOGIC

+15V Supply 11 Typ, 15 Max mA

-15V Supply 21 Typ, 28 Max mA

7 Typ, 15 Max mA

Power Dissipation

±15V, +5V 515 Typ, 720 Max mW ±12V, +5V 385 Typ mW

Internal Reference Voltage

to T

MIN

MAX

Output current, available for external loads (external load should not

+10.00 ±0.05 Max V

2.0 Max mA

change during conversion).

Digital Specifications All Models, Over Full Temperature Range; Parameters with MIN and/or MAX limits are 100% tested at +25°C,

unless otherwise specified. Temperature limits established by characterization and are not production tested.

PARAMETER MIN TYP MAX

Logic Inputs (CE, CS

Logic “1” +2.4V - +5.5V Logic “0” -0.5V - +0.8V Current - ±0.1µA ±5µA Capacitance - 5pF -

Logic Outputs (DB11-DB0, STS)

Logic “0” (I Logic “1” (I Logic “1” (I Leakage (High-Z State, DB11-DB0 Only) - ±0.1µA ±5µA Capacitance - 5pF -

, R/C, AO,12/8)

- 1.6mA) - - +0.4V

SINK SOURCE SOURCE

- 500µA) +2.4V - -

- 10µA) +4.5V - -

Timing Specifications (HI-574A) +25°C, Note 5, Unless Otherwise Specified.

SYMBOL PARAMETER MIN TYP MAX UNITS

CONVERT MODE

DSC

HEC

SSC

HSC

SRC

HRC

SAC

HAC

STS Delay from CE - - 200 ns CE Pulse Width 50 - - ns CS to CE Setup 50 - - ns CS Low During CE High 50 - - ns R/C to CE Setup 50 - - ns R/C Low During CE High 50 - - ns AO to CE Setup 0 - - ns AO Valid During CE High 50 - - ns Conversion Time 12-Bit Cycle T

8-Bit Cycle T

MIN

to T

MAX

15 20 25 μs 10 13 17 μs

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HI-574A, HI-674A

Timing Specifications (HI-574A) +25°C, Note 5, Unless Otherwise Specified. (Continued)

SYMBOL PARAMETER MIN TYP MAX UNITS

READ MODE

SSR

SRR

SAR

HSR

HRR

HAR

Timing Specifications (HI-674A) +25°C, Note 5, Unless Otherwise Specified.

SYMBOL PARAMETER MIN TYP MAX UNITS

CONVERT MODE

DSC

HEC

SSC

HSC

SRC

HRC

SAC

HAC

READ MODE

SSR

SRR

SAR

HSR

HRR

HAR

NOTES:

5. Time is measured from 50% level of digital transitions. Tested with a 50pF and 3kΩ load.

6. For the “10V Input”, Pin 13.

7. For the “20V Input”, Pin 14.

Access Time from CE - 75 150 ns Data Valid After CE Low 25 - - ns Output Float Delay - 100 150 ns CS to CE Setup 50 - - ns R/C to CE Setup 0 - - ns AO to CE Setup 50 - - ns CS Valid After CE Low 0 - - ns R/C High After CE Low 0 - - ns AO Valid After CE Low 50 - - ns STS Delay After Data Valid 300 - 1200 ns

8-Bit Cycle T

MIN

to T

MAX

81215µs 5810µs

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HI-574A, HI-674A

Pin Descriptions

PIN SYMBOL DESCRIPTION

1V 2 12/8 Data Mode Select - Selects between

3CS

5R/C 6 CE Chip Enable - Chip Enable low disables

7V 8 REF OUT +10V Reference

9 AC Analog Common 10 REF IN Reference Input 11 V 12 BIP OFF Bipolar Offset 13 10V Input 10V Input - Used for 0V to 10V and -5V to

14 20V Input 20V Input - Use d for 0V to 20V a nd -10 V to

15 DC Digital Common 16 DB0 Data Bit 0 (LSB) 17 DB1 Data Bit 1 18 DB2 Data Bit 2 19 DB3 Data Bit 3 20 DB4 Data Bit 4 21 DB5 Data Bit 5 22 DB6 Data Bit 6 23 DB7 Data Bit 7 24 DB8 Data Bit 8 25 DB9 Data Bit 9 26 DB10 Data Bit 10 27 DB11 Data Bit 11 (MSB) 28 STS Status Bit - S tatus high implies a conversion

LOGIC

Logic supply pin (+5V)

12-bit and 8-bit output modes. Chip Select - Chip Select high disables

the device. Byte Address/Short Cycle - See Table 3

for operation. Read/Convert - See T able 3 for operation.

the device. Positive Supply (+12V/+15V)

Negative Supply (-12V/-15V).

