The HGTD3N60B3S, HGT1S3N60B3S and HGTP3N60B3
are MOS gated high voltage switching devices combining
the best features of MOSFETs and bipolar transistors.
These devices have the high input impedance of a MOSFET
and the low on-state conduction loss of a bipolar transistor.
The much lower on-state voltage drop varies only
moderately between 25
o
C and 150oC.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
ARV
STG
L
SC
SC
100mJ
-55 to 150
260
5µs
10µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
= 360V, TJ = 125oC, RG = 82Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
CE(SAT)IC
CES
ECS
CES
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE= 0V2028-V
VCE = BV
= I
C110
VGE = 15V
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
GE(TH)
GES
IC = 250µA, VCE = V
VGE = ±20V--±250nA
Switching SOASSOATJ = 150oC
RG = 82Ω
VGE = 15V
L = 500µH
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
GEP
g(ON)
IC = I
IC = I
C110
C110
VCE = 0.5 BV
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On EnergyE
Turn-Off Energy (Note 3)E
rI
fI
ON
OFF
IGBT and Diode at TJ = 25oC
ICE = I
C110
VCE = 0.8 BV
VGE = 15V
RG = 82Ω
L = 1mH
Test Circuit (Figure 17)
CES
TC = 25oC--250µA
TC = 150oC--2.0mA
,
TC = 25oC-1.82.1V
TC = 150oC-2.12.5V
GE
VCE= 600V18--A
, VCE = 0.5 BV
,
VGE = 15V-1822nC
CES
VGE = 20V-2125nC
CES
CES
4.55.46.0V
-7.9-V
-18- ns
-16- ns
-105-ns
-70- ns
-6675µJ
-88160µJ
2
HGTD3N60B3S, HGT1S3N60B3S, HGTP3N60B3
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On EnergyE
Turn-Off Energy (Note 3)E
Thermal Resistance Junction To CaseR
rI
fI
ON
OFF
θJC
IGBT and Diode at TJ = 150oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG = 82Ω
L = 1mH
Test Circuit (Figure 17)
-16- ns
-18- ns
-220295ns
-115175ns
-130140µJ
-210325µJ
--3.75
o
C/W
NOTE:
3. Turn-OffEnergy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Turn-On losses include losses due
to diode recovery.