Intersil Corporation HGTG30N120CN Datasheet

HGTG30N120CN
Data Sheet January 2000
75A, 1200V, NPT Series N-Channel IGBT
The HGTG30N120CN is a Non-Punch Through (NPT) IGBT design. This is a new member of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on­state conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
Formerly Developmental Type TA49281.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTG30N120CN TO-247 G30N120CN
NOTE: When ordering, use the entire part number.
File Number 4483.3
Features
• 75A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 350ns at T
• Short Circuit Rating
• Low Conduction Loss
• Avalanche Rated
Thermal Impedance SPICE Model Temperature Compensating SABER™ Model www.intersil.com
Packaging
JEDEC STYLE TO-247
E
COLLECTOR
(BOTTOM SIDE
METAL)
= 150oC
J
C
G
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
1-888-INTERSIL or 321-724-7143
| Copyright © Intersil Corporation 2000
SABER™ is a trademark of Analogy, Inc.
HGTG30N120CN
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
HGTG30N120CN UNITS
Collector to Emitter Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
C25
C110
CM
GES
GEM
75 A 40 A
240 A
±20 V ±30 V
Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 150A at 1200V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
500 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0 W/oC
Forward Voltage Avalanche Energy (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Short Circuit Withstand Time (Note 3) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
Short Circuit Withstand Time (Note 3) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
AV
STG
L SC SC
135 mJ
-55 to 150 260
8 µs
15 µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. ICE = 30A, L = 400µH, TJ = 125oC.
3. V
= 960V, TJ = 125oC, RG = 3.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV Emitter to Collector Breakdown Voltage BV Collector to Emitter Leakage Current I
CES ECS
CES
IC = 250µA, VGE = 0V 1200 - - V IC = 10mA, VGE= 0V 15 - - V VCE = BV
CES
TC = 25oC - - 250 µA TC = 125oC - 600 - µA TC = 150oC--8mA
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V Gate to Emitter Leakage Current I
CE(SAT)IC
GE(TH)
GES
= I
,
C110
VGE = 15V IC = 250µA, VCE = V
TC = 25oC - 2.1 2.4 V TC = 150oC - 2.9 3.5 V
GE
VGE = ±20V - - ±250 nA
Switching SOA SSOA TJ = 150oC, RG = 3Ω, VGE = 15V,
Gate to Emitter Plateau Voltage V On-State Gate Charge Q
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy (Note 4) E Turn-On Energy (Note 4) E Turn-Off Energy (Note 5) E
GEP
G(ON)
rI
fI ON1 ON2 OFF
L = 200µH, V IC = I IC = I
, VCE = 0.5 BV
C110
,
C110
VCE = 0.5 BV IGBT and Diode at TJ = 25oC
ICE = I
C110
VCE = 0.8 BV VGE = 15V RG= 3 L = 1mH Test Circuit (Figure 18)
CE(PK)
CES
CES
= 1200V
CES
VGE = 15V - 260 325 nC VGE = 20V - 330 420 nC
6.0 6.6 - V
150 - - A
- 9.6 - V
-2430ns
-2126ns
- 220 260 ns
- 180 240 ns
- 2.2 - mJ
- 2.8 3.5 mJ
- 4.2 4.8 mJ
2
HGTG30N120CN
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy (Note 4) E Turn-On Energy (Note 4) E Turn-Off Energy (Note 5) E Thermal Resistance Junction To Case R
rI
fI ON1 ON2 OFF
θJC
IGBT and Diode at TJ = 150oC ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V RG= 3 L = 1mH Test Circuit (Figure 18)
-2228ns
-2126ns
- 260 300 ns
- 350 400 ns
- 2.6 - mJ
- 5.6 7.0 mJ
- 6.6 7.5 mJ
- - 0.25
o
C/W
NOTES:
4. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. EON1 is the turn-on loss of the IGBT only. EON2 is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in Figure 18.
5. Turn-OffEnergy Loss (EOFF) is defined as the integral of the instantaneous powerloss starting at the trailing edge of the input pulse andending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
Typical Performance Curves Unless Otherwise Specified
80
70
60
V
= 15V
GE
200
TJ= 150oC, RG = 3, VGE= 15V, L = 200µH
160
50
40
30
20
, DC COLLECTOR CURRENT (A)
10
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
100
TJ= 150oC, RG = 3, L = 1mH, VCE= 960V
10
f
MAX1
f
MAX2
= CONDUCTION DISSIPATION
P
C
, OPERATING FREQUENCY (kHz)
MAX
f
R
ØJC
1
5
= 0.05 / (t = (PD- PC) / (E
(DUTY FACTOR = 50%)
= 0.25oC/W, SEE NOTES
, COLLECTOR TO EMITTER CURRENT (A)
I
CE
d(OFF)I
10
+ t
ON2
d(ON)I
+ E
OFF
)
)
T
C
o
75
C
75oC 12V
o
C
110 110oC
V
15V
15V 12V
GE
120
80
40
, COLLECTOR TO EMITTER CURRENT (A)
CE
0
I
0
, COLLECTOR TO EMITTER VOLTAGE (V)
V
CE
600 800400200 1000 1200
1400
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
50 500
VCE = 960V, RG = 3, TJ= 125oC
40
30
20
10
, SHORT CIRCUIT WITHST AND TIME (µs)
SC
0
t
6020
11 12 13 14 15 16
, GATE TO EMITTER VOLTAGE (V)
V
GE
I
SC
400
300
200
t
SC
100
, PEAK SHORT CIRCUIT CURRENT (A)
SC
I
0
FIGURE 3. OPERATINGFREQUENCY vs COLLECTOR TO
EMITTER CURRENT
3
FIGURE 4. SHORT CIRCUIT WITHSTAND TIME
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