The HGTG20N120CN is a Non-Punch Through (NPT) IGBT
design. This is a new member of the MOS gated high
voltage switching IGBT family. IGBTs combine the best
features of MOSFETs and bipolar transistors. This device
has the high input impedance of a MOSFET and the low onstate conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
Formerly Developmental Type TA49289.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG20N120CNTO-247G20N120CN
NOTE: When ordering, use the entire part number
Symbol
C
Features
• 63A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 340ns at T
• Short Circuit Rating
• Low Conduction Loss
• Avalanche Rated
• Temperature Compensating SABER™ Model
www.intersil.com
Packaging
JEDEC STYLE TO-247
E
C
G
= 150oC
J
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
AV
STG
L
SC
SC
125mJ
-55 to 150
260
8µs
15µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. ICE = 25A, L = 400µH, TJ = 25oC.
3. V
= 960V, TJ = 125oC, RG= 3Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V1200--V
IC = 10mA, VGE= 0V15--V
VCE = BV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CE(SAT)IC
GE(TH)
GES
= 20A,
VGE = 15V
IC = 150µA, VCE = V
TC = 25oC-2.12.4V
TC = 150oC-2.93.5V
GE
VGE = ±20V--±250nA
Switching SOASSOATJ = 150oC, RG = 3Ω, VGE = 15V,
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 5)E
Turn-On Energy (Note 5)E
Turn-Off Energy (Note 4)E
GEP
G(ON)
rI
fI
ON1
ON2
OFF
L = 200µH, V
IC = 20A, VCE = 0.5 BV
IC = 20A,
VCE = 0.5 BV
IGBT and Diode at TJ = 25oC
ICE = 20A
VCE = 0.8 BV
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 18)
CE(PK)
CES
CES
= 1200V
CES
VGE = 15V-155200nC
VGE = 20V-200250nC
6.06.9-V
100--A
-10.2-V
-2328ns
-1722ns
-200240ns
-220270ns
-0.91.1mJ
-2.02.5mJ
-2.83.3mJ
2
HGTG20N120CN
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 5)E
Turn-On Energy (Note 5)E
Turn-Off Energy (Note 4)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC
ICE = 20A
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 18)
-2126ns
-1722ns
-225270ns
-340400ns
-1.01.2mJ
-3.85.0mJ
-4.65.3mJ
--0.32
NOTES:
4. Turn-OffEnergy Loss (E
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
5. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 18.