TM
HGTG7N60A4D, HGTP7N60A4D,
HGT1S7N60A4DS
Data Sheet March 2000
600V, SMPS Series N-Channel IGBT with
Anti-Parallel Hyperfast Diode
The HGTG7N60A4D, HGTP7N60A4D and
HGT1S7N60A4DS are MOS gated high voltage switching
devices combining the best features of MOSFETs and
bipolar transistors. These devices have the high input
impedance of a MOSFET and the low on-state conduction
loss of a bipolar transistor. The much lower on-state voltage
drop varies only moderately between 25
o
C and 150oC. The
IGBT used is the development type TA49331. The diode
used in anti-parallel is the development type TA49370.
This IGBT is ideal for many high voltage switching
applications operating at high frequencies where low
conduction losses are essential. This device has been
optimized for high frequency switch mode power
supplies.
Formerly Developmental Type TA49333.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTG7N60A4D TO-247 7N60A4D
HGTP7N60A4D TO-220AB 7N60A4D
HGT1S7N60A4DS TO-263AB 7N60A4D
NOTE: When ordering, use the entirepart number.Add the suffix 9A
to obtain the TO-263AB variant in tape and reel, e.g.,
HGT1S7N60A4DS9A.
File Number 4827.1
Features
• >100kHz Operation At 390V, 7A
• 200kHz Operation At 390V, 5A
• 600V Switching SOA Capability
• Typical Fall Time. . . . . . . . . . . . . . . . . 75ns at T
• Low Conduction Loss
• Temperature Compensating SABER™ Model
www.intersil.com
Packaging
JEDEC STYLE TO-247
E
C
G
COLLECTOR
(FLANGE)
JEDEC TO-220AB
E
C
G
= 125oC
J
Symbol
C
G
E
G
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713
4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637
4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986
4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767
4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
2-1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000
SABER™ is a trademark of Analogy, Inc. | 1-888-INTERSIL or 321-724-7143
JEDEC TO-263AB
E
COLLECTOR
(FLANGE)
COLLECTOR
(FLANGE)
HGTG7N60A4D, HGTP7N60A4D, HGT1S7N60A4DS
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
ALL TYPES UNITS
Collector to Emitter Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . BV
CES
600 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
C25
C110
CM
GES
GEM
34 A
14 A
56 A
±20 V
±30 V
Switching Safe Operating Area at TJ = 150oC, Figure 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . .SSOA 35A at 600V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
125 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W/oC
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
-55 to 150
Maximum Lead Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Tech Brief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
PKG
300
260
o
C
o
C
o
C
NOTE:
1. Pulse width limited by maximum junction temperature.
Electrical Specifications T
= 25oC, Unless Otherwise Specified
J
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV
Collector to Emitter Leakage Current I
CES
CES
IC = 250µ A, VGE = 0V 600 - - V
VCE = 600V TJ = 25oC - - 250 µ A
TJ = 125oC- - 2 m A
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V
Gate to Emitter Leakage Current I
CE(SAT)IC
GE(TH)
GES
Switching SOA SSOA TJ = 150oC, RG = 25Ω , VGE = 15V,
= 7A,
VGE = 15V
TJ = 25oC - 1.9 2.7 V
TJ = 125oC - 1.6 2.2 V
IC = 250µ A, VCE = 600V 4.5 5.9 7 V
VGE = ± 20V - - ± 250 nA
35 - - A
L = 100µ H, VCE = 600V
Gate to Emitter Plateau Voltage V
On-State Gate Charge Q
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t
Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t
Turn-On Energy E
Turn-On Energy E
Turn-Off Energy (Note 2) E
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t
Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t
Turn-On Energy (Note 2) E
Turn-On Energy (Note 2) E
Turn-Off Energy (Note 3) E
GEP
g(ON)
rI
fI
ON1
ON2
OFF
rI
fI
ON1
ON2
OFF
IC = 7A, VCE = 300V - 9 - V
IC = 7A,
VCE = 300V
IGBT and Diode at TJ = 25oC,
ICE = 7A,
VCE = 390V,
VGE = 15V,
RG = 25Ω,
L = 1mH,
Test Circuit (Figure 24)
VGE = 15V - 37 45 nC
VGE = 20V - 48 60 nC
-1 1- n s
-1 1- n s
- 100 - ns
-4 5- n s
-5 5- µJ
- 120 150 µ J
-6 07 5µJ
IGBT and Diode at TJ = 125oC,
ICE = 7A,
VCE = 390V, VGE = 15V,
RG= 25Ω,
L = 1mH,
Test Circuit (Figure 24)
-1 0- n s
-7-n s
- 130 150 ns
-7 58 5n s
-5 0- µJ
- 200 215 µ J
- 125 170 µ J
2-2
HGTG7N60A4D, HGTP7N60A4D, HGT1S7N60A4DS
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
J
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Diode Forward Voltage V
Diode Reverse Recovery Time t
EC
rr
IEC = 7A - 2.4 - V
IEC = 7A, dIEC/dt = 200A/µ s - 34 - ns
IEC = 1A, dIEC/dt = 200A/µ s - 22 - ns
Thermal Resistance Junction To Case R
θ JC
IGBT - - 1.0
Diode - - 2.2
NOTES:
2. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only. E
ON1
is the turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in
Figure 24.
3. Turn-Off Energy Loss (E
) is defined as the integral of the instantaneouspower loss starting at the trailing edge of the input pulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
Typical Performance Curves Unless Otherwise Specified
35
VGE= 15V
30
25
20
15
40
TJ= 150oC, RG = 25Ω , VGE= 15V, L = 100µ H
30
20
o
o
C/W
C/W
ON2
10
, DC COLLECTOR CURRENT (A)
5
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
FIGURE 1. DC COLLECTOR CURRENT vs CASE
TEMPERATURE
500
200
100
f
= 0.05 / (t
MAX1
= (PD- PC) / (E
f
MAX2
P
= CONDUCTION DISSIPATION
C
, OPERATING FREQUENCY (kHz)
MAX
f
30
(DUTY FACTOR = 50%)
R
= 1.0oC/W, SEE NOTES
ØJC
TJ= 125oC, RG = 25Ω , L = 1mH, VCE= 390V
1
, COLLECTOR TO EMITTER CURRENT (A)
I
CE
d(OFF)I
+ t
ON2
d(ON)I
+ E
OFF
)
)
TCV
75
10
, COLLECTOR TO EMITTER CURRENT (A)
CE
0
I
0
VCE, COLLECTOR TO EMITTER VOLTAGE (V)
300 400 200 100 500 600
700
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
GE
o
15V
C
20 51 0
14
12
10
8
6
, SHORT CIRCUIT WITHSTAND TIME (µ s)
SC
4
t
10
VCE = 390V, RG = 25Ω , TJ= 125oC
I
SC
t
SC
11 12 15
VGE, GATE TO EMITTER VOLTAGE (V)
13 14
140 16
120
100
80
60
40
, PEAK SHORT CIRCUIT CURRENT (A)
SC
I
20
FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO
EMITTER CURRENT
2-3
FIGURE 4. SHORT CIRCUIT WITHSTAND TIME