NOTE: When ordering, use the entire part number. Add the suffix 9A
to obtain the TO-263 variant in tape and reel; i.e.,
HGT1S15N120C3S9A.
Formerly Developmental Type TA49145.
35A, 1200V, UFS Series N-Channel IGBTs
Description
The HGTG15N120C3, HGTP15N120C3, HGT1S15N120C3
and HGT1S15N120C3S are MOS gated high voltage switching
devices combining the best features of MOSFETs and bipolar
transistors. These devices have the high input impedance of a
MOSFET and the low on-state conduction loss of a bipolar transistor. The much low er on-state voltage drop v aries only moderately between 25
The IGBT is ideal for many high voltage switching applications
operating at moderate frequencies where low conduction
losses are essential, such as: AC and DC motor controls,
power supplies and drivers for solenoids , rela ys and contactors.
Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . TJ, T
Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Short Circuit Withstand Time (Note 2) at VGE = 15V . . . . . . . . . . . . . . . . . . . . t
Short Circuit Withstand Time (Note 2) at VGE = 10V . . . . . . . . . . . . . . . . . . . . t
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
ARV
STG
L
SC
SC
100mJ
-55 to 150
260
6µs
25µs
o
C
o
C
NOTES:
1. Pulse width limited by maximum junction temperature.
2. V
= 720V, TJ = 125oC, RGE = 25Ω.
CE(PK)
Electrical SpecificationsT
= 25oC, Unless Otherwise Specified
C
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNITS
Collector to Emitter Breakdown VoltageBV
Emitter to Collector Breakdown VoltageBV
Collector to Emitter Leakage CurrentI
CESIC
ECSIC
CES
= 250µA, VGE = 0V1200--V
= 10mA, VGE= 0V1525-V
VCE = BV
CES
TC = 25oC--250µA
TC = 150oC--3.0mA
Collector to Emitter Saturation VoltageV
Gate to Emitter Threshold VoltageV
Gate to Emitter Leakage CurrentI
CE(SAT)IC
GE(TH)IC
GES
Switching SOASSOATJ = 150oC, RG = 10Ω
Gate to Emitter Plateau VoltageV
On-State Gate ChargeQ
Current Turn-On Delay Timet
Current Rise Timet
Current Turn-Off Delay Timet
Current Fall Timet
Turn-On EnergyE
Turn-Off Energy (Note 3)E
Thermal ResistanceR
GEP
g(ON)IC
d(ON)I
rI
d(OFF)I
fI
ON
OFF
θJC
= I
,
C110
VGE = 15V
= 250µA, VCE = V
TC = 25oC-2.33.5V
TC = 150oC-2.43.2V
GE
4.05.67.5V
VGE = ±20V--±100nA
VGE = 15V, L = 1mH
IC = I
VCE = 0.5 BV
= I
C110
C110
, VCE = 0.5 BV
,
ES
TJ = 150oC
ICE = I
C110
V
CE(PK)
= 0.8 BV
CES
VGE = 15V
RG = 10Ω
L = 1mH
V
V
CES
VGE = 15V-75100nC
VGE = 20V-100130nC
= 960V40--A
CE(PK)
= 1200V15--A
CE(PK)
-8.8-V
-17-ns
-25-ns
-470550ns
-350400ns
-2100-µJ
-4700-µJ
--0.76oC/W
NOTE:
3. Turn-Off Energy Loss (E
) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and
OFF
ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC standard No. 24-1 Method for
Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Turn-On losses
include losses due to diode recovery.