The HGTD7N60A4S, HGT1S7N60A4S, HGTG7N60A4 and
HGTP7N60A4 are MOS gated high voltage switching
devices combining the best features of MOSFETs and
bipolar transistors. These devices have the high input
impedance of a MOSFET and the low on-state conduction
loss of a bipolar transistor. The much lower on-state voltage
drop varies only moderately between 25
o
C and 150oC.
This IGBT is ideal for many high voltage switching
applications operating at high frequencies where low
conduction losses are essential. This device has been
optimized for high frequency switch mode power supplies.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
PKG
300
260
o
C
o
C
o
C
NOTE:
1. Pulse width limited by maximum junction temperature.
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
J
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CES
ECS
CES
CE(SAT)IC
GE(TH)
GES
Switching SOASSOAT
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE= 0V20--V
VCE = 600VTJ = 25oC--250µA
= 125oC--2mA
T
J
= 7A,
VGE = 15V
TJ = 25oC-1.92.7V
= 125oC-1.62.2V
T
J
IC = 250µA, VCE = 600V4.55.97.0V
VGE = ±20V--±250nA
= 150oC, RG = 25Ω, VGE = 15V
J
35--A
L = 100µH, VCE= 600V
Pulsed Avalanche EnergyE
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 2)E
Turn-On Energy (Note 2)E
Turn-Off Energy (Note 3)E
AS
GEP
g(ON)
rI
fI
ON1
ON2
OFF
ICE = 7A, L = 500µH25--mJ
IC = 7A, VCE = 300V-9.0-V
IC = 7A,
VCE = 300V
IGBT and Diode at TJ = 25oC
ICE = 7A
VCE = 390V
VGE = 15V
RG= 25Ω
L = 1mH
Test Circuit (Figure 20)
VGE = 15V-3745nC
V
= 20V-4860nC
GE
-11- ns
-11- ns
-100-ns
-45- ns
-55- µJ
-120150µJ
-6075µJ
2-2
HGTD7N60A4S, HGT1S7N60A4S, HGTG7N60A4, HGTP7N60A4
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
J
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 2)E
Turn-On Energy (Note 2)E
Turn-Off Energy (Note 3)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 125oC
ICE = 7A
VCE = 390V
VGE = 15V
RG= 25Ω
L = 1mH
Test Circuit (Figure 20)
-10- ns
-7-ns
-130150ns
-7585ns
-50- µJ
-200215µJ
-125170µJ
--1.0
NOTES:
2. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 20.
3. Turn-Off Energy Loss (E
) is defined as the integral of the instantaneouspower loss starting at the trailing edge of the input pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.