+5V input ranges.

+10V input ranges.

is in progress.

Definitions of Specifications

Linearity Error

Linearity error refers to the deviation of each individual code from a line drawn from “zero” through “full scale”. The point used as “zero” occurs the first code transition (all zeros to only the LSB “on”). “Full scale” is defined as a level 1 transition (to all ones). The deviation of a code from the true straight line is measured from the middle of each particular code.

/2 LSB (1.22mV for 10V span) before

/2 LSB beyond the last code

The HI-X74AK grade is guaranteed for maximum nonlinearity

of ±

/2 LSB. For this grade, this means that an analog value which falls exactly in the center of a given code width will result in the correct digital output code. Values nearer the upper or lower transition of the code width may produce the next upper or lower digital output code. The HI-X74AJ is guaranteed to ±1 LSB max error. For this grade, an analog value which falls within a given code width will result in either the correct code for that region or either adjacent one.

Note that the linearity error is not user-adjustable.

Differential Linearity Error (No Missing Codes)

A specification which guarantees no missing codes requires that every code combination appear in a monotonic increasing sequence as the analog input level is increased. Thus every code must have a finite width. For the HI-X74AK grade, which guarantees no missing codes to 12-bit resolution, all 4096 codes must be present over the entire operating temperature ranges. The HI-X74AJ grade guarantees no missing codes to 11 -bit resolution over tempe rature; this means th at all code combinations of the upper 1 1 bits must be present; in practice very few of the 12-bit codes are missing.

Unipolar Offset

The first transition should occur at a level 1/2 LSB above analog common. Unipolar offset is defined as the deviation of the actual transition from that point. This offset can be adjusted as discussed on the following pages. The unipolar offset temperature coefficient specifies the maximum change of the transition point over temperature, with or without external adjustment.

Bipolar Offset

Similarly, in the bipolar mode, the major carry transition (0111 1111 1111 to 1000 0000 0000) should occur for an analog value

/2 LSB below analog common. The bipolar offset error and temperature coefficient specify the initial deviation and maximum change in the error over temperature.

Full Scale Calibration Error

The last transition (from 111 1 1111 1110 to 1111 1111 1111) should occur for an analog value 1 nominal full scale (9.9963V for 10.000V full scale). The full scale calibration error is the deviation of the actu al level at the last transition from the ideal level. This error, which is typically 0.05 to 0.1% of full scale, can be trimmed out as shown in Figures 1 and 2. The full scale calibration error over temperature is given with and without the initial error trimmed out. The temperature coefficients for each grade indicate the maximum change in the full scale gain from the initial value using the internal 10V reference.

/2 LSB below the

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HI-574A, HI-674A

Temperature Coefficients

The temperature coefficients for full-scale calibration, unipolar offset, and bipolar offset specify the maximum change from the initial (25°C) value to the value at T T

MAX

MIN

Power Supply Rejection

The standard specifications for the HI-X74A assume use of +5.00V and ±15.00V or ±12.00V supplies. The only effect of power supply error on the performance of the device will be a small change in the full scale calibration. This will result in a linear change in all lower order codes. The specifications show the maximum change in calibration from the initial value with the supplies at the various limits.

Code Width

A fundamental quantity for A/D converter specifications is the code width. This is defined as the range of analog input values for which a given digital output code will occur. The nominal value of a code width is equivalent to 1 least significant bit (LSB) of the full scale range or 2.44mV out of 10V for a 12-bit ADC.

Quantization Uncertainty

Analog-to-digital converters exhibit an inherent quantization uncertainty of ± characteristic of the quantization process and cannot be reduced for a converter of given resolution.

