The HGTG20N60A4 and HGTP20N60A4 are MOS gated
high voltage switching devices combining the best features
of MOSFETs and bipolar transistors. These devices have
the high input impedance of a MOSFET and the low on-state
conduction loss of a bipolar transistor. The much lower
on-state voltage drop varies only moderately between 25
and 150
o
C.
o
This IGBT is ideal for many high voltage switching
applications operating at high frequencies where low
conduction losses are essential. This device has been
optimized for high frequency switch mode power
supplies.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
PKG
300
260
o
C
o
C
o
C
NOTE:
1. Pulse width limited by maximum junction temperature.
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
J
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE= 0V15--V
VCE = 600VTJ = 25oC--250µA
TJ = 125oC--2.0mA
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 3)E
Turn-On Energy (Note 3)E
Turn-Off Energy (Note 2)E
GEP
g(ON)
rI
fI
ON1
ON2
OFF
IC = 20A, VCE = 300V-8.6-V
IC = 20A,
VCE = 300V
IGBT and Diode at TJ = 25oC
ICE = 20A
VCE = 390V
VGE =15V
RG= 3Ω
L = 500µH
Test Circuit (Figure 20)
VGE = 15V-142162nC
VGE = 20V-182210nC
-15- ns
-12- ns
-73- ns
-32- ns
-105-µJ
-280350µJ
-150200µJ
2
HGTG20N60A4, HGTP20N60A4
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
J
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 3)E
Turn-On Energy (Note 3)E
Turn-Off Energy (Note 2)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 125oC
ICE = 20A
VCE = 390V
VGE = 15V
RG= 3Ω
L = 500µH
Test Circuit (Figure 20)
-1521ns
-1318ns
-105135ns
-5573ns
-115-µJ
-510600µJ
-330500µJ
--0.43
NOTES:
2. Turn-OffEnergyLoss (E
) isdefinedas the integralofthe instantaneous powerlossstarting at thetrailingedge of the inputpulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
3. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 20.