The HGTP5N120BN and the HGT1S5N120BNS are
Non-Punch Through (NPT) IGBT designs. They are new
members of the MOS gated high voltage switching IGBT
family. IGBTs combine the best features of MOSFETs and
bipolar transistors.This device has the high inputimpedance
of a MOSFET and the low on-state conduction loss of a
bipolar transistor.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC
SC
300
260
8µs
15µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. ICE = 12A, L = 500µH.
3. V
= 840V, TJ = 125oC, RG= 25Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CES
ECS
CES
IC = 250µA, VGE = 0V1200--V
IC = 10mA, VGE= 0V15--V
VCE = BV
TC = 150oC-3.74.2V
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
GE(TH)
GES
IC = 45µA, VCE = V
GE
VGE = ±20V--±250nA
Switching SOASSOATJ = 150oC, RG = 25Ω,VGE = 15V,
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
GEP
G(ON)
L = 5mH, V
IC = 5A, VCE = 0.5 BV
IC = 5A,
VCE = 0.5 BV
CE(PK)
CES
= 1200V
CES
VGE = 15V-5365nC
VGE = 20V-6072nC
6.06.8-V
30--A
-10.5-V
2
HGTP5N120BN, HGT1S5N120BNS
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Current Turn-On Delay Timet
d(ON)I
IGBT and Diode at TJ = 25oC,
-2225ns
ICE = 5A,
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 5)E
Current Turn-On Delay Timet
d(ON)I
rI
fI
ON1
ON2
OFF
VCE = 0.8 BV
CES
,
VGE = 15V,
RG = 25Ω,
L = 5mH,
Test Circuit (Figure 18)
IGBT and Diode at TJ = 150oC,
-1520ns
-160180ns
-130160ns
-220-µJ
-450600µJ
-390450µJ
-2025ns
ICE = 5A,
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 5)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
VCE = 0.8 BV
CES
,
VGE = 15V,
RG = 25Ω,
L = 5mH,
Test Circuit (Figure 18)
-1520ns
-182280ns
-175200ns
-220-µJ
-10001300µJ
-560800µJ
--0.75
NOTES:
4. Values for twoT urn-Onloss conditions are shown for the convenienceof the circuit designer.E
is the turn-on lossof theIGBT only. E
ON1
ON2
turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in Figure 18.
5. Turn-Off Energy Loss (E
) is definedas the integralof the instantaneouspower loss starting at the trailing edge of the input pulse and ending
OFF
at the point where the collector currentequals zero (ICE= 0A). All devices were tested per JEDEC Standard No.24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.