This family of MOS gated high voltage switching devices
combining the best features of MOSFETs and bipolar
transistors. These devices have the high input impedance of
a MOSFET and the low on-state conduction loss of a bipolar
transistor. The much lower on-state voltage drop varies only
moderately between 25
o
C and 150oC.
The IGBT is ideal for many high voltage switching
applications operating at moderate frequencies where low
conduction losses are essential, such as: AC and DC motor
controls, power supplies and drivers for solenoids, relays
and contactors.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC
SC
100mJ
-55 to 150
300
260
4µs
10µs
o
C
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
= 360V, TJ = 125oC, RG = 10Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
Collector to Emitter Saturation VoltageV
CE(SAT)IC
CES
ECS
CES
IC = 250µA, VGE = 0V600--V
IC = 10mA, VGE = 0V1528-V
VCE = BV
= I
CES
C110
VGE = 15V
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
GE(TH)
GES
IC = 250µA, VCE = V
VGE = ±20V--±250nA
Switching SOASSOATJ = 150oC, RG =
10Ω, VGE = 15V,
L = 100µH
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
d(ON)I
Current Rise Timet
Current Turn-Off Delay Timet
d(OFF)I
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 3)E
GEP
G(ON)
rI
fI
ON1
ON2
OFF
ICE = I
ICE = I
VCE = 0.5 BV
, VCE = 0.5 BV
C110
C110
CES
IGBT and Diode at TJ = 25oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 10Ω
L = 1mH
Test Circuit (Figure 17)
Current Fall Timet
Turn-On Energy (Note 4)E
Turn-On Energy (Note 4)E
Turn-Off Energy (Note 3)E
Thermal Resistance Junction To CaseR
rI
fI
ON1
ON2
OFF
θJC
IGBT and Diode at TJ = 150oC
ICE = I
C110
VCE = 0.8 BV
CES
VGE = 15V
RG= 10Ω
L = 1mH
Test Circuit (Figure 17)
-2832ns
-2428ns
-280450ns
-108210ns
-380410µJ
-1.01.1mJ
-1.21.7mJ
--0.76
NOTES:
3. Turn-OffEnergy Loss (E
) isdefinedas the integralofthe instantaneous powerlossstarting atthetrailing edge of theinputpulse and ending
OFF
at the pointwherethe collector current equals zero(ICE= 0A). Alldevices were tested per JEDECStandardNo.24-1 Method for Measurement
of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss.
4. Values for two Turn-On loss conditions are shown for the convenience of the circuit designer. E
is the turn-on loss of the IGBT only.E
ON1
ON2
turn-on loss when a typical diode is used in the test circuit and the diode is at the same TJ as the IGBT. The diode type is specified in Figure 17.