The HGTG40N60B3 is a MOS gated high voltage switching
device combining the best features of MOSFETs and bipolar
transistors. The device has the high input impedance of a
MOSFET and the low on-state conduction loss of a bipolar
transistor. The much lower on-state voltage drop varies only
moderately between 25
o
C and 150oC.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
Formerly Developmental Type TA49052.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG40N60B3TO-247G40N60B3
NOTE: When ordering, use the entire part number.
File Number3943.3
Features
• 70A, 600V, TC = 25oC
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 100ns at T
• Short Circuit Rating
• Low Conduction Loss
Packaging
JEDEC STYLE TO-247
E
COLLECTOR
(FLANGE)
= 150oC
J
C
G
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
ARV
STG
L
SC
SC
100mJ
-55 to 150
260
2µs
10µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
S
Electrical SpecificationsT
= 360V, TJ = 125oC, RG= 3Ω.
CE(PK)
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CES
ECS
CES
CE(SAT)IC
GE(TH)
GES
Switching SOASSOATJ = 150oC
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE= 0V1525-V
VCE = BV
VCE = BV
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On EnergyE
Turn-Off Energy (Note 1)E
GEP
G(ON)
rI
fI
ON
OFF
IC = I
IC = I
VCE = 0.5 BV
, VCE = 0.5 BV
C110
,
C110
CES
VGE = 15V-250330nC
CES
VGE = 20V-335435nC
IGBT and Diode Both at TJ = 25oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 100µH
Test Circuit (Figure 17)
-7.5-V
-47- ns
-35- ns
-170200ns
-50100ns
-10501200µJ
-8001400µJ
2
HGTG40N60B3
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On EnergyE
Turn-Off Energy (Note 1)E
Thermal Resistance Junction To CaseR
rI
fI
ON
OFF
θJC
IGBT and Diode Both at TJ = 150oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 100µH
Test Circuit (Figure 17)
-47- ns
-35- ns
-285375ns
-100175ns
-1850-µJ
-2000-µJ
--0.43
NOTE:
3. Turn-OffEnergyLoss(E
) isdefinedasthe integral of the instantaneous power lossstartingatthe trailing edge of the input pulseandending
OFF
at the point where thecollectorcurrentequalszero(ICE= 0A). All devices weretestedperJEDECStandardNo.24-1Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Turn-On losses include losses due
to diode recovery.