Intersil Corporation HGTP1N120CND, HGT1S1N120CNDS Datasheet

HGTP1N120CND, HGT1S1N120CNDS
Data Sheet January 2000 File Number 4651.1
6.2A, 1200V, NPT Series N-Channel IGBT with Anti-Parallel Hyperfast Diode
The HGTP1N120CND and the HGT1S1N120CNDS are Non-Punch Through (NPT) IGBT designs. They are new members of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors.This device has the high inputimpedance of a MOSFET and the low on-state conduction loss of a bipolar transistor.
The IGBT is development type number TA49317. The diode used in anti-parallel with the IGBT is the RHRD4120 (TA49056).
The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors.
Formerly developmental type TA49315.
Ordering Information
PART NUMBER PACKAGE BRAND
HGTP1N120CND TO-220AB 1N120CND
Features
• 6.2A, 1200V, TC = 25oC
• 1200V Switching SOA Capability
• Typical E
. . . . . . . . . . . . . . . . . . . 200µJ at TJ = 150oC
OFF
• Short Circuit Rating
• Low Conduction Loss
Temperature Compensating SABER™ Model Thermal Impedance SPICE Model www.intersil.com/
• Related Literature
- TB334, “Guidelines for Soldering Surface Mount
Components to PC Boards”
Packaging
JEDEC TO-220AB
E
C
COLLECTOR
(FLANGE)
G
HGT1S1N120CNDS TO-263AB 1N120CND
NOTE: Whenordering, use theentirepart number. Add the suffix9A to obtain the TO-263AB in tape and reel, e.g. HGT1S1N120CNDS9A.
Symbol
C
G
E
INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS
4,364,073 4,417,385 4,430,792 4,443,931 4,466,176 4,516,143 4,532,534 4,587,713 4,598,461 4,605,948 4,620,211 4,631,564 4,639,754 4,639,762 4,641,162 4,644,637 4,682,195 4,684,413 4,694,313 4,717,679 4,743,952 4,783,690 4,794,432 4,801,986 4,803,533 4,809,045 4,809,047 4,810,665 4,823,176 4,837,606 4,860,080 4,883,767 4,888,627 4,890,143 4,901,127 4,904,609 4,933,740 4,963,951 4,969,027
G
JEDEC TO-263AB
COLLECTOR
(FLANGE)
E
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
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| Copyright © Intersil Corporation 2000
SABER™ is a trademark of Analogy, Inc.
HGTP1N120CND, HGT1S1N120CNDS
Absolute Maximum Ratings T
= 25oC, Unless Otherwise Specified
C
HGTP1N120CND,
HGT1S1N120CNDS UNITS
Collector to Emitter Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BV
CES
1200 V
Collector Current Continuous
At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Average Rectified Forward Current at TC = 148oC . . . . . . . . . . . . . . . . . . . . . . . . . . . .. I
Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
C25
C110
F(AV)
CM
GES
GEM
6.2 A
3.2 A 4A 6A
±20 V ±30 V
Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 6A at 1200V
Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
60 W
Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.476 W/oC
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, T
STG
-55 to 150
o
C
Maximum Lead Temperature for Soldering
Leads at 0.063in (1.6cm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, see Tech Brief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
Short Circuit Withstand Time (Note 2) at VGE = 13V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
L
pkg
SC SC
300 260
8 µs
11 µs
o
C
o
C
NOTES:
1. Single Pulse; VGE = 15V; Pulse width limited by maximum junction temperature.
2. V
= 840V, TJ = 125oC, RG = 82.
