Intersil Corporation HI5662 Datasheet

HI5662
Data Sheet February 1999 File Number 4317.2
Dual 8-Bit, 60MSPS A/D Converter with Internal Voltage Reference
The HI5662 is a monolithic, dual 8-Bit, 60MSPS analog-to­digital converter fabricated in an advanced CMOS process. It is designed for high speed applications where integration, bandwidth and accuracy are essential. The HI5662 reaches a new level of multi-channel integration. The fully pipeline architecture and an innovativeinputstageenable the HI5662 to accept a variety of input configurations, single-ended or fully differential. Only one external clock is necessary to drive both converters and an internal band-gap voltage reference is provided. This allows the system designer to realize an increased level of system integration resulting in decreased cost and power dissipation.
The HI5662 has excellent dynamic performance while consuming only 650mW power at 60MSPS. The A/D only requires a single +5V power supply and encode clock. Data output latches are provided which present valid data to the output bus with a latency of 6 clock cycles.
For those customers needing dual channel 10-bit resolution, please refer to the HI5762. For single channel 10-bit applications, please refer to the HI5767.
Ordering Information
Features
• Sampling Rate . . . . . . . . . . . . . . . . . . . . . . . . . . .60MSPS
• 7.8 Bits at f
= 10MHz
IN
• Low Power at 60MSPS. . . . . . . . . . . . . . . . . . . . . 650mW
• Wide Full Power Input Bandwidth. . . . . . . . . . . . . 250MHz
• Excellent Channel-to-Channel Isolation. . . . . . . . . >75dB
• On-Chip Sample and Hold Amplifiers
• Internal Band-Gap Voltage Reference . . . . . . . . . . . . 2.5V
• Fully Differential or Single-Ended Analog Inputs
• Single Supply Voltage Operation . . . . . . . . . . . . . . . . +5V
• TTL/CMOS Compatible Digital Inputs
• CMOS Compatible Digital Outputs. . . . . . . . . . . . 3.0/5.0V
• Offset Binary Digital Data Output Format
• Dual 8-Bit A/D Converters on a Monolithic Chip
Applications
• Wireless Local Loop
• PSK and QAM I and Q Demodulators
• Medical Imaging
PART
NUMBER
TEMP.
RANGE (oC) PACKAGE PKG. NO.
HI5662/6IN -40 to 85 44 Ld MQFP Q44.10x10 HI5662EVAL2 25 Evaluation Platform
• High Speed Data Acquisition
Pinout
HI5662
(MQFP)
TOP VIEW
AV
DV
A
D
GND
CC2
ID7 ID6 ID5 ID4 ID3
CC3
GND
ID2 ID1
DC
IV
44 43 42 41 40
1
2 3 4 5 6 7 8 9
10 11
12 13 14 15 16 17
IN-IIN+
I
GND
RIN
A
V
39 38 37 36 35 34
NC
ROUT
V
CC1
AV
IN+QIN-
Q
DC
QV
33 32 31 30 29
28 27 26 25 24 23
2221201918
A
GND
AV QD7 QD6 QD5 QD4 QD3 DV D
GND
QD2 QD1
CC2
CC3
10
NC
NC
ID0
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
CC1
GND
CLK
D
DV
| Copyright © Intersil Corporation 1999
CC2
DV
GND
D
NC
NC
QD0
Functional Block Diagram
HI5662
I/QIN-
I/Q
BIAS
+
IN
S/H
STAGE 1
X2
2-BIT
FLASH
+
-
STAGE M-1
2-BIT
FLASH
+
-
2-BIT
DAC
DIGITAL DELAY
AND
DIGITAL ERROR
CORRECTION
2-BIT
DAC
I/QV
DC
DV
CC3
I/QD7 (MSB)
I/QD6
I/QD5
I/QD4
I/QD3
I/QD2
I/QD1
I/QD0 (LSB)
V
REFOUT
V
REFIN
X2
REFERENCE
11
2-BIT
FLASH
AV
CC1,2
STAGE M
AGND DV
CC1,2
DGND
CLOCK
I or Q CHANNEL
CLK
Typical Application Schematic
HI5662
HI5662
+
I
IN
IIN-
Q
+
IN
-
Q
IN
0.1µF
+
(42) I
IN
(44) IV
DC
(43) IIN-
+
(36) Q
IN
(34) QV
DC
(35) QIN-
(40) V
RIN
(38) V
ROUT
(13,14,20,21,39) NC
(LSB) ID0 (12)
ID1 (11) ID2 (10) ID3 (7) ID4 (6) ID5 (5) ID6 (4)
(MSB) ID7 (3)
(LSB) QD0 (22)
QD1 (23) QD2 (24) QD3 (27) QD4 (28) QD5 (29) QD6 (30)
(MSB) QD7 (31)
CLK (17)
DV
(8,26)
CC3
ID0 ID1 ID2 ID3 ID4 ID5 ID6 ID7
QD0 QD1 QD2 QD3 QD4 QD5 QD6 QD7
0.1µF10µF
+
CLOCK
+5V or +3V
+5V
10µF
(37) AV
CC1
(2,32) AV
+
0.1µF
AGND
BNC
CC2
(1,33,41) AGND
DGND
DV
(18)
CC2
DV
(16)
CC1
DGND (9,15,19,25)
10µF AND 0.1µF CAPS ARE PLACED AS CLOSE TO PART AS POSSIBLE
