The HGTG30N60B3 is a MOS gated high voltage switching
device combining the best features of MOSFETs and bipolar
transistors. This device has the high input impedance of a
MOSFET and the low on-state conduction loss of a bipolar
transistor. The much lower on-state voltage drop varies only
moderately between 25
o
C and 150oC.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
Formerly Developmental Type TA49170.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG30N60B3TO-247G30N60B3
NOTE: When ordering, use the entire part number.
File Number4444.2
Features
• 60A, 600V, TC = 25oC
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . . 90ns at T
• Short Circuit Rating
• Low Conduction Loss
Packaging
JEDEC STYLE TO-247
E
C
G
= 150oC
J
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
ARV
STG
L
SC
SC
100mJ
-55 to 150
260
4µs
10µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
Electrical SpecificationsT
= 360V, TJ = 125oC, RG = 3Ω.
CE(PK)
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE= 0V1528-V
VCE = BV
CES
TC = 25oC--250µA
TC = 150oC--3.0mA
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CE(SAT)IC
GE(TH)
GES
Switching SOASSOATJ = 150oC,
= I
,
C110
VGE = 15V
IC = 250µA, VCE = V
TC = 25oC-1.451.9V
TC = 150oC-1.72.1V
GE
4.55.06.0V
VGE = ±20V--±250nA
RG = 3Ω,
VGE = 15V
V
V
= 480V200--A
CE (PK)
= 600V60--A
CE (PK)
L = 100µH,
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 3)E
GEP
G(ON)
rI
fI
ON1
ON2
OFF
IC = I
IC = I
VCE = 0.5 BV
, VCE = 0.5 BV
C110
,
C110
CES
VGE = 15V-170190nC
CES
VGE = 20V-230250nC
IGBT and Diode at TJ = 25oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 17)
-7.2-V
-36- ns
-25- ns
-137-ns
-58- ns
-500-µJ
-550800µJ
-680900µJ
2
HGTG30N60B3
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 3)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 17)
-32- ns
-24- ns
-275320ns
-90150ns
-500-µJ
-13001550µJ
-16001900µJ
--0.6
NOTES:
3. Turn-OffEnergyLoss(E
) isdefinedasthe integral of the instantaneous power lossstartingatthe trailing edge of the input pulseandending
OFF
at the point where thecollectorcurrentequalszero(ICE= 0A). All devices weretestedperJEDECStandardNo.24-1Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
4. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 17.