CE(PK)
Electrical Specifications T
= 25oC, Unless Otherwise Specified
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Collector to Emitter Breakdown Voltage BV Collector to Emitter Leakage Current I
CES
CES
IC = 250µA, VGE = 0V 1200 - - V VCE = BV
CES
TC = 25oC - - 250 µA TC = 125oC - 20 - µA TC = 150oC - - 1.0 mA
Collector to Emitter Saturation Voltage V
Gate to Emitter Threshold Voltage V Gate to Emitter Leakage Current I
CE(SAT)IC
GE(TH)
GES
= 1.0A,
VGE = 15V IC = 50µA, VCE = V
TC = 25oC - 2.05 2.4 V TC = 150oC - 2.75 3.2 V
GE
VGE = ±20V - - ±250 nA
Switching SOA SSOA TJ = 150oC, RG = 82, VGE = 15V,
Gate to Emitter Plateau Voltage V On-State Gate Charge Q
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy (Note 3) E Turn-Off Energy (Note 3) E
GEP
G(ON)
rI
fI
ON
OFF
L = 2mH, V IC = 1.0A, VCE = 0.5 BV IC = 1.0A,
VCE = 0.5 BV IGBT and Diode at TJ = 25oC
ICE = 1.0A, VCE = 0.8 BV VGE = 15V, RG = 82Ω, L = 4mH, Test Circuit (Figure 20)
CE(PK)
CES
= 1200V
CES
VGE = 15V - 13 19 nC VGE = 20V - 16 28 nC
CES,
6.0 7.1 - V
6- - A
- 9.7 - V
-1521ns
-1115ns
-6595ns
- 365 450 ns
- 175 195 J
- 140 155 J
2
HGTP1N120CND, HGT1S1N120CNDS
Electrical Specifications T
= 25oC, Unless Otherwise Specified (Continued)
C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Current Turn-On Delay Time t
d(ON)I
Current Rise Time t Current Turn-Off Delay Time t
d(OFF)I
Current Fall Time t Turn-On Energy (Note 3) E Turn-Off Energy (Note 3) E Diode Forward Voltage V Diode Reverse Recovery Time t Thermal Resistance Junction To Case R
rI
fI
ON
OFF
EC
rr
θJC
IGBT and Diode at TJ = 150oC, ICE= 1.0 A, VCE= 0.8 BV
CES,
VGE = 15V, RG = 82Ω, L = 4mH, Test Circuit (Figure 20)
-1320ns
-1118ns
- 75 100 ns
- 465 625 ns
- 385 460 J
- 200 225 J IEC = 1A - 1.3 1.8 V IEC = 1A, dIEC/dt = 200A/µs--50ns IGBT - - 2.1 Diode - - 3
NOTE:
3. Turn-Off Energy Loss (E
) is defined as the integral of the instantaneous power loss starting at the trailing edgeof the inputpulse and ending
OFF
at the point where the collector current equals zero (ICE= 0A). All devices were tested per JEDEC Standard No.24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test methodproduces the true total Turn-Off Energy Loss. Turn-on losses include lossesdue to diode recovery.
Typical Performance Curves Unless Otherwise Specified
7
6
VGE= 15V
7
TJ= 150oC, RG = 82, VGE= 15V, L = 2mH
6
o o
C/W C/W
5
4
3
2
, DC COLLECTOR CURRENT (A)
1
CE
I
0
25 75 100 125 150
50
TC, CASE TEMPERATURE (oC)
FIGURE 1. DCCOLLECTORCURRENT vs CASE
TEMPERATURE
300
TJ= 150oC, RG = 82, L = 4mH, VCE = 960V
200
100
f
MAX1
f
MAX2
P
, OPERATING FREQUENCY (kHz)
MAX
f
C
10
R
θJC
5
0.5
= 0.05 / (t = (PD- PC) / (EON+ E
= CONDUCTION DISSIPATION
(DUTY FACTOR = 50%)
= 2.1oC/W, SEE NOTES
, COLLECTOR TO EMITTER CURRENT (A)
I
CE
d(OFF)I
+ t
d(ON)I
OFF
) )
2.01.0
TCV
o
75
o
75
o
110 110oC
5
4
3
2
1
, COLLECTOR TO EMITTER CURRENT (A)
0
CE
I
0
, COLLECTOR TO EMITTER VOLTAGE (V)
V
CE
600 800400200 1000 1200
1400
FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA
GE
15V
C
13V
C
15V
C
13V
3.0
20
VCE = 840V, RG = 82, TJ= 125oC
18
16
14
12
, SHORT CIRCUIT WITHSTAND TIME (ms)
10
SC
t
13 14 15
t
SC
I
SC
VGE, GATE TO EMITTER VOLTAGE (V)
20
18
16
14
12
, PEAK SHORT CIRCUIT CURRENT (A)
SC
I
10
FIGURE 3. OPERATING FREQUENCYvs COLLECTOR TO
EMITTER CURRENT
3
FIGURE 4. SHORT CIRCUIT WITHSTAND TIME
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