0.1µF10µF
+
+5V
12
Pin Descriptions
HI5662
PIN NO. NAME DESCRIPTION
1A 2AV
GND
CC2
Analog Ground
Analog Supply (+5.0V) 3 ID7 I-Channel, Data Bit 7 Output (MSB) 4 ID6 I-Channel, Data Bit 6 Output 5 ID5 I-Channel, Data Bit 5 Output 6 ID4 I-Channel Data Bit 4 Output 7 ID3 I-Channel, Data Bit 3 Output 8DV
CC3
Digital Output Supply
(+3.0V or +5.0V) 9D
GND
Digital Ground
10 ID2 I-Channel, Data Bit 2 Output 11 ID1 I-Channel, Data Bit 1 Output 12 ID0 I-Channel, Data Bit 0 Output (LSB) 13 NC No Connect 14 NC No Connect 15 D 16 DV
GND
CC1
Digital Ground
Digital Supply (+5.0V)
17 CLK Sample Clock Input 18 DV 19 D
CC2
GND
Digital Supply (+5.0V)
Digital Ground
20 NC No Connect 21 NC No Connect 22 QD0 Q-Channel, Data Bit 0 Output(LSB) 23 QD1 Q-Channel, Data Bit 1 Output
PIN NO. NAME DESCRIPTION
24 QD2 Q-Channel, Data Bit 2 Output 25 D 26 DV
GND
CC3
Digital Ground Digital Output Supply
(+3.0V or +5.0V) 27 QD3 Q-Channel, Data Bit 3 Output 28 QD4 Q-Channel, Data Bit 4 Output 29 QD5 Q-Channel, Data Bit 5 Output 30 QD6 Q-Channel, Data Bit 6 Output 31 QD7 Q-Channel, Data Bit 7 Output
(MSB) 32 AV 33 A 34 QV 35 Q 36 Q 37 AV 38 V
CC2
GND
DC
IN-
IN+
CC1
ROUT
Analog Supply (+5.0V)
Analog Ground
Q-Channel DC Bias Voltage Output
Q-Channel Negative Analog Input
Q-Channel Positive Analog Input
Analog Supply (+5.0V)
+2.5V Reference Voltage Output 39 NC No Connect 40 V 41 A 42 I 43 I 44 IV
RIN
GND
IN+
IN-
DC
+2.5V Reference Voltage Input
Analog Ground
I-Channel Positive Analog Input
I-Channel Negative Analog Input
I-Channel DC Bias Voltage Output
13
HI5662
Absolute Maximum Ratings T
Supply Voltage, AVCC or DVCC to AGND or DGND . . . . . . . . . . .6V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V
Digital I/O Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND to DV
Analog I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . AGND to AV
Operating Conditions
Temperature Range
HI5662/6IN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications AV
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
ACCURACY
Resolution 8 - - Bits Integral Linearity Error, INL f Differential Linearity Error, DNL
(Guaranteed No Missing Codes) Offset Error, V Full Scale Error, FSE fIN = DC - 1 - LSB
DYNAMIC CHARACTERISTICS
Minimum Conversion Rate No Missing Codes - 1 - MSPS Maximum Conversion Rate No Missing Codes 60 - - MSPS Effective Number of Bits, ENOB fIN = 10MHz
Signal to Noise and Distortion Ratio, SINAD fIN = 10MHz - 48.7 - dB
--------------------------------------------------------------=
RMS Noise + Distortion
OS
RMS Signal
=25oC Thermal Information
A
Thermal Resistance (Typical, Note 1) θJA (oC/W)
HI5662/6IN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
CC CC
= DV
CC1,2
= 10pF; TA = 25oC; Differential Analog Input; Unless Otherwise Specified
C
L
= +5.0V, DV
CC1,2
= 10MHz - 0.5 - LSB
IN
fIN = 10MHz - ±0.2 ±1.0 LSB
fIN = DC -10 - +10 LSB
fIN = 10MHz, Single Ended Analog Input
CC3
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(Lead Tips Only)
= +3.0V; V
= 2.50V; fS = 60MSPS at 50% Duty Cycle;
RIN
7.5
7.0
7.8
7.7
-
-
Bits Bits
Signal to Noise Ratio, SNR f
RMS Signal
-------------------------------=
RMS Noise
Total Harmonic Distortion, THD fIN = 10MHz - -66 - dBc 2nd Harmonic Distortion fIN = 10MHz - -71 - dBc 3rd Harmonic Distortion fIN = 10MHz - -71 - dBc Spurious Free Dynamic Range, SFDR fIN = 10MHz - 71 - dBc Intermodulation Distortion, IMD f1 = 1MHz, f2 = 1.02MHz - 64 - dBc I/Q Channel Crosstalk - -75 -60 dBc I/Q Channel Offset Match - 2.5 - LSB I/Q Channel Full Scale Error Match - 2.5 - LSB Transient Response (Note 2) - 1 - Cycle Over-Voltage Recovery 0.2V Overdrive (Note 2) - 1 - Cycle
= 10MHz - 48 - dB
IN
14
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