Intersil Corporation HGTP5N120CND, HGTG5N120CND, HGT1S5N120CNDS Datasheet

HGTG5N120CND, HGTP5N120CND,
HGT1S5N120CNDS
Data Sheet January 2000
25A, 1200V, NPT Series N-Channel IGBT with Anti-Parallel Hyperfast Diode
The HGTG5N120CND, HGTP5N120CND and HGT1S5N120CNDS are Non-Punch Through (NPT) IGBT designs. They are new members of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The IGBT used is developmental type TA49309. The diode used in anti-parallel is developmental type TA49058.
The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
Formerly Developmental Type TA49307.
Ordering Information
PART NUMBER PACKAGE BRAND
File Number 4598.2
Features
• 25A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 350ns at T
• Short Circuit Rating
• Low Conduction Loss
Temperature Compensating SABER™ Model Thermal Impedance SPICE Model www.intersil.com
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Packaging
JEDEC TO-220AB ALTERNATE VERSION
E
C
COLLECTOR
(FLANGE)
G
= 150oC
J
HGTG5N120CND TO-247 5N120CND HGTP5N120CND TO-220AB 5N120CND HGT1S5N120CNDS TO-263AB 5N120CND
NOTE: When ordering,use theentirepart number. Addthe suffix 9A to obtain the TO-263AB variant in Tape and Reel, i.e., HGT1S5N120CNDS9A.
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
JEDEC TO-263AB
G
E
JEDEC STYLE TO-247
COLLECTOR
(FLANGE)
E
C
COLLECTOR
(FLANGE)
G
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Copyright © Intersil Corporation 2000
SABER™ is a trademark of Analogy, Inc.
HGTG5N120CND, HGTP5N120CND, HGT1S5N120CNDS
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
HGTG5N120CND HGTP5N120CND
HGT1S5N120CNDS UNITS
Collector to Emitter Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
C25
C110
CM
GES
GEM
25 A 12 A 40 A
±20 V ±30 V
Switching Safe Operating Area at TJ = 150oC, Figure 2 . . . . . . . . . . . . . . . . . . . . . . . . SSOA 30A at 1200V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
167 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.33 W/oC
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
-55 to 150
o
C Maximum Lead Temperature for Soldering
Leads at 0.063in (1.6mm) from case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC SC
300 260
8 µs
15 µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
= 840V, TJ = 125oC, RG = 25Ω.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV Collector to Emitter Leakage Current I
CES
CES
IC = 250µA, VGE = 0V 1200 - - V VCE = BV
CES
TC = 25oC - - 250 µA TC = 125oC - 100 - µA TC = 150oC--2mA
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V Gate to Emitter Leakage Current I
CE(SAT)IC
GE(TH)
GES
= 5.5A,
VGE = 15V
IC = 45µA, VCE = V
TC = 25oC - 2.1 2.4 V TC = 150oC - 2.9 3.5 V
GE
VGE = ±20V - - ±250 nA
Switching SOA SSOA TJ = 150oC, RG = 25Ω, VGE = 15V,
Gate to Emitter Plateau Voltage V On-State Gate Charge Q
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy E Turn-Off Energy (Note 3) E
GEP
G(ON)
rI
fI
ON
OFF
L = 200µH, V IC = 5.5A, VCE = 0.5 BV IC = 5.5A,
VCE = 0.5 BV
IGBT and Diode at TJ = 25oC ICE = 5.5A VCE = 0.8 BV VGE = 15V RG= 25 L = 5mH Test Circuit (Figure 20)
CE(PK)
CES
CES
= 1200V
CES
VGE = 15V - 45 55 nC VGE = 20V - 60 75 nC
6.0 7.0 - V
25 - - A
- 10.6 - V
-2230ns
-1216ns
- 180 250 ns
- 280 350 ns
- 400 500 µJ
- 640 700 µJ
2
HGTG5N120CND, HGTP5N120CND, HGT1S5N120CNDS
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy E Turn-Off Energy (Note 3) E Diode Forward Voltage V Diode Reverse Recovery Time t
rI
fI
ON
OFF
EC
rr
IGBT and Diode at TJ = 150oC ICE = 5.5A VCE = 0.8 BV
CES
VGE = 15V
-2025ns
-1216ns
- 225 300 ns
RG= 25 L = 5mH Test Circuit (Figure 20)
- 350 400 ns
- 1 1.2 mJ
- 1 1.1 mJ IEC = 5.5A - 2.4 3.3 V IEC = 5.5A, dIEC/dt = 200A/µs - 48 60 ns IEC = 1A, dIEC/dt = 200A/µs - 30 40 ns
Thermal Resistance Junction To Case R
θJC
IGBT - - 0.75 Diode - - 1.9
NOTE:
3. Turn-OffEnergy Loss (E
) is defined as the integral of the instantaneous powerloss starting atthe trailing edgeof the inputpulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
Typical Performance Curves Unless Otherwise Specified
o o
C/W C/W
25
20
15
10
5
, DC COLLECTOR CURRENT (A)
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
V
GE
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
= 15V
35
TJ= 150oC, RG = 25, VGE = 15V, L = 200µH
30
25
20
15
10
5
, COLLECTOR TO EMITTER CURRENT (A)
CE
I
0
0
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
600 800400200 1000 1200
1400
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
3
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