The HGTG18N120BN is a Non-Punch Through (NPT) IGBT
design. This is a new member of the MOS gated high
voltage switching IGBT family. IGBTs combine the best
features of MOSFETs and bipolar transistors. This device
has the high input impedance of a MOSFET and the low
on-state conduction loss of a bipolar transistor.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
Formerly Developmental Type TA49288.
Ordering Information
PART NUMBERPACKAGEBRAND
HGTG18N120BNTO-247G18N120BN
NOTE: When ordering, use the entire part number.
Symbol
C
Features
• 54A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . 140ns at T
• Short Circuit Rating
• Low Conduction Loss
• Avalanche Rated
• Temperature Compensating SABER™ Model
www.intersil.com
Packaging
JEDEC STYLE TO-247
E
C
G
= 150oC
J
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
AV
STG
L
SC
SC
125mJ
-55 to 150
260
8µs
15µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. ICE = 25A, L = 400µH, TJ = 25oC.
3. V
= 960V, TJ = 125oC, RG = 3Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V1200--V
IC = 10mA, VGE= 0V15--V
VCE = BV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CE(SAT)IC
GE(TH)
GES
= 18A,
VGE = 15V
IC = 150µA, VCE = V
TC = 25oC-2.452.7V
TC = 150oC-3.84.2V
GE
VGE = ±20V--±250nA
Switching SOASSOATJ = 150oC, RG = 3Ω, VGE = 15V,
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 5)E
Turn-On Energy (Note 5)E
Turn-Off Energy (Note 4)E
GEP
G(ON)
rI
fI
ON1
ON2
OFF
L = 200µH, V
IC = 18A, VCE = 0.5 BV
IC = 18A,
VCE = 0.5 BV
IGBT and Diode at TJ = 25oC
ICE = 18A
VCE = 0.8 BV
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 18)
CE(PK)
CES
CES
= 1200V
CES
VGE = 15V-165200nC
VGE = 20V-220250nC
6.07.0-V
100--A
-10.5-V
-2328ns
-1722ns
-170200ns
-90140ns
-0.81.0mJ
-1.92.4mJ
-1.82.2mJ
2
HGTG18N120BN
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 5)E
Turn-On Energy (Note 5)E
Turn-Off Energy (Note 4)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC
ICE = 18A
VCE = 0.8 BV
CES
VGE = 15V
RG= 3Ω
L = 1mH
Test Circuit (Figure 18)
-2126ns
-1722ns
-205240ns
-140200ns
-0.851.1mJ
-3.74.9mJ
-2.63.1mJ
--0.32
NOTES:
4. Turn-Off Energy Loss (E
) is defined as the integral of the instantaneous power loss starting at the trailing edge of theinput pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
5. Values for two Turn-On loss conditions are shown for the convenienceof the circuit designer.E
is the turn-on loss of the IGBT only. E
ON1
the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJas the IGBT.The diode type is specified in Fig. 18.