Intersil Corporation HGTP5N120BND, HGTG5N120BND, HGT1S5N120BNDS Datasheet

HGTG5N120BND, HGTP5N120BND,
HGT1S5N120BNDS
Data Sheet January 2000 File Number 4597.2
21A, 1200V, NPT Series N-Channel IGBTs with Anti-Parallel Hyperfast Diodes
The HGTG5N120BN, HGTP5N120BND, and HGT1S5N120BNDS are Non-Punch Through (NPT) IGBT designs. They are new members of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on­state conduction loss of a bipolar transistor. The IGBT used is the development type TA49308. The Diode used is the development type TA49058 (Part number RHRD6120).
The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
Formerly Developmental Type TA49306.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTG5N120BND TO-247 5N120BND HGTP5N120BND TO-220AB 5N120BND HGT1S5N120BNDS TO-263AB 5N120BND
NOTE: When ordering,use theentirepart number. Addthesuffix 9A to obtain the TO-263AB variant in Tape and Reel, i.e., HGT1S5N120BNS9A.
Features
• 21A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 175ns at T
• Short Circuit Rating
• Low Conduction Loss
Thermal Impedance SPICE Model Temperature Compensating SABER™ Model www.intersil.com
• Related Literature
- TB334 “Guidelines for Soldering Surface Mount
Components to PC Boards”
Packaging
JEDEC STYLE TO-247
E
COLLECTOR
(FLANGE)
JEDEC TO-220AB (ALTERNATE VERSION)
= 150oC
J
C
G
Symbol
E
C
COLLECTOR
(FLANGE)
G
E
G
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143
JEDEC TO-263AB
E
COLLECTOR
(FLANGE)
SABER™ is a trademark of Analogy, Inc.
| Copyright © Intersil Corporation 2000
C
G
HGTG5N120BND, HGTP5N120BND, HGT1S5N120BNDS
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
HGTG5N120BND HGTP5N120BND
HGT1S5N120BNDS UNITS
Collector to Emitter Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
C25
C110
CM
GES
GEM
21 A 10 A 40 A
±20 V ±30 V
Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 30A at 1200V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
167 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.33 W/oC
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
-55 to 150
o
C Maximum Lead Temperature for Soldering
Leads at 0.063in (1.6mm) from case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC SC
300 260
8 µs
15 µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
= 840V, TJ = 125oC, RG = 25Ω.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV Collector to Emitter Leakage Current I
CES
CES
IC = 250µA, VGE = 0V 1200 - - V VCE = BV
CES
TC = 25oC - - 250 µA TC = 125oC - 100 - µA TC = 150oC - - 1.5 mA
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V Gate to Emitter Leakage Current I
CE(SAT)IC
GE(TH)
GES
= 5A,
VGE = 15V
IC = 45µA, VCE = V
TC = 25oC - 2.45 2.7 V TC = 150oC - 3.7 4.2 V
GE
VGE = ±20V - - ±250 nA
Switching SOA SSOA TJ = 150oC, RG = 25Ω, VGE = 15V,
Gate to Emitter Plateau Voltage V On-State Gate Charge Q
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy E Turn-Off Energy (Note 3) E
GEP
G(ON)
rI
fI
ON
OFF
L = 5mH, V IC = 5A, VCE = 0.5 BV IC = 5A,
VCE = 0.5 BV
IGBT and Diode at TJ = 25oC, ICE = 5A, VCE = 0.8 BV VGE = 15V, RG = 25, L = 5mH, Test Circuit (Figure 20)
CE(PK)
CES
CES
= 1200V
CES
VGE = 15V - 53 65 nC VGE = 20V - 60 72 nC
,
6.0 6.8 - V
30 - - A
- 10.5 - V
-2225ns
-1520ns
- 160 180 ns
- 130 160 ns
- 450 600 µJ
- 390 450 µJ
2
HGTG5N120BND, HGTP5N120BND, HGT1S5N120BNDS
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy E Turn-Off Energy (Note 3) E Diode Forward Voltage V Diode Reverse Recovery Time t
rI
fI
ON
OFF
EC
rr
IGBT and Diode at TJ = 150oC, ICE = 5A, VCE = 0.8 BV
CES
,
VGE = 15V,
-2025ns
-1520ns
- 182 280 ns
RG = 25, L = 5mH, Test Circuit (Figure 20)
- 175 200 ns
- 1000 1300 µJ
- 560 800 µJ IEC = 10A - 2.70 3.50 V IEC = 7A, dlEC/dt = 200A/µs - 50 60 ns IEC = 1A, dlEC/dt = 200A/µs - 30 40 ns
Thermal Resistance Junction To Case R
θJC
IGBT - - 0.75 Diode - - 1.75
NOTE:
3. Turn-Off Energy Loss (E
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and
OFF
ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
Typical Performance Curves Unless Otherwise Specified
o o
C/W C/W
25
VGE= 15V
20
15
10
5
, DC COLLECTOR CURRENT (A)
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
35
TJ= 150oC, RG = 25, VGE= 15V, L = 5mH
30
25
20
15
10
5
, COLLECTOR TO EMITTER CURRENT (A)
CE
0
I
V
, COLLECTOR TO EMITTER VOLTAGE (V)
CE
600 800400200 1000 1200
14000
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
3
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