/2 LSB. This uncertainty is a fundamental

Left-Justified Data

The data format used in the HI-X74A is left-justified. This means that the data represents the analog input as a fraction of full-scale, ranging from 0 to . This implies a binary point to the left of the MSB.

4095 4096

Applying the HI-X74A

For each application of this converter, the ground connections, power supply bypassing, analog signal source, digital timing and signal routing on the circuit board must be optimized to assure maximum performance. These areas are reviewed in the following sections, along with basic operating modes and calibration requirements.

Physical Mounting and Layout Considerations

LAYOUT

Unwanted, parasitic circuit components, (L, R, and C) can make 12-bit accuracy impossible, even with a perfect A/D converter. The best policy is to eliminate or minimize these parasitics through proper circuit layout, rather than try to quantify their effects.

The recommended construction is a double-sided printed

circuit board with a ground plane on the component side.

Other techniques, such as wire-wrapping or point-to-point

wiring on vector board, will have an unpredictable effect on

accuracy.

In general, sensitive analog signals should be routed between ground traces and kept well away from digital lines. If analog and digital lines must cross, they should do so at right angles.

Power Supplies

Supply voltages to the HI-X74A (+15V, -15V and +5V) must be “quiet” and well regulated. Voltage spikes on these lines can affect the converter’s accuracy , causing several LSBs to flicker when a constant input is applied. Digital noise and spikes from a switching power supply are especially troublesome. If switching supplies must be used, outputs should be carefully filtered to assure “quiet” DC voltage at the converter terminals.

Further, a bypass capacitor pair on each supply voltage terminal is necessary to counter the effect of variations in supply current. Connect one pair from pin 1 to 15 (V supply), one from pin 7 to 9 (V one from pin 11 to 9 (V capacitor pair, a 10µF tantalum type in parallel with a 0.1µF ceramic type is recommended.

to Analog Common). For each

to Analog Common) and

LOGIC

Ground Connections

Pins 9 and 15 should be tied together at the package to guarantee specified performance for the converter. In addition, a wide PC trace should run directly from pin 9 to (usually) +15V common, and from pin 15 to (usually) the +5V Logic Common. If the converter is located some dista nce from the system’s “single point” ground, make only these connections to pins 9 and 15: Tie them together at the package, and back to the system ground with a single path. This path should have low resistance. (Code dependent currents flow in the V through the HI-X74A’s AnalogCommon or Digital Common).

, VEE and V

terminals, but not

LOGIC

Analog Signal Source

HI-574A and HI-674A

The device chosen to drive the HI-X74A analog input will see a nominal load of 5kΩ (10V range) or 10kΩ (20V range). However, the other end of these input resistors may change ±400mV with each bit decision, creating abrupt changes in current at the analog input. Thus, the signal source must maintain its output voltage while furnishing these step changes in load current, which occur at 1.6μs and 950ns intervals for the HI-574A and HI-674A, respectively. This requires low output impedance and fast settling by the signal source.

The output impedance of an op amp, for example, has an open loop value which, in a closed loop, is divided by the loop gain available at a frequency of interest. The amplifier should have acceptable loop gain at 600kHz for use with the HI-X74A. To check whether the output properties of a signal source are suitable, monitor the HI-X74A’s input (pin 13 or

14) with an oscilloscope while a conversion is in progress. Each of the twelve disturbances should subside in 1μs or less for the HI-574A and 500ns or less for the HI-674A. (The comparator decision is made about 1.5µs and 850ns after each code change from the SAR for the HI-574A and HI-674A, respectively.)

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HI-574A, HI-674A

If the application calls for a Sample/Hold to precede the converter, it should be noted that not all Sample/Holds are compatible with the HI-574A in the manner described above. These will require an additional wideband buffer amplifier to lower their output impedance. A simpler solution is to use the Intersil HA-5320 Sample/Hold, which was designed for use with the HI-574A.

