The HGTG27N120BN is a Non-Punch Through (NPT) IGBT
design. This is a new member of the MOS gated high
voltage switching IGBT family. IGBTs combine the best
features of MOSFETs and bipolar transistors. This device
has the high input impedance of a MOSFET and the low onstate conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
Formerly Developmental Type TA49280.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG27N120BNTO-247G27N120BN
NOTE: When ordering, use the entire part number.
File Number4482.3
Features
• 72A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 140ns at T
• Short Circuit Rating
• Low Conduction Loss
• Thermal Impedance SPICE Model
Temperature Compensating SABER™ Model
www.intersil.com
• Avalanche Rated
Packaging
JEDEC STYLE TO-247
E
C
G
= 150oC
J
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
AV
STG
L
SC
SC
135mJ
-55 to 150
260
8µs
15µs
o
C
o
C
NOTES:
1. Pulse width limited by Max junction temperature.
2. ICE = 30A, L = 400µH, TJ = 125oC
3. V
= 960V, TJ = 125oC, RG = 3Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CES
ECS
CES
CE(SAT)IC
GE(TH)
GES
Switching SOASSOAT
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
Current Rise Timet
Current Turn-Off Delay Timet
Current Fall Timet
Turn-On Energy (Note 5)E
Turn-On Energy (Note 5)E
Turn-Off Energy (Note 4)E
GEP
G(ON)
d(ON)I
rI
d(OFF)I
fI
ON1
ON2
OFF
IC = 250µA, VGE = 0V1200--V
IC = 10mA, VGE= 0V15--V
VCE = BV
= I
C110
CES
,
VGE = 15V
IC = 250µA, VCE = V
TC = 25oC--250µA
= 125oC-300-µA
T
C
= 150oC--4mA
T
C
TC = 25oC-2.452.7V
= 150oC-3.84.2V
T
C
GE
66.6-V
VGE = ±20V--±250nA
= 150oC, RG = 3Ω, VGE = 15V,
J
L = 200µH, V
IC = I
IC = I
, VCE = 0.5 BV
C110
,
C110
VCE = 0.5 BV
CE(PK)
CES
= 1200V
CES
VGE = 15V-270325nC
= 20V-350420nC
V
GE
IGBT and Diode at TJ = 25oC,
ICE = I
VCE = 0.8 BV
C110
,
,
CES
VGE = 15V,
RG = 3Ω,
L = 1mH,
Test Circuit (Figure 18)
150--A
-9.2-V
-2430ns
-2025ns
-195240ns
-80120ns
-2.2-mJ
-2.73.3mJ
-2.32.8mJ
2
HGTG27N120BN
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 5)E
Turn-On Energy (Note 5)E
Turn-Off Energy (Note 4)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC,
ICE = I
VCE = 0.8 BV
C110
,
,
CES
VGE = 15V,
RG = 3Ω,
L = 1mH,
Test Circuit (Figure 18)
-2228ns
-2025ns
-220280ns
-140200ns
-2.7-mJ
-5.16.5mJ
-3.44.2mJ
--0.25
NOTES:
4. Turn-OffEnergy Loss (E
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
5. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 18.