Intersil Corporation HGTP1N120BN, HGTD1N120BNS Datasheet

HGTD1N120BNS, HGTP1N120BN
Data Sheet January 2000 File Number 4649.2
5.3A, 1200V, NPT Series N-Channel IGBT
The HGTD1N120BNS and HGTP1N120BN are Non-Punch Through (NPT)IGBT designs. They are new members of the
MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
Formerly Developmental Type TA49316.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTD1N120BNS TO-252AA 1N120B HGTP1N120BN TO-220AB 1N120BN
NOTE: Whenordering, usetheentirepartnumber.Addthe suffix 9A to obtain the TO-252AA in tape and reel, i.e. HGTD1N120BNS9A
Symbol
C
Features
• 5.3A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical E
. . . . . . . . . . . . . . . . . . . 120µJ at TJ = 150oC
OFF
• Short Circuit Rating
• Low Conduction Loss
• Avalanche Rated
Temperature Compensating SABER™ Model Thermal Impedance SPICE Model www.intersil.com
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Packaging
JEDEC TO-220AB
E
COLLECTOR
(FLANGE)
C
G
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143
G
JEDEC TO-252AA
COLLECTOR
(FLANGE)
E
| Copyright © Intersil Corporation 2000
SABER™ is a trademark of Analogy, Inc.
HGTD1N120BNS, HGTP1N120BN
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
ALL TYPES UNITS
Collector to Emitter Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
C25
C110
CM
GES
GEM
5.3 A
2.7 A 6A
±20 V ±30 V
Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 6A at 1200V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .P
D
60 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.476 W/oC
Forward Voltage Avalanche Energy (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
AV
STG
10 mJ
-55 to 150
o
C
Maximum Lead Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 3) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
Short Circuit Withstand Time (Note 3) at VGE = 13V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC SC
300 260
8 µs
13 µs
o
C
o
C
NOTES:
1. Single Pulse; VGE = 15V; Pulse width limited by maximum junction temperature.
2. ICE = 7A, L = 400µH, VGE = 15V, TJ = 25oC.
3. V
= 840V, TJ = 125oC, RG = 82Ω.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV Emitter to Collector Breakdown Voltage BV Collector to Emitter Leakage Current I
CES ECS
CES
IC = 250µA, VGE = 0V 1200 - - V IC = 10mA, VGE= 0V 15 - - V VCE = BV
CES
TC = 25oC - - 250 µA TC = 125oC - 20 - µA TC = 150oC - - 1.0 mA
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V Gate to Emitter Leakage Current I
CE(SAT)IC
GE(TH)
GES
= 1.0A
VGE = 15V
IC = 50µA, VCE = V
TC = 25oC - 2.5 2.9 V TC = 150oC - 3.8 4.3 V
GE
VGE = ±20V - - ±250 nA
Switching SOA SSOA TJ = 150oC, RG = 82Ω, VGE = 15V,
Gate to Emitter Plateau Voltage V On-State Gate Charge Q
GEP
G(ON)
L = 2mH, V IC = 1.0A, VCE = 0.5 BV IC = 1.0A
VCE = 0.5 BV
CE(PK)
CES
= 1200V
CES
VGE = 15V - 14 20 nC VGE = 20V - 15 21 nC
6.0 7.1 - V
6- - A
- 9.2 - V
2
HGTD1N120BNS, HGTP1N120BN
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy (Note 5) E Turn-On Energy (Note 5) E Turn-Off Energy (Note 4) E Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy (Note 5) E Turn-On Energy (Note 5) E Turn-Off Energy (Note 4) E Thermal Resistance Junction To Case R
rI
fI ON1 ON2 OFF
rI
fI ON1 ON2 OFF
θJC
IGBT and Diode at TJ = 25oC ICE = 1.0A VCE = 0.8 BV
CES
VGE = 15V RG = 82 L = 4mH Test Circuit (Figure 18)
IGBT and Diode at TJ = 150oC ICE = 1.0 A VCE = 0.8 BV
CES
VGE = 15V RG = 82 L = 4mH Test Circuit (Figure 18)
-1520ns
-1114ns
-6776ns
- 226 300 ns
-70- J
- 172 187 J
- 90 123 J
-1317ns
-1115ns
-7588ns
- 258 370 ns
- 145 - J
- 385 440 J
- 120 175 J
- - 2.1
NOTES:
4. Turn-OffEnergy Loss (E
) is defined as the integral of the instantaneous power loss startingat the trailing edge of the input pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
5. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJas the IGBT. The diode type is specified in Figure 18.
o
C/W
ON2
is
Typical Performance Curves (Unless Otherwise Specified)
6
5
4
3
2
, DC COLLECTOR CURRENT (A)
1
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
VGE= 15V
7
TJ= 150oC, RG = 82, VGE= 15V, L = 2mH
6
5
4
3
2
1
, COLLECTOR TO EMITTER CURRENT (A)
0
CE
I
0
V
, COLLECTOR TO EMITTER VOLTAGE (V)
CE
600 800400200 1000 1200
1400
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
3
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