The HGTG40N60C3 is a MOS gated high voltage switching
device combining the best features of a MOSFET and a
bipolar transistor. These devices have the high input
impedance of a MOSFET and the low on-state conduction
loss of a bipolar transistor. The much lower on-state voltage
drop varies only moderately between 25
o
C and 150oC.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
Formerly developmental type TA49273.
Ordering Information
PART NUMBERPACKAGEPKG. NO.
HGTG40N60C3TO-247G40N60C3
NOTE: When ordering, use the entire part number.
File Number4472.2
Features
• 75A, 600V, TC = 25oC
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 100ns at T
• Short Circuit Rating
• Low Conduction Loss
Packaging
JEDEC STYLE TO-247
E
C
G
= 150oC
J
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
ARV
STG
L
SC
SC
100mJ
-55 to 150
260
5µs
10µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
Electrical SpecificationsT
= 360V, TJ = 125oC, RG = 3Ω.
CE(PK)
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE = 0V1525-V
VCE = BV
CES
TC = 25oC--250µA
TC = 150oC--4.0mA
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CE(SAT)IC
GE(TH)
GES
Switching SOASSOATJ = 150oC, RG =
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
Current Rise Timet
Current Turn-Off Delay Timet
Current Fall Timet
Turn-On Energy (Note 3)E
Turn-On Energy (Note 3)E
Turn-Off Energy (Note 4)E
GEP
G(ON)
d(ON)I
rI
d(OFF)I
fI
ON1
ON2
OFF
= I
,
C110
VGE = 15V
IC = 250µA, VCE = V
TC = 25oC-1.31.8V
TC = 150oC-1.42.0V
GE
3.14.56.0V
VGE = ±20V--±250nA
VCE = 480V200--A
3Ω, VGE = 15V,
L = 400µH
IC = I
IC = I
, VCE = 0.5 BV
C110
,
C110
VCE = 0.5 BV
IGBT and Diode at TJ = 25oC
ICE = I
C110
VCE = 0.8 BV
VGE = 15V
VCE = 600V40--A
CES
-7.2-V
VGE = 15V-275302nC
CES
VGE = 20V-360395nC
-47- ns
CES
-30- ns
-185-ns
RG= 3Ω
L = 1mH
Test Circuit (Figure 17)
-60- ns
-850-mJ
-1.01.2mJ
-1.01.8mJ
2
HGTG40N60C3
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 3)E
Turn-On Energy (Note 3)E
Turn-Off Energy (Note 4)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 17)
-41- ns
-30- ns
-360450ns
-100210ns
-860-µJ
-2.02.4mJ
-2.54mJ
--0.43
NOTES:
3. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 17.
4. Turn-OffEnergy Loss (E
) is defined as theintegral of the instantaneous power loss starting at thetrailing edge of the inputpulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.