The HGTG11N120CN, HGTP11N120CN, and
HGT1S11N120CNS are Non-Punch Through (NPT) IGBT
designs. They are new members of the MOS gated high
voltage switching IGBT family. IGBTs combine the best
features of MOSFETs and bipolar transistors. This device
has the high input impedance of a MOSFET and the low onstate conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC
SC
300
260
8µs
15µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. ICE= 20A, L = 400µH, TJ = 25oC.
3. V
= 840V, TJ = 125oC, RG = 10Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V1200--V
IC = 10mA, VGE= 0V15--V
VCE = BV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CE(SAT)IC
GE(TH)
GES
= 11A,
VGE = 15V
IC = 90µA, VCE = V
TC = 25oC-2.12.4V
TC = 150oC-2.83.5V
GE
VGE = ±20V--±250nA
Switching SOASSOATJ = 150oC, RG = 10Ω, VGE = 15V,
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
GEP
G(ON)
L = 400µH, V
IC = 11A, VCE = 0.5 BV
IC = 11A,
VCE = 0.5 BV
CE(PK)
CES
= 1200V
CES
VGE = 15V-100120nC
VGE = 20V-130150nC
6.06.8-V
55--A
-10.4-V
2
HGTG11N120CN, HGTP11N120CN, HGT1S11N120CNS
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 5)E
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 5)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 25oC
ICE = 11A
VCE = 0.8 BV
CES
VGE = 15V
RG= 10Ω
L = 2mH
Test Circuit (Figure 18)
IGBT and Diode at TJ = 150oC
ICE = 11A
VCE = 0.8 BV
CES
VGE = 15V
RG= 10Ω
L = 2mH
Test Circuit (Figure 18)
-2326ns
-1216ns
-180240ns
-190230ns
-0.40.5mJ
-0.951.3mJ
-1.31.6mJ
-2124ns
-1216ns
-210280ns
-340400ns
-0.450.6mJ
-1.92.5mJ
-2.12.5mJ
--0.42
NOTES:
4. Values fortwo Turn-On loss conditionsare shown for theconvenience of the circuitdesigner.E
is the turn-on lossof the IGBT only.E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJas the IGBT. The diode type is specified in
Figure 18.
5. Turn-OffEnergy Loss (E
) is defined as the integral ofthe instantaneous powerloss starting atthe trailing edgeof the input pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.