STS 28

HIGH BITS

MIDDLE BITS

LOW BITS

+5V 1

+15V 7

-15V 11

†

DIG COM 15

24-27

20-23

16-19

-15V

ANALOG

100K

100Ω

0V TO +10V

INPUTS

0V TO +20V

OFFSET

100K

+15V

GAIN

100Ω

212/8

3CS

5R/C

6CE

10 REF IN

8REF OUT

12 BIP OFF

13 10V

14 20V

9 ANA

COM

†When driving the 20V (pin 14) input, minimize capacitance on pin 13.

FIGURE 1. UNIPOLAR CONNECTIONS

HIGH BITS

MIDDLE BITS

LOW BITS

-15V 11

†

DIG COM 15

STS 28

24-27

20-23

16-19

+5V 1

+15V 7

ANALOG

INPUTS

±5V

±10V

GAIN

100Ω

OFFSET

2 12/8

3CS

5R/C

6CE

10 REF IN

8REF OUT

12 BIP OFF

13 10V

14 20V

9 ANA

COM

†When driving the 20V (pin 14) input, minimize capacitance on pin 13.

FIGURE 2. BIPOLAR CONNECTIONS

Range Connections and Calibration Procedures

The HI-X74A is a “complete” A/D converter, meanin g it is fully operational with addition of the power supply volt ages, a Start Convert signal, and a few external components as shown in Figures 1 and 2. Nothing more is required for most applications.

Whether controlled by a processor or operating in the stand-alone mode, the HI-X74A offers four standard input ranges: 0V to +10V, 0V to +20V, ±5V and ±10V. The maximum errors for gain and offset are listed under Specifications. If required, however, these errors may be adjusted to zero as explained below. Power supply and ground connections have been discussed in an earlier section.

Unipolar Connections and Calibration

Refer to Figure 1. The resistors shown (see Note below) are for calibration of offset and gain. If this is not required, replace R2 with a 50Ω, 1% metal film resistor and remove the network on pin 12. Connect pin 12 to pin 9. Then, connect the analog signal to pin 13 for the 0V to 10V range, or to pin 14 for the 0V to 20V range. Inputs to +20V (5V over the power supply) are no problem - the converter operates normally.

Calibration consists of adjusting the converter’s most negative output to its ideal value (offset adjustment), then, adjusting the most positive output to its ideal value (gain adjustment). To understand the procedure, note that in principle, one is setting the output with respect to the midpoint of an increment of analog input, as denoted by two adjacent code changes. Nominal value of an increme nt is one LSB. However, this approach is impractical because nothing “happens” at a midpoint to indicate that an adjustment is complete. Therefore, calibration is performed in terms of the observable code changes instead of the midpoint between code changes.

For example, midpoint of the first LSB increment should be positioned at the origin, with an output code of all 0’s. To do this, apply an input of +

/2 LSB (+1.22mV for the 10V range; +2.44mV for the 20V range). Adjust the Offset potentiometer R1 until the first code transition flickers between 0000 0000 0000 and 0000 0000 0001.

Next, perform a Gain Adjust at positive full scale. Again, the ideal input corresponding to the last code change is applied. This is 1

/2 LSBs below the nominal full scale (+9.9963V for 10V range; +19.9927V for 20V range). Adjust the Gain potentiometer R2 for flicker between codes 1111 1111 1110 and 1111 1111 1111 .

Bipolar Connections and Calibration

Refer to Figure 2. The gain and offset errors listed under Specifications may be adjusted to zero using potentiometers R1 and R2 (see Note below). If this isn’t

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August 7, 2008

HI-574A, HI-674A

required, either or both pots may be replaced by a 50Ω, 1% metal film resistor.

Connect the Analog signal to pin 13 for a ±5V range, or to pin 14 for a ±10V range. Calibration of offset and gain is similar to that for the unipolar ranges as discussed above. First apply a DC input voltage

/2 LSB above negative full scale (i.e., -4.9988V for the ±5V range, or -9.9976V for the ±10V range). Adjust the offset potentiometer R1 for flicker between output codes 0000 0000 0000 and 0000 0000

0001. Next, apply a DC input voltage 1

/2 LSBs below positive full scale (+4.9963V for ±5V range; +9.9927V for ±10V range). Adjust the Gain potentiometer R2 for flicker between codes 1111 1111 1110 and 1111 1111 1111.

NOTE: The 100Ω potentiometer R2 provides Gain Adjust for the 10V and 20V ranges. In some applications, a full scale of 10.24V (LSB equals 2.5mV) or 20.48V (LSB equals 5.0mV) is more convenient. For these, replace R2 by a 50Ω, 1% metal film resistor. Then, to provide Gain Adjust for the 10.24V range, add a 200Ω potentiometer in series with pin 13. For the 20.48V range, add a 500Ω potentiometer in series with pin 14.

Controlling the HI-X74A

The HI-X74A includes logic for direct interface to most microprocessor systems. The processor may take full control of each conversion, or the converter may operate in the “stand-alone” mode, controlled only by the R/C Full control consists of selecting an 8-bit or 12-bit conversion cycle, initiating the conversion, and reading the output data when ready-choosing either 12 bits at once or 8 followed by 4, in a left-justified format. The five control inputs are all TTL/CMOS-compatible: (12/8

, CS, AO, R/C and CE). Table 3 illustrates the use of these inputs in controlling the converter’s operations. Also, a simplified schematic of the internal control logic is shown in Figure 6.

“Stand-Alone Operation”

The simplest control interface calls for a single control line connected to R/C A

are wired low, and the output data appears in words of

12 bits each. The R/C

signal may have any duty cycle within (and including) the extremes shown in Figures 7 and 8. In general, data may be read when R/C also high, indicating a conversion is in progress. Timing parameters particular to this mode of operation are listed in Tables 1 and 2.

. Also, CE and 12/8 are wired high, CS and

is high unless STS is

input.

TABLE 1. HI-574A STAND-ALONE MODE TIMING

SYMBOL PARAMETER MIN TYP MAX UNITS

Low R/C Pulse Width 50 - - ns

HRL

STS Delay from R/C - - 200 ns

t t

Time is measured from 50% level of digital transitions. Tested with a 50pF and 3kΩ load.

SYMBOL PARAMETER MIN TYP MAX UNITS

Time is measured from 50% level of digital transitions. Tested with a 50pF and 3kΩ load.

Data Valid after R/C Low 25 - - ns

HDR

STS Delay after Data Valid 300 - 1200 ns

High R/C Pulse Width 150 - - ns

HRH

Data Access Time - - 150 ns

DDR

TABLE 2. HI-674A STAND-ALONE MODE TIMING

t t

Low R/C Pulse Width 50 - - ns

HRL

STS Delay from R/C - - 200 ns

Data Valid after R/C Low 25 - - ns

HDR

STS Delay after Data

Valid High R/C Pulse Width 150 - - ns

HRH

Data Access Time - - 150 ns

DDR

25 - 850 ns

Conversion Length

A Convert Start transition (see Table 1) latches the state of A

, which determines whether the conversion continues for

12 bits (A

low) or stops with 8 bits (AO high). If all 12 bits are

read following an 8-bit conversion, the last three LSBs will read ZERO and DB3 will read ONE. A

is latched because it

is also involved in enabling the output buffers (see ““Reading the Output Data” on page 13). No other control inputs are latched.

TABLE 3. TRUTH TABLE FOR HI-X74A CONTROL INPUTS

CE CS

0 X X X X None

X 1 X X X None

↑ 0 0 X 0 Initiate 12-bit conversion ↑ 0 0 X 1 Initiate 8-bit conversion

1 ↓ 0 X 0 Initiate 12-bit conversion 1 ↓ 0 X 1 Initiate 8-bit conversion 10↓ X 0 Initiate 12-bit conversion 10↓ X 1 Initiate 8-bit conversion 1 0 1 1 X Enable 12-bit Output 1 0 1 0 0 Enable 8 MSBs Only 1 0 1 0 1 Enable 4 LSBs Plus 4 Trailing Zeroes

R/C 12/8 A

OPERATION

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HI-574A, HI-674A

Conversion Start

A conversion may be initiated as shown in Table 3 by a logic transition on any of three inputs: CE, CS

or R/C. The last of the three to reach the correct state starts the conversion, so one, two or all three may be dynamically controlled. The nominal delay from each is the same, and if necessary, all three may change state simultaneously. However, to ensure that a particular input cont ro ls the start of conversion, the other two should be set up at least 50ns earlier. See the HI-X74A Timing Specifications, Convert Mode.

This variety of HI-X74A control modes allows a simple interface in most system applications. The Convert Start timing relationships are illustrated in Figure 3.

The output signal STS indicates status of the converter by going high only while a conversion is in progress. While STS is high, the output buffers remain in a high impedance state and data cannot be read. Also, an additional Start Convert will not reset the converter or re-initiate a conversion while STS is high.

Reading the Output Data

The output data buffers remain in a high impedance state until four conditions are met: R/C and CS

low. At that time, data lines become active according to the state of inputs 12/8 illustrated in Figure 4.

The 12/8

input will be tied high or low in most applications,

though it is fully TTL/CMOS-compatible. With 12/8

high, STS low, CE high

and AO. Timing constraints are

high, all

12 output lines become active simultaneously, for interface to a 12-bit or 16-bit data bus. The A

input is ignored.

With 12/8 low, the output is organized in two 8-bit bytes, selected one at a time by A to be connected as shown in Figure 5. A

. This allows an 8-bit data bus

is usually tied to

the least significant bit of the address bus, for storing the HI-X74A output in two consecutive memory locations. (With A

low, the 8 MSBs only are enabled. With AO high, 4 MSBs

are disabled, bits 4 through 7 are forced low, and the 4 LSBs are enabled). This two byte format is considered “left justified data,” for which a decimal (or binary!) point is assumed to the left of byte 1:

BYTE 1 BYTE 2

XXXXXXXX XXXX0000

•

MSB LSB

Further, A

may be toggled at any time without damage to

the converter. Break-before-make action is guaranteed between the two data bytes, which assures that the outputs strapped together in Figure 5 will never be enabled at the same time.

A read operation usually begins after the conversion is complete and STS is low. For earliest access to the data, however, the read should begin no later than (t

+ tHS)

before STS goes low. See Figure 4.

R/C

STS

DB11-DB0

SSC

SRC

SAC

HRC

HAC

DSC

HIGH IMPEDANCE

HEC

HSC

See HI-X74A Timing Specifications for more information.

FIGURE 3. CONVERT START TIMING

R/C

STS

DB11-DB0

SSR

SRR

SAR

HIGH IMPEDANCE

HSR

HRR

HAR

DATA

VALID

See HI-X74A Timing Specifications for more information.

FIGURE 4. READ CYCLE TIMING

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August 7, 2008

HI-574A, HI-674A

12/8

ADDRESS BUS

DB11 (MSB)

HI-X74A

DB0 (LSB)

COM.

STS

DIG.

FIGURE 5. INTERFACE TO AN 8-BIT DATA BUS

DATA BUS

INPUT BUFFERS

12/8

R/C

LATCH

EOC9

EOC13

READ CONTROL

POWER UP

RESET

FIGURE 6. HI-X74A CONTROL LOGIC

CONVERT

CONTROL

CURRENT

CONTROLLED

OSCILLATOR

NIBBLE B ZERO OVERRIDE

NIBBLE A, B

NIBBLE C

STATUS

STROBE

CLOCK

RESET

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August 7, 2008

R/C

STS

HI-574A, HI-674A

HRL

HDR

DB11-DB0

DATA

VALID

FIGURE 7. LOW PULSE FOR R/C - OUTPUTS ENABLED AFTER CONVERSION

R/C

HRH

STS

DDR

DB11-DB0

FIGURE 8. HIGH PULSE FOR R/C

DATA

VALID

HIGH-ZHIGH-Z

DATA

VALID

HDR

- OUTPUTS ENABLED WHILE R/C HIGH, OTHERWISE HIGH-Z

FN3096.6

August 7, 2008

Die Characteristics

HI-574A, HI-674A

DIE DIMENSIONS:

Analog: 3070mm x 4610mm Digital: 1900mm x 4510mm

METALLIZATION:

Digital Type: Nitrox Thickness: 10kÅ ±2kÅ

Metal 1: AlSiCu Thickness: 8k

Å ±1kÅ

Metal 2: AlSiCu Thickness: 16k

Å ±2kÅ

Analog Type: Al Thickness: 16k

Å ±2kÅ

Metallization Mask Layout

R/C

PASSIVATION:

WORST CASE CURRENT DENSITY:

HI-574A, HI-674A

Type: Nitride Over Silox Nitride Thickness: 3.5kÅ ±0.5kÅ Silox Thickness: 12kÅ ±1.5kÅ

1.3 x 10

A/cm

12/8

LOGIC

STS

DB11

DB10

DB9

REFOUT

ANALOG

COMMON

ANALOG

COMMON

ANALOG

COMMON

REFIN

10VIN20V

OFFSET

BIPOLAR

DB8

DB7

DB6

DB5

DB4

DB3

DB2

DIGITAL

COMMON

DB0

DB1

FN3096.6

August 7, 2008

HI-574A, HI-674A

Ceramic Dual-In-Line Metal Seal Packages (SBDIP)

LEAD FINISH

-A-

-B-

bbb C A - B

BASE

PLANE

SEATING

PLANE

S1 b2

ccc

CA - BM

DS S

NOTES:

1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark.

2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied.

3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness.

4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2.

5. Dimension Q shall be measured from the seating plane to the base plane.

6. Measure dimension S1 at all four corners.

7. Measure dimension S2 from the top of the ceramic body to the nearest metallization or lead.

8. N is the maximum number of terminal positions.

9. Braze fillets shall be concave.

10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.

11. Controlling dimension: INCH.

-DBASE

-C-

METAL

(b)

SECTION A-A

(c)

aaa

eA/2

CA - BM DS S

D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C)

28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE

INCHES MILLIMETERS

SYMBOL

A-0.232 - 5.92 -

b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 b3 0.023 0.045 0.58 1.14 4

c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3

D-1.490 - 37.85 - E 0.500 0.610 12.70 15.49 -

e 0.100 BSC 2.54 BSC -

eA 0.600 BSC 15.24 BSC -

eA/2 0.300 BSC 7.62 BSC -

L 0.125 0.200 3.18 5.08 -

Q 0.015 0.060 0.38 1.52 5 S1 0.005 - 0.13 -6 S2 0.005 - 0.13 -7

105

105 aaa - 0.015 - 0.38 bbb - 0.030 - 0.76 -

ccc - 0.010 - 0.25 -

M-0.0015 - 0.038 2 N28 288

NOTESMIN MAX MIN MAX

Rev. 0 5/18/94

FN3096.6

August 7, 2008

Dual-In-Line Plastic Packages (PDIP)

HI-574A, HI-674A

-C-

-B-

INDEX

AREA

BASE

PLANE

SEATING

PLANE

12 3 N/2

-AD

0.010 (0.25) C AM BS

NOTES:

1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95.

4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3.

5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).

6. E and are measured with the leads constrained to be perpendic-

7. e

ular to datum .

and eC are measured at the lead tips with the leads unconstrained.

must be zero or greater.

-C-

8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm).

9. N is the maximum number of terminal positions.

10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).

E28.6 (JEDEC MS-011-AB ISSUE B)

28 LEAD DUAL-IN-LINE PLASTIC PACKAGE

INCHES MILLIMETERS

SYMBOL

A-0.250 - 6.35 4 A1 0.015 - 0.39 -4 A2 0.125 0.195 3.18 4.95 -

B 0.014 0.022 0.356 0.558 B1 0.030 0.070 0.77 1.77 8

C 0.008 0.015 0.204 0.381 -

D 1.380 1.565 35.1 39.7 5

D1 0.005 - 0.13 -5

E 0.600 0.625 15.24 15.87 6 E1 0.485 0.580 12.32 14.73 5

e 0.100 BSC 2.54 BSC -

0.600 BSC 15.24 BSC 6

- 0.700 - 17.78 7

L 0.115 0.200 2.93 5.08 4

N28 289

NOTESMIN MAX MIN MAX

Rev. 1 12/00

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implicat ion or oth erwise u nde r any p a tent or p at ent r ights of Intersil or its subsidiari es.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN3096.6

August 7, 2008

Datasheet HI-574A, HI-674A Datasheet (intersil)

Specifications and Main Features

Frequently Asked Questions